CN206075226U - A kind of bus type heat pipe type water-cooling heat radiating system - Google Patents
A kind of bus type heat pipe type water-cooling heat radiating system Download PDFInfo
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- CN206075226U CN206075226U CN201620816229.7U CN201620816229U CN206075226U CN 206075226 U CN206075226 U CN 206075226U CN 201620816229 U CN201620816229 U CN 201620816229U CN 206075226 U CN206075226 U CN 206075226U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
This utility model provides a kind of bus type heat pipe type water-cooling heat radiating system, the water-cooling heat radiating system is by the heat sink component of bus, CPU termal conductor modules, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module and cooled plate radiating subassembly composition, the CPU termal conductor modules, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module, by respective fixed block be fixed on the heat sink component bus of bus it is heat sink on, by CPU, memory bar, north and south bridge chip heat transfer is heat sink to the bus of the heat sink component of bus, again the water-cooled plate heat pipe of Jing grafting by bus heat sink heat transfer feed water cold drawing radiating subassembly, realize CPU, memory bar, the radiating of north and south bridge chip.As this utility model is using centralized radiating and directly heating element is radiated, radiating efficiency is high, cooling system structure is simple, stable, reliability height, noiselessness, energy consumption are low, and the heat sink connection of each component and bus and dismounting are very convenient.
Description
Technical field
This utility model is related to heat pipe heat radiation field, and in particular to a kind of bus type heat pipe type water-cooling heat radiating system.
Background technology
At present, Novel machine rack server and blade server, its process in operation are adopted in data center in a large number
In can produce substantial amounts of heat, heat flow density is improved year by year, and the heat dissipating method of traditional data center is using precision air conditioner system
Cold wind-cooling heat dissipating mode, wherein air conditioner in machine room CRAC are the core of heat dissipation system for computer room, suck server by air conditioner in machine room
Cold air is excluded after heat exchange by the hot-air of discharge, carries out forced convertion cooling to server.But this mode energy
Effect is bigger than not high, machine room noise.
As liquid is more much larger than the specific heat of air, radiating rate is also far longer than air, therefore refrigerating efficiency is far above
Wind-cooling heat dissipating, while eliminating fan, can also reduce the effect of noise.All expand to server liquid refrigeration technique both at home and abroad
Research.At present, for liquid cooling system pattern, direct cooled (immersion type liquid is cold) and the indirect type of cooling are broadly divided into
(liquid cooling plate, liquid cold head).Direct cooled, even if cooled object and coolant directly contact, by server master board, CPU, internal memory
It is completely submerged in coolant etc. the big element that generated heat.Due to coolant and cooled object directly contact, better heat-radiation effect,
And the heat dissipation problem of whole components and parts can be disposably solved, completely without additional configuration fan, fin etc..But this system
Change to original computer system is larger, and needs to make sealing cabin for holding coolant；In addition, the system will to coolant
Ask higher, need with the physical and chemical performance such as good insulation preformance, nontoxic, non-corrosiveness.Indirect cooling-type, i.e. coolant with
Cooled object is separated, and is not directly contacted with, but by liquid cooling plate etc. efficiently heat-conduction component by the heat of cooled object
It is delivered in coolant, this system changes little to computer system, it is only necessary to which former wind-cooling heat dissipating piece is replaced with liquid-cooling heat radiation piece (liquid
Cold head), and refrigerant pipeline is drawn into cabinet.In the indirect type of cooling, coolant has its own path, not with electronics device
Part directly contact, as long as therefore liquid line good seal performance, coolant do not reveal, and the system requires relatively low, Duo Zhongleng to coolant
Matchmaker is capable of achieving its function.Which has the disadvantage that due to increased diabatic process thermal resistance the hot temperature difference increases, and refrigeration is inferior to directly cold
But formula, must additionally install fan and other components and parts of computer are radiated.Above two mode, safeguards inconvenience.
Chinese patent (number of patent application 201510144650.8) discloses " a kind of liquid cooling apparatus and auxiliary radiating device knot
The server radiating system of conjunction ", the system include liquid-cooled suit business device rack, and liquid-cooled suit business device rack includes rack cabinet and setting
Multiple liquid-cooled suit business devices in cabinet body, which is provided with liquid cooling apparatus and carries out direct liquid-cooling heat radiation to liquid-cooled suit business device, also
Being provided with auxiliary radiating device carries out auxiliary heat dissipation.Liquid cooling heat radiator in the patent application is located near server chips, or
Directly contact with server chips, it is impossible to which the heat of the memory bar in addition to CPU, South Bridge chip, north bridge chips is taken away, take
Business device bulk temperature is still higher, and building environment temperature can still be restricted.
A kind of disclosed " the spray cooling type whole machine cabinet radiating system of Chinese patent (number of patent application 201510529384.0)
System ", the system include water pump, water tower, heat exchange liquid pump, and the water tower inner chamber top is provided with water-cooled spray bar, water-cooled spray bar
It is connected with water pump；It is provided with radiator below the water-cooled spray bar, the radiator two ends are exchanged heat with server cabinet respectively
One end of cabinet heat exchanger and heat exchange liquid pump connection, described heat exchange liquid pump are connected with the other end of cabinet heat exchanger.In the patent
The cabinet heat exchanger of server heat exchange cabinet is only merely that the hot blast in server is exchanged heat, not to its main heater element
Carry out most directly radiating, while the cooling system includes two-class heat dissipation, inevitable radiating efficiency is lower than the efficiency of directly radiating,
Therefore above-mentioned heat sink conception is not perfect enough.
The content of the invention
The purpose of this utility model is the shortcoming and defect for overcoming prior art, proposes that a kind of easy for installation, radiating is high
Effect, noiselessness, reliability are high, safeguard simple bus type heat pipe type water-cooling heat radiating system.Solve existing server cooling to dissipate
The problems referred to above that thermal technology is present.
The technical scheme adopted by this utility model is that a kind of bus type heat pipe type water-cooling heat radiating system, the water-cooled dissipate
Hot systems are by the heat sink component of bus, CPU termal conductor modules, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge core
Piece termal conductor module and cooled plate radiating subassembly composition, the CPU termal conductor modules, memory bar termal conductor module, South Bridge chip
Termal conductor module, north bridge chips termal conductor module, by respective fixed block be fixed on the heat sink component bus of bus it is heat sink on, will
CPU, memory bar, north and south bridge chip heat transfer are heat sink to the bus of the heat sink component of bus, then the water-cooled plate heat pipe of Jing grafting will
Heat transfer that bus is heat sink feedwater cold drawing radiating subassembly, realizes CPU, memory bar, the radiating of north and south bridge chip；
Described bus is heat sink, and component includes that one piece of bus is heat sink, and the upper and lower surface that bus is heat sink is longitudinally provided with pressing samming
The samming corrugated heat pipe and T-nut groove of heat pipe, the middle part that bus is heat sink is provided with the heat pipe for thermal conductivity hole of transverse splicing water-cooled plate heat pipe；
Described CPU termal conductor modules include one piece of CPU fixed block, and the CPU of Jing CPU heat pipes connection heat sink；
Described memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block (31), and Jing memory bars
Some groups of memory bar conducting strips that heat pipe connects, being symmetricly set in memory bar both sides two-by-two, it is described symmetrically arranged interior two-by-two
Deposit and on bar conducting strip, be stained with memory bar heat conduction patch, some groups of memory bar conducting strips are connected by screw and are fixed as an entirety；
Described South Bridge chip termal conductor module, including one piece of south bridge fixed block, and the connection of Jing South Bridge chips heat pipe
South bridge is heat sink；
Described north bridge chips termal conductor module, including one piece of north bridge fixed block, and the connection of Jing north bridge chips heat pipe
North bridge is heat sink；
The cooled plate radiating subassembly, including one piece of inside is provided with the cooled plate of circulating water line, is provided with the middle part of cooled plate
The heat pipe through hole of grafting water-cooled plate heat pipe, in the circulating water line intake-outlet of the water-cooled front edge of board, is connected to water inlet pipe and water outlet pipe and connects
Head.
Bus type heat pipe type water-cooling heat radiating system described in the utility model, is further characterized in that,
Described CPU heat pipes, South Bridge chip heat pipe, north bridge chips heat pipe, be slug type heat pipe or for composite type heat pipe,
Or be groove-shaped heat pipe, heat pipe two ends are circle into D types, stage casing；Described CP U fixed blocks, memory bar heat-conductive assembly are fixed
Block, south bridge fixed block, north bridge fixed block, the installation contact surface heat sink with the bus, are provided with heat conduction groove, and the CPU is warm
D type heat pipe ends are closely adhesively fixed by pipe, memory bar heat pipe, South Bridge chip heat pipe, north bridge chips heat pipe by pressing to process
In the heat conduction groove of each fixed block, and by D type heat pipe transverse planes to the heat sink conduction heat of bus.
