CN215991772U - Solve radiating quick-witted case of consumption electronic equipment under natural convection condition - Google Patents
Solve radiating quick-witted case of consumption electronic equipment under natural convection condition Download PDFInfo
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- CN215991772U CN215991772U CN202122458850.4U CN202122458850U CN215991772U CN 215991772 U CN215991772 U CN 215991772U CN 202122458850 U CN202122458850 U CN 202122458850U CN 215991772 U CN215991772 U CN 215991772U
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Abstract
The utility model discloses a chassis for solving the problem of heat dissipation of power-consumption electronic equipment under the condition of natural convection, which comprises: a housing with heat dissipating fins; a heat pipe assembly installed at an inner wall of the case; the circuit that leads with heat pipe assembly fixed connection leads cold plate to and be located the guide rail of circuit lead cold plate both sides. The utility model relates to the technical field of electronic products, wherein a duct component is arranged as a heat conduction channel, a phase-change material in a heat pipe is used as a medium, heat generated when an electronic device runs is quickly conducted to a shell through a circuit cold conduction plate, and then heat exchange is carried out between a radiating fin and outside air, so that the electronic device is finally radiated under the condition of natural convection, the sealing property of a case device is ensured, the dust-proof and moisture-proof effects are better, and the case device has the characteristics of no power consumption and no noise in the radiating process.
Description
Technical Field
The utility model relates to the technical field of electronic products, in particular to a case for solving the problem of heat dissipation of power-consumption electronic equipment under the condition of natural convection.
Background
The electronic equipment case is an important structure for installing and protecting various circuit units, components and mechanical parts in the electronic equipment, plays an important role in eliminating the interference of various complex environments to the equipment, ensuring the safe, stable and reliable work of the equipment, improving the service efficiency and service life of the equipment, enhancing the convenience of equipment installation and maintenance, is not only a shell but also has a protection function and reasonable layout in the internal part, and is convenient for installing various electronic equipment with different functions.
In the prior art, electronic components and circuit boards of an industrial control case are required to be installed in a closed environment to avoid dust and moisture in a working environment from affecting electronic equipment in the case, so that heat generated by the electronic components in operation is conducted to the wall of the case through a special metal cold conduction plate, and then the heat is dissipated in a natural environment in which heat generated by the components is dissipated by external air flowing downwards through a radiating fin outside the case, but the heat generated by power consumption components cannot be dissipated timely and accumulated on the electronic components due to the influence of factors such as metal thermal conductivity (the thermal conductivity of a common thermal metal material is lower than 200W/M DEG C) and contact thermal resistance of each installation part, and at the moment, a frequency reduction mechanism of the electronic components cannot be triggered to reduce the working efficiency of the electronic components, and the electronic components can be damaged due to overheating, therefore, we propose a case for dissipating heat of power-consuming electronic devices under natural convection to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems in the prior art, and provides a chassis for dissipating heat of power-consuming electronic equipment under the condition of natural convection.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a chassis for dissipating heat from a power-consuming electronic device while addressing natural convection conditions, comprising:
a housing with heat dissipating fins;
a heat pipe assembly installed at an inner wall of the case;
the circuit cold guide plate is fixedly connected with the heat pipe assembly, and the guide rails are positioned on two sides of the circuit cold guide plate;
the cold end of the heat pipe assembly is close to the radiating fin, and the hot end of the heat pipe assembly is close to the circuit cold conducting plate.
Preferably, the housing comprises:
the side walls of the two side plates, which are close to each other, are fixedly connected with an installation frame, and the top plate, the bottom plate, the front cover plate and the rear cover plate are detachably connected with the installation frame;
the radiating fins are fixedly connected with the side walls, far away from the two side plates, of the radiator.
Preferably, the heat pipe assembly includes:
the heat pipe comprises a heat pipe body and heat conducting blocks for fixedly connecting two ends of the heat pipe body;
the heat conduction block is provided with a through hole, and the side wall of the side plate and the upper surface of the circuit cold conduction plate are provided with mounting grooves matched with the heat conduction block.
Preferably, a plurality of mounting holes are formed in the side wall of the front cover plate, and connectors matched with electronic equipment are fixedly connected in the mounting holes.
Preferably, the top plate, the bottom plate, the front cover plate, the rear cover plate and one side of the two side plates close to each other are provided with reinforcing ribs.
Preferably, the circuit cold plate and the guide rail are both made of aluminum or copper, and the lower surface of the circuit cold plate is fixedly connected with a bulge attached to the electronic device.
Preferably, the heat dissipation fins are vertically arranged.
Preferably, the lower surface of the bottom plate is fixedly connected with a cushion block.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the duct assembly is arranged as the heat conduction channel, the phase-change material in the heat pipe is used as the medium, the heat generated when the electronic device operates is quickly conducted to the shell through the circuit cold conduction plate, and then the heat is exchanged with the external air through the heat dissipation fins, so that the electronic device is finally dissipated under the condition of natural convection, the sealing performance of the case device is ensured, the dust-proof and moisture-proof effects are better, and meanwhile, the case device has the characteristics of no power consumption and no noise in the heat dissipation process;
2. according to the utility model, the circuit cold conduction plate is matched with the guide rail, the guide rail is used as the mounting frame for fixing the electronic device, and is also used as the heat conduction piece for conducting heat generated during the operation of the electronic device to the heat pipe assembly, and on the other hand, the heat pipe assembly is used for supporting the circuit cold conduction plate, so that the circuit cold conduction plate is not contacted with the inner wall of the shell, and the case device further has certain anti-falling and anti-vibration effects.
Drawings
Fig. 1 is a schematic view of an overall structure of a chassis for dissipating heat of an electronic device with power consumption under a natural convection condition according to the present invention;
fig. 2 is an exploded view of a case for dissipating heat of a power-consuming electronic device under natural convection according to the present invention;
fig. 3 is a schematic view of an assembly structure of a chassis for dissipating heat of an electronic device with power consumption under a natural convection condition according to the present invention;
fig. 4 is a schematic diagram of a circuit cooling plate structure of a chassis for dissipating heat of a power-consuming electronic device under a natural convection condition according to the present invention;
fig. 5 is a schematic structural diagram of a heat pipe assembly of a chassis for dissipating heat of a power-consuming electronic device under a natural convection condition according to the present invention.
In the figure: 1. a heat dissipating fin; 2. a housing; 21. a top plate; 22. a base plate; 23. a front cover plate; 24. a rear cover plate; 25. a side plate; 26. installing a frame; 3. a heat pipe assembly; 31. a heat pipe body; 32. a heat conducting block; 4. a circuit cold conducting plate; 5. a guide rail; 6. a connector; 7. and a cushion block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, a chassis for dissipating heat of an electronic device with power consumption under natural convection includes: a housing 2 with heat dissipating fins 1, wherein the housing 2 comprises: a top plate 21, a bottom plate 22, a front cover plate 23, a rear cover plate 24 and two side plates 25; the side wall fixedly connected with installing frame 26 that two curb plates 25 are close to each other, and roof 21, bottom plate 22, front shroud 23, back shroud 24 and installing frame 26 can dismantle and be connected the setting, roof 21, bottom plate 22, front shroud 23, one side that back shroud 24 and two curb plates 25 are close to each other all is provided with the strengthening rib, casing 2 is the panel beating material, and set up the strengthening rib and can reduce roof 21, bottom plate 22, front shroud 23, back shroud 24 and two curb plates 25 raw materials thickness, ensure the physical strength of casing 2, can reduce the cost of chassis device and the consumption of steel, the lower surface fixedly connected with cushion 7 of bottom plate 22, cushion 7 can be used for buffering shock attenuation, can also make the air better flow in the direction from heat radiating fin 1, the side wall fixed connection setting that heat radiating fin 1 and two curb plates 25 are far away from each other, by roof 21, bottom plate 22, front shroud 23, The rear cover plate 24 and the two side plates 25 form a six-sided rectangular shell 2, and the mounting frame 26 is arranged for connection, so that a user can conveniently and independently dismount the top plate 21, the bottom plate 22, the front cover plate 23 and the rear cover plate 24 of the shell 2, and further, the user can conveniently mount, maintain and repair the electronic element; the heat pipe assembly 3 is arranged on the inner wall of the shell 2, the cold end of the heat pipe assembly 3 is arranged close to the heat radiating fin 1, and the hot end of the heat pipe assembly 3 is arranged close to the circuit cold conducting plate 4;
wherein the heat pipe assembly 3 includes: a heat pipe body 31 and a heat conduction block 32 for fixedly connecting two ends of the heat pipe body 31; the heat conducting block 32 is provided with a through hole, the side wall of the side plate 25 and the upper surface of the circuit cold conducting plate 4 are both provided with mounting grooves matched with the heat conducting block 32, when the heat pipe body 31 is applied, bending and shaping are carried out under the condition that the circulation of a phase change material in the heat pipe body is not influenced, so that the distance between two slide rails is matched with an electronic device, the heat conducting block 32 is welded on the heat pipe body 31, the heat conducting block 32 is made of copper, the heat conducting block 32 is also used for enlarging the heat exchange area and improving the heat dissipation effect, wherein the inner wall of the mounting groove is fixedly connected with a threaded sleeve which is used for matching with the through hole to realize the purpose of fixing the heat conducting block 32 in the mounting groove by using a bolt, the circuit cold conducting plate 4 fixedly connected with the heat pipe assembly 3 and the guide rail 5 positioned between the circuit cold conducting plates 4, the shell 2 with the heat radiating fins 1 is arranged to match with the circuit cold conducting plate assembly 3 to conduct the heat on the circuit cold conducting plate 4 to the outside air, wherein the circuit cold conducting plate 4 and the guide rail 5 are used as a mounting frame for fixing electronic devices, the heat exchange area is enlarged, the heat conduction effect is improved, and the circuit cold conducting plate 4 is used for being attached to a circuit board, when the circuit cold conducting plate 4 is mounted, the circuit board and the circuit cold conducting plate 4 are firstly attached to the circuit cold conducting plate 4, then the assembly formed by the circuit board and the circuit cold conducting plate 4 is slid into the guide rail 5, the aim of mounting a multilayer circuit board can be achieved, and the clearance between the electronic devices on the circuit board and the circuit cold conducting plate 4 can be reduced by coating heat-conducting silicone grease on the circuit cold conducting plate 4, the heat conduction effect is further improved, the shell 2 is ensured to be a sealed shell, the dustproof and moistureproof effects are better, and the shell has the characteristics of no power consumption and no noise in the heat dissipation process, on the other hand, the heat pipe assembly 3 is used for supporting the circuit cold conducting plate 4, and the circuit cold conducting plate 4 is not contacted with the inner wall of the shell 2, the case device also has certain anti-falling and anti-vibration effects, and can provide better protection effect for more precise electronic devices.
Furthermore, a plurality of mounting holes have been seted up to the lateral wall of front shroud 23, and fixedly connected with and electronic equipment matched connector 6 in the mounting hole, and electronic device needs power supply, access signal line and output signal, through the mode that sets up connector 6 on the one hand when making things convenient for the wiring, improves quick-witted case device's sealed effect, and on the other hand to the interface that needs frequent plug, uses interchangeable connector 6 can reduce subsequent cost of maintenance.
Further, circuit cold plate 4 and guide rail 5 are aluminium material or copper product, the lower fixed surface of guide rail 5 is connected with the arch of laminating with electronic device, aluminium material or copper product all have better heat conduction effect, and circuit cold plate 4 and guide rail 5 need cooperate heat pipe assembly 3 when as support piece to the heat that produces when with electronic device operation outwards conduct, so use the metal preparation that coefficient of heat conductivity is high, simultaneously because 2 inside enclosure spaces that are of casing, need not worry the corrosion of copper product.
Further, radiating fin 1 is vertical setting, and after radiating fin 1 of vertical setting carried out the heat exchange with the air at the radiating process, the air was heated the inflation and upwards flows, and then formed heat convection, improved the radiating effect, and on the other hand, radiating fin 1 of vertical setting set up for level setting or slope setting, and the ash that more is difficult to falls reduces radiating fin 1's clearance frequency.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A chassis for dissipating heat from a power-consuming electronic device while addressing natural convection conditions, comprising:
a housing with heat dissipating fins;
a heat pipe assembly installed at an inner wall of the case;
the circuit cold guide plate is fixedly connected with the heat pipe assembly, and the guide rails are positioned on two sides of the circuit cold guide plate;
the cold end of the heat pipe assembly is close to the radiating fin, and the hot end of the heat pipe assembly is close to the circuit cold conducting plate.
2. The chassis of claim 1, wherein the housing comprises:
the device comprises a top plate, a bottom plate, a front cover plate, a rear cover plate and two side plates;
the side walls of the two side plates, which are close to each other, are fixedly connected with an installation frame, and the top plate, the bottom plate, the front cover plate and the rear cover plate are detachably connected with the installation frame;
the radiating fins are fixedly connected with the side walls, far away from the two side plates, of the radiator.
3. A case for dissipating heat from power consuming electronic devices under natural convection conditions as recited in claim 2, wherein the heat pipe assembly comprises:
the heat pipe comprises a heat pipe body and heat conducting blocks for fixedly connecting two ends of the heat pipe body;
the heat conduction block is provided with a through hole, and the side wall of the side plate and the upper surface of the circuit cold conduction plate are provided with mounting grooves matched with the heat conduction block.
4. The chassis for dissipating heat of electronic devices with power consumption under natural convection as recited in claim 2, wherein a plurality of mounting holes are formed in a sidewall of the front cover plate, and connectors matching with the electronic devices are fixedly connected in the mounting holes.
5. The chassis for dissipating heat of electronic devices with power consumption under natural convection as claimed in claim 1, wherein the top plate, the bottom plate, the front cover plate, the rear cover plate and the side of the two side plates adjacent to each other are provided with reinforcing ribs.
6. The case of claim 1, wherein the circuit cold conducting plate and the guide rail are both made of aluminum or copper, and a protrusion attached to an electronic device is fixedly connected to a lower surface of the circuit cold conducting plate.
7. The chassis for dissipating heat from an electronic device dissipating heat under natural convection conditions as recited in claim 1, wherein the heat dissipating fins are vertically disposed.
8. The chassis for dissipating heat of an electronic device dissipating heat under natural convection conditions as recited in claim 2, wherein a pad is fixedly attached to a lower surface of the bottom plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202122458850.4U CN215991772U (en) | 2021-10-11 | 2021-10-11 | Solve radiating quick-witted case of consumption electronic equipment under natural convection condition |
Applications Claiming Priority (1)
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CN202122458850.4U CN215991772U (en) | 2021-10-11 | 2021-10-11 | Solve radiating quick-witted case of consumption electronic equipment under natural convection condition |
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CN215991772U true CN215991772U (en) | 2022-03-08 |
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CN202122458850.4U Active CN215991772U (en) | 2021-10-11 | 2021-10-11 | Solve radiating quick-witted case of consumption electronic equipment under natural convection condition |
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2021
- 2021-10-11 CN CN202122458850.4U patent/CN215991772U/en active Active
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