CN213124433U - Microchannel liquid cooling radiator and lead cold plug-in components - Google Patents
Microchannel liquid cooling radiator and lead cold plug-in components Download PDFInfo
- Publication number
- CN213124433U CN213124433U CN202022520829.8U CN202022520829U CN213124433U CN 213124433 U CN213124433 U CN 213124433U CN 202022520829 U CN202022520829 U CN 202022520829U CN 213124433 U CN213124433 U CN 213124433U
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- plate
- plug
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- 239000007788 liquid Substances 0.000 title claims abstract description 76
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 238000005192 partition Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 3
- 238000010622 cold drawing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a microchannel liquid cooling radiator and lead cold plug-in components, including packaging plate, apron, packaging plate fixes and form the liquid cavity between the two through the fixed part with the apron, packaging plate's interior bottom surface is equipped with the heat dissipation post of even setting, be fixed with the baffle between the inner wall of apron, set up the exchange mouth that even setting and correspond with the heat dissipation post on the baffle, the opening of circulation has been seted up to the top one end of baffle, the top of apron is connected with and derives liquid pipe, leading-in liquid pipe, the lower tip that derives liquid pipe runs through the baffle to make the liquid cooling radiator when using, make better the exchanging of circulation cold liquid, and make its holistic leakproofness better, make its better satisfy the demand on the use, the radiator is restricted in the cold plug-in components simultaneously, makes its convenient whole use of installing.
Description
Technical Field
The utility model relates to a liquid cooling radiator technical field specifically is a microchannel liquid cooling radiator and lead cold plug-in components.
Background
With the increasing integration degree of the plug-in, the heat dissipation problem of the power chip with high heat flux density on the plug-in printed board becomes the key point of structural design and thermal design research.
Traditional heat conduction mode includes forced air cooling and liquid cooling, and wherein most heat dissipation is all at the chip package completion back, takes away the heat of the chip that will generate heat through the cold drawing, and the cold drawing reduces thermal contact resistance through heat conduction gasket or heat conduction silicone grease with the chip surface that generates heat, and the cold drawing can be the cold type of leading simultaneously or the liquid cooling formula that has the coolant liquid runner inside, and this kind of mode structural design is simple relatively, and the reliability is higher.
However, the application of the present ultra-large-scale gate array chip, the transmitting and receiving chip and the like causes the heating power of the chip to sharply rise, while the existing liquid cooling mode can take away the heat of the chip, the flowing mode of the circulating cold liquid in the liquid cavity is improved, and in order to avoid incomplete exchange of the circulating cold liquid in the liquid cavity, a micro-channel liquid cooling radiator and a cold guiding plug-in are provided for this reason.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a microchannel liquid cooling radiator and lead cold plug-in components has solved the above-mentioned problem that proposes.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a micro-channel liquid cooling radiator comprises a packaging plate and a cover plate, wherein the packaging plate and the cover plate are fixed through a fixing part, and a liquid cavity is formed between the packaging plate and the cover plate;
the inner bottom surface of the packaging plate is provided with uniformly arranged heat dissipation columns;
a partition plate is fixed between the inner walls of the cover plates, exchange ports which are uniformly arranged and correspond to the heat dissipation columns are formed in the partition plate, and a circulation port is formed in one end of the top of the partition plate;
the top of the cover plate is connected with a liquid outlet pipe and a liquid inlet pipe, the lower end part of the liquid outlet pipe penetrates through the partition plate, and the lower end of the liquid inlet pipe is positioned above the partition plate;
the upper ends of the liquid outlet pipe and the liquid inlet pipe are both in threaded connection with a connecting pipe.
Preferably, the fixing part comprises connecting blocks fixed at two ends of the packaging plate and the cover plate, and a connecting bolt is connected between the packaging plate and the connecting blocks at two ends of the cover plate.
Preferably, the top of the heat dissipation column is abutted against the bottom surface of the partition plate, and the heat dissipation column plugs the corresponding exchange port.
Preferably, a notch is formed in a port of the packaging plate, and a sealing frame matched with the notch is fixed at the bottom of the cover plate.
The utility model provides a lead cold plug-in components, includes the above microchannel liquid cooling radiator, the plug-in components body includes plug-in components board, mounting panel, encapsulation board and apron centre gripping are in between plug-in components board and the mounting panel, be equipped with between plug-in components board and the mounting panel and run through both installation bolts of setting for.
Preferably, the top of mounting panel sets up the through-hole that the symmetry set up, two the connecting pipe stretches out from the through-hole activity, the rectangle mouth has been seted up to the bottom of plug-in components board, the mounting groove with rectangle mouth intercommunication is seted up at the top of plug-in components board, the packaging board card is established in the mounting groove.
Preferably, mounting holes are formed in the plug-in board and the mounting plate, and the mounting bolt penetrates through the mounting holes of the plug-in board and the mounting plate in a threaded manner.
(III) advantageous effects
The utility model provides a microchannel liquid cooling radiator and lead cold plug-in components. The method has the following beneficial effects: make the liquid cooling radiator when using, make better the exchanging of cold liquid of circulation, and make its holistic leakproofness better, make its better satisfy the demand on using, the radiator is retrained in cold plug-in components simultaneously, makes its convenient whole install and use.
Drawings
Fig. 1 is a schematic structural view of a liquid-cooled radiator of the present invention;
FIG. 2 is a schematic view of the overall structure of the present invention;
fig. 3 is a schematic structural view of the middle package plate and the cover plate of the present invention.
In the figure: 1. a package board; 10. a notch; 2. a cover plate; 21. sealing the frame; 3. a heat-dissipating column; 4. a partition plate; 5. an exchange port; 6. a flow port; 7. a liquid outlet pipe; 8. a liquid inlet pipe; 9. a connecting pipe; 11. connecting blocks; 12. a connecting bolt; 13. a card board; 14. mounting a plate; 15. Installing a bolt; 16. mounting holes; 17. a rectangular opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution:
a micro-channel liquid cooling radiator comprises a packaging plate 1 and a cover plate 2, wherein the packaging plate 1 and the cover plate 2 are fixed through a fixing part, and a liquid cavity is formed between the packaging plate 1 and the cover plate 2, so that the packaging plate 1 and the cover plate 2 are detachably fixed through the fixing part, and the liquid cavity is convenient for storing cold liquid;
the inner bottom surface of the packaging plate 1 is provided with the uniformly arranged heat dissipation columns 3, so that the contact area with the circulating cold liquid is increased, and the heat dissipation efficiency is improved;
a partition plate 4 is fixed between the inner walls of the cover plates 2, exchange ports 5 which are uniformly arranged and correspond to the heat dissipation columns 3 are formed in the partition plate 4, and a circulation port 6 is formed in one end of the top of the partition plate 4;
the top of the cover plate 2 is connected with a liquid outlet pipe 7 and a liquid inlet pipe 8, the lower end part of the liquid outlet pipe 7 penetrates through the partition plate 4, the lower end of the liquid inlet pipe 8 is positioned above the partition plate 4, so that the circulating cold liquid enters the upper part of the partition plate 4 through the liquid inlet pipe 8 and is further introduced into the cavity where the radiating column 3 is positioned from the circulation port 6, the circulating cold liquid in the cavity where the radiating column 3 is positioned which is heated more is firstly led out by the liquid outlet pipe 7, and the circulating cold liquid on the partition plate 4 is supplemented accordingly, so that the cooling using effect of the circulating cold liquid is better;
the upper ends of the liquid outlet pipe 7 and the liquid inlet pipe 8 are both connected with a connecting pipe 9 in a threaded manner.
In order to facilitate the disassembly, the fixing part comprises connecting blocks 11 fixed at two ends of the packaging plate 1 and the cover plate 2, and a connecting bolt 12 is connected between the packaging plate 1 and the connecting blocks 11 at two ends of the cover plate 2.
The top of the heat dissipation column 3 is abutted against the bottom surface of the partition plate 4, and the heat dissipation column 3 blocks the corresponding exchange port 5, so that the heat dissipation column 3 can be fully immersed in the circulating cold liquid.
In order to improve the sealing performance, the port of the package plate 1 is provided with a notch 10, the bottom of the cover plate 2 is fixed with a sealing frame 21 matched with the notch 10, and the sealing frame 21 can be clamped in the notch 10, so that a large gap cannot exist between the cover plate 2 and the package plate 1 when the cover plate is connected with the package plate.
The utility model provides a lead cold plug-in components, includes microchannel liquid cooling radiator, the plug-in components body includes plug-in components board 13, mounting panel 14, package board 1 and 2 centre grippings of apron are in between plug-in components board 13 and the mounting panel 14, be equipped with between plug-in components board 13 and the mounting panel 14 and run through the installation bolt 15 that both set for, make the liquid cooling radiator encapsulated in leading cold plug-in components.
The through-hole 18 that the symmetry set up is seted up at the top of mounting panel 14, two connecting pipe 9 stretches out from the through-hole 18 activity, makes its easy to assemble, rectangle mouth 17 has been seted up to the bottom of plug-in board 13, the mounting groove with rectangle mouth 17 intercommunication has been seted up at the top of plug-in board 13, package board 1 card is established in the mounting groove, makes it better with outside connectivity.
Make it make things convenient for the frock, mounting hole 16 has all been seted up on plug-in components board 13 and the mounting panel 14, the mounting hole 16 of plug-in components board 13 and mounting panel 14 is run through to the mounting bolt 15 screw thread.
Firstly, the liquid cooling radiator can be assembled in the mounting groove of the plug-in board 13 and is conveniently clamped by the mounting plate 14, so that the mounting bolt 15 penetrates through the mounting plate 14 and the plug-in board 13, and the penetrating mounting bolt 15 is conveniently mounted on a device;
and when dispelling the heat, the circulation cold liquid can be followed connecting pipe 9 and lead in through inlet pipe 8, make the circulation cold liquid enter into the top of baffle 4 through inlet pipe 8, and then make it lead in to the cavity that radiating column 3 locates from circulation mouth 6, thereby make the circulation cold liquid of the cavity that radiating column 3 locates that is heated more derive by outlet pipe 7 at first, and the circulation cold liquid on the baffle 4 supplements thereupon, make the cooling result of use of circulation cold liquid better, thereby make the liquid cooling radiator when using, make better the exchanging of circulation cold liquid, and make its holistic leakproofness better, make its better demand in satisfying the use, the radiator is restricted in cold plug-in spare simultaneously, make its convenient whole install the use.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A microchannel liquid cooling radiator, its characterized in that: the packaging structure comprises a packaging plate (1) and a cover plate (2), wherein the packaging plate (1) and the cover plate (2) are fixed through a fixing part, and a liquid cavity is formed between the packaging plate and the cover plate;
the inner bottom surface of the packaging plate (1) is provided with uniformly arranged heat dissipation columns (3);
a partition plate (4) is fixed between the inner walls of the cover plates (2), exchange ports (5) which are uniformly arranged and correspond to the heat dissipation columns (3) are formed in the partition plate (4), and a circulation port (6) is formed in one end of the top of the partition plate (4);
the top of the cover plate (2) is connected with a liquid outlet pipe (7) and a liquid inlet pipe (8), the lower end part of the liquid outlet pipe (7) penetrates through the partition plate (4), and the lower end of the liquid inlet pipe (8) is positioned above the partition plate (4);
the upper ends of the liquid outlet pipe (7) and the liquid inlet pipe (8) are both connected with a connecting pipe (9) in a threaded manner.
2. The microchannel liquid cooled heat sink of claim 1, wherein: the fixing part comprises connecting blocks (11) fixed at two ends of the packaging plate (1) and the cover plate (2), and connecting bolts (12) are connected between the packaging plate (1) and the connecting blocks (11) at two ends of the cover plate (2).
3. The microchannel liquid cooled heat sink of claim 1, wherein: the top of the heat dissipation column (3) is abutted against the bottom surface of the partition plate (4), and the heat dissipation column (3) plugs the corresponding exchange port (5).
4. The microchannel liquid cooled heat sink of claim 1, wherein: a notch (10) is formed in the port of the packaging plate (1), and a sealing frame (21) matched with the notch (10) is fixed at the bottom of the cover plate (2).
5. A cold-conducting insert, comprising: the micro-channel liquid cooled heat sink comprising the micro-channel liquid cooled heat sink of any of claims 1 to 4 and a plug-in body comprising a plug-in board (13) and a mounting plate (14), the package board (1) and the cover plate (2) being sandwiched between the plug-in board (13) and the mounting plate (14), the plug-in board (13) and the mounting plate (14) having a mounting peg (15) defined therethrough.
6. An insert according to claim 5, wherein: through-hole (18) that the symmetry set up, two are seted up at the top of mounting panel (14) connecting pipe (9) are stretched out from through-hole (18) activity, rectangle mouth (17) have been seted up to the bottom of plug-in components board (13), the mounting groove with rectangle mouth (17) intercommunication is seted up at the top of plug-in components board (13), encapsulation board (1) card is established in the mounting groove.
7. An insert according to claim 5, wherein: mounting holes (16) are formed in the plug-in board (13) and the mounting plate (14), and the mounting bolt (15) penetrates through the mounting holes (16) of the plug-in board (13) and the mounting plate (14) in a threaded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022520829.8U CN213124433U (en) | 2020-11-04 | 2020-11-04 | Microchannel liquid cooling radiator and lead cold plug-in components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022520829.8U CN213124433U (en) | 2020-11-04 | 2020-11-04 | Microchannel liquid cooling radiator and lead cold plug-in components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213124433U true CN213124433U (en) | 2021-05-04 |
Family
ID=75667604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022520829.8U Expired - Fee Related CN213124433U (en) | 2020-11-04 | 2020-11-04 | Microchannel liquid cooling radiator and lead cold plug-in components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213124433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115297671A (en) * | 2022-06-24 | 2022-11-04 | 浙江大华技术股份有限公司 | Heat dissipation module, heat dissipation system and server system |
-
2020
- 2020-11-04 CN CN202022520829.8U patent/CN213124433U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115297671A (en) * | 2022-06-24 | 2022-11-04 | 浙江大华技术股份有限公司 | Heat dissipation module, heat dissipation system and server system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210504 |
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| CF01 | Termination of patent right due to non-payment of annual fee |