CN106125872A - A kind of bus type heat pipe type water-cooling heat radiating system - Google Patents
A kind of bus type heat pipe type water-cooling heat radiating system Download PDFInfo
- Publication number
- CN106125872A CN106125872A CN201610614327.7A CN201610614327A CN106125872A CN 106125872 A CN106125872 A CN 106125872A CN 201610614327 A CN201610614327 A CN 201610614327A CN 106125872 A CN106125872 A CN 106125872A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- bus
- cpu
- memory bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 45
- 230000015654 memory Effects 0.000 claims abstract description 96
- 239000004020 conductor Substances 0.000 claims abstract description 77
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 4
- 238000010622 cold drawing Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 15
- 239000002826 coolant Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 101100165177 Caenorhabditis elegans bath-15 gene Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003936 working memory Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a kind of bus type heat pipe type water-cooling heat radiating system, described water-cooling heat radiating system is by the heat sink assembly of bus, CPU termal conductor module, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module and cooled plate radiating subassembly composition, described CPU termal conductor module, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module, by respective fixed block be fixed on the heat sink component bus of bus heat sink on, by CPU, memory bar, the bus that north and south bridge chip heat passes to the heat sink assembly of bus is heat sink, heat sink for bus heat is passed to cooled plate radiating subassembly by the cooled plate heat pipe through grafting again, realize CPU, memory bar, the heat radiation of north and south bridge chip.Owing to the present invention uses centralized heat radiation and directly dispels the heat heating element, radiating efficiency is high, cooling system structure simple, stable, reliability height, noiselessness, energy consumption are low, and each assembly and the heat sink connection of bus and dismantle the most very convenient.
Description
Technical field
The present invention relates to heat pipe heat radiation field, be specifically related to a kind of bus type heat pipe type water-cooling heat radiating system.
Background technology
At present, a large amount of employing Novel machine rack server and blade server in data center, it is in the process run
In can produce substantial amounts of heat, heat flow density improves year by year, the heat dissipating method of traditional data center be use precision air conditioner system
Cold wind-cooling heat dissipating mode, wherein air conditioner in machine room CRAC is the core of heat dissipation system for computer room, sucks server by air conditioner in machine room
The hot-air of discharge, gets rid of cold air after heat exchange, server is carried out forced convertion cooling.But this mode energy
Effect ratio is the highest, machine room noise is big.
Owing to liquid is more much larger than the specific heat of air, radiating rate is also far longer than air, and therefore refrigerating efficiency is far above
Wind-cooling heat dissipating, eliminates fan simultaneously, also can reduce the effect of noise.All expand server liquid refrigeration technique both at home and abroad
Research.At present, for liquid cooling system pattern, it is broadly divided into direct cooled (immersion type liquid is cold) and the indirect type of cooling
(liquid cooling plate, liquid cold head).Directly cooled, even if cooled object directly contacts with coolant, by server master board, CPU, internal memory
It is completely submerged in coolant etc. the big element that generated heat.Owing to coolant directly contacts with cooled object, better heat-radiation effect,
And can disposably solve the heat dissipation problem of whole components and parts, completely without additional configuration fan, fin etc..But this system
Change to original computer system is relatively big, and needs to make sealing cabin for holding coolant；It addition, coolant is wanted by this system
Ask higher, need that there is the physical and chemical performance such as good insulation preformance, nontoxic, non-corrosiveness.Indirect cooling-type, i.e. coolant with
Cooled object separates, and is not directly contacted with, but by efficient heat-conduction components such as liquid cooling plates by the heat of cooled object
Being delivered in coolant, computer system is changed little by this system, it is only necessary to former wind-cooling heat dissipating sheet is replaced with liquid-cooling heat radiation sheet (liquid
Cold head), and refrigerant pipeline is drawn cabinet.In the indirect type of cooling, coolant has himself path, not with electronics device
Part directly contacts, as long as therefore liquid line good seal performance, coolant do not reveals, and coolant is required relatively low by this system, multiple cold
Matchmaker all can realize its function.Its shortcoming is owing to adding diabatic process thermal resistance, and the hot temperature difference increases, and refrigeration is inferior to the coldest
But formula, must additionally install fan and dispel the heat other components and parts of computer.Above two mode, safeguards all inconvenience.
Chinese patent (number of patent application 201510144650.8) discloses " a kind of liquid cooling apparatus and auxiliary radiating device knot
The server radiating system closed ", this system includes that liquid-cooled suit business device rack, liquid-cooled suit business device rack include rack cabinet and setting
Multiple liquid-cooled suits business device in cabinet body, it is provided with liquid cooling apparatus and liquid-cooled suit business device is carried out direct liquid-cooling heat radiation, also
It is provided with auxiliary radiating device and carries out auxiliary heat dissipation.Liquid cooling heat radiator in this patent application is located near server chips, or
Directly contact with server chips, it is impossible to the memory bar in addition to CPU, South Bridge chip, the heat of north bridge chips are taken away, clothes
Business device bulk temperature is the most higher, and building environment temperature still can be restricted.
Chinese patent (number of patent application 201510529384.0) is disclosed, and " a kind of spray cooling type whole machine cabinet heat radiation is
System ", this system includes that water pump, water tower, heat exchange liquid pump, described water tower inner chamber top are provided with water-cooled spray bar, water-cooled spray bar
It is connected with water pump；Be provided with radiator below described water-cooled spray bar, described radiator two ends respectively with server heat exchange cabinet
One end of cabinet heat exchanger and heat exchange liquid pump connect, and described heat exchange liquid pump is connected with the other end of cabinet heat exchanger.In this patent
The cabinet heat exchanger of server heat exchange cabinet is only merely and the hot blast in server carries out heat exchange, not to its main heater element
The most directly dispelling the heat, this cooling system comprises two-class heat dissipation simultaneously, and inevitable radiating efficiency is lower than the efficiency of directly heat radiation,
The most above-mentioned heat sink conception is the most perfect.
Summary of the invention
It is an object of the invention to overcome the shortcoming and defect of prior art, propose a kind of easy for installation, efficient, nothing of dispelling the heat
Noise, reliability are high, safeguard simple bus type heat pipe type water-cooling heat radiating system.Solve existing server cooling heat dissipation technology
The problems referred to above existed.
The technical solution adopted in the present invention is, a kind of bus type heat pipe type water-cooling heat radiating system, described water-cooling system
Unite by the heat sink assembly of bus, CPU termal conductor module, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips heat
Conducting subassembly and cooled plate radiating subassembly composition, described CPU termal conductor module, memory bar termal conductor module, South Bridge chip heat pass
Guide assembly, north bridge chips termal conductor module, by respective fixed block be fixed on the heat sink component bus of bus heat sink on, by CPU,
The bus that memory bar, north and south bridge chip heat pass to the heat sink assembly of bus is heat sink, then through the cooled plate heat pipe of grafting by bus
Heat sink heat passes to cooled plate radiating subassembly, it is achieved CPU, memory bar, the heat radiation of north and south bridge chip；
Described bus is heat sink, and assembly includes that one piece of bus is heat sink, and the upper and lower surface that bus is heat sink is longitudinally provided with pressing samming
The samming corrugated heat pipe of heat pipe and T-nut groove, the middle part that bus is heat sink is provided with the heat pipe for thermal conductivity hole of transverse splicing cooled plate heat pipe；
Described CPU termal conductor module includes one piece of CPU fixed block, and heat sink through the CPU of CPU heat pipe connection；
Described memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block (31), and through memory bar
Some groups of memory bar conducting strips that heat pipe connects, that be symmetricly set in memory bar both sides two-by-two, described the most symmetrically arranged interior
Depositing and be stained with memory bar heat conduction patch on bar conducting strip, some groups of memory bar conducting strips are connected by screw and are fixed as an entirety；
Described South Bridge chip termal conductor module, including one piece of south bridge fixed block, and through the connection of South Bridge chip heat pipe
South bridge is heat sink；
Described north bridge chips termal conductor module, including one piece of north bridge fixed block, and through the connection of north bridge chips heat pipe
North bridge is heat sink；
Described cooled plate radiating subassembly, is provided with the cooled plate of circulating water line, is provided with in the middle part of cooled plate including one piece of inside
The heat pipe through hole of grafting cooled plate heat pipe, in the circulating water line intake-outlet of described cooled plate front end, is connected to water inlet pipe and water outlet pipe and connects
Head.
Bus type heat pipe type water-cooling heat radiating system of the present invention, is further characterized in that,
Described CPU heat pipe, South Bridge chip heat pipe, north bridge chips heat pipe, for slug type heat pipe or be composite type heat pipe,
Or be groove-shaped heat pipe, heat pipe two ends become D type, and stage casing is circular；Described CP U fixed block, memory bar heat-conductive assembly are fixed
Block, south bridge fixed block, north bridge fixed block, the installation contact surface heat sink with described bus, all have heat conduction groove, described CPU heat
Pipe, memory bar heat pipe, South Bridge chip heat pipe, north bridge chips heat pipe, processed by pressing and D type heat pipe end be closely adhesively fixed
In the heat conduction groove of each fixed block, and by D type heat pipe end plane to bus heat sink conduction heat.
The cooled plate heat pipe of described cooled plate radiating subassembly is plugged in the heat pipe through hole of cooled plate, will be from the heat sink suction of bus
The heat received is conducted to cooled plate, and is taken away by the heat of absorption by the recirculated water in cooled plate inner loop water lines.
Described memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block, is symmetricly set in internal memory two-by-two
The some groups of memory bar conducting strips on bar both sides, connected memory bar heat pipe or be two semi-circular heat pipes, its heat pipe one end
Flat, one end is semi-circular, and two semi-circular heat pipe flat ends clamp memory bar, then are deposited bar conducting strip by symmetrically arranged two panels
Clamp, added by memory bar clip and fasten, two semi-circular heat pipes of merging, it is plugged on memory bar heat-conductive assembly fixed block
In heat conduction through hole, hot air convection reflow soldering process is used to be welded as a whole.
The CPU of described CPU termal conductor module is heat sink, for the not two pieces on a vertical curve and CPU more than two pieces
During heat conduction, it is by one piece of CPU fixed block, the CPU heat pipe through separating, and heat sink with the CPU on each CPU is respectively connected, it is achieved more than one piece
CPU heat conduction cools down.
The scolding tin of welding cooled plate heat pipe is had in the hole of described bus is heat sink heat pipe for thermal conductivity hole and cooled plate heat pipe through hole
Groove, the welding of described cooled plate heat pipe uses hot air convection reflow soldering process；
The hot air convection reflow soldering process of described welding cooled plate heat pipe 62, solder uses Sn63Pb37 solder paste, equipment
Using 8 warm area reflow machines, wherein, one or two district are heating zone, and San Siwu district is heat preservation zone, and six or seven district are weld zone, and 8th district are cold
But district, temperature parameter is respectively set to 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 210 DEG C, 240 DEG C, 240 DEG C, 200 DEG C, return air speed
Degree is 40-50mm/s, and reflow machine chain speed is 8mm/s.
Compared with present technology, bus type heat pipe type water-cooling heat radiating system of the present invention has the advantages that
The present invention is by by memory bar termal conductor module, CPU termal conductor module, north bridge chips termal conductor module, south bridge core
Sheet termal conductor module the heat of memory bar, CPU, north and south bridge chip is concentrated be transmitted to bus heat sink on, then pass through cooled plate
Heat is taken away by termal conductor module and outer circulation water, uses centralized heat radiation and directly dispels the heat heating element, dissipates
The thermal efficiency is high, cooling system structure is simple, stable, reliability height, noiselessness, energy consumption are low.
The bus type heat pipe type water-cooling heat radiating system of the present invention, due to CPU termal conductor module, memory bar termal conductor module,
South Bridge chip termal conductor module and north bridge chips termal conductor module by screw locking to bus heat sink on T-nut on, from
And each assembly and the heat sink connection of bus and dismounting are the most very convenient.
The manufacture method of bus type heat pipe type water-cooling heat radiating system of the present invention, has that technique is simple, production cost is low, is suitable for
Feature in large-scale production.
Accompanying drawing explanation
Fig. 1 is bus type heat pipe type water-cooling heat radiating system structural representation of the present invention；
Fig. 2 is bus of the present invention heat sink modular construction schematic diagram；
Fig. 3 is CPU termal conductor module structural representation of the present invention；
Fig. 4 a, Fig. 4 b are memory bar termal conductor module structural representations of the present invention；
Fig. 5 is South Bridge chip termal conductor module structural representation of the present invention；
Fig. 6 is north bridge chips termal conductor module structural representation of the present invention；
Fig. 7 is cooled plate heat radiation assembly structure schematic diagram of the present invention；
Fig. 8 is another kind form memory bar termal conductor module structural representation of the present invention；
Fig. 9 is the present invention another form of CPU termal conductor module structure chart.
In figure, the 1. heat sink assembly of bus, 2.CPU termal conductor module, 3. memory bar termal conductor module, 4. South Bridge chip heat passes
Guide assembly, 5. north bridge chips termal conductor module, 6. cooled plate radiating subassembly, 7. heat conduction groove, 10. bus is heat sink, and 11. all warm
Tube seat, 12. samming heat pipes, 13.T type nut groove, 14. heat pipe for thermal conductivity holes, 15. solder baths, 21.CPU fixed block, 22.CPU heat
Pipe, 23.CPU is heat sink, 31. memory bar heat-conductive assembly fixed blocks, 32. memory bar heat pipes, and 32 '. semi-circular heat pipes .33. memory bar
Conducting strip, 34. memory bar heat conduction patches, 35. memory bar clips, 36. heat conduction through holes, 41. south bridge fixed blocks, 42. South Bridge chip heat
Pipe, 43. south bridges are heat sink, 51. north bridge fixed blocks, 52. north bridge chips heat pipes, and 53. north bridges are heat sink, 61. cooled plate, 62. cooled plate
Heat pipe, 63. heat pipe through holes, 64. circulating water line intake-outlets, 65. water inlet pipe and water outlet pipe joints, 66. solder baths.
Detailed description of the invention
The present invention is described in detail with detailed description of the invention below in conjunction with the accompanying drawings.
A kind of bus type heat pipe type water-cooling heat radiating system, as it is shown in figure 1, water-cooling heat radiating system by the heat sink assembly of bus 1,
CPU termal conductor module 2, memory bar termal conductor module 3, South Bridge chip termal conductor module 4, north bridge chips termal conductor module 5 and water
Cold drawing radiating subassembly 6 forms, described CPU termal conductor module 2, memory bar termal conductor module 3, South Bridge chip termal conductor module 4, north
Bridge chip termal conductor module 5, is fixed in bus heat sink assembly 1 bus heat sink 10 by respective fixed block, by CPU, internal memory
Bar, north and south bridge chip heat pass to the bus heat sink 10 of the heat sink assembly of bus 1, then through the cooled plate heat pipe 62 of grafting by bus
Heat sink 10 heats pass to cooled plate radiating subassembly 6, it is achieved CPU, memory bar, the heat radiation of north and south bridge chip.
As in figure 2 it is shown, the present invention the heat sink assembly of bus 1 include one piece of bus heat sink 10, bus is heat sink 10 upper and lower
Two sides is longitudinally provided with samming corrugated heat pipe 11 and the T-nut groove 13 of pressing samming heat pipe 12, bus is heat sink 10 middle part be provided with horizontal stroke
Heat pipe for thermal conductivity hole 14 to grafting cooled plate heat pipe 62.
As it is shown on figure 3, the CPU termal conductor module 2 of the present invention includes one piece of CPU fixed block 21, and connect through CPU heat pipe 22
The CPU heat sink 23 connect.
As shown in figures 4 a and 4b, the memory bar termal conductor module 3 of the present invention, fix including one piece of memory bar heat-conductive assembly
Block 31, and connect through memory bar heat pipe 32, some groups of memory bar conducting strips 33 being symmetricly set in memory bar both sides two-by-two,
Being stained with memory bar heat conduction patch 34 on the most symmetrically arranged described memory bar conducting strip 33, some groups of memory bar conducting strips 33 pass through
Screw connection is fixed as an entirety.
As it is shown in figure 5, the South Bridge chip termal conductor module 4 of the present invention, including one piece of south bridge fixed block 41, and through south bridge
The south bridge heat sink 43 that chip heat pipe 42 connects.
As shown in Figure 6, the north bridge chips termal conductor module 5 of the present invention, including one piece of north bridge fixed block 51, and through north bridge
The north bridge heat sink 53 that chip heat pipe 52 connects.
As it is shown in fig. 7, the cooled plate radiating subassembly 6 of the present invention, it is provided with the cooled plate of circulating water line including one piece of inside
61, it is provided with the heat pipe through hole 63 of grafting cooled plate heat pipe 62 in the middle part of cooled plate 61, in the circulating water pipe of described cooled plate 61 front end
Road intake-outlet 64 is connected to water inlet pipe and water outlet pipe joint 65.
The CPU heat pipe 22 of the present invention, South Bridge chip heat pipe 42, north bridge chips heat pipe 52, for slug type heat pipe or be compound
Type heat pipe or be groove-shaped heat pipe, heat pipe two ends become D type, and stage casing be circle；Described CP U fixed block 21, memory bar heat conduction
Assembly fixed block 31, south bridge fixed block 41, north bridge fixed block 51, the installation contact surface of heat sink with described bus 10, all have and lead
Hot groove 7, described CPU heat pipe 22, memory bar heat pipe 32, South Bridge chip heat pipe 42, north bridge chips heat pipe 52, processed by pressing
D type heat pipe end is closely adhesively fixed in the heat conduction groove 7 of each fixed block, and by D type heat pipe end plane to bus heat
Heavy 10 conduction heats.
The heat sink assembly of bus 1 of the present invention with CPU termal conductor module 2, South Bridge chip termal conductor module 4, north bridge chips
When termal conductor module 5 carries out installing fixing, first CPU heat pipe 22, South Bridge chip heat pipe 42, north bridge chips heat pipe 52 are placed on respectively
In the heat conduction groove 7 with fixed block heat sink from termal conductor module, in pressing processing procedure, after rolling and processing, then dock
Tactile plane is polished, it is ensured that each termal conductor module enthusiasm and flatness of fixed block.And in respective termal conductor module heat
Sincere feeling, fixed block are all coated with uniform heat-conducting silicone grease on heat pipe and heat sink 10 contact surfaces of bus, the clamping screw then passed through
Respective termal conductor module is fitted tightly equipped with the fixed block heat sink with bus 10 of heat pipe and is fixed as one, by bus heat sink 10
Effectively conduct heat.
The cooled plate heat pipe 62 of the cooled plate radiating subassembly 6 of the present invention is plugged in the heat pipe through hole 63 of cooled plate 61, will
The heat absorbed from bus heat sink 10 is conducted to cooled plate 61, is water cooled the recirculated water within plate 61 and absorbs, by circulating water line
The water inlet pipe and water outlet pipe joint 65 of intake-outlet 64 is transported in the cooling recirculation system of outside.
The memory bar termal conductor module 3 of the present invention, it is also possible to for another kind of version, as shown in Figure 8, including in one piece
Deposit bar heat-conductive assembly fixed block 31, be symmetricly set in the some groups of memory bar conducting strips 33 on memory bar both sides two-by-two, connected
Memory bar heat pipe 32 or be two semi-circular heat pipes 32 ', its memory bar heat pipe one end is flat, one end is semi-circular；Actual make
In with, clamp memory bar with two semi-circular heat pipe 32 ' flat ends, then deposited bar conducting strip 33 by symmetrically arranged two panels and clamp,
Added above two memory bar conducting strips 33 by two memory bar clips 35 and fasten；Two semi-circular heat pipes after merging
32 ', it is plugged in the heat conduction through hole 36 of memory bar heat-conductive assembly fixed block 31, then uses hot air convection reflow soldering process to incite somebody to action both
It is welded as a whole.
This version of memory bar termal conductor module 3 of the present invention, memory bar is directly and memory bar heat pipe 32 flat end
Plane contact, when server working memory bar adstante febre, there is the temperature difference in memory bar heat pipe 32 two ends, and the heat of memory bar is from interior
Deposit bar heat pipe 32 and be directly delivered to memory bar fixed block 31, then be delivered in bus heat sink 10 by memory bar fixed block 31, its work
Make principle identical with aforementioned structure, simply when wherein certain memory bar breaks down, in that context it may be convenient to pull up and clamp memory bar
Two memory bar clips 35, unclamp two panels and deposit bar conducting strip 33, change the memory bar broken down.
The CPU heat sink 23 of the CPU termal conductor module 2 of the present invention, for the not two pieces on a vertical curve and two pieces with
On CPU heat conduction time, it is by one piece of CPU fixed block 21, the CPU heat pipe 22 through separating, respectively heat sink with the CPU on each CPU 23
Connect, it is achieved the heat conduction of more than one piece CPU cools down.As it is shown in figure 9, the CPU termal conductor module 2 of the present invention in practice other one
The form of kind, the laterally separated layout of two pieces CPU, the two pieces of CPU heat sink 23 on CPU, fix with 3 CPU heat pipes 22 and one piece respectively
Block 21 connects；During server work, the heat of every CPU is through heat sink 23, the CPU heat pipe 22 and CPU from the CPU each connected respectively
Fixed block 21 is delivered in bus heat sink 10, it is achieved heat loss through conduction.
Welding cooled plate is had in the hole of bus of the present invention is heat sink 10 heat pipe for thermal conductivity holes 14 and cooled plate 61 heat pipe through hole 63
The solder bath 15,66 of heat pipe 62, the welding of cooled plate heat pipe 62 uses hot air convection reflow soldering process.
In the actual course of processing, first on cooled plate heat pipe 62, smear appropriate Sn63Pb37 solder paste, then by water
Cold drawing heat pipe 62 inserts in the heat pipe for thermal conductivity hole 14 of bus heat sink 10 and the heat pipe through hole 63 of cooled plate 61, makes solder paste stay heat
In the solder bath 15 of pipe thermal hole 14 and the solder bath 66 of heat pipe through hole 63, use that mould fixed bus is heat sink 10, cooled plate 61
After cooled plate heat pipe 15, be positioned in the high temperature furnace that temperature is 280 DEG C～360 DEG C, heat 3min～8min, take out air-cooled extremely
Room temperature, draws off mould, obtains connecting as one bus heat sink 10 and cooled plate 61 by cooled plate heat pipe 62.
Bus type heat pipe type water-cooling heat radiating system of the present invention, by bolt with T-nut by CPU termal conductor module 2, internal memory
Bar termal conductor module 3, South Bridge chip termal conductor module 4 and north bridge chips termal conductor module 5 are locked in bus heat sink 10 and it
Laminating closely, concentrates the heat of memory bar, CPU, north and south bridge chip and is transmitted in bus heat sink 10, then pass through cooled plate
Heat is taken away by termal conductor module 6 and outer circulation water, concentrates and directly dispels the heat heating element, and its cooling system is steady
Determine, radiating efficiency is high, highly reliable, noiselessness, energy consumption are low.
Above-mentioned embodiment is an example of the present invention, is not intended to limit enforcement and the interest field of invention, all
The equivalence change made according to the content described in the present patent application scope of patent protection and modification, all should be included in the present patent application
In the scope of the claims.
Claims (6)
1. a bus type heat pipe type water-cooling heat radiating system, it is characterised in that described water-cooling heat radiating system is by the heat sink assembly of bus
(1), CPU termal conductor module (2), memory bar termal conductor module (3), South Bridge chip termal conductor module (4), north bridge chips conduction of heat
Assembly (5) and cooled plate radiating subassembly (6) composition, described CPU termal conductor module (2), memory bar termal conductor module (3), south bridge
Chip termal conductor module (4), north bridge chips termal conductor module (5), be fixed on the heat sink assembly of bus (1) by respective fixed block
On bus is heat sink (10), the bus that CPU, memory bar, north and south bridge chip heat pass to the heat sink assembly of bus (1) is heat sink
(10), then through the cooled plate heat pipe (62) of grafting heat sink for bus (10) heat is passed to cooled plate radiating subassembly (6), it is achieved
CPU, memory bar, the heat radiation of north and south bridge chip；
Described bus is heat sink, and assembly (1) includes one piece of bus heat sink (10), and the upper and lower surface that bus is heat sink (10) is longitudinally provided with
The samming corrugated heat pipe (11) of pressing samming heat pipe (12) and T-nut groove (13), the middle part that bus is heat sink (10) is provided with laterally inserts
The heat pipe for thermal conductivity hole (14) of water receiving cold drawing heat pipe (62)；
Described CPU termal conductor module (2) includes one piece of CPU fixed block (21), and the CPU heat connected through CPU heat pipe (22)
Heavy (23)；
Described memory bar termal conductor module (3), including one piece of memory bar heat-conductive assembly fixed block (31), and through memory bar heat
Some groups of memory bar conducting strips (33) that pipe (32) connects, that be symmetricly set in memory bar both sides two-by-two, described symmetry two-by-two sets
Being stained with memory bar heat conduction patch (34) on the memory bar conducting strip (33) put, some groups of memory bar conducting strips (33) are connected by screw
It is fixed as an entirety；
Described South Bridge chip termal conductor module (4), including one piece of south bridge fixed block (41), and through South Bridge chip heat pipe (42)
The south bridge heat sink (43) connected；
Described north bridge chips termal conductor module (5), including one piece of north bridge fixed block (51), and through north bridge chips heat pipe (52)
The north bridge heat sink (53) connected；
Described cooled plate radiating subassembly (6), is provided with the cooled plate (61) of circulating water line, in cooled plate (61) including one piece of inside
Portion is provided with the heat pipe through hole (63) of grafting cooled plate heat pipe (62), in the circulating water line Inlet and outlet water of described cooled plate (61) front end
Mouth (64)) it is connected to water inlet pipe and water outlet pipe joint (65).
Bus type heat pipe type water-cooling heat radiating system the most according to claim 1, it is characterised in that described CPU heat pipe
(22), South Bridge chip heat pipe (42), north bridge chips heat pipe (52), for slug type heat pipe or be composite type heat pipe or for groove-shaped
Heat pipe, heat pipe two ends become D type, and stage casing is circular；Described CPU fixed block (21), memory bar heat-conductive assembly fixed block (31), south
Bridge fixed block (41), north bridge fixed block (51), the installation contact surface of heat sink with described bus (10), all have heat conduction groove (7),
Described CPU heat pipe (22), memory bar heat pipe (32), South Bridge chip heat pipe (42), north bridge chips heat pipe (52), processed by pressing
D type heat pipe end is closely adhesively fixed in the heat conduction groove (7) of each fixed block, and by D type heat pipe end plane to bus
Heat sink (10) conduction heat.
Bus type heat pipe type water-cooling heat radiating system the most according to claim 1, it is characterised in that described cooled plate heat radiation group
The cooled plate heat pipe (62) of part (6) is plugged in the heat pipe through hole (63) of cooled plate (61), heat sink from bus (10) is absorbed
Heat is conducted to cooled plate (61), and is taken away by the heat of absorption by the recirculated water in cooled plate (61) inner loop water lines.
Bus type heat pipe type water-cooling heat radiating system the most according to claim 1, it is characterised in that described memory bar conduction of heat
Assembly (3), including one piece of memory bar heat-conductive assembly fixed block (31), is symmetricly set in the some groups of internal memories on memory bar both sides two-by-two
Bar conducting strip (33), connected memory bar heat pipe (32) or be two semi-circular heat pipes (32 '), its heat pipe one end is flat,
One end is semi-circular, and two semi-circular heat pipe (32 ') flat ends clamp memory bar, then are deposited bar conducting strip by symmetrically arranged two panels
(33) clamp, added by memory bar clip (35) and fasten, two semi-circular heat pipes (32 ') of merging, it is plugged on memory bar and leads
In the heat conduction through hole (36) of hot assembly fixed block (31), hot air convection reflow soldering process is used to be welded as a whole.
Bus type heat pipe type water-cooling heat radiating system the most according to claim 1, it is characterised in that described CPU conduction of heat group
The CPU of part (2) is heat sink (23), and during for the not two pieces on a vertical curve and CPU heat conduction more than two pieces, it is by one piece
CPU fixed block (21), the CPU heat pipe (22) through separating, heat sink with the CPU on each CPU (23) respectively it is connected, it is achieved more than one piece CPU
Heat conduction cools down.
6. according to the bus type heat pipe type water-cooling heat radiating system described in claim 1 or 3, it is characterised in that described bus is heat sink
(10) scolding tin of welding cooled plate heat pipe (62) is had in the hole of heat pipe for thermal conductivity hole (14) and cooled plate (61) heat pipe through hole (63)
Groove (15,66), the welding of described cooled plate heat pipe (62) uses hot air convection reflow soldering process；
The hot air convection reflow soldering process of described welding cooled plate heat pipe 62, solder uses Sn63Pb37 solder paste, and equipment uses 8
Warm area reflow machine, wherein, one or two district are heating zone, and San Siwu district is heat preservation zone, and six or seven district are weld zone, eight cooling zones, district,
Temperature parameter is respectively set to 120 DEG C, 140 DEG C, 160 DEG C, 180 DEG C, 210 DEG C, 240 DEG C, 240 DEG C, 200 DEG C, and return air speed is
40-50mm/s, reflow machine chain speed is 8mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614327.7A CN106125872A (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614327.7A CN106125872A (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106125872A true CN106125872A (en) | 2016-11-16 |
Family
ID=57255310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610614327.7A Pending CN106125872A (en) | 2016-07-29 | 2016-07-29 | A kind of bus type heat pipe type water-cooling heat radiating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106125872A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN109739325A (en) * | 2019-01-09 | 2019-05-10 | 皖西学院 | A kind of server for wisdom high-speed rail data center |
| US10433458B1 (en) * | 2018-05-08 | 2019-10-01 | Hewlett Packard Enterprise Development Lp | Conducting plastic cold plates |
| CN111949094A (en) * | 2020-07-15 | 2020-11-17 | 苏州浪潮智能科技有限公司 | Water-cooling heat dissipation structure for memory |
| CN111984086A (en) * | 2020-09-14 | 2020-11-24 | 青海师范大学 | Computer water-cooling heat abstractor |
| WO2021114878A1 (en) * | 2019-12-09 | 2021-06-17 | 华南理工大学 | Server water-cooling heat dissipation system having redundant phase change heat transfer element, and control method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648495Y (en) * | 2003-08-05 | 2004-10-13 | 刘锋 | Case with radiating device of chip for computer |
| CN2872593Y (en) * | 2005-12-22 | 2007-02-21 | 佛山市顺德区汉达精密电子科技有限公司 | Structure of radiator |
| CN201035486Y (en) * | 2007-03-28 | 2008-03-12 | 褚锽埕 | Heat sink for internal memory |
| CN201319724Y (en) * | 2008-12-09 | 2009-09-30 | 奇鋐科技股份有限公司 | Liquid-cooled heat radiation module |
| CN103076864A (en) * | 2013-01-30 | 2013-05-01 | 山东超越数控电子有限公司 | Heat radiating fins of mainboard of compact peripheral component interconnect (CPCI) computer |
| CN203773455U (en) * | 2014-03-18 | 2014-08-13 | 中国移动通信集团广东有限公司 | Server radiating device |
| CN203786651U (en) * | 2014-03-06 | 2014-08-20 | 北京芯铠电子散热技术有限责任公司 | Liquid cooling system of server and server comprising liquid cooling system |
| CN206075226U (en) * | 2016-07-29 | 2017-04-05 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
-
2016
- 2016-07-29 CN CN201610614327.7A patent/CN106125872A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648495Y (en) * | 2003-08-05 | 2004-10-13 | 刘锋 | Case with radiating device of chip for computer |
| CN2872593Y (en) * | 2005-12-22 | 2007-02-21 | 佛山市顺德区汉达精密电子科技有限公司 | Structure of radiator |
| CN201035486Y (en) * | 2007-03-28 | 2008-03-12 | 褚锽埕 | Heat sink for internal memory |
| CN201319724Y (en) * | 2008-12-09 | 2009-09-30 | 奇鋐科技股份有限公司 | Liquid-cooled heat radiation module |
| CN103076864A (en) * | 2013-01-30 | 2013-05-01 | 山东超越数控电子有限公司 | Heat radiating fins of mainboard of compact peripheral component interconnect (CPCI) computer |
| CN203786651U (en) * | 2014-03-06 | 2014-08-20 | 北京芯铠电子散热技术有限责任公司 | Liquid cooling system of server and server comprising liquid cooling system |
| CN203773455U (en) * | 2014-03-18 | 2014-08-13 | 中国移动通信集团广东有限公司 | Server radiating device |
| CN206075226U (en) * | 2016-07-29 | 2017-04-05 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN107977064B (en) * | 2017-12-29 | 2024-09-06 | 华南理工大学 | Water-cooling heat dissipation device of server and heat dissipation method thereof |
| US10433458B1 (en) * | 2018-05-08 | 2019-10-01 | Hewlett Packard Enterprise Development Lp | Conducting plastic cold plates |
| CN109739325A (en) * | 2019-01-09 | 2019-05-10 | 皖西学院 | A kind of server for wisdom high-speed rail data center |
| CN109739325B (en) * | 2019-01-09 | 2022-03-18 | 皖西学院 | A server for wisdom high-speed railway data center |
| WO2021114878A1 (en) * | 2019-12-09 | 2021-06-17 | 华南理工大学 | Server water-cooling heat dissipation system having redundant phase change heat transfer element, and control method |
| CN111949094A (en) * | 2020-07-15 | 2020-11-17 | 苏州浪潮智能科技有限公司 | Water-cooling heat dissipation structure for memory |
| CN111949094B (en) * | 2020-07-15 | 2021-12-28 | 苏州浪潮智能科技有限公司 | Water-cooling heat dissipation structure for memory |
| CN111984086A (en) * | 2020-09-14 | 2020-11-24 | 青海师范大学 | Computer water-cooling heat abstractor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106125872A (en) | A kind of bus type heat pipe type water-cooling heat radiating system | |
| RU2695089C2 (en) | System for direct liquid cooling of electronic components | |
| US9930807B2 (en) | Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader | |
| US8913384B2 (en) | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) | |
| US8619425B2 (en) | Multi-fluid, two-phase immersion-cooling of electronic component(s) | |
| US8493738B2 (en) | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails | |
| US8934250B2 (en) | Immersion-cooling of selected electronic component(s) mounted to printed circuit board | |
| US9282678B2 (en) | Field-replaceable bank of immersion-cooled electronic components and separable heat sinks | |
| US8345423B2 (en) | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems | |
| US8687364B2 (en) | Directly connected heat exchanger tube section and coolant-cooled structure | |
| CN107979962B (en) | Water-cooled circuit board heat abstractor | |
| CN106102418B (en) | The cold VPX cabinets efficient radiating apparatus of liquid and method based on soaking plate | |
| CN103249281A (en) | Heat dissipating module | |
| CN206075226U (en) | A kind of bus type heat pipe type water-cooling heat radiating system | |
| CN106486433A (en) | Igbt radiator | |
| CN216775385U (en) | Optical module liquid cooling radiator | |
| CN109152314B (en) | Heat abstractor, control radiating component and washing machine | |
| CN205883830U (en) | High -efficient heat abstractor of liquid cooling VPX machine case based on soaking board | |
| CN207820432U (en) | Water-cooled circuit plate heat dissipating device | |
| CN212413342U (en) | Liquid cooling heat radiator for switch chip and optical module | |
| CN108489303A (en) | A kind of heat sink arrangement with thermal insulation layer | |
| WO2024055604A1 (en) | Full-liquid-cooling heat dissipation apparatus of single-layer server level | |
| CN207516905U (en) | A kind of bus type heat pipe type water-cooling heat radiating device | |
| CN105470222A (en) | Cooling device for electronic component | |
| CN219644427U (en) | Water jacket radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Li Yong Inventor after: Liu Song Inventor after: Zhou Wenjie Inventor after: He Bailin Inventor after: Huang Guangwen Inventor after: Chen Chuangxin Inventor after: Chen Hanyin Inventor before: Li Yong Inventor before: Liu Gao Inventor before: Zhou Wenjie Inventor before: He Bailin Inventor before: Huang Guangwen Inventor before: Chen Chuangxin Inventor before: Chen Hanyin |
|
| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |
|
| RJ01 | Rejection of invention patent application after publication |