The water-cooled plate heat pipe of the cooled plate radiating subassembly is plugged in the heat pipe through hole of cooled plate, will be from the heat sink suction of bus
The heat of receipts is conducted to cooled plate, and takes away the heat of absorption by the recirculated water in cooled plate inner loop water lines.
The memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block, are symmetricly set in internal memory two-by-two
The some groups of memory bar conducting strips on bar both sides, connected memory bar heat pipe or be two semi-circular heat pipes, its heat pipe one end
Flat, one end is in semi-circular, and two semi-circular heat pipe flat ends clamp memory bar, then deposit bar conducting strip by symmetrically arranged two panels
Clamp, step up to fix by memory bar clip, two semi-circular heat pipes of merging are plugged on memory bar heat-conductive assembly fixed block
In heat conduction through hole, it is welded as a whole using hot air convection reflow soldering process.
The CPU of the CPU termal conductor modules is heat sink, for two pieces and CPU more than two pieces not on a vertical curve
During heat conduction, its by one piece of CPU fixed block, the CPU heat pipes that Jing is separated, respectively with each CPU on the heat sink connections of CPU, realize more than one piece
CPU heat conduction is cooled down.
The scolding tin of welding water-cooled plate heat pipe is provided with the hole of the bus is heat sink heat pipe for thermal conductivity hole and water-cooled plate heat pipe through hole
Groove, the welding of the water-cooled plate heat pipe adopt hot air convection reflow soldering process.
Compared with present technology, this utility model bus type heat pipe type water-cooling heat radiating system has the advantages that：
This utility model is by by memory bar termal conductor module, CPU termal conductor modules, north bridge chips termal conductor module, south
Bridge chip termal conductor module the heat of memory bar, CPU, north and south bridge chip is concentrated be transmitted to bus it is heat sink on, then by water
Heat is taken away by cold drawing termal conductor module and outer circulation water, using centralized radiating and directly heating element is dissipated
Heat, radiating efficiency is high, cooling system structure is simple, stable, reliability height, noiselessness, energy consumption are low.
Bus type heat pipe type water-cooling heat radiating system of the present utility model, due to CPU termal conductor modules, memory bar conduction of heat group
Part, South Bridge chip termal conductor module and north bridge chips termal conductor module by screw locking to bus it is heat sink on T-nut on,
So as to the heat sink connection of each component and bus and dismounting are very convenient.
This utility model bus type heat pipe type water-cooling heat radiating system, with manufacturing process is simple, low production cost, it is adaptable to
The characteristics of large-scale production.
Description of the drawings
Fig. 1 is this utility model bus type heat pipe type water-cooling heat radiating system structural representation；
Fig. 2 is the heat sink modular construction schematic diagram of this utility model bus；
Fig. 3 is this utility model CPU termal conductor module structural representations；
Fig. 4 a, Fig. 4 b are this utility model memory bar termal conductor module structural representations；
Fig. 5 is this utility model South Bridge chip termal conductor module structural representation；
Fig. 6 is this utility model north bridge chips termal conductor module structural representation；
Fig. 7 is this utility model cooled plate heat radiation assembly structure schematic diagram；
Fig. 8 is this utility model another kind form memory bar termal conductor module structural representation；
Fig. 9 is the another form of CPU termal conductor modules structure chart of this utility model.
In figure, the 1. heat sink component of bus, 2.CPU termal conductor modules, 3. memory bar termal conductor module, 4. South Bridge chip heat pass
Guide assembly, 5. north bridge chips termal conductor module, 6. cooled plate radiating subassembly, 7. heat conduction groove, 10. bus is heat sink, and 11. warm
Tube seat, 12. samming heat pipes, 13.T type nut grooves, 14. heat pipe for thermal conductivity holes, 15. solder baths, 21.CPU fixed blocks, 22.CPU are warm
Pipe, 23.CPU is heat sink, 31. memory bar heat-conductive assembly fixed blocks, 32. memory bar heat pipes, and 32 '. semi-circular heat pipes .33. memory bars
Conducting strip, 34. memory bar heat conduction patch, 35. memory bar clips, 36. heat conduction through holes, 41. south bridge fixed blocks, 42. South Bridge chips heat
Pipe, 43. south bridges are heat sink, 51. north bridge fixed blocks, 52. north bridge chips heat pipes, and 53. north bridges are heat sink, 61. cooled plates, 62. cooled plates
Heat pipe, 63. heat pipe through holes, 64. circulating water line intake-outlets, 65. water inlet pipe and water outlet pipe joints, 66. solder baths.
Specific embodiment
With reference to the accompanying drawings and detailed description this utility model is described in detail.
A kind of bus type heat pipe type water-cooling heat radiating system, as shown in figure 1, water-cooling heat radiating system by the heat sink component 1 of bus,
CPU termal conductor modules 2, memory bar termal conductor module 3, South Bridge chip termal conductor module 4, north bridge chips termal conductor module 5 and water
Cold drawing radiating subassembly 6 is constituted, the CPU termal conductor modules 2, memory bar termal conductor module 3, South Bridge chip termal conductor module 4, north
Bridge chip termal conductor module 5, is fixed in heat sink 1 bus of component of bus heat sink 10, by CPU, internal memory by respective fixed block
The bus heat sink 10 of bar, north and south bridge chip heat transfer to the heat sink component of bus 1, then the water-cooled plate heat pipe 62 of Jing grafting is by bus
Heat sink 10 heat transfer feedwater cold drawing radiating subassembly 6, realizes CPU, memory bar, the radiating of north and south bridge chip.
As shown in Fig. 2 the heat sink component of bus of the present utility model 1 includes one piece of bus heat sink 10, bus is heat sink 10
Upper and lower surface is longitudinally provided with the samming corrugated heat pipe 11 and T-nut groove 13 of pressing samming heat pipe 12, and bus is heat sink, and 10 middle part sets
There is the heat pipe for thermal conductivity hole 14 of transverse splicing water-cooled plate heat pipe 62.
As shown in figure 3, CPU termal conductor modules of the present utility model 2 include one piece of CPU fixed block 21, and Jing CPU heat pipes
The CPU heat sink 23 of 22 connections.
As shown in figures 4 a and 4b, memory bar termal conductor module 3 of the present utility model, including one piece of memory bar heat-conductive assembly
Fixed block 31, and the connection of Jing memory bars heat pipe 32, some groups of memory bar heat conduction being symmetricly set in memory bar both sides two-by-two
Piece 33, is stained with memory bar heat conduction patch 34, some groups of memory bar conducting strips on the symmetrically arranged memory bar conducting strip 33 two-by-two
33 are connected by screw and are fixed as an entirety.
As shown in figure 5, South Bridge chip termal conductor module 4 of the present utility model, including one piece of south bridge fixed block 41, Yi Jijing
The south bridge heat sink 43 of the connection of South Bridge chip heat pipe 42.
As shown in fig. 6, north bridge chips termal conductor module 5 of the present utility model, including one piece of north bridge fixed block 51, Yi Jijing
The north bridge heat sink 53 of the connection of north bridge chips heat pipe 52.
As shown in fig. 7, cooled plate radiating subassembly 6 of the present utility model, is provided with the water of circulating water line including one piece of inside
Cold drawing 61, is provided with the heat pipe through hole 63 of grafting water-cooled plate heat pipe 62, in the circulation of 61 front end of the cooled plate in the middle part of cooled plate 61
Water lines intake-outlet 64 is connected to water inlet pipe and water outlet pipe joint 65.
CPU heat pipes 22 of the present utility model, South Bridge chip heat pipe 42, north bridge chips heat pipe 52 are slug type heat pipe or are
Composite type heat pipe is groove-shaped heat pipe, and heat pipe two ends are circle into D types, stage casing；Described CP U fixed blocks 21, memory bar
Heat-conductive assembly fixed block 31, south bridge fixed block 41, north bridge fixed block 51, heat sink with the bus 10 installation contact surface, open
There are heat conduction groove 7, the CPU heat pipes 22, memory bar heat pipe 32, South Bridge chip heat pipe 42, north bridge chips heat pipe 52, by pressing
Process is closely adhesively fixed on D types heat pipe end in the heat conduction groove 7 of each fixed block, and by D type heat pipe transverse planes to total
Line is heat sink 10 conduction heats.
Bus of the present utility model is heat sink component 1 with CPU termal conductor modules 2, South Bridge chip termal conductor module 4, north bridge
When chip termal conductor module 5 carries out installing fixed, first CPU heat pipes 22, South Bridge chip heat pipe 42, north bridge chips heat pipe 52 are placed
In the heat conduction groove 7 of and fixed block heat sink in respective termal conductor module, in pressing processing procedure, after rolling and processing, then
Contact plane is polished, it is ensured that the flatness of respective termal conductor module enthusiasm and fixed block.And in respective conduction of heat group
Uniform heat-conducting silicone grease is coated with part enthusiasm, fixed block and heat pipe and heat sink 10 contact surface of bus, the locking for then passing through
Fixed block with bus heat sink 10 of the respective termal conductor module equipped with heat pipe is brought into close contact and is fixed as one by bolt, by bus heat
Heavy 10 effectively conducting heat.
The water-cooled plate heat pipe 62 of cooled plate radiating subassembly of the present utility model 6 is plugged in the heat pipe through hole 63 of cooled plate 61
In, the heat absorbed from bus heat sink 10 is conducted to into cooled plate 61, the recirculated water inside plate 61 is water cooled and is absorbed, by recirculated water
The water inlet pipe and water outlet pipe joint 65 of pipeline intake-outlet 64 is transported in the cooling recirculation system of outside.
Memory bar termal conductor module 3 of the present utility model, can also be another kind of version, as shown in figure 8, including one
Block memory bar heat-conductive assembly fixed block 31, is symmetricly set in some groups of memory bar conducting strips 33 on memory bar both sides, two-by-two with which
The memory bar heat pipe 32 of connection is two semi-circular heat pipes 32 ', and its memory bar heat pipe one end is flat, one end is in semi-circular；It is real
In the use of border, memory bar is clamped with two 32 ' flat ends of semi-circular heat pipe, then bar conducting strip 33 is deposited by symmetrically arranged two panels and pressed from both sides
Firmly, step up to fix above two memory bar conducting strips 33 by two memory bar clips 35；Two semi-circular heat after merging
Pipe 32 ', is plugged in the heat conduction through hole 36 of memory bar heat-conductive assembly fixed block 31, then using hot air convection reflow soldering process by two
Person is welded as a whole.
This version of this utility model memory bar termal conductor module 3, memory bar are directly flat with memory bar heat pipe 32
The plane contact of flush end, when server working memory bar adstante febre, there is the temperature difference, the heat of memory bar in 32 two ends of memory bar heat pipe
Memory bar fixed block 31 is directly delivered to from memory bar heat pipe 32, then is delivered in bus heat sink 10 by memory bar fixed block 31,
Its operation principle is identical with aforementioned structure, simply when wherein certain memory bar breaks down, in that context it may be convenient to pull up in clamping
Two memory bar clips 35 of bar are deposited, two panels is unclamped and is deposited bar conducting strip 33, change the memory bar for breaking down.
The CPU heat sink 23 of CPU termal conductor modules of the present utility model 2, for two pieces and two not on a vertical curve
During more than part CPU heat conduction,, by one piece of CPU fixed block 21, the CPU heat pipes 22 that Jing is separated are warm with the CPU on each CPU respectively for which
Heavy 23 connection, realizes that the heat conduction of more than one piece CPU is cooled down.As shown in figure 9, CPU termal conductor modules of the present utility model 2 are in practice
Another form, the laterally separated arrangement of two pieces CPU, two on CPU piece CPU is heat sink 23, respectively with 3 CPU heat pipes 22 with
One piece of fixed block 21 connects；When server works, the heat Jing of every CPU is respectively from the CPU of respective connection is heat sink 23, CPU is warm
Pipe 22 and CPU fixed blocks 21 are delivered in bus heat sink 10, realize heat loss through conduction.
Welding water is provided with the hole of this utility model bus is heat sink 61 heat pipe through hole 63 of 10 heat pipe for thermal conductivity holes 14 and cooled plate
The solder bath 15,66 of cold drawing heat pipe 62, the welding of water-cooled plate heat pipe 62 adopt hot air convection reflow soldering process.
During reality processing, appropriate Sn63Pb37 solder pastes are smeared on water-cooled plate heat pipe 62 first, then by water
In the heat pipe for thermal conductivity hole 14 of the insertion bus heat sink 10 of cold drawing heat pipe 62 and the heat pipe through hole 63 of cooled plate 61, solder paste is made to stay in heat
In the solder bath 66 of the solder bath 15 and heat pipe through hole 63 of pipe thermal hole 14, using mould fixed bus are heat sink 10, cooled plate 61
After water-cooled plate heat pipe 15, it is positioned in the high temperature furnace that temperature is 280 DEG C～360 DEG C, heats 3min～8min, taking-up is air-cooled extremely
Room temperature, draws off mould, obtains connecting as one bus heat sink 10 and cooled plate 61 by water-cooled plate heat pipe 62.
This utility model bus type heat pipe type water-cooling heat radiating system, by bolt and T-nut by CPU termal conductor modules 2,
Memory bar termal conductor module 3, South Bridge chip termal conductor module 4 and north bridge chips termal conductor module 5 are locked in bus heat sink 10
With its it is close fit, the heat of memory bar, CPU, north and south bridge chip is concentrated and is transmitted in bus heat sink 10, then by water
Heat is taken away by cold drawing termal conductor module 6 and outer circulation water, concentrates and directly heating element is radiated, its radiating system
Stable, high, highly reliable radiating efficiency, noiselessness, the energy consumption of uniting is low.
Above-mentioned embodiment is one or two example of the present utility model, is not intended to limit enforcement and the power of utility model
Sharp scope, equivalence changes and modification that all contents according to described in this utility model patent protection scope are made, all should wrap
Include in this utility model claim.
Claims (6)
1. a kind of bus type heat pipe type water-cooling heat radiating system, it is characterised in that the water-cooling heat radiating system is by the heat sink component of bus
(1), CPU termal conductor modules (2), memory bar termal conductor module (3), South Bridge chip termal conductor module (4), north bridge chips conduction of heat
Component (5) and cooled plate radiating subassembly (6) composition, the CPU termal conductor modules (2), memory bar termal conductor module (3), south bridge
Chip termal conductor module (4), north bridge chips termal conductor module (5), are fixed on the heat sink component of bus (1) by respective fixed block
On bus is heat sink (10), will be CPU, memory bar, north and south bridge chip heat transfer heat sink to the bus of the heat sink component of bus (1)
(10), then Jing grafting water-cooled plate heat pipe (62) by bus heat sink (10) heat transfer feedwater cold drawing radiating subassembly (6), realize
CPU, memory bar, the radiating of north and south bridge chip；
Described bus is heat sink, and component (1) is heat sink (10) including one piece of bus, and the upper and lower surface that bus is heat sink (10) is longitudinally provided with
The samming corrugated heat pipe (11) and T-nut groove (13) of pressing samming heat pipe (12), is provided with laterally slotting in the middle part of bus is heat sink (10)
The heat pipe for thermal conductivity hole (14) of water receiving cold drawing heat pipe (62)；
Described CPU termal conductor modules (2) are warm including one piece of CPU fixed block (21), and the CPU that Jing CPU heat pipes (22) connects
Heavy (23)；
Described memory bar termal conductor module (3) is warm including one piece of memory bar heat-conductive assembly fixed block (31), and Jing memory bars
Some groups of memory bar conducting strips (33) that pipe (32) connects, being symmetricly set in memory bar both sides two-by-two are described symmetrically to set two-by-two
Memory bar heat conduction patch (34) is stained with the memory bar conducting strip (33) put, some groups of memory bar conducting strips (33) are connected by screw
It is fixed as an entirety；
Described South Bridge chip termal conductor module (4), including one piece of south bridge fixed block (41), and Jing South Bridge chip heat pipes (42)
The south bridge heat sink (43) of connection；
Described north bridge chips termal conductor module (5), including one piece of north bridge fixed block (51), and Jing north bridge chips heat pipes (52)
The north bridge heat sink (53) of connection；
The cooled plate radiating subassembly (6), is provided with the cooled plate (61) of circulating water line including one piece of inside, in cooled plate (61)
Portion is provided with the heat pipe through hole (63) of grafting water-cooled plate heat pipe (62), in the circulating water line Inlet and outlet water of the cooled plate (61) front end
Mouth (64) is connected to water inlet pipe and water outlet pipe joint (65).
