CN210052736U

CN210052736U - Two-sided microchannel water-cooling plate

Info

Publication number: CN210052736U
Application number: CN201921975699.8U
Authority: CN
Inventors: 常青保
Original assignee: Chengdu Common Radiator Co Ltd
Current assignee: Chengdu Common Radiator Co Ltd
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2020-02-11
Anticipated expiration: 2029-11-15

Abstract

The utility model relates to a two-sided microchannel water-cooling board, including the base frame, microchannel fin and backup pad, the base frame is for having the framework structure that runs through the open-ended, open one side of base frame has the medium entry, the opposite side is opened there is the medium export, two microchannel fin symmetries set up in the both sides of base frame, the microchannel fin includes heat absorption base plate and heat dissipation dentate lamina, the edge sealing connection of heat absorption base plate is at the opening part of base frame, the heat dissipation dentate lamina is located the one side of heat absorption base plate on the surface, the inboard of base frame is stretched into to the heat dissipation dentate lamina, the heat dissipation dentate lamina comprises the fin that the polylith is parallel to each other, regional formation microchannel between two adjacent fin, the opposite side of heat absorption base plate. The utility model has the advantages that: the heat dissipation effect is good; the structure is compact, the structural space of the whole machine is saved, and the material cost is saved; the production cost is low, and the radiating fins can be manufactured according to the thermal design requirement conditions; the heat dissipation structure can be applied to heat dissipation structures with more power electronic components.

Description

Two-sided microchannel water-cooling plate

Technical Field

The utility model relates to a radiator technical field, especially a two-sided microchannel water-cooling board.

Background

In recent years, with the development of scientific technology, the technologies available to people, such as convenient mobile technology, 5G mobile communication, intelligent LED street lamps, industrial 4.0 change, the continuous development of the Internet of things, new energy automobile technology and the like, make the life of people more convenient, safe and environment-friendly. High-reliability semiconductor power device products are developing towards miniaturization, high integration, high speed, high efficiency and high power, the semiconductor devices inevitably generate more heat than before, and if the heat dissipation problem of the semiconductor devices is not solved well, the high temperature directly causes the efficiency of the semiconductor devices to be reduced. In order to stabilize the performance of a semiconductor device, the heat dissipation design of the semiconductor device becomes extremely important, otherwise the performance of the device cannot be improved or the device cannot work normally, and the temperature of the semiconductor device exceeds the allowable maximum temperature, thereby causing the device to be damaged.

The existing radiator is generally divided into an air-cooled heat dissipation system and a water-cooled heat dissipation system, the water-cooled heat dissipation system is composed of a water-cooled plate, a water pipe and a water pump, the water-cooled plate is provided with a water inlet and a water outlet, the water inlet and the water outlet form a circulation water path through the water pipe and the water pump, and a cooling water channel is arranged inside the water-cooled plate. At present, as shown in fig. 1, in order to improve a water cooling effect, a water channel of an "M" structure is generally used in a conventional water cooling plate. The existing M-shaped water channel has limited heat exchange surface area, cannot fully utilize the surface of the whole water cooling plate, and has poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a two-sided microchannel water-cooling board, in the finite volume space, obtain great heat exchange area to reach better radiating effect, be applicable to the more heat dissipation parameter requirement of power electronic components.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a two-sided microchannel water-cooling board, includes base frame, microchannel fin and backup pad, the base frame is for having the frame structure that runs through the opening, open one side of base frame has the medium entry, and the opposite side is opened there is the medium export, and two microchannel fin symmetries set up in the both sides of base frame, the microchannel fin includes endothermic base plate and heat dissipation dentate, the edge sealing connection of endothermic base plate is at the opening part of base frame, the heat dissipation dentate is located on the surface of one side of endothermic base plate, the inboard of base frame is stretched into to the heat dissipation dentate, the heat dissipation dentate comprises the fin that the polylith is parallel to each other, and regional formation microchannel between two adjacent fin, the opposite side of heat absorption base plate is equipped with power electronic components and parts on the surface.

Further, the axis of the medium inlet is coincident with the axis of the medium outlet and is parallel to the length direction of the base frame.

Further, the middle part of the heat dissipation tooth piece is provided with an avoiding groove, the avoiding groove is aligned with the medium inlet, a supporting plate is arranged in the avoiding groove, and the upper surface and the lower surface of the supporting plate are respectively abutted to the heat absorption base plate on the corresponding side.

Furthermore, two ends of the supporting plate are respectively provided with a flow guide surface, the flow guide surfaces are cylindrical structures, and the axis of the medium inlet is vertically intersected with the axis of the flow guide surfaces.

