CN218450986U

CN218450986U - Silicon controlled rectifier driving module

Info

Publication number: CN218450986U
Application number: CN202221442482.2U
Authority: CN
Inventors: 兰敏
Original assignee: Anhui Chuanglan Century Integrated Circuit Co ltd
Current assignee: Anhui Chuanglan Century Integrated Circuit Co ltd
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2023-02-03
Anticipated expiration: 2032-06-10

Abstract

The utility model discloses a silicon controlled rectifier drive module, which comprises a substrate, the base plate top is equipped with the drive module body, drive module body lateral wall fixedly connected with heat sink, heat sink lateral wall fixedly connected with fin, the heat sink lateral wall is connected with first heat dissipation mechanism, drive module body bottom is provided with second heat dissipation mechanism. The utility model discloses a heat absorbing fin, the conducting strip, the setting of feed liquor pipe and radiating block, make the heat that the cooling liquid that circulates and flows produced the drive module body absorb, avoid the heat to pile up on the base plate, cooperate the use of fin simultaneously, great improvement the radiating effect, setting through the red copper bottom plate, and under the cooperation of cooling tube, the radiating efficiency of red copper bottom plate has been improved, be convenient for dispel the heat bottom the drive module body, avoid the drive module body to work under high temperature environment, the longer life of drive module body has been guaranteed.

Description

Silicon controlled rectifier driving module

Technical Field

The utility model relates to an electronic power equipment technical field especially relates to a silicon controlled rectifier drive module.

Background

The thyristor is called SCR, is a high-power electric element, also called thyristor, and has the advantages of small volume, high efficiency, long service life, etc. In an automatic control system, the device can be used as a high-power driving device to realize the control of high-power equipment by using a low-power control. It is widely applied to speed regulating systems, power regulating systems and follow-up systems of alternating current and direct current motors.

Current silicon controlled rectifier drive module is generally dispelled the heat through the fin in long-time use, and heat dispersion is relatively poor, because thermal continuous production, if just in time the heat dissipation leads to the product to break down easily and influences the stability of producing the performance, also appears burning out easily simultaneously etc. because of the problem that the life-span that the heat dissipation problem caused can not effectively be solved shortens.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem of poor radiating effect of the silicon controlled drive module in the prior art and providing a silicon controlled drive module.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the silicon controlled rectifier driving module comprises a substrate, wherein a driving module body is arranged above the substrate, the outer side wall of the driving module body is fixedly connected with a heat absorbing sheet, the outer side wall of the heat absorbing sheet is fixedly connected with a radiating fin, the outer side wall of the heat absorbing sheet is connected with a first radiating mechanism, and a second radiating mechanism is arranged at the bottom of the driving module body.

Preferably, the first heat dissipation mechanism comprises a heat dissipation block fixedly connected with the outer side wall of the substrate, a liquid inlet cavity is formed in the inner side wall of the heat dissipation block, a plurality of heat conduction pieces are arranged in the liquid inlet cavity, and the outer side walls of the heat conduction pieces penetrate through the liquid inlet cavity and are fixedly connected with the outer side walls of the heat absorption pieces.

Preferably, the outer side wall of the heat dissipation block is fixedly connected with a liquid inlet pipe, and the outer side wall of the heat dissipation block is fixedly connected with a connecting pipe.

Preferably, the second heat dissipation mechanism includes the red copper bottom plate with drive module body bottom fixed connection, red copper bottom plate bottom and base plate lateral wall fixed connection, the mounting groove has been seted up to red copper bottom plate lateral wall, mounting groove inside wall fixedly connected with cooling tube, the cooling tube is the wave setting, is convenient for increase the area of contact of cooling tube and red copper bottom plate.

Preferably, the connecting pipe is kept away from one end outer side wall of the radiating block and is fixedly connected with the outer side wall of the radiating pipe, and the radiating pipe is kept away from one end outer side wall of the connecting pipe and is fixedly connected with the liquid outlet pipe.

Preferably, the feed liquor intracavity lateral wall is seted up the through opening with heat conduction piece looks adaptation, through opening inside wall fixedly connected with sealing rubber sleeve, sealing rubber sleeve inside wall supports tight contact with the heat conduction piece lateral wall.

The utility model has the advantages that:

through the heat absorbing fin, the conducting fin, the setting of feed liquor pipe and radiating block, make the heat that the cooling liquid of circulation flow produced the drive module body absorb, avoid the heat to pile up on the base plate, the use of cooperation fin simultaneously, great improvement the radiating effect, setting through the red copper bottom plate, red copper has good heat dispersion, and under the cooperation of cooling tube, make the cooling liquid take away the heat on the red copper bottom plate, the radiating efficiency of red copper bottom plate has been improved, be convenient for dispel the heat bottom the drive module body, avoid the drive module body to work under high temperature environment, the longer life of drive module body has been guaranteed.

Drawings

Fig. 1 is a schematic structural diagram of a thyristor driving module provided by the present invention;

fig. 2 is the utility model provides a connection structure schematic diagram of red copper bottom plate and cooling tube among silicon controlled rectifier drive module.

In the figure: 1. a substrate; 2. a red copper base plate; 3. a driving module body; 4. a heat absorbing sheet; 5. a heat sink; 6. a heat dissipating block; 7. a heat conductive sheet; 8. a liquid inlet pipe; 9. a connecting pipe; 10. a radiating pipe; 11. a liquid outlet pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a silicon controlled rectifier driving module includes a substrate 1, the substrate 1 is a PCB substrate, which is not described herein in detail for the prior art, a driving module body 3 is disposed above the substrate 1, the driving module body 3 is the prior art, which is not described herein in detail, a heat absorbing sheet 4 is fixedly connected to an outer side wall of the driving module body 3, a heat dissipating sheet 5 is fixedly connected to an outer side wall of the heat absorbing sheet 4, and a first heat dissipating mechanism is connected to an outer side wall of the heat absorbing sheet 4.

