CN219876716U

CN219876716U - High-power supply chip heat abstractor

Info

Publication number: CN219876716U
Application number: CN202321250426.3U
Authority: CN
Inventors: 杨永旺
Original assignee: Wuxi Zhengyan Technology Co ltd
Current assignee: Wuxi Zhengyan Technology Co ltd
Priority date: 2023-05-23
Filing date: 2023-05-23
Publication date: 2023-10-20
Anticipated expiration: 2033-05-23

Abstract

The utility model discloses a high-power supply chip heat dissipation device which comprises a heat dissipation plate, wherein a chip body is attached to the bottom of the heat dissipation plate, a liquid cavity is communicated with the top of the heat dissipation plate, a driver is communicated with the inner wall of the liquid cavity, side plates are communicated with the outer walls of two sides of the heat dissipation plate, heat dissipation pipes are communicated with the outer walls of the inner sides of the side plates, a main pipe is communicated with the inner sides of the heat dissipation pipes, and a return pipe is communicated between the liquid cavity and the inner wall of the main pipe. Through the heating panel direct laminating with the top of chip body, when the chip work generates heat, its heat can directly be absorbed by the coolant liquid in the heating panel, then carries out the pressure boost through the driver of liquid intracavity for the coolant liquid removes to the curb plate of both sides, later reentrant cooling tube is interior and the heat dissipation, gathers in being responsible for afterwards, and finally flows back through the back flow, thereby can carry out the heat dissipation that lasts.

Description

High-power supply chip heat abstractor

Technical Field

The utility model belongs to the technical field of power chip heat dissipation, and particularly relates to a high-power chip heat dissipation device.

Background

The power chip is a chip which plays roles in converting, distributing, detecting and other electric energy management of electric energy in an electronic equipment system, is mainly responsible for identifying the power supply amplitude of a CPU, generating corresponding short moment waves and pushing a post-stage circuit to output power, has wide application range, has important significance in improving the performance of the whole machine, is directly related to the requirement of the system, is not separated from the electronic equipment for a moment in the world, is indispensable to the electronic system, and has direct influence on the performance of the whole machine.

But current power chip can produce a large amount of heat and pile up after carrying out long-time work, the relatively easily cause damage to chip itself, influence its life, so can adopt the means of installing the fin additional to dispel the heat usually, a radiating good LED illumination power chip that patent CN211424306U set forth can mutually support through piece offset plate and fin, the piece offset plate is with heat transfer fast to the fin on, dispel the heat by the fin again, can prolong the life of whole power chip to a certain extent, because the fin is direct with the air contact, and the radiating effect of air is not fine, so install a special radiating part additional for it.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide a high-power supply chip heat dissipation device which has the advantage of being convenient for chip heat dissipation.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high-power supply chip heat abstractor, includes the heating panel, the bottom laminating of heating panel has the chip body, the top intercommunication of heating panel has the liquid chamber, the inner wall intercommunication in liquid chamber has the driver, the both sides outer wall intercommunication of heating panel has the curb plate, the inboard outer wall intercommunication of curb plate has the cooling tube, the inboard intercommunication of cooling tube has the person in charge, the intercommunication has the back flow between the inner wall of liquid chamber and person in charge.

Preferably, the heat dissipation plate is made of copper, and the inner wall of the heat dissipation plate is hollow and fixedly connected with a heat dissipation plate.

Preferably, the driver comprises a motor, wherein the output end of the motor is fixedly connected with a spiral column, and the spiral column is positioned in the liquid cavity.

Preferably, the liquid cavity comprises a vertical barrel, a shaft groove is formed in the top of the vertical barrel, and a connecting port is formed in the outer wall of the vertical barrel.

Preferably, the shaft groove is used for the output end of the motor to pass through, and the connecting port is communicated with the inner wall of the return pipe.

Preferably, the side plate comprises a plate body, the inner wall of the plate body is hollow, a pipe groove is formed in the outer wall of the plate body, and the outer wall of the pipe groove is communicated with the radiating pipe.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the heating panel direct laminating with the top of chip body, when the chip work generates heat, its heat can directly be absorbed by the coolant liquid in the heating panel, then carries out the pressure boost through the driver of liquid intracavity for the coolant liquid removes to the curb plate of both sides, later reentrant cooling tube is interior and the heat dissipation, gathers in being responsible for afterwards, and finally flows back through the back flow, thereby can carry out the heat dissipation that lasts.

2. The heating panel adopts copper product, can let it have better heat conduction effect, through the setting of fin, can improve the area of contact of fin and coolant liquid to improve the heat conversion rate, can control the screw column through the motor and rotate, make screw column control coolant liquid move down and to the bottom pressure boost, thereby can carry out the coolant liquid circulation.

Drawings

FIG. 1 is a schematic diagram of the main structure of the present utility model;

FIG. 2 is a schematic view of a heat dissipating component according to the present utility model;

FIG. 3 is a schematic view of the structure of the return tube of the present utility model;

FIG. 4 is a schematic diagram of a driver structure according to the present utility model;

fig. 5 is a schematic view of the internal structure of the heat dissipating plate of the present utility model.

In the figure: 1. a heat dissipation plate; 2. a liquid chamber; 3. a driver; 4. a side plate; 5. a heat radiating pipe; 6. a main pipe; 7. a return pipe; 8. a heat sink; 9. a chip body; 200. a vertical barrel; 201. a shaft groove; 202. a connection port; 300. a motor; 301. a screw column; 400. a plate body; 401. a tube groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a high-power supply chip heat abstractor, includes heating panel 1, and the laminating of the bottom of heating panel 1 has chip body 9, and the top intercommunication of heating panel 1 has liquid chamber 2, and the inner wall intercommunication of liquid chamber 2 has driver 3, and the both sides outer wall intercommunication of heating panel 1 has curb plate 4, and the inboard outer wall intercommunication of curb plate 4 has cooling tube 5, and the inboard intercommunication of cooling tube 5 has and is responsible for 6, and the intercommunication has back flow 7 between the inner wall of liquid chamber 2 and responsible for 6.

