CN217881474U - Heat radiation structure and energy storage base station power - Google Patents
Heat radiation structure and energy storage base station power Download PDFInfo
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- CN217881474U CN217881474U CN202220454642.9U CN202220454642U CN217881474U CN 217881474 U CN217881474 U CN 217881474U CN 202220454642 U CN202220454642 U CN 202220454642U CN 217881474 U CN217881474 U CN 217881474U
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- heat dissipation
- heat
- field effect
- effect transistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model is suitable for the technical field of batteries, and provides a heat dissipation structure and an energy storage base station power supply, wherein the heat dissipation mechanism comprises a heat dissipation shell; a power control board installed in the heat dissipation casing; the field effect tube is arranged on the power supply control panel; and a heat dissipation block connected with the field effect transistor and the heat dissipation shell; the field effect tube is arranged on the power supply control panel in a vertical installation mode, and the field effect tube is fixedly connected with the radiating block through screws. The power control panel of this application embodiment is installed in heat dissipation shell, is provided with field effect transistor on the power control panel, and field effect transistor passes through vertical mounting means and installs on power control panel to through screw fixed mounting on the radiating block, make the heat that field effect transistor produced can conduct to the heat dissipation shell through the radiating block and dispel the heat, wherein, because field effect transistor adopts vertical installation, avoid the screw to be blocked by the radiating block, thereby conveniently dismantle the MOS pipe get off or assemble, make things convenient for dismouting and maintenance.
Description
Technical Field
The utility model belongs to the technical field of the battery, especially, relate to a heat radiation structure and energy storage basic station power.
Background
The function of present energy storage base station power can realize that DC-DC two-way decompression or step up, provide functions such as overcharge, overdischarge, overflow, excess temperature, lack the temperature, short circuit and reverse connection protection to the group battery, energy storage base station power is in the course of the work, calorific capacity is very big, this is because the equipment has components and parts such as a plurality of MOS pipes, relay, inductance and resistance on the power control panel of energy storage base station power, these components and parts can produce a large amount of heats in the course of the work, thereby lead to energy storage base station power to generate heat seriously.
In order to avoid the instability and even damage of the power supply of the energy storage base station in a high-temperature environment, the heat of the power supply of the energy storage base station needs to be conducted away, a heat conduction structure is used for conducting the heat generated by the components to the shell for heat dissipation, for example, the MOS tube is fixedly mounted with a MOS tube heat dissipation block through a screw, the MOS tube is horizontally mounted, and the heat dissipation block is fixed between the MOS tube and the shell so as to conduct the heat generated by the MOS tube to the shell for heat dissipation. However, the MOS pipe adopts horizontal installation to lead to the screw to be blocked by the radiating block, when certain MOS pipe among a plurality of MOS pipes of energy storage base station power damages and needs to be changed or maintain, need dismantle whole row of MOS pipe from power control circuit board with the radiating block, then just can contact the screw and dismantle the MOS pipe with damaging to install good MOS pipe and go, the MOS pipe is difficult to the dismouting, and the maintenance degree of difficulty is big.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure aims at solving the big problem of the degree of difficulty is maintained in the dismouting of MOS pipe among the prior art.
The embodiment of the present invention is realized as follows, and a heat dissipation structure includes:
a heat dissipating housing;
a power control board arranged in the heat dissipation shell;
the field effect tube is arranged on the power supply control panel; and
the heat dissipation block is connected with the field effect tube and the heat dissipation shell;
the field effect tube is arranged on the power supply control panel in a vertical installation mode, and the field effect tube is fixedly connected with the radiating block through screws.
Optionally, a heat dissipation ceramic plate is arranged between the field effect transistor and the heat dissipation block.
Optionally, a flexible heat conducting material is filled between the heat dissipation block and the heat dissipation shell.
Optionally, the outer side surface of the heat dissipation housing is provided with a heat dissipation groove.
Optionally, the inner side surface of the heat dissipation housing is provided with a boss contacting with the heat dissipation block.
Optionally, the heat dissipation housing is made of a metal material.
Optionally, the power control board is provided with a relay as a heat source, and a flexible heat conduction material is filled between the relay and the heat dissipation shell.
Optionally, the power control board is provided with an inductance element as a heat source, and a flexible heat conduction material is filled between the inductance element and the heat dissipation shell.
Optionally, the flexible heat conducting material comprises one or a combination of heat conducting mud, heat conducting silica gel and heat conducting rubber.
In a second aspect, the present application further provides an energy storage base station power supply, which includes the heat dissipation structure as described above.
The utility model discloses power control panel installs in the heat dissipation shell, the last field effect transistor that is provided with of power control panel, field effect transistor passes through vertical mounting means and installs on power control panel to through screw fixed mounting on the radiating block, make the heat that field effect transistor produced can dispel the heat to the heat dissipation shell through the radiating block conduction, wherein, because field effect transistor adopts vertical installation, avoid the screw to be blocked by the radiating block, thereby conveniently dismantle MOS pipe or assemble, make things convenient for dismouting and maintenance.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a heat dissipation structure of the present application;
FIG. 2 is a schematic view of an embodiment of a heat dissipation structure of the present application with a heat dissipation housing and a power control board detached from each other;
fig. 3 is an enlarged structural view of a portion a in fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
According to the embodiment of the application, the vertical type installation is adopted through the field effect transistor, the screw is prevented from being blocked by the radiating block, so that the MOS transistor is conveniently detached or assembled, and the disassembly, the assembly and the maintenance are convenient.
Example one
In some alternative embodiments, as shown in fig. 1 to 3, the present application provides a heat dissipation structure, including:
a heat-dissipating housing 100;
a power control board 200 installed in the heat dissipation case 100;
a field effect transistor 300 disposed on the power control board 200; and
a heat radiation block 400 connected to the field effect transistor 300 and the heat radiation housing 100;
the field effect transistor 300 is arranged on the power control board 200 in a vertical installation manner, and the field effect transistor 300 is fixedly connected with the heat dissipation block 400 through screws.
In implementation, the heat dissipation structure provided by the present application is applied to a power supply of an energy storage base station, where the heat dissipation housing 100 is a structural frame of a product and also can be used as an appearance panel of the product, optionally, the heat dissipation housing 100 may be designed to be a container-shaped shell with an opening on one side, and the heat dissipation housing 100 may be made of a metal material, such as iron, copper, or aluminum, preferably aluminum, which can effectively improve heat dissipation efficiency.
In some embodiments, the power board 200 is a circuit board of a product, and optionally, at least one Field Effect Transistor 300 is mounted on the power board 200, where the Field Effect Transistor (MOS) refers to a Metal-Oxide-Semiconductor Field Effect Transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
At least one field effect transistor 300 is mounted on the power control board 200 in a vertical mounting manner, which is a mounting manner that the field effect transistor and the power control board 200 are perpendicular to each other, the field effect transistor is fixedly connected with the heat dissipation block 400 through a screw, the heat dissipation block 400 can be made of a material with high thermal conductivity, such as metal copper or metal aluminum, preferably metal aluminum, the heat dissipation block 400 is provided with at least one hole for fixing the field effect transistor in cooperation with the screw, and the heat dissipation block 400 is further connected with the heat dissipation housing 100 to conduct heat generated by the field effect transistor to the heat dissipation housing 100 for heat dissipation.
In the implementation process, the field effect tube of the conventional energy storage base station power supply adopts a horizontal installation mode, the horizontal installation mode enables the field effect tube 300 to be attached to the power supply control board 200, so that the screw is blocked by the heat dissipation block 400, and further, the single field effect tube cannot be disassembled and assembled with the heat dissipation block 400, all the field effect tubes need to be disassembled from the power supply control board 200 and then disassembled and assembled with the heat dissipation block 400, the disassembly and assembly difficulty is high, and further, the maintenance difficulty is high.
The field effect transistor of this application adopts vertical mounting means to make the field effect transistor vertical on power control panel 200, and the screw can not blocked by radiating block 400 this moment to can carry out the dismouting with arbitrary field effect transistor and radiating block 400 alone, make things convenient for dismouting and maintenance.
Example two
In some alternative embodiments, a heat-dissipating ceramic sheet 500 is disposed between the fet 300 and the heat-dissipating block 400.
Optionally, the heat dissipation ceramic sheet 500 has the characteristics of high temperature resistance, corrosion resistance and long service life, and can prevent the electric leakage phenomenon caused by the direct connection between the field effect transistor 300 and the heat dissipation block 400, thereby protecting the safety of the product and achieving a good heat dissipation effect.
EXAMPLE III
In some alternative embodiments, the heat slug 400 and the heat sink housing 100 are filled with a flexible, thermally conductive material therebetween.
Alternatively, the flexible heat conducting material may adopt one or a combination of heat conducting mud, heat conducting silica gel and heat conducting rubber. The gap between the heat dissipation block 400 and the heat dissipation housing 100 is filled with the flexible heat conductive material, so that heat can be better conducted to the heat dissipation housing 100.
Example four
In some alternative embodiments, the outer side of the heat dissipation housing 100 is provided with a heat dissipation groove 110. When the heat dissipation structure is implemented, the plurality of heat dissipation grooves 110 are formed in the outer side face of the heat dissipation shell 100, so that the surface area of the heat dissipation shell 100 can be effectively increased, heat dissipation is better performed, and the heat dissipation efficiency is improved.
EXAMPLE five
In some alternative embodiments, the inner side of the heat-dissipating housing 100 is provided with a boss contacting the heat-dissipating block 400. The heat dissipation housing 100 is in contact with the heat dissipation block 400 through the bosses, so that the direct contact between the heat dissipation housing 100 and each component on the power control board 200 is avoided, and the product safety is protected.
Example six
In some alternative embodiments, the power control board 200 is provided with the relay 600 and the inductive element 700 as the heat generating source, and the relay 600 and the inductive element 700 are filled with a flexible heat conductive material between the heat dissipation case 100.
In implementation, the relay 600 and the inductance element 700 also generate a large amount of heat, and the heat of the relay 600 and the inductance element 700 is conducted through the flexible heat conduction material to cause the heat dissipation shell 100 to have a good heat dissipation effect.
EXAMPLE seven
In some optional embodiments, the present application further provides an energy-storing base station power supply, including the heat dissipation structure as described above.
In implementation, the heat dissipation structure of the power supply of the energy storage base station comprises a heat dissipation shell 100; a power control board 200 installed in the heat dissipation case 100; a field effect transistor 300 disposed on the power control board 200; and a heat radiation block 400 connected to the field effect transistor 300 and the heat radiation housing 100; the fet 300 is mounted on the power control board 200 in a vertical manner, and the fet 300 is fixedly connected to the heat sink 400 by screws.
In implementation, the heat dissipation housing 100 may serve as a structural frame of the power supply of the energy storage base station, and may also serve as an appearance panel of the power supply of the energy storage base station, optionally, the heat dissipation housing 100 may be designed to be a container-shaped shell with an opening on one side, and the heat dissipation housing 100 may be made of a metal material, such as iron, copper, or aluminum, preferably aluminum, which can effectively improve heat dissipation efficiency.
In some embodiments, the power control board 200 is a circuit board of a power supply of an energy storage base station, optionally, at least one fet 300 is mounted on the power control board 200, the at least one fet 300 is mounted on the power control board 200 in a vertical mounting manner, where the at least one fet is mounted on the power control board 200 in a perpendicular manner, the fet is fixedly connected to the heat sink 400 by a screw, the heat sink 400 may be made of a material with high thermal conductivity, such as metallic copper or metallic aluminum, preferably metallic aluminum, the heat sink 400 is provided with at least one hole for fixing the fet in cooperation with the screw, and the heat sink 400 is further connected to the heat dissipation housing 100 to conduct heat generated by the fet to the heat dissipation housing 100 for heat dissipation.
The field effect transistor of this application adopts vertical mounting means to make the field effect transistor vertical on power control panel 200, and the screw can not blocked by radiating block 400 this moment to can carry out the dismouting with arbitrary field effect transistor and radiating block 400 alone, make things convenient for dismouting and maintenance.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A heat dissipation structure, comprising:
a heat dissipation housing;
a power control board mounted in the heat dissipation housing;
the field effect tube is arranged on the power supply control board; and
the heat dissipation block is connected with the field effect tube and the heat dissipation shell;
the field effect transistor is arranged on the power control panel in a vertical installation mode and is fixedly connected with the radiating block through screws.
2. The heat dissipating structure of claim 1, wherein a heat dissipating ceramic sheet is disposed between the field effect transistor and the heat dissipating block.
3. The heat dissipation structure of claim 1, wherein a flexible heat conductive material is filled between the heat dissipation block and the heat dissipation housing.
4. The heat dissipating structure of claim 1, wherein the heat dissipating housing is provided with heat dissipating grooves on an outer side thereof.
5. The heat dissipation structure according to claim 1 or 4, wherein the inner side surface of the heat dissipation case is provided with a boss that contacts the heat dissipation block.
6. The heat dissipating structure of claim 1 or 4, wherein the heat dissipating housing is made of a metal material.
7. The heat dissipation structure according to claim 1, wherein the power supply control board is provided with a relay as a heat generation source, and a flexible heat conductive material is filled between the relay and the heat dissipation case.
8. The heat dissipation structure according to claim 1, wherein the power control board is provided with an inductance element as a heat generation source, and a flexible heat conductive material is filled between the inductance element and the heat dissipation housing.
9. The heat dissipation structure of claim 3, 7 or 8, wherein the flexible thermally conductive material is thermally conductive mud, thermally conductive silicone or thermally conductive rubber.
10. An energy storage base station power supply, characterized in that it comprises a heat dissipation structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220454642.9U CN217881474U (en) | 2022-03-02 | 2022-03-02 | Heat radiation structure and energy storage base station power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220454642.9U CN217881474U (en) | 2022-03-02 | 2022-03-02 | Heat radiation structure and energy storage base station power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217881474U true CN217881474U (en) | 2022-11-22 |
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ID=84086428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220454642.9U Active CN217881474U (en) | 2022-03-02 | 2022-03-02 | Heat radiation structure and energy storage base station power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217881474U (en) |
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2022
- 2022-03-02 CN CN202220454642.9U patent/CN217881474U/en active Active
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