Wherein, first heat dissipation mechanism include with 1 lateral wall fixed connection's of base plate radiating block 6, the feed liquor chamber has been seted up to 6 inside walls of radiating block, be provided with a plurality of conducting strips 7 in the feed liquor intracavity, 7 lateral walls of a plurality of conducting strips all run through the feed liquor chamber and with 4 lateral walls fixed connection of heat absorbing sheet, the feed liquor intracavity inside wall set up with the feed liquor of 7 looks adaptations of conducting strip run through the mouth, run through a mouthful inside wall fixedly connected with sealing rubber sleeve, sealing rubber sleeve inside wall supports tight contact with 7 lateral walls of conducting strip.

6 lateral wall fixedly connected with feed liquor pipes 8 of radiating block, 6 lateral wall fixedly connected with connecting pipes 9 of radiating block, through the setting of feed liquor pipe 8 and connecting pipe 9, make the coolant liquid circulation get into the feed liquor intracavity, make the coolant liquid with the heat absorption on the conducting strip 7, play and absorb the effect of detaching to the heat, avoid the heat to pile up around drive module body 3, improve the radiating effect.

3 bottoms of drive module body are provided with the second heat dissipation mechanism, the second heat dissipation mechanism include with 3 bottoms fixed connection's of drive module body red copper bottom plate 2, red copper radiating effect is good, be convenient for dispel the heat to 3 bottoms of drive module body, 2 bottoms of red copper bottom plate and 1 lateral wall fixed connection of base plate, the mounting groove has been seted up to 2 lateral walls of red copper bottom plate, mounting groove inside wall fixedly connected with cooling tube 10, cooling tube 10 is the wave setting, be convenient for increase cooling tube 10 and red copper bottom plate 2's area of contact, thereby be convenient for increase coolant liquid and red copper bottom plate 2's heat transfer area, improve the radiating efficiency to red copper bottom plate 2.

Connecting pipe 9 is kept away from radiating block 6 one end lateral wall and cooling tube 10 lateral wall fixed connection, and connecting pipe 9 one end lateral wall fixed connection drain pipe 11 is kept away from to cooling tube 10, and it needs to explain that, feed liquor pipe 8 and drain pipe 11 are connected with the cooling tank (not shown in the figure), improve the setting of feed liquor pipe 8 and drain pipe 11 for the coolant liquid carries out the circulation flow, is convenient for carry out long-time heat dissipation.

The utility model discloses in, the heat that produces on the heat absorbing sheet 4 will drive module body 3 absorbs, partial heat passes through fin 5 and outwards discharges, partial heat passes through conducting strip 7 and gets into the feed liquor intracavity, through coolant liquid and 7 contacts of conducting strip, make the coolant liquid absorb the heat, red copper bottom plate 2 absorbs the heat of 3 bottoms of drive module body simultaneously, dispel the heat 3 bottoms of drive module body, the coolant liquid passes through in connecting pipe 9 gets into cooling tube 10, absorb the heat on the red copper bottom plate 2, improve red copper bottom plate 2's radiating efficiency.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a silicon controlled rectifier drive module, includes base plate (1), its characterized in that, base plate (1) top is equipped with drive module body (3), drive module body (3) lateral wall fixedly connected with heat sink (4), heat sink (4) lateral wall fixedly connected with fin (5), heat sink (4) lateral wall is connected with first heat dissipation mechanism, drive module body (3) bottom is provided with second heat dissipation mechanism.

2. The silicon controlled rectifier driving module according to claim 1, wherein the first heat dissipation mechanism includes a heat dissipation block (6) fixedly connected to an outer side wall of the substrate (1), a liquid inlet cavity is formed in an inner side wall of the heat dissipation block (6), a plurality of heat conduction fins (7) are disposed in the liquid inlet cavity, and outer side walls of the plurality of heat conduction fins (7) penetrate through the liquid inlet cavity and are fixedly connected to outer side walls of the heat absorption fins (4).

3. The silicon controlled rectifier driving module according to claim 2, wherein a liquid inlet pipe (8) is fixedly connected to an outer side wall of the heat dissipation block (6), and a connection pipe (9) is fixedly connected to an outer side wall of the heat dissipation block (6).

4. The silicon controlled rectifier driving module according to claim 3, wherein the second heat dissipation mechanism includes a red copper base plate (2) fixedly connected to the bottom of the driving module body (3), the bottom of the red copper base plate (2) is fixedly connected to the outer side wall of the substrate (1), a mounting groove is formed on the outer side wall of the red copper base plate (2), a heat dissipation tube (10) is fixedly connected to the inner side wall of the mounting groove, the heat dissipation tube (10) is disposed in a wave shape, so as to increase the contact area between the heat dissipation tube (10) and the red copper base plate (2).

5. The silicon controlled rectifier driving module according to claim 4, wherein the connecting tube (9) is fixedly connected to the outer sidewall of the end away from the heat sink (6) and the outer sidewall of the heat pipe (10), and the outer sidewall of the end away from the connecting tube (9) of the heat pipe (10) is fixedly connected to the drain tube (11).

6. The silicon controlled rectifier driving module as claimed in claim 2, wherein the inner sidewall of the liquid inlet chamber is provided with a through hole adapted to the heat conducting strip (7), the inner sidewall of the through hole is fixedly connected with a sealing rubber sleeve, and the inner sidewall of the sealing rubber sleeve is in abutting contact with the outer sidewall of the heat conducting strip (7).