In this embodiment, through the direct laminating of heating panel 1 with the top of chip body 9, when the chip work generates heat, its heat can directly be absorbed by the coolant liquid in the heating panel 1, then carries out the pressure boost through the driver 3 in the liquid chamber 2 for the coolant liquid removes to curb plate 4 of both sides, later reentrant cooling tube 5 is interior and the heat dissipation, then gathers in being responsible for 6, finally flows back through back flow 7, thereby can carry out the heat dissipation that lasts.

Specifically, the heat dissipation plate 1 is made of copper, and the inner wall of the heat dissipation plate 1 is hollow and fixedly connected with the heat dissipation plate 8.

In this embodiment, the heat dissipation plate 1 is made of copper material, which has a good heat conduction effect, and the heat dissipation plate 8 is arranged to increase the contact area between the heat dissipation plate 8 and the cooling liquid, thereby increasing the heat conversion rate.

Specifically, the driver 3 includes a motor 300, and an output end of the motor 300 is fixedly connected with a screw column 301, and the screw column 301 is located in the liquid cavity 2.

In this embodiment, the rotation of the screw 301 is controlled by the motor 300, so that the screw 301 controls the cooling liquid to move down and pressurizes the bottom, thereby allowing the cooling liquid to circulate.

Specifically, the liquid chamber 2 includes a vertical barrel 200, a shaft groove 201 is formed at the top of the vertical barrel 200, and a connection port 202 is formed on the outer wall of the vertical barrel 200.

In this embodiment, the vertical tub 200 can pass through the output of the motor 300 via the shaft groove 201, and the cooling liquid can enter the vertical tub 200 via the connection port 202.

Specifically, the shaft groove 201 is used for the output end of the motor 300 to pass through, and the connection port 202 is communicated with the inner wall of the return pipe 7.

In this embodiment, the connection port 202 communicates with the return pipe 7, so that the return pipe 7 can let the cooling liquid directly enter the liquid chamber 2 through the connection port 202.

Specifically, the side plate 4 includes a plate body 400, the inner wall of the plate body 400 is hollow, the outer wall of the plate body 400 is provided with a pipe groove 401, and the outer wall of the pipe groove 401 is communicated with the radiating pipe 5.

In this embodiment, the plate body 400 can be communicated with the radiating pipe 5 through the pipe groove 401, so that the radiating pipe 5 can allow the cooling liquid to enter the main pipe 6.

The working principle and the using flow of the utility model are as follows: through the direct laminating of heating panel 1 with the top of chip body 9, when the chip work generates heat, its heat can directly be absorbed by the coolant liquid in the heating panel 1, then carry out the pressure boost through driver 3 in the liquid chamber 2, make the coolant liquid remove to curb plate 4 of both sides, afterwards in getting into cooling tube 5 and heat dissipation, then assemble in being responsible for 6, finally flow back through back flow 7, thereby can continuously dispel the heat, heating panel 1 adopts the copper product, can let it have better heat conduction effect, through the setting of fin 8, can improve the area of contact of fin 8 with the coolant liquid, thereby improve the thermal conversion rate, can control the screw 301 through motor 300 and rotate, make screw 301 control coolant liquid move down and to the bottom pressure boost, thereby can carry out the coolant liquid circulation, upright barrel 200 can let the output of motor 300 pass through the axle groove 201, can let the coolant liquid get into upright barrel 200 through connector 202, 202 and 7 are linked together, make 7 can let the coolant liquid directly get into liquid chamber 2 through connector 202, plate 400 can realize through tube groove 401 and can realize with back flow 7, can let the coolant liquid in the main tube 5 connector that the cooling tube 5 is cooled down.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-power supply chip heat abstractor, includes heating panel (1), the laminating of the bottom of heating panel (1) has chip body (9), its characterized in that: the top intercommunication of heating panel (1) has liquid chamber (2), the inner wall intercommunication of liquid chamber (2) has driver (3), the both sides outer wall intercommunication of heating panel (1) has curb plate (4), the inboard outer wall intercommunication of curb plate (4) has cooling tube (5), the inboard intercommunication of cooling tube (5) has main pipe (6), the intercommunication has back flow (7) between the inner wall of liquid chamber (2) and main pipe (6).

2. The high power supply chip heat sink as claimed in claim 1, wherein: the heat dissipation plate (1) is made of copper, and the inner wall of the heat dissipation plate (1) is hollow and fixedly connected with heat dissipation fins (8).

3. The high power supply chip heat sink as claimed in claim 1, wherein: the driver (3) comprises a motor (300), wherein the output end of the motor (300) is fixedly connected with a spiral column (301), and the spiral column (301) is positioned in the liquid cavity (2).

4. The high power supply chip heat sink as claimed in claim 1, wherein: the liquid cavity (2) comprises a vertical barrel (200), a shaft groove (201) is formed in the top of the vertical barrel (200), and a connecting port (202) is formed in the outer wall of the vertical barrel (200).

5. The high power supply chip heat sink as set forth in claim 4, wherein: the shaft groove (201) is used for enabling the output end of the motor (300) to pass through, and the connecting port (202) is communicated with the inner wall of the return pipe (7).

6. The high power supply chip heat sink as claimed in claim 1, wherein: the side plate (4) comprises a plate body (400), the inner wall of the plate body (400) is hollow, a pipe groove (401) is formed in the outer wall of the plate body (400), and the outer wall of the pipe groove (401) is communicated with the radiating pipe (5).