CN111949094B - Water-cooling heat dissipation structure for memory - Google Patents
Water-cooling heat dissipation structure for memory Download PDFInfo
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- CN111949094B CN111949094B CN202010678861.0A CN202010678861A CN111949094B CN 111949094 B CN111949094 B CN 111949094B CN 202010678861 A CN202010678861 A CN 202010678861A CN 111949094 B CN111949094 B CN 111949094B
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- 230000015654 memory Effects 0.000 title claims abstract description 73
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 53
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 11
- 238000012423 maintenance Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention discloses a water-cooling heat dissipation structure for a memory, which comprises a mainboard, wherein a heat dissipation device and a first connector are installed on the mainboard, the first connector is installed on one side of the heat dissipation device on the mainboard, a first heat conduction sheet is arranged on the heat dissipation device, a first heat dissipation plate is installed on the first heat conduction sheet, a second heat conduction sheet is arranged on the first heat dissipation plate, a switching device is installed on the second heat conduction sheet, and heat conduction gel is filled in the switching device, in a gap between the switching device and the first heat dissipation plate and in a gap between the switching device and the second heat dissipation plate. The switching device is convenient to install and maintain later, the heat conducting gel is filled between the memories, the distance between the memories can be reduced, the number of the memories is increased, the working efficiency is improved, heat generated by the memories can be transmitted out under the action of the heat conducting gel and dissipated out under the action of the first heat dissipation plate, and the normal production work of the memories is guaranteed.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a water-cooling heat dissipation structure for an internal memory.
Background
As the heating wattage of key devices of electronic products is increasing and the requirements of data centers on operation and maintenance cost optimization are increasing, the traditional air cooling heat dissipation approaches the limit, so that the liquid cooling technology becomes the field of rapid development in recent years; the most developed and technically mature cold plate (cold plate) liquid cooling; at the beginning of development of cold plate liquid cooling, the major trend is for high-wattage key devices such as CPU/GPU, however, as the memory technology is developed, the wattage is increasing, and the cold plate manufacturing technology is advanced, the memory water cooling plate technology is also gradually introduced into electronic products.
The existing heat dissipation of the internal water storage cold plate directly penetrates a water loop through gaps among the internal memories, and heat of internal memory particles is transferred to the water loop through the heat conducting fins to dissipate heat; and the heat conductive sheet is likely to be damaged or contact failure occurs during assembly and maintenance.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a water-cooling heat dissipation structure for memories, wherein a switching device is convenient to install and maintain at a later stage, heat-conducting gel is filled between the memories, so that the distance between the memories can be reduced, the number of the memories can be increased, the working efficiency is improved, heat generated by the memories can be transmitted out under the action of the heat-conducting gel and dissipated out under the action of a first heat dissipation plate, and the normal production work of the memories is ensured.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a memory water-cooling heat radiation structure, includes the mainboard, install heat abstractor and first connector on the mainboard, first connector is installed in one side of heat abstractor on the mainboard, is equipped with first conducting strip on heat abstractor, install first heating panel on the first conducting strip, be equipped with the second conducting strip on the first heating panel, install switching device on the second conducting strip, switching device with first connector on the mainboard cooperatees, and switching device's top is equipped with the second heating panel, the second heating panel cooperatees with first heating panel, and the space between switching device and the first heating panel, the space department between switching device and the second heating panel are filled with heat conduction gel in switching device's inside, switching device and first heating panel.
Preferably, the heat dissipation device comprises a third heat conduction sheet and a water cooling pipe embedded on the third heat conduction sheet, the water cooling pipe is of a stepped structure in cross section, the heat dissipation device can dissipate heat generated by the memory, and the heat generated by the memory is taken away and dissipated under the action of cooling liquid in the water cooling pipe.
Preferably, the first connectors are two, the two first connectors are symmetrically arranged on two sides of the third heat conducting fin, the switching device comprises a switching board, the two second connectors are arranged at the bottom of the switching board and are arranged at two ends of the switching board, the two second connectors correspond to the two first connectors one by one, a plurality of memory connectors are arranged at the top of the switching board, each memory is provided with one memory, the switching device is convenient to install and maintain, the installation and maintenance efficiency is improved, heat conducting gel is filled between the memories for conducting heat, the problem that a heat conducting plate in the assembling process is broken and damaged or the memory is not in good contact and the like is avoided, and the transmission quality between the memories and a mainboard is improved.
Preferably, the first radiating fin comprises a bottom plate and two side plates, the bottom plate and the two side plates form a groove-shaped structure with openings at two ends, the first radiating fin conveniently wraps the switching device, conditions are provided for filling of heat conduction gel, heat conduction efficiency is greatly improved, and normal work of the server is guaranteed.
Preferably, the second radiating fin is matched with the first radiating fin and comprises a top plate and two baffles, the top plate and the two baffles form an inverted U shape, the second radiating fin is matched with the first radiating fin to wrap the switching device, heat conducting gel is conveniently filled, radiating efficiency is improved, and normal work of the memory is guaranteed.
Preferably, the length of the second heat-conducting fin is not greater than the distance between the two second connectors, the width of the second heat-conducting fin is not greater than the distance between the two side plates of the first heat-radiating fin, and the second heat-conducting fin is connected with the switching device and the first heat-radiating fin, so that heat conduction is ensured, the heat-radiating efficiency is improved, and the normal operation of the memory is ensured.
The invention has the beneficial effects that:
1) this device switching device is convenient for install and the maintenance in later stage, fills heat conduction gel between the memory, not only can reduce the distance between the memory, increases memory quantity, has improved work efficiency, and under the effect of heat conduction gel, can reach away the heat that the memory produced, distributes away under the effect of first heating panel, has guaranteed the just production work of memory.
2) This device heat abstractor includes the third conducting strip and inlays the water-cooled tube on the third conducting strip, the water-cooled tube adopts the cross-section to be the structure of echelonment, and heat abstractor can distribute away the heat that the memory produced, takes away and distributes away the heat that produces the memory under the effect of cooling liquid in the water-cooled tube.
3) The first connector of this device is equipped with two, and the both sides at the third conducting strip are installed to two first connector symmetries, switching device includes the keysets, two second connectors are installed to the bottom of keysets, two second connectors are installed at the both ends of keysets, and two second connectors and two first connector one-to-one, install a plurality of memory connectors at the top of keysets, all install a memory on every memory connector, and the device is easy to assemble and maintenance, has improved the efficiency of installation and maintenance, and packs heat conduction gel between the memory and carry out the heat conduction, has avoided the heat-conducting plate in the assembling process to break and has damaged, or with the not good scheduling problem of memory contact, has improved the transmission quality between memory and the mainboard.
4) The first radiating fin of the device comprises a bottom plate and two side plates, wherein the bottom plate and the two side plates form a groove-shaped structure with openings at two ends, the first radiating fin is convenient to wrap the switching device, conditions are provided for filling heat-conducting gel, heat-conducting efficiency is greatly improved, and normal work of the server is guaranteed.
5) This device second fin and first fin cooperate, the second fin includes a roof and two baffles, and a roof and two baffles constitute the type of falling U, and the second fin cooperatees with first fin, wraps up switching device, conveniently fills heat conduction gel, has improved the radiating efficiency, the normal work of the memory of having guaranteed.
6) The length of this device second conducting strip is not more than the distance between two second connectors, and the width of second conducting strip is not more than the distance between two curb plates on the first fin, and switching device and first fin are connected to the second conducting strip, have guaranteed thermal conduction, have improved the radiating efficiency, have guaranteed the normal work of memory.
Drawings
Fig. 1 is a schematic structural diagram of a water-cooling heat dissipation structure of an internal memory.
Fig. 2 is an exploded view of a water-cooling heat dissipation structure of an internal memory according to the present invention.
Fig. 3 is a schematic structural diagram of the heat dissipation device of the present invention.
Fig. 4 is a schematic structural diagram of the adapter of the present invention.
Fig. 5 is a schematic structural view of a second heat dissipation plate according to the present invention.
Fig. 6 is a schematic structural view of a first heat dissipation plate according to the present invention.
In the figure: 1. a main board; 2. a first connector; 3. a second thermally conductive sheet; 4. a first thermally conductive sheet; 5. a heat sink; 501. a third thermally conductive sheet; 502. a water-cooled tube; 6. a switching device; 601. an adapter plate; 602. a memory connector; 603. a second connector; 604. a memory; 7. a second heat dissipation plate; 701. a top plate; 702. a baffle plate; 8. a first heat dissipation plate; 801. a side plate; 802. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 6, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
A water-cooling heat dissipation structure of a memory 604 comprises a mainboard 1, wherein a heat dissipation device 5 and a first connector 2 are installed on the mainboard 1, the first connector 2 is installed on one side of the heat dissipation device 5 on the mainboard 1, a first heat conduction sheet 4 is arranged on the heat dissipation device 5, a first heat dissipation plate 8 is installed on the first heat conduction sheet 4, a second heat conduction sheet 3 is arranged on the first heat dissipation plate 8, a switching device 6 is installed on the second heat conduction sheet 3, the switching device 6 is matched with the first connector 2 on the mainboard 1, a second heat dissipation plate 7 is arranged at the top of the switching device 6, the second heat dissipation plate 7 is matched with the first heat dissipation plate 8, and heat conduction gel is filled in the switching device 6, in a gap between the switching device 6 and the first heat dissipation plate 8 and in a gap between the switching device 6 and the second heat dissipation plate 7; this device switching device 6 is convenient for the maintenance of installation and later stage, fills heat conduction gel between the memory 604, not only can reduce the distance between the memory 604, increases memory 604 quantity, has improved work efficiency, and under the effect of heat conduction gel, can reach away the heat that memory 604 produced, distributes away under the effect of first heating panel 8, has guaranteed the just productive work of memory 604.
The heat dissipation device 5 comprises a third heat conduction sheet 501 and a water cooling pipe 502 embedded in the third heat conduction sheet 501, the water cooling pipe 502 is of a stepped structure, the heat generated by the memory 604 can be dissipated by the heat dissipation device 5, and the heat generated by the memory 604 is taken away and dissipated under the action of cooling liquid in the water cooling pipe 502.
The stepped arrangement of the water-cooled tube 502 increases the contact area between the water-cooled tube 502 and the second heat sink, improves the heat dissipation efficiency, and ensures the normal operation of the memory 604.
The two first connectors 2 are symmetrically arranged on two sides of the third heat-conducting fin 501, the switching device 6 comprises a switching board 601, two second connectors 603 are arranged at the bottom of the switching board 601, the two second connectors 603 are arranged at two ends of the switching board 601, the two second connectors 603 correspond to the two first connectors 2 one by one, the plurality of memory connectors 602 are arranged at the top of the switching board 601, each memory connector 602 is provided with one memory 604, the device is convenient to install and maintain, the installation and maintenance efficiency is improved, heat-conducting gel is filled between the memories 604 for heat conduction, the problems that the heat-conducting plate is broken and damaged in the assembling process or the contact with the memories 604 is poor and the like are avoided, and the transmission quality between the memories 604 and the main board 1 is improved.
The memory connector 602 facilitates connection between the memory 604 and the adapter board 601, so as to ensure signal transmission and normal operation of the memory 604.
The first cooling fin comprises a bottom plate 802 and two side plates 801, the bottom plate 802 and the two side plates 801 form a groove-shaped structure with openings at two ends, the first cooling fin is convenient to wrap the switching device 6, conditions are provided for filling heat-conducting gel, heat-conducting efficiency is greatly improved, and normal work of the server is guaranteed.
The second radiating fin is matched with the first radiating fin and comprises a top plate 701 and two baffle plates 702, the top plate 701 and the two baffle plates 702 form an inverted U shape, the second radiating fin is matched with the first radiating fin to wrap the adapter device 6, heat conducting gel is conveniently filled, radiating efficiency is improved, and normal work of the memory 604 is guaranteed.