2. bus type heat pipe type water-cooling heat radiating system according to claim 1, it is characterised in that described CPU heat pipes
(22), South Bridge chip heat pipe (42), north bridge chips heat pipe (52), are slug type heat pipe or for composite type heat pipe or for groove-shaped
Heat pipe, heat pipe two ends are circle into D types, stage casing；Described CPU fixed blocks (21), memory bar heat-conductive assembly fixed block (31), south
Bridge fixed block (41), north bridge fixed block (51), the installation contact surface of (10) heat sink with the bus, are provided with heat conduction groove (7),
The CPU heat pipes (22), memory bar heat pipe (32), South Bridge chip heat pipe (42), north bridge chips heat pipe (52), are processed by pressing
D types heat pipe end is closely adhesively fixed in the heat conduction groove (7) of each fixed block, and by D type heat pipe transverse planes to bus
Heat sink (10) conduct heat.
3. bus type heat pipe type water-cooling heat radiating system according to claim 1, it is characterised in that the cooled plate radiating group
The water-cooled plate heat pipe (62) of part (6) is plugged in the heat pipe through hole (63) of cooled plate (61), and (10) heat sink from bus are absorbed
Heat is conducted to cooled plate (61), and takes away the heat of absorption by the recirculated water in cooled plate (61) inner loop water lines.
4. bus type heat pipe type water-cooling heat radiating system according to claim 1, it is characterised in that the memory bar conduction of heat
Component (3), including one piece of memory bar heat-conductive assembly fixed block (31), is symmetricly set in some groups of internal memories on memory bar both sides two-by-two
Bar conducting strip (33), connected memory bar heat pipe (32) or be two semi-circular heat pipes (32 '), its heat pipe one end is flat,
One end is in semi-circular, and two semi-circular heat pipe (32 ') flat ends clamp memory bar, then deposit bar conducting strip by symmetrically arranged two panels
(33) clamp, step up to fix by memory bar clip (35), two semi-circular heat pipes (32 ') of merging are plugged on memory bar and lead
In the heat conduction through hole (36) of hot component fixed block (31), it is welded as a whole using hot air convection reflow soldering process.
5. bus type heat pipe type water-cooling heat radiating system according to claim 1, it is characterised in that the CPU conduction of heat group
When the CPU heat sink (23) of part (2), CPU heat conduction for two pieces not on a vertical curve and more than two pieces, which is by one piece
CPU fixed blocks (21), the CPU heat pipes (22) that Jing is separated are connected with the CPU on each CPU heat sink (23) respectively, realize more than one piece CPU
Heat conduction is cooled down.
6. the bus type heat pipe type water-cooling heat radiating system according to claim 1 or 3, it is characterised in that the bus is heat sink
(10) scolding tin of welding water-cooled plate heat pipe (62) is provided with the hole of heat pipe for thermal conductivity hole (14) and cooled plate (61) heat pipe through hole (63)
Groove (15,66), the welding of the water-cooled plate heat pipe (62) adopt hot air convection reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620816229.7U CN206075226U (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620816229.7U CN206075226U (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
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| CN206075226U true CN206075226U (en) | 2017-04-05 |
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| CN201620816229.7U Active CN206075226U (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
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| CN (1) | CN206075226U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN109585971A (en) * | 2017-09-29 | 2019-04-05 | 保时捷股份公司 | Battery module for traction battery |
| US10433458B1 (en) * | 2018-05-08 | 2019-10-01 | Hewlett Packard Enterprise Development Lp | Conducting plastic cold plates |
-
2016
- 2016-07-29 CN CN201620816229.7U patent/CN206075226U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN109585971A (en) * | 2017-09-29 | 2019-04-05 | 保时捷股份公司 | Battery module for traction battery |
| US10433458B1 (en) * | 2018-05-08 | 2019-10-01 | Hewlett Packard Enterprise Development Lp | Conducting plastic cold plates |
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Inventor after: Li Yong Inventor after: Liu Song Inventor after: Zhou Wenjie Inventor after: He Bailin Inventor after: Huang Guangwen Inventor after: Chen Chuangxin Inventor after: Chen Hanyin Inventor before: Li Yong Inventor before: Liu Gao Inventor before: Zhou Wenjie Inventor before: He Bailin Inventor before: Huang Guangwen Inventor before: Chen Chuangxin Inventor before: Chen Hanyin |
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