CN214674948U - Discrete thermoelectric power generation system using industrial waste heat - Google Patents
Discrete thermoelectric power generation system using industrial waste heat Download PDFInfo
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- CN214674948U CN214674948U CN202120489155.1U CN202120489155U CN214674948U CN 214674948 U CN214674948 U CN 214674948U CN 202120489155 U CN202120489155 U CN 202120489155U CN 214674948 U CN214674948 U CN 214674948U
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- 238000010248 power generation Methods 0.000 title claims description 41
- 239000002440 industrial waste Substances 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 238000005338 heat storage Methods 0.000 claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
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- 238000009825 accumulation Methods 0.000 description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
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Abstract
The utility model discloses an utilize discrete thermoelectric generation system of industry used heat, include: the high-power thermoelectric generation module comprises a heat storage metal plate, a semiconductor thermoelectric generation device and a heat dissipation water tank, wherein the semiconductor thermoelectric generation device is arranged at the top end of the heat storage metal plate, and the heat dissipation water tank is fixedly arranged at the top end of the semiconductor thermoelectric generation device. The utility model is not only simple in structure, easily assembly, combination convenient and fast can improve the generated power moreover.
Description
Technical Field
The utility model belongs to the technical field of semiconductor thermoelectric generation, more specifically the discrete thermoelectric generation system who utilizes industry used heat that says so relates to.
Background
The power generation by utilizing waste heat is widely used in a middle-high temperature region (400 ℃ plus 800 ℃), but under the condition of lower than 400 ℃, most of the power generation by utilizing waste heat is difficult to recycle in a waste heat environment of about 100 ℃ plus 300 ℃. The semiconductor thermoelectric power generation is not limited by weather and places, and the temperature range of a heat source is wide by utilizing an industrial waste heat flue gas pipeline, a smelting furnace or the outer wall of a kiln furnace and the like. The temperature difference power generation technology is adopted to utilize low-grade heat (100-. Many experts consider that the thermoelectric generator can directly generate low-voltage large current by using the heat energy, such as for liquid crystal display screens or LED illumination, and is one of the best energy utilization modes.
Semiconductor thermoelectric power generation is a solid state energy conversion mode that converts thermoelectric energy (heat energy) into electric energy. The power generation device has no chemical reaction and mechanical movement, no noise, no pollution, no abrasion and long service life. The core component of the thermoelectric generator is a semiconductor thermoelectric generator. Body temperature or other heat source is conducted to one surface of the device to form temperature difference between the two surfaces, and the device can output direct current to an electric appliance through the voltage stabilizing module. However, the thermoelectric conversion efficiency of the semiconductor thermoelectric couple module is low at present, and researches in recent years show that the maximum thermoelectric conversion efficiency is less than 5%, and the power generation power of a single-group module is relatively low, which is the biggest obstacle to the practicability of the semiconductor thermoelectric generation.
Therefore, how to provide a discrete thermoelectric power generation system using industrial waste heat is a problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an utilize discrete thermoelectric generation system of industry used heat, not only simple structure, easily assembly, combination convenient and fast can improve the generated power moreover.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a discrete thermoelectric power generation system using industrial waste heat, comprising: the high-power thermoelectric generation module comprises a heat storage metal plate, a semiconductor thermoelectric generation device and a heat dissipation water tank, wherein the semiconductor thermoelectric generation device is arranged at the top end of the heat storage metal plate, and the heat dissipation water tank is fixedly arranged at the top end of the semiconductor thermoelectric generation device.
Preferably, a graphite heat conduction layer is arranged between the heat storage metal plate and the semiconductor thermoelectric power generation device.
Preferably, the surface of one end of the semiconductor thermoelectric power generation device, which is positioned on the heat dissipation water tank, is coated with heat-conducting silicone grease.
Preferably, the heat radiation water tank is provided with a fixing clamping piece, and the fixing clamping piece is connected with the heat storage metal plate through a bolt.
Preferably, the semiconductor thermoelectric power generation device is provided in plurality, and the plurality of semiconductor thermoelectric power generation devices are connected in series.
Preferably, the number of the heat dissipation water tanks is consistent with that of the semiconductor thermoelectric power generation devices, and the heat dissipation water tanks are communicated with one another by high-temperature silicone tubes.
Preferably, the interior of the heat radiation water tank is processed into an M-shaped water channel.
Preferably, one end of the heat storage metal plate, which is far away from the semiconductor thermoelectric power generation device, is set to be a plane or a curved surface according to the shape of the installation position.
Preferably, the power supply device further comprises a power supply management module and an electrical appliance, wherein one end of the power supply management module is electrically connected with the semiconductor thermoelectric generation device, and the other end of the power supply management module is electrically connected with the electrical appliance.
Preferably, the power management module adopts a DC-DC voltage stabilizer or a DC-AC converter; and the electrical appliance is a direct current electrical appliance or an alternating current electrical appliance corresponding to the power management module.
The beneficial effects of the utility model reside in that:
the utility model has the advantages of simple structure, easy assembly and convenient and quick combination, and adopts a novel semiconductor thermoelectric power generation device and a water-cooled heat dissipation method, thereby improving the power generation power; it has no mechanical transmission part, no noise and no working medium, so that it has no environmental pollution, high acting speed, long service life and easy control of temperature.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is another schematic structural diagram of the present invention.
Fig. 3 is a schematic structural diagram of the heat radiation water tank of the present invention.
Fig. 4 is a schematic diagram of the operation of the present invention.
Fig. 5 is another schematic diagram of the present invention.
Wherein, in the figure:
1-a heat storage metal plate; 2-semiconductor thermoelectric generation devices; 3-a heat dissipation water tank; 4-fixing the card; 5-bolt; 6-high temperature silicone tube; 7-a power management module; and 8-using the electric appliance.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 5, the present invention provides a discrete thermoelectric power generation system using industrial waste heat, including: the high-power thermoelectric generation module comprises a heat storage metal plate 1, a semiconductor thermoelectric generation device 2 and a heat dissipation water tank 3, wherein the semiconductor thermoelectric generation device 2 is arranged on the top end of the heat storage metal plate 1, the heat dissipation water tank 3 is fixedly arranged on the top end of the semiconductor thermoelectric generation device 2, one end, close to the heat storage metal plate 1, of the semiconductor thermoelectric generation device 2 is a hot end, and one end, close to the heat dissipation water tank 3, of the semiconductor thermoelectric generation device is a cold end.
The utility model is not only simple in structure, easily assembly, combination convenient and fast adopts neotype semiconductor thermoelectric generation device 2 moreover, and heat radiation water tank 3 adopts water-cooled heat dissipation method, can improve the generating power.
The utility model discloses be provided with graphite heat-conducting layer between heat accumulation metal sheet 1 and the semiconductor thermoelectric generation device 2. The graphite heat conduction layer is positioned between the surface of the ceramic substrate of the semiconductor thermoelectric generator 2 and the heat storage metal plate 1, is combined together to play a role in heat conduction, and can relieve the damage to the power generator caused by deformation generated when the heat storage metal plate 1 is changed in cold and hot states, so that the reliability of a product is improved.
The surface of one end of the semiconductor thermoelectric power generation device 2, which is positioned on the heat dissipation water tank 3, is coated with heat-conducting silicone grease. After the cold end surface of the semiconductor thermoelectric power generation device 2 is coated with the heat-conducting silicone grease, the cold end surface and the heat-radiating water tank 3 are fixed together in a mechanical mode (such as a screw), so that heat is better conducted.
Install fixing clip 4 on the heat dissipation water tank 3, fixing clip 4 passes through bolt 5 and links to each other with heat accumulation metal sheet 1 to it is fixed to facilitate the installation.
The semiconductor thermoelectric generation device 2 is provided in plurality, and the plurality of semiconductor thermoelectric generation devices 2 are connected in series. In this embodiment, the semiconductor thermoelectric power generation device 2 is a thermoelectric power generation device capable of resisting a temperature of 400 degrees or more, and four thermoelectric power generation devices are provided to form a power generation circuit in a series connection manner. The semiconductor thermoelectric power generation device 2 may employ a thermoelectric power generation device of TEG-199T 300.
The number of the radiating water tanks 3 is consistent with that of the semiconductor thermoelectric power generation devices 2, and the radiating water tanks 3 are communicated with one another by high-temperature silicone tubes 6 and are sequentially connected in series, and are locked by a hose clamp to prevent water leakage. The high-temperature silicone tube 6 is a polytetrafluoroethylene silicone tube which can resist the temperature of 300 ℃ and prevent the high temperature from melting when water is cut off.
The radiating water tank 3 is made of copper or aluminum, and in order to achieve a better radiating effect, an M-shaped water channel is formed in the radiating water tank, and then the shell and the water receiving port are welded.
One end of the heat storage metal plate 1, which is far away from the semiconductor thermoelectric power generation device 2, is a heat source contact surface, and can be set to be a plane or a curved surface according to different shapes of installation positions. The heat storage metal plate 1 is made of copper (or aluminum) materials, so that the heat conductivity is very good, and the heat source contact surface of the heat storage metal plate 1 can be made into a plane or a curved surface according to different heat source conditions, and is more tightly attached to a heat source with reference to attached drawings 1 and 2.
The utility model discloses still include power management module 7 and use electrical apparatus 8, 7 one end of power management module is connected with 2 electricity of semiconductor thermoelectric generation device, and the other end is connected with electrical apparatus 8 electricity. The power management module 7 adopts a DC-DC voltage stabilizer or a DC-AC converter; the electric appliance 8 is a direct current electric appliance or an alternating current electric appliance corresponding to the power management module 7. The anode and the cathode led out from the semiconductor thermoelectric power generation device 2 are respectively connected with the anode and the cathode of the input end of the DC-DC voltage stabilizer, and the output end of the DC-DC voltage stabilizer is directly connected with a direct current electric appliance; the anode and cathode led out from the semiconductor thermoelectric power generation device 2 are respectively connected with the anode and cathode of the input end of the DC-AC converter, and the output end of the DC-AC converter is directly connected with an alternating current electric appliance or is converted into alternating current through the DC-AC converter to be merged into a national power grid.
Utilize the utility model discloses a discrete thermoelectric generation system, semiconductor thermoelectric generation device adopt TEG-199-62x 62's thermoelectric generation device, and 4 series connections, load resistance 18 Europe, the test result of electricity generation data, as shown in Table 1, wherein, the temperature is 20 degrees.
TABLE 1
The utility model has the advantages of simple structure, easy assembly, convenient and quick combination, and the adoption of novel thermoelectric generation device, water-cooled heat dissipation method and independent module group, which can improve the power generation power; it has no mechanical transmission part, no noise and no working medium, so that it has no environmental pollution, high acting speed, long service life and easy control of temperature.
When the thermoelectric power generation device is installed, the heat storage metal plate 1 is fixed on the surface of an object with waste heat by using screws or other methods, the heat is absorbed, the temperature is increased (the highest temperature can reach more than 350 ℃), the heat dissipation water tank 3 is connected with the high-temperature silicone tube 6 to be filled with water for heat dissipation, the cold surface is kept at 20-50 ℃, so that temperature difference is formed on two surfaces of the semiconductor thermoelectric power generation device 2, the maximum temperature difference can reach more than 300 ℃, and the continuous output power of the semiconductor thermoelectric power generