CN207589393U - A kind of heat radiating fin structure on AMC boards - Google Patents
A kind of heat radiating fin structure on AMC boards Download PDFInfo
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- CN207589393U CN207589393U CN201721638391.5U CN201721638391U CN207589393U CN 207589393 U CN207589393 U CN 207589393U CN 201721638391 U CN201721638391 U CN 201721638391U CN 207589393 U CN207589393 U CN 207589393U
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- CN
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- Prior art keywords
- cooling fin
- heat
- fin
- chip
- boss
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- 238000001816 cooling Methods 0.000 claims abstract description 66
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004519 grease Substances 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 239000011159 matrix material Substances 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- FPFQUFITJZWWIH-UHFFFAOYSA-N 2-amino-5-(diaminomethylideneamino)pentanoic acid;1,3-thiazolidine-2-carboxylic acid Chemical compound [O-]C(=O)C1NCCS1.OC(=O)C(N)CCC[NH+]=C(N)N FPFQUFITJZWWIH-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 206010043431 Thinking abnormal Diseases 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Abstract
The utility model is related to the heat radiating fin structures on a kind of AMC boards, including left cooling fin, middle cooling fin, right cooling fin, stud, heat-conducting silica gel sheet, heat-conducting silicone grease, monoblock large scale cooling fin is replaced using three kinds of left, center, right radiating fin combination, and heat-conducting silica gel sheet is filled in each cooling fin and by gap between heat radiation chip, cooling fin is made to be pasted with respectively by heat radiation chip tighter, advantageous effect is that the chip for ensureing that each cooling fin is different from height is well adjacent to；Its heat dissipation effect is relatively preferable, and the temperature of chip decreases.
Description
Technical field
The utility model is related to a kind of heat radiating fin structure, the heat radiating fin structure on more particularly to a kind of AMC boards.
Background technology
At present, for the perpendicular plate communication machine box of ATCA frameworks, the heat dissipation wind channel of General System is from the bottom before cabinet
Portion is acted on, into each board region, the heat that each board is generated is behind cabinet into cold wind by the air draught of blower module
It takes away at top.It is erected for slotting business board or power board for each, crucial or important chip at work, compare by calorific value thereon
Height, the temperature how effectively taken away the heat on chip and reduce chip are particularly important.For business board,
It goes up and usually carries four pieces of AMC boards, calorific value is higher at work for the key or important chip on AMC boards, is dissipated
Thermal design.
In the prior art, the chip on integral heat dissipation piece, heat-conducting silica gel sheet and AMC boards is adopted and is screwed patch
Tightly, due to the location hole irrational distribution on AMC boards, corresponding integral heat dissipation on piece is riveted stud positioning pore size distribution
It is unreasonable, cause integral heat dissipation piece that cannot compress chip well, finally increase chip temperature.
In face of the above problem, the structure of cooling fin on AMC boards how is solved so that chip temperature is decreased into
For the utility model technical issues that need to address.
Invention content
In order to solve above-mentioned technical problem, the utility model provides the heat radiating fin structure on a kind of AMC boards, ensures
Cooling fin can be adjacent to chip well, and the heat of chip is taken on cooling fin in time, pass through ATCA casing system radiatings
Heat is taken away in air duct, and the Wen Sheng of chip is made to decrease, and specific technical solution is the heat radiating fin structure on a kind of AMC boards,
Including left cooling fin, middle cooling fin, right cooling fin, stud, heat-conducting silica gel sheet, heat-conducting silicone grease, it is characterised in that：Left cooling fin is
The front end face of the first matrix have the first fin of rib-type, rear end face have slightly larger than with left by heat radiation chip size, similar shape
First boss is also riveted three studs in the first matrix rear end face, and the height of first boss is when left cooling fin is by being riveted on
When three studs on left cooling fin are fixed on AMC boards, make first boss on left cooling fin and left by between heat radiation chip
Away from less than heat-conducting silica gel sheet thickness, middle cooling fin has the second fin of rib-type for the front end face in the second matrix, and right cooling fin is
The front end face of third matrix have rib-type third fin, rear end face have slightly larger than with right by heat radiation chip size, similar shape
Third boss, third matrix rear end face are also riveted two studs, and the height of third boss is when right cooling fin is by being riveted on the right side
Two studs on cooling fin and when being fixed on AMC boards, make third boss on right cooling fin and right by between heat radiation chip
Away from less than heat-conducting silica gel sheet thickness, left cooling fin first boss in the left gap by cooling fin, the third of right cooling fin
Fill heat-conducting silica gel sheet in boss and the right gap by heat radiation chip, make each cooling fin with being respectively adjacent to by heat radiation chip, in it is scattered
Backing pastes middle part by heat radiation chip with heat-conducting silicone grease.
The beneficial effects of the utility model are that the chip for ensureing that each cooling fin is different from height is well adjacent to；Its heat dissipation effect
Relatively preferably, the temperature of chip decreases.
Description of the drawings
Fig. 1 is the front view that the utility model is mounted on AMC boards；
Fig. 2 is the bottom view that the utility model is mounted on AMC boards；
Fig. 3 is the front view of the left heat radiating fin structure of the utility model；
Fig. 4 is the vertical view of left heat radiating fin structure shown in Fig. 3；
Fig. 5 is the middle heat sink structure illustration of the utility model；
Fig. 6 is the front view of the right heat radiating fin structure of the utility model；
Fig. 7 is the vertical view of right heat radiating fin structure shown in Fig. 6；
Fig. 8 is the front view of second embodiment of the utility model；
Fig. 9 is the close-up schematic view of middle cooling fin shown in Fig. 8.
Specific embodiment
The utility model is further illustrated with reference to the accompanying drawings and embodiments.
Embodiment 1
As shown in Fig. 1 ~ 7, a kind of heat radiating fin structure on AMC boards, left cooling fin 5 is the front end face in the first matrix 51
Have the first fin of rib-type 52, rear end face have slightly larger than with left by 103 size of heat radiation chip, the first boss of similar shape 54,
First matrix, 51 rear end face is also riveted three studs 2, and the height of first boss 54 is when left cooling fin 5 is by being riveted on left heat dissipation
When three studs 2 on piece 5 are fixed on AMC boards, the first boss 54 of left cooling fin 5 with it is left by 103 spacing of heat radiation chip
For 0.6 mm, for middle cooling fin 6 to have the second fin of rib-type 62 in the front end face of the second matrix 61, right cooling fin 7 is in third
The front end face of matrix 71 have rib-type third fin 72, rear end face have slightly larger than with right by heat radiation chip 101 size, similar shape
Third boss 74,71 rear end face of third matrix are also riveted two studs 2, and the height of third boss 74 is when left cooling fin 5 passes through
When two studs 2 being riveted on right cooling fin 7 are fixed on AMC boards, the third boss 74 of right cooling fin 7 is radiated with right
101 spacing of chip be 0.6 mm, left cooling fin 5 first boss 54 with it is left by the gap of heat radiation chip 103, right cooling fin
7 third boss 74 is 1.0 mm with filling heat-conducting silica gel sheet 3,3 thickness of heat-conducting silica gel sheet in right 101 gap by heat radiation chip,
Make cooling fin with being respectively adjacent to by heat radiation chip, middle cooling fin 6 heat-conducting silicone grease 8 pastes middle part by heat radiation chip 102.It is left
Cooling fin 5, middle cooling fin 6, right cooling fin 7 are manufactured for aluminium alloy.
Embodiment 2
As shown in Fig. 8 ~ 9, structure, material and fixed form and the first embodiment of left cooling fin 5 and right cooling fin 7
It is just the same, it is unique unlike in cooling fin 6, middle cooling fin 6 is by embedding on the second matrix 61, the second fin 62 and matrix
Copper billet 9 forms, i.e., copper billet 9 is embedded into the second matrix 61.The advantages of cooling fin is the thermal conductivity ratio aluminium alloy of copper billet
Thermal conductivity factor it is high, the heat that can be generated at middle part by heat radiation chip 102 is timely passed on copper billet 9, then pass it to
On second matrix 61 and the second fin 62, heat is taken away in time using the heat dissipation wind channel of case system.The installation of middle cooling fin 6
And fixed form is consistent with the middle cooling fin 6 of the first embodiment.
It is only specific embodiment of the present utility model in summary, designer can exist according to the enlightenment of examples detailed above
It optimizes or improves without departing under technical solution.
Claims (1)
1. a kind of heat radiating fin structure on AMC boards, including left cooling fin（5）, middle cooling fin（6）, right cooling fin（7）, stud
（2）, heat-conducting silica gel sheet（3）, heat-conducting silicone grease（8）, it is characterised in that：Left cooling fin（5）For in the first matrix（51）Front end face
There is the first fin of rib-type（52）, rear end face have slightly larger than with left by heat radiation chip（103）Size, the first boss of similar shape
（54）, in the first matrix（51）Rear end face is also riveted three studs（2）, first boss（54）Height be when left cooling fin（5）
By being riveted on left cooling fin（5）On three studs（2）When being fixed on AMC boards, make left cooling fin（5）On it is first convex
Platform（54）With left by heat radiation chip（103）It is smaller than heat-conducting silica gel sheet（3）Thickness, middle cooling fin（6）For in the second matrix
（61）Front end face have the second fin of rib-type（62）, right cooling fin（7）For in third matrix（71）Front end face have rib-type
Third fin（72）, rear end face have slightly larger than with right by heat radiation chip（101）The third boss of size, similar shape（74）, third
Matrix（71）Rear end face is also riveted two studs（2）, third boss（74）Height be when right cooling fin（7）By being riveted on the right side
Cooling fin（7）On two studs（2）And when being fixed on AMC boards, make right cooling fin（7）On third boss（74）With the right side
By heat radiation chip（101）It is smaller than heat-conducting silica gel sheet（3）Thickness, in left cooling fin（5）First boss（54）It is dissipated with left
Hot chip（103）Gap in, right cooling fin（7）Third boss（74）With right by heat radiation chip（101）Gap in fill
Heat-conducting silica gel sheet（3）, make each cooling fin with being respectively adjacent to by heat radiation chip, middle cooling fin（6）Use heat-conducting silicone grease（8）In pasting
Portion is by heat radiation chip（102）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721638391.5U CN207589393U (en) | 2017-11-30 | 2017-11-30 | A kind of heat radiating fin structure on AMC boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721638391.5U CN207589393U (en) | 2017-11-30 | 2017-11-30 | A kind of heat radiating fin structure on AMC boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207589393U true CN207589393U (en) | 2018-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721638391.5U Active CN207589393U (en) | 2017-11-30 | 2017-11-30 | A kind of heat radiating fin structure on AMC boards |
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| CN (1) | CN207589393U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108829207A (en) * | 2018-08-22 | 2018-11-16 | 北京航天长征飞行器研究所 | A kind of snap-gauge shell, VPX cabinet and VPX processor |
| CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
| CN111225544A (en) * | 2019-12-06 | 2020-06-02 | 法雷奥西门子新能源汽车(深圳)有限公司 | Heat sink for electronic component |
-
2017
- 2017-11-30 CN CN201721638391.5U patent/CN207589393U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108829207A (en) * | 2018-08-22 | 2018-11-16 | 北京航天长征飞行器研究所 | A kind of snap-gauge shell, VPX cabinet and VPX processor |
| CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
| CN111225544A (en) * | 2019-12-06 | 2020-06-02 | 法雷奥西门子新能源汽车(深圳)有限公司 | Heat sink for electronic component |
| CN111225544B (en) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | Heat sink for electronic component |
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