The length of the second heat-conducting fin 3 is not greater than the distance between the two second connectors 603, the width of the second heat-conducting fin 3 is not greater than the distance between the two side plates 801 on the first heat sink, and the second heat-conducting fin 3 is connected with the adapter device 6 and the first heat sink, so that heat conduction is ensured, the heat dissipation efficiency is improved, and the normal operation of the memory 604 is ensured.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the present invention as defined in the accompanying claims.
Claims (1)
1. A water-cooling heat dissipation structure for a memory comprises a mainboard and is characterized in that a heat dissipation device and a first connector are mounted on the mainboard, the first connector is mounted on one side of the heat dissipation device on the mainboard, a first heat conduction sheet is arranged on the heat dissipation device, a first heat dissipation plate is mounted on the first heat conduction sheet, a second heat conduction sheet is arranged on the first heat dissipation plate, a switching device is mounted on the second heat conduction sheet, the switching device is matched with the first connector on the mainboard, a second heat dissipation plate is arranged at the top of the switching device, the second heat dissipation plate is matched with the first heat dissipation plate, and heat conduction gel is filled in the switching device, in a gap between the switching device and the first heat dissipation plate and in a gap between the switching device and the second heat dissipation plate;
the heat dissipation device comprises a third heat conduction sheet and a water cooling pipe embedded on the third heat conduction sheet, and the water cooling pipe adopts a structure with a step-shaped section;
the first connectors are arranged in two numbers, the two first connectors are symmetrically arranged on two sides of the third heat conducting fin, the switching device comprises a switching plate, two second connectors are arranged at the bottom of the switching plate and are arranged at two ends of the switching plate, the two second connectors correspond to the two first connectors one by one, a plurality of memory connectors are arranged at the top of the switching plate, and each memory connector is provided with a memory;
the first radiating fin comprises a bottom plate and two side plates, and the bottom plate and the two side plates form a groove-shaped structure with openings at two ends;
the second radiating fin is matched with the first radiating fin and comprises a top plate and two baffles, and the top plate and the two baffles form an inverted U shape;
the length of the second heat conducting fin is not more than the distance between the two second connectors, and the width of the second heat conducting fin is not more than the distance between the two side plates on the first heat radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010678861.0A CN111949094B (en) | 2020-07-15 | 2020-07-15 | Water-cooling heat dissipation structure for memory |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010678861.0A CN111949094B (en) | 2020-07-15 | 2020-07-15 | Water-cooling heat dissipation structure for memory |
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| Publication Number | Publication Date |
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| CN111949094A CN111949094A (en) | 2020-11-17 |
| CN111949094B true CN111949094B (en) | 2021-12-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202331335U (en) * | 2011-11-21 | 2012-07-11 | 浪潮电子信息产业股份有限公司 | Effective memory heat radiator |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN206639146U (en) * | 2017-02-28 | 2017-11-14 | 华为技术有限公司 | A kind of EMS memory heat radiating device |
| DE202018100437U1 (en) * | 2018-01-26 | 2018-02-22 | Tung-Yi Wu | Heat dissipation unit for working memory |
| CN210895326U (en) * | 2019-12-20 | 2020-06-30 | 刘洋 | Improved generation memory bank heat radiation structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2321607A1 (en) * | 2008-08-04 | 2011-05-18 | Clustered Systems Company | A contact cooled electronic enclosure |
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2020
- 2020-07-15 CN CN202010678861.0A patent/CN111949094B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202331335U (en) * | 2011-11-21 | 2012-07-11 | 浪潮电子信息产业股份有限公司 | Effective memory heat radiator |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN206639146U (en) * | 2017-02-28 | 2017-11-14 | 华为技术有限公司 | A kind of EMS memory heat radiating device |
| DE202018100437U1 (en) * | 2018-01-26 | 2018-02-22 | Tung-Yi Wu | Heat dissipation unit for working memory |
| CN210895326U (en) * | 2019-12-20 | 2020-06-30 | 刘洋 | Improved generation memory bank heat radiation structure |
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| CN111949094A (en) | 2020-11-17 |
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