AU2021102059A4 - A laser module - Google Patents
A laser module Download PDFInfo
- Publication number
- AU2021102059A4 AU2021102059A4 AU2021102059A AU2021102059A AU2021102059A4 AU 2021102059 A4 AU2021102059 A4 AU 2021102059A4 AU 2021102059 A AU2021102059 A AU 2021102059A AU 2021102059 A AU2021102059 A AU 2021102059A AU 2021102059 A4 AU2021102059 A4 AU 2021102059A4
- Authority
- AU
- Australia
- Prior art keywords
- laser module
- liquid cooling
- module according
- bottom plate
- metal bottom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 35
- 238000005192 partition Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Lasers (AREA)
Abstract
The invention discloses a laser module, which comprises a metal bottom plate, wherein
the upper end surface of the metal bottom plate is provided with laser components; the lower
end surface of the metal bottom plate is connected with a base; and a liquid cooling cavity and
a water inlet and a water outlet communicated with the liquid cooling cavity are arranged on
the base. The lower end surface of the metal bottom plate is provided with a flow passage
partition plate for prolonging the liquid flow time in the liquid cooling cavity and a turbulence
structure for increasing the liquid flow resistance in the liquid cooling cavity. The invention
not only has simple structure and convenient processing, but also can effectively meet the heat
dissipation performance of high-power equipment.
1/3
FIGURES
1
3
Figure 1
6
0,2
j-6
e.• 5
55 0
1
Figure 2
Description
1/3 FIGURES
1 3 Figure 1
6 0,2 j-6 e.• 5
0 55 1
Figure 2
A laser module
The invention relates to the technical field of lasers, and is a laser module capable of
realizing liquid cooling function.
With the continuous development of science and technology, high-power processing and manufacturing equipment has been widely used in equipment manufacturing industry. Because some internal modules of high-power processing and manufacturing equipment will generate a lot of heat when working, it is necessary to arrange corresponding heat dissipation components at the heating module to cool it down and prevent it from being damaged due to high temperature. At present, the cooling components mainly adopt air-cooled cooling components or liquid-cooled cooling components. Compared with air-cooled cooling components, liquid cooled cooling components have better cooling performance, so high-power processing and manufacturing equipment generally adopts liquid cooling to reduce temperature at present. In the prior art, the structure of the liquid-cooled heat dissipation assembly generally adopts a flow channel partition plate arranged in the liquid-cooled cavity to form a plurality of diversion channels communicated in parallel, and heat dissipation is realized by matching with the heat dissipation fins on the metal bottom plate, as shown in Chinese patents CN201115234, CN208300202 and CN206024400, although the diversion channels of the above patents can prolong the liquid flow time in the liquid-cooled cavity to a certain extent and take away a certain amount of heat. However, for equipment with large heat generation (such as pump module of fiber laser, etc.), the setting of diversion channel often cannot meet the requirements of heat dissipation performance, especially when the base is made of non-thermal conductive material. Generally, the liquid-cooled heat dissipation assembly dissipates heat by exchanging
heat between the laser module and the cover plate of the liquid-cooled heat dissipation
assembly, as shown in Chinese patents CN202159888U and CN206962242U, the above technical solutions all have the following problems: there is a slight gap between the metal bottom plate of the laser module and the cover plate of the water-cooled plate, or the thermal conductivity of the intermediate heat-conducting pad is low, which leads to poor water-cooled heat dissipation effect.
In view of the defects in the prior art, the invention discloses a novel laser module, which is not only simple in structure and convenient to process, but also can effectively meet the heat dissipation performance of high-power equipment. In order to solve the above technical problems, the invention adopts such a laser module, which comprises a metal bottom plate, wherein the upper end face of the metal bottom plate is provided with laser components; the lower end face of the metal bottom plate is connected with a base; the base is provided with a liquid cooling cavity, a water inlet and a water outlet communicated with the liquid cooling cavity; and the lower end face of the metal bottom plate is provided with a flow passage partition plate for prolonging the liquid flow time in the liquid cooling cavity and a turbulence structure for increasing the liquid flow resistance in the liquid cooling cavity. In a preferred embodiment of the invention, the spoiler structure is a spoiler column vertically arranged on the end face of the metal bottom plate. In a preferred embodiment of the invention, the shape of the spoiler column is cylindrical or/and strip or/and v-shaped. In a preferred embodiment of the present invention, a reinforcing rib arranged perpendicularly to the partition plate is arranged between two adjacent partition plates. In a preferred embodiment of the present invention, both sides of the partition plate are provided with reinforcing ribs arranged in parallel with the partition plate. In a preferred embodiment of the invention, a reinforcing rib is arranged between the reinforcing rib and the partition plate. In a preferred embodiment of the invention, the base is provided with a plurality of liquid cooling cavities. In a preferred embodiment of the present invention, the base is made of plastic.
In a preferred embodiment of the invention, a rubber sealing ring is arranged between the base and the metal bottom plate. In a preferred embodiment of the present invention, the laser module is a semiconductor laser module. The invention has the advantages of compact structure, high reliability, simple installation process, good heat dissipation performance and high stability; meanwhile, compared with the traditional installation mode, the thermal conductivity is improved, so that the heat dissipation effect is improved; and compared with the prior art, the water cooling plate has smaller volume and lighter weight under the condition of realizing the same heat conduction. According to the invention, the metal bottom plate and the water cooling plate of the laser module are combined into a whole part, so that the fine gap between the joint surfaces of the two parts is eliminated, the heat conductivity coefficient of heat conduction is greatly improved, and the time for the water cooling plate to reach the heat balance state can be shortened at the same time; Furthermore, by adding a turbulence structure on the metal bottom plate, the flow speed of liquid flowing in the liquid cooling cavity is effectively delayed, the contact time between the metal bottom plate and the liquid is increased, and the heat dissipation efficiency of the metal bottom plate is improved, so that the invention can be effectively suitable for cooling and lowering the temperature of heating positions of various high-power equipment; Furthermore, various spoiler columns disclosed by the invention can be reasonably combined and arranged according to the heat dissipation requirement; Furthermore, by adding reinforcing ribs and ribs beside the partition plate, the invention not only effectively increases the strength of the partition plate and facilitates its processing and manufacturing, but also increases the contact area between the metal bottom plate and the liquid in the liquid cooling cavity and further improves the heat dissipation efficiency,Furthermore, the base of the invention is made of plastic, which is convenient for processing and manufacturing and has low cost. BRIEF DESCRIPTION OF THE FIGURES
Fig. 1 is a schematic diagram of a laser module according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of a laser module according to an embodiment of the present invention; (The laser components on the upper end face of the metal bottom plate have been hidden) Fig. 3 is a schematic diagram of a metal bottom plate of a laser module according to an embodiment of the present invention; Fig. 4 is a schematic diagram of a metal bottom plate of a laser module according to an embodiment of the present invention; Fig. 5 is a schematic diagram of a metal bottom plate of a laser module according to an embodiment of the present invention; Fig. 6 is a schematic diagram of a metal bottom plate of a laser module according to an embodiment of the present invention; In the drawing: 1- base, 2- metal bottom plate, 3- water inlet, 4- water outlet, 5 channel partition plate, 6- spoiler structure, 7- reinforcing rib, 8- reinforcing rib, 9- rubber sealing ring, 1.1- liquid cooling cavity, 2.1- laser components.
In order to make the object, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail with reference to the drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention. As shown in the attached drawings of the specification, the invention discloses a laser module, which comprises a base 1 which is preferably made of plastic. The base 1 is provided with a liquid cooling cavity 1.1 and a water inlet 3 and a water outlet 4 which are communicated with the liquid cooling cavity 1.1. A metal bottom plate 2 is covered above the liquid cooling cavity 1.1, which is a self-contained part of the laser module. The metal bottom plate 2 is fixedly connected with the liquid cooling chamber 1.1 by screws and threads, and the lower end surface of the metal bottom plate 2 is provided with a flow channel partition plate 5 for prolonging the liquid flowing time in the liquid cooling chamber 1.1. A plurality of flow channel partition plates 5 are arranged at intervals in parallel and staggered positions to form an S-shaped flow channel, and the height of the flow channel partition plate 5 can be slightly larger than the depth of the liquid cooling chamber 1.1, thus ensuring that the water flow of two flow channels separated by the flow channel partition plate 5 in the liquid cooling chamber 1.1 does not cross. The spoiler structure 6 of the present invention is a spoiler column or a heat dissipation fin vertically arranged on the end face of the metal bottom plate 2, and the spoiler column is cylindrical or/and long strip or/and V-shaped. The spoiler column on the metal bottom plate 2 can adopt one or more of the above shapes, which can be selected according to the heat dissipation requirements. Preferably, reinforcing ribs 7 are arranged vertically between two adjacent partition plates 5 of the present invention. Two sides of the partition plate 5 are provided with reinforcing ribs 8 arranged in parallel with the partition plate 5. A reinforcing rib is arranged between the reinforcing rib 8 and the partition plate 5. Preferably, the base 1 is provided with a plurality of liquid cooling cavities 1.1, and a rubber sealing ring is arranged between the base 1 and the metal bottom plate 2. It should be understood that the above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited to this, and any change or substitution that can be easily thought of by any person familiar with the field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A laser module comprising a metal base plate (2), said metal base plate (2) having laser components provided on the upper surface, characterized in that: said metal base plate (2) has a base (1) attached to the lower surface, said base (1) having a liquid cooling chamber (1.1) and a water inlet (3) and outlet (4) connected to the liquid cooling chamber (1.1), said metal base plate (2) having a There is a flow divider (5) for extending the liquid flow time in the liquid cooling chamber (1.1) and a flow disturbance structure (6) for increasing the flow resistance of the liquid in the liquid cooling chamber (1.1).
2. The laser module according to claim 1, characterized in that the spoiler structure (6) is a spoiler column vertically arranged on the end face of the metal bottom plate (2).
3.The laser module according to claim 2, wherein the shape of the spoiler column is cylindrical or/and strip or/and V-shaped.
4.The laser module according to claim 1, characterized in that a reinforcing rib (7) arranged perpendicularly to the partition plate (5) is arranged between two adjacent partition plates.
5.The laser module according to claim 1, characterized in that the two sides of the partition plate (5) are provided with reinforcing ribs (8) arranged in parallel with the partition plate.
6.The laser module according to claim 5, characterized in that a reinforcing rib (7) is arranged between the reinforcing rib (8) and the partition plate (5).
7.The laser module according to claim 1, characterized in that a plurality of liquid cooling cavities (1.1) are arranged on the base (1).
8.The laser module according to claim 1, characterized in that the base (1) is made of plastic.
9.The laser module according to claim 1, characterized in that a rubber sealing ring (9) is arranged between the base (1) and the metal bottom plate (2).
10.The laser module according to claim 1, wherein the laser module is a semiconductor laser module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2021102059A AU2021102059A4 (en) | 2021-04-20 | 2021-04-20 | A laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2021102059A AU2021102059A4 (en) | 2021-04-20 | 2021-04-20 | A laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2021102059A4 true AU2021102059A4 (en) | 2021-06-10 |
Family
ID=76215564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2021102059A Ceased AU2021102059A4 (en) | 2021-04-20 | 2021-04-20 | A laser module |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2021102059A4 (en) |
-
2021
- 2021-04-20 AU AU2021102059A patent/AU2021102059A4/en not_active Ceased
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGI | Letters patent sealed or granted (innovation patent) | ||
| MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |