CN112652463A - Reactor with intelligent energy-saving cooling system - Google Patents
Reactor with intelligent energy-saving cooling system Download PDFInfo
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- CN112652463A CN112652463A CN202011568739.4A CN202011568739A CN112652463A CN 112652463 A CN112652463 A CN 112652463A CN 202011568739 A CN202011568739 A CN 202011568739A CN 112652463 A CN112652463 A CN 112652463A
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- reactor
- cooling system
- intelligent energy
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- 238000001816 cooling Methods 0.000 title claims abstract description 60
- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000005057 refrigeration Methods 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 20
- 239000004020 conductor Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
Abstract
The invention discloses a reactor with an intelligent energy-saving cooling system, which comprises a reactor main body, wherein a bearing plate is fixedly connected to the upper end of the reactor main body, a semiconductor refrigerating sheet is arranged on the upper side of the bearing plate, the semiconductor refrigerating sheet comprises a heat dissipation surface and a cold guide surface, a plurality of uniformly distributed heat dissipation fins are fixedly connected to the heat dissipation surface, a plurality of cooling columns are fixed to the cold guide surface, the cooling columns are distributed around the reactor main body, a sealing frame is arranged between the semiconductor refrigerating sheet and the bearing plate, spacing cavities are formed among the sealing frame, the semiconductor refrigerating sheet and the bearing plate, and the cooling columns penetrate through the spacing cavities and the bearing plate. The semiconductor refrigeration piece can realize forced heat dissipation of the reactor main body, can ensure a better heat dissipation effect even in a high-temperature environment, has a better energy-saving effect, and can realize intelligent cooling of the reactor.
Description
Technical Field
The invention belongs to the technical field of electric reactors, and particularly relates to an electric reactor with an intelligent energy-saving cooling system.
Background
Reactors, also called inductors, are electrical conductors that, when energized, generate a magnetic field in a certain spatial area occupied by a conductor, so that all electrical conductors capable of carrying current are inductive in the general sense. However, the inductance of the electrified long straight conductor is small, and the generated magnetic field is not strong, so that the actual reactor is in a mode that a conducting wire is wound into a solenoid, and is called as an air-core reactor; in order to make this solenoid have a larger inductance, a core, called a core reactor, is sometimes inserted into the solenoid. Reactance is divided into inductive reactance and capacitive reactance, and the more scientific classification is that inductive reactance (inductor) and capacitive reactance (capacitor) are collectively called reactor, however, since the inductor is existed in the past and is called reactor, the capacitor is called reactor now, and the reactor is specially called inductor.
The materials for manufacturing the reactor include two types, namely, a metal material and an insulating material. The metal material is resistant to high temperature, and the insulating material gradually loses the original mechanical property and insulating property under the action of higher temperature, electric field and magnetic field for a long time, such as brittleness, weakened mechanical strength and electric breakdown. This gradual process is the aging of the insulating material. The higher the temperature is, the faster the mechanical property and the insulating property of the insulating material are weakened, so that the reactor needs to be cooled, and the common cooling mode in the prior art is generally air-cooled cooling, so that the cooling effect is poor, more electric energy can be wasted for a long time, and most importantly, the air-cooled cooling effect is extremely poor in a high-temperature environment.
Therefore, in view of the above technical problems, it is necessary to provide a reactor with an intelligent energy-saving cooling system.
Disclosure of Invention
The invention aims to provide a reactor with an intelligent energy-saving cooling system to solve the problems.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
a reactor with an intelligent energy-saving cooling system comprises a reactor main body, wherein a bearing plate is fixedly connected to the upper end of the reactor main body, a semiconductor refrigeration sheet is arranged on the upper side of the bearing plate, the semiconductor refrigeration sheet comprises a heat dissipation surface and a cold conduction surface, a plurality of uniformly distributed heat dissipation fins are fixedly connected to the heat dissipation surface, a plurality of cooling columns are fixed to the cold conduction surface, and the plurality of cooling columns are distributed around the reactor main body;
be provided with sealed frame between semiconductor refrigeration piece and the loading board, be formed with the interval cavity between sealed frame, semiconductor refrigeration piece and the loading board, it is a plurality of the cooling column all runs through interval cavity and loading board.
As a further improvement of the invention, the sealing frame is fixedly connected to the lower end of the semiconductor refrigeration piece, and the range formed by the lower end of the sealing frame is positioned in the range of the upper end of the bearing plate.
As a further improvement of the invention, the lower end of the sealing frame is fixedly connected with a sealing ring, and the sealing ring is an elastic sealing ring.
As a further improvement of the invention, the cold guide surface is fixedly connected with a storage battery, and a connecting piece is electrically connected between the storage battery and the semiconductor refrigeration sheet.
As a further improvement of the invention, the outer surface of the storage battery is wrapped with a heat insulation layer.
As a further improvement of the invention, the cooling column comprises a cold guide column and a heat insulation sleeve wrapped on the cold guide column, and the heat insulation sleeve is provided with a cold guide notch.
As a further improvement of the invention, the opening direction of the cold conducting notch is opposite to the reactor main body.
As a further improvement of the invention, the bearing plate is provided with a limiting hole matched with the cooling column, and a sealing structure is arranged between the limiting hole and the cooling column.
As a further improvement of the invention, the sealing frame is fixedly connected with an auxiliary radiating pipe, the auxiliary radiating pipe is provided with a second through hole and a third through hole, the sealing frame is provided with a first through hole, the spacing cavity is communicated with the outside through the first through hole, the second through hole and the third through hole in sequence, and the third through hole is positioned at the upper side of the semiconductor refrigerating sheet.
As a further improvement of the invention, a base is fixedly connected to the lower end of the reactor main body, and a plurality of threaded holes are formed in the base.
Compared with the prior art, the invention has the following advantages:
the semiconductor refrigeration piece can realize forced heat dissipation of the reactor main body, can ensure a better heat dissipation effect even in a high-temperature environment, has a better energy-saving effect, and can realize intelligent cooling of the reactor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a reactor with an intelligent energy-saving cooling system according to an embodiment of the present invention;
FIG. 2 is a front view of a reactor with an intelligent energy-saving cooling system according to an embodiment of the invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a schematic view of the structure at B in FIG. 3;
FIG. 5 is a partial exploded view of a reactor with an intelligent energy-saving cooling system according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram at C in fig. 5.
In the figure: 01. the reactor comprises a reactor main body, 02, a base, 03, a bearing plate, 031 limiting holes, 1, a semiconductor refrigeration piece, 101, a heat dissipation surface, 102, a cold conduction surface, 2, a cooling column, 201, a cold conduction column, 202, a heat insulation sleeve, 203, a cold conduction notch, 3, a sealing frame, 301, a first through hole, 4, a sealing ring, 5, a storage battery, 6, a connecting piece, 7, a heat insulation layer, 8, a heat dissipation fin, 9, an auxiliary heat dissipation pipe, 901, a second through hole, 902 and a third through hole.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
The reactor with the intelligent energy-saving cooling system disclosed by the embodiment of the invention is shown in fig. 1-3, and comprises a reactor main body 01, wherein the upper end of the reactor main body 01 is fixedly connected with a bearing plate 03, the lower end of the reactor main body 01 is fixedly connected with a base 02, and a plurality of threaded holes are formed in the base 02.
The bearing plate 03 is used for fixing and bearing related structures of the cooling system, the base 02 is used for fixing the reactor integrally, and threaded holes in the base 02 facilitate bolts to fix the base 02.
The upper side of the bearing plate 03 is provided with the semiconductor refrigerating sheet 1, the semiconductor refrigerating sheet 1 utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be achieved. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.
Referring to fig. 3, the semiconductor cooling plate 1 includes a heat dissipating surface 101 and a cold conducting surface 102, in order to improve the heat dissipating effect of the heat dissipating surface 101, a plurality of uniformly distributed heat dissipating fins 8 are fixedly connected to the heat dissipating surface 101, so as to facilitate the improvement of the heat dissipating area, thereby improving the heat dissipating effect, reducing the load of the semiconductor cooling plate 1, reducing the energy consumption, and having the energy saving effect.
In order to enhance the effect of the cooling guide surface 102 in absorbing heat, the plurality of cooling columns 2 are fixed to the cooling guide surface 102, and the plurality of cooling columns 2 are distributed around the reactor main body 01 so as to be able to absorb heat around the reactor main body 01.
Referring to fig. 5 to 6, specifically, the cooling column 2 includes a cold guiding column 201 and a heat insulating sleeve 202 wrapped on the cold guiding column 201, and the heat insulating sleeve 202 is provided with a cold guiding gap 203.
Preferably, the opening direction of the cold conducting notch 203 is opposite to the reactor main body 01, so that heat dissipation is reduced conveniently, pertinence is achieved, and the energy-saving effect is good.
Referring to fig. 6, the cold conducting notch 203 is an arc opening, and has a larger heat absorbing area and less heat dissipation compared to a triangle.
Referring to fig. 1 to 3, in order to improve the refrigerating effect, a sealing frame 3 is arranged between the semiconductor refrigerating sheet 1 and the bearing plate 03, a spacing cavity is formed between the sealing frame 3, the semiconductor refrigerating sheet 1 and the bearing plate 03, and the plurality of cooling columns 2 penetrate through the spacing cavity and the bearing plate 03.
The interval cavity can make semiconductor refrigeration piece 1 and loading board 03 between have certain distance, and sealed frame 3 is thermal insulation material, can save more air conditioning in the interval cavity, even if semiconductor refrigeration piece 1 pause work, also can provide the low temperature of an end time, has the effect of buffering.
Specifically, sealed frame 3 fixed connection is at the lower extreme of semiconductor refrigeration piece 1, and the scope that the lower extreme of sealed frame 3 formed is located the scope of loading board 03 upper end, and the area of loading board 03 is more than or equal to the area of sealed frame 3 promptly, is convenient for realize better sealed between sealed frame 3 and the loading board 03.
Referring to fig. 3, the lower end of the sealing frame 3 is fixedly connected with a sealing ring 4, and the sealing ring 4 is an elastic sealing ring, so that better sealing performance is conveniently realized.
Referring to fig. 5 in combination with fig. 6, a position-limiting hole 031 matched with the cooling column 2 is formed in the bearing plate 03, and the cooling column 2 penetrates through the position-limiting hole 031, and is convenient to take out of the position-limiting hole 031, so that the cooling system can be disassembled and maintained.
Preferably, be seal structure between spacing hole 031 and the cooling post 2, the accessible realizes sealedly by slightly interference fit's mode, can realize better sealed effect, and does not influence the taking out of cooling post 2 from spacing hole 031.
Referring to fig. 3 or 5, in order to realize emergency power supply to the semiconductor chilling plate 1, the storage battery 5 is fixedly connected to the cold conducting surface 102, the connecting piece 6 is electrically connected between the storage battery 5 and the semiconductor chilling plate 1, the connecting piece 6 is used for electrically connecting the storage battery 5 and the semiconductor chilling plate 1, and when an external power supply of the semiconductor chilling plate 1 fails and stops supplying power, the storage battery 5 can supply power to the semiconductor chilling plate 1.
Specifically, a related power management module is arranged in the connecting piece 6 or the storage battery 5, so that the switching of the power supply can be realized, and the storage battery 5 can be charged by an external power supply in cooperation with a charging module.
Referring to fig. 3, the outer surface of the storage battery 5 is wrapped by the heat insulation layer 7, and the heat insulation layer 7 can prevent the storage battery 5 from being at a low temperature, so that the storage battery 5 cannot normally perform the effects of discharging and storing electric energy due to the low temperature.
Optionally, as shown in fig. 1 to 4, an auxiliary radiating pipe 9 is fixedly connected to the sealing frame 3, as shown in fig. 3 to 4, a second through hole 901 and a third through hole 902 are provided on the auxiliary radiating pipe 9, the sealing frame 3 is provided with the first through hole 301, the spaced cavity is communicated with the outside through the first through hole 301, the second through hole 901 and the third through hole 902 in sequence, and the third through hole 902 is located on the upper side of the semiconductor chilling plate 1, so that the heat dissipation pressure of the radiating surface 101 in a high-temperature environment can be conveniently realized.
During the use, as shown in figures 1-3, the length of the cooling column 2 can radiate the whole of the reactor main body 01, so that a better heat absorption and heat dissipation effect is convenient to provide, meanwhile, the semiconductor refrigeration sheet 1 can actively refrigerate, can perform forced heat dissipation on the reactor main body 01, has a better heat dissipation effect in a high-temperature environment, and has a better energy-saving effect compared with air cooling in the prior art.
According to the technical scheme, the invention has the following beneficial effects:
the semiconductor refrigeration piece can realize forced heat dissipation of the reactor main body, can ensure a better heat dissipation effect even in a high-temperature environment, has a better energy-saving effect, and can realize intelligent cooling of the reactor.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A reactor with an intelligent energy-saving cooling system comprises a reactor main body and is characterized in that a bearing plate is fixedly connected to the upper end of the reactor main body, a semiconductor refrigeration piece is arranged on the upper side of the bearing plate and comprises a heat dissipation surface and a cold conduction surface, a plurality of uniformly distributed heat dissipation fins are fixedly connected to the heat dissipation surface, a plurality of cooling columns are fixed to the cold conduction surface, and the plurality of cooling columns are distributed around the reactor main body;
be provided with sealed frame between semiconductor refrigeration piece and the loading board, be formed with the interval cavity between sealed frame, semiconductor refrigeration piece and the loading board, it is a plurality of the cooling column all runs through interval cavity and loading board.
2. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein the sealing frame is fixedly connected to the lower end of the semiconductor chilling plate, and the range formed by the lower end of the sealing frame is located in the range of the upper end of the bearing plate.
3. The reactor with the intelligent energy-saving cooling system according to claim 2, wherein a sealing ring is fixedly connected to the lower end of the sealing frame, and the sealing ring is an elastic sealing ring.
4. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein a storage battery is fixedly connected to the cold conducting surface, and a connecting piece is electrically connected between the storage battery and the semiconductor refrigerating sheet.
5. The reactor with the intelligent energy-saving cooling system according to claim 4, wherein the outer surface of the storage battery is wrapped with a heat insulation layer.
6. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein the cooling column comprises a cold guide column and a heat insulating sleeve wrapped on the cold guide column, and a cold guide notch is formed in the heat insulating sleeve.
7. The reactor with the intelligent energy-saving cooling system according to claim 6, wherein the opening direction of the cold-conducting notch is opposite to the reactor main body.
8. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein a limiting hole matched with the cooling column is formed in the bearing plate, and a sealing structure is arranged between the limiting hole and the cooling column.
9. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein an auxiliary radiating pipe is fixedly connected to the sealing frame, a second through hole and a third through hole are formed in the auxiliary radiating pipe, a first through hole is formed in the sealing frame, the spacing cavity is communicated with the outside through the first through hole, the second through hole and the third through hole in sequence, and the third through hole is located on the upper side of the semiconductor refrigerating sheet.
10. The reactor with the intelligent energy-saving cooling system according to claim 1, wherein a base is fixedly connected to the lower end of the reactor main body, and a plurality of threaded holes are formed in the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011568739.4A CN112652463A (en) | 2020-12-25 | 2020-12-25 | Reactor with intelligent energy-saving cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011568739.4A CN112652463A (en) | 2020-12-25 | 2020-12-25 | Reactor with intelligent energy-saving cooling system |
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| CN112652463A true CN112652463A (en) | 2021-04-13 |
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| CN202011568739.4A Pending CN112652463A (en) | 2020-12-25 | 2020-12-25 | Reactor with intelligent energy-saving cooling system |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011181804A (en) * | 2010-03-03 | 2011-09-15 | Denso Corp | Reactor device and power converter |
| CN207009270U (en) * | 2017-05-26 | 2018-02-13 | 东莞市咏隆电子有限公司 | It is a kind of can noise reduction high efficiency inductor |
| CN110164652A (en) * | 2018-01-30 | 2019-08-23 | 深圳市金顺怡电子有限公司 | A kind of transformer reactance device with heat-pipe radiator |
| CN110534292A (en) * | 2019-08-30 | 2019-12-03 | 国网山西省电力公司晋城供电公司 | Voltage transformer with high heat dispersion |
| CN110600231A (en) * | 2019-09-27 | 2019-12-20 | 西安嘉特电气设备有限公司 | Protection device for series filter reactor |
| CN210743737U (en) * | 2019-11-04 | 2020-06-12 | 凤冠电机（昆山）有限公司 | Transformer heat radiation structure |
| CN211507300U (en) * | 2020-03-18 | 2020-09-15 | 唐誉硕 | High temperature resistant power transformer |
| CN211698691U (en) * | 2020-04-16 | 2020-10-16 | 云南科腾电气设备有限公司 | Multifunctional PLC intelligent transformer cooler |
| CN212084807U (en) * | 2020-06-18 | 2020-12-04 | 东莞市光华实业有限公司 | Reactor for high-efficiency wind energy inverter |
-
2020
- 2020-12-25 CN CN202011568739.4A patent/CN112652463A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011181804A (en) * | 2010-03-03 | 2011-09-15 | Denso Corp | Reactor device and power converter |
| CN207009270U (en) * | 2017-05-26 | 2018-02-13 | 东莞市咏隆电子有限公司 | It is a kind of can noise reduction high efficiency inductor |
| CN110164652A (en) * | 2018-01-30 | 2019-08-23 | 深圳市金顺怡电子有限公司 | A kind of transformer reactance device with heat-pipe radiator |
| CN110534292A (en) * | 2019-08-30 | 2019-12-03 | 国网山西省电力公司晋城供电公司 | Voltage transformer with high heat dispersion |
| CN110600231A (en) * | 2019-09-27 | 2019-12-20 | 西安嘉特电气设备有限公司 | Protection device for series filter reactor |
| CN210743737U (en) * | 2019-11-04 | 2020-06-12 | 凤冠电机（昆山）有限公司 | Transformer heat radiation structure |
| CN211507300U (en) * | 2020-03-18 | 2020-09-15 | 唐誉硕 | High temperature resistant power transformer |
| CN211698691U (en) * | 2020-04-16 | 2020-10-16 | 云南科腾电气设备有限公司 | Multifunctional PLC intelligent transformer cooler |
| CN212084807U (en) * | 2020-06-18 | 2020-12-04 | 东莞市光华实业有限公司 | Reactor for high-efficiency wind energy inverter |
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