Further, the radiating fins are perpendicular to the heat absorbing substrate, and the extending direction of the micro-channel is parallel to the axis of the medium inlet.

Furthermore, the heat dissipation tooth piece and the heat absorption substrate are of an integrated structure.

Further, the heat absorption substrate is hermetically connected to the opening of the base frame in a welding manner.

Further, the welding mode is one of vacuum electron beam welding, diffusion welding or friction stir welding.

Furthermore, the base frame and the microchannel cooling fin are made of copper or aluminum.

Furthermore, internal threads are arranged on the inner wall of the medium inlet and the inner wall of the medium outlet.

The utility model has the advantages of it is following:

1. the utility model discloses a microchannel water-cooling board is in finite volume space, and the heat dissipation pick in the water-cooling board runner is big with medium fluidic heat exchange area, obtains great heat exchange area to reach better radiating effect.

2. The product has compact structure, saves the structural space of the whole machine, saves the material cost and has high heat dissipation efficiency.

3. The implementation is easy, the related research and development time such as a die does not need to be increased, and the radiating fins can be manufactured according to the thermal design requirement conditions.

4. The utility model discloses set up the microchannel fin respectively in the both sides of base frame, it is applicable in the more heat radiation structure of power electronic components.

Drawings

FIG. 1 is a schematic structural diagram of a conventional water-cooled panel;

FIG. 2 is a schematic structural view of the present invention;

fig. 3 is a schematic diagram of the explosion structure of the present invention;

FIG. 4 is a schematic structural view of a microchannel heat sink of the present invention;

fig. 5 is a schematic view of the internal structure of the present invention;

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;

in the figure: the heat dissipation structure comprises a base frame 1, a medium inlet 1a, a medium outlet 1b, a microchannel heat dissipation plate 2, a heat absorption substrate 2a, a heat dissipation toothed sheet 2b, an avoidance groove 2c, a support plate 3, a flow guide surface 3a and a power electronic component 4.

Detailed Description

The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.

As shown in fig. 2 to 6, a double-sided microchannel water cooling plate comprises a base frame 1, microchannel fins 2 and a support plate 3, wherein the base frame 1 is a frame structure with a through opening, one side of the base frame 1 is provided with a medium inlet 1a, the other side is provided with a medium outlet 1b, the two microchannel fins 2 are symmetrically arranged on two sides of the base frame 1, the microchannel fins 2 comprise a heat absorption substrate 2a and heat dissipation fins 2b, the edge of the heat absorption substrate 2a is hermetically connected to the opening of the base frame 1, the heat dissipation fins 2b are arranged on the surface of one side of the heat absorption substrate 2a, the heat dissipation fins 2b extend into the inner side of the base frame 1, the heat dissipation fins 2b are composed of a plurality of parallel fins, a microchannel is formed in an area between two adjacent fins, the microchannel can be a straight channel or a curved channel, the surface of the other side of the heat absorption substrate 2a is provided with a power electronic component 4, the power electronic component 4 is a heat source, and generally, components such as an IGBT (insulated gate bipolar transistor), a TEC (thermoelectric cooler) and the like are arranged, and the components can emit a large amount of heat during working.

Further, as shown in fig. 3, the axis of the medium inlet 1a coincides with the axis of the medium outlet 1b, and is parallel to the longitudinal direction of the base frame 1.

Further, as shown in fig. 3, 4 and 5, an avoiding groove 2c is provided in the middle of the heat dissipating fins 2b, the avoiding groove 2c is aligned with the medium inlet 1a, a support plate 3 is provided in the avoiding groove 2c, and the upper and lower surfaces of the support plate 3 are respectively abutted to the heat absorbing substrates 2a on the corresponding sides. The supporting plate 3 serves to support the heat absorbing substrates 2a at both sides thereof, and increases structural strength in a large space, so that it is not easily deformed during use.

Further, as shown in fig. 3 and 6, two ends of the support plate 3 are respectively provided with a flow guide surface 3a, the flow guide surfaces 3a are cylindrical structures, and an axis of the medium inlet 1a is perpendicular to an axis of the flow guide surfaces 3 a. When the fluid enters from the medium inlet 1a, the diversion surface 3a can perform a diversion function, so that the medium flows towards the micro-channels on two sides.

More preferably, as shown in fig. 3 and 4, the heat radiation fins 2b are perpendicular to the heat absorbing substrate 2a, and the extension direction of the micro channel is parallel to the axis of the medium inlet 1 a.

More preferably, the heat dissipation fins 2b and the heat absorption substrate 2a are formed integrally, and have no thermal resistance, so as to ensure high thermal conductivity of the microchannel heat dissipation plate 2.

Further, the heat absorbing substrate 2a is hermetically connected to the opening of the base frame 1 by welding, in this embodiment, the welding mode is one of vacuum electron beam welding, diffusion welding or friction stir welding, which is more environment-friendly, and the sealing effect after welding completely meets the requirement.

More preferably, the base frame 1 and the microchannel heat sink 2 are made of copper or aluminum, and both the copper material and the aluminum material have a good heat dissipation effect.

Further, the inner wall of the medium inlet 1a and the inner wall of the medium outlet 1b are both provided with internal threads. According to different flow rate designs of fluid media, different internal thread hole diameters are selected for connecting joints of the fluid media.

The working process of the utility model is as follows: the heat generated by the power electronic component 4 is transferred to the heat-absorbing substrate 2a, a cooling medium (cooling liquid such as deionized water, pure water, antifreeze and the like) is shunted from the medium inlet 1a through the diversion surface 3a and then enters the microchannel, because the heat-dissipating toothed sheet 2b is positioned in the base frame 1, the cooling medium is contacted with the heat-dissipating toothed sheet 2b, so that the temperature of the heat-dissipating toothed sheet 2b is reduced, when the temperature of the heat-absorbing substrate 2a is higher than that of the heat-dissipating toothed sheet 2b, the heat on the heat-absorbing substrate 2a is transferred to the heat-dissipating toothed sheet 2b, and then the heat is taken away by the continuous cooling medium and is discharged from the medium outlet 1 b.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A two-sided microchannel water-cooling board which characterized in that: comprises a base frame (1), a micro-channel radiating fin (2) and a supporting plate (3), the base frame (1) is a frame structure with a through opening, one side of the base frame (1) is provided with a medium inlet (1 a), the other side of the base frame is provided with a medium outlet (1 b), the two micro-channel radiating fins (2) are symmetrically arranged at two sides of the base frame (1), the microchannel heat sink (2) comprises a heat absorbing substrate (2 a) and heat dissipating fins (2 b), the edge of the heat absorbing substrate (2 a) is connected with the opening of the base frame (1) in a sealing way, the heat dissipation tooth sheet (2 b) is arranged on the surface of one side of the heat absorption substrate (2 a), the radiating fins (2 b) extend into the inner side of the base frame (1), the radiating fins (2 b) are composed of a plurality of radiating fins which are parallel to each other, micro-channels are formed in the area between two adjacent radiating fins, and a power electronic component (4) is arranged on the surface of the other side of the heat-absorbing substrate (2 a).

2. A two-sided microchannel water cooled plate as set forth in claim 1, wherein: the axis of the medium inlet (1 a) is coincident with the axis of the medium outlet (1 b) and is parallel to the length direction of the base frame (1).

3. A two-sided microchannel water-cooled plate as set forth in claim 2, wherein: the middle part of heat dissipation pick (2 b) is equipped with dodges groove (2 c), dodge groove (2 c) and medium entry (1 a) and align, be equipped with backup pad (3) in should dodging groove (2 c), the upper and lower surface of backup pad (3) respectively with the heat absorption base plate (2 a) butt of corresponding side.

4. A two-sided microchannel water-cooled plate as set forth in claim 3, wherein: the two ends of the supporting plate (3) are respectively provided with a flow guide surface (3 a), the flow guide surfaces (3 a) are cylindrical structures, and the axis of the medium inlet (1 a) is vertically intersected with the axis of the flow guide surfaces (3 a).

5. A two-sided microchannel water cooled plate as set forth in claim 1, wherein: the radiating fins (2 b) are perpendicular to the heat absorbing substrate (2 a), and the extension direction of the micro-channel is parallel to the axis of the medium inlet (1 a).

6. A two-sided microchannel water cooled plate as set forth in claim 1, wherein: the heat dissipation tooth piece (2 b) and the heat absorption substrate (2 a) are of an integrated structure.

7. A two-sided microchannel water cooled plate as set forth in claim 1, wherein: the heat absorption substrate (2 a) is hermetically connected to the opening of the base frame (1) in a welding mode.

8. A two-sided microchannel water-cooled plate as set forth in claim 7, wherein: the welding mode is one of vacuum electron beam welding, diffusion welding or friction stir welding.

9. A two-sided microchannel water-cooled plate as set forth in any one of claims 1 to 8, wherein: the base frame (1) and the microchannel cooling fins (2) are made of copper or aluminum.

10. A two-sided microchannel water cooled plate as set forth in claim 9, wherein: internal threads are arranged on the inner wall of the medium inlet (1 a) and the inner wall of the medium outlet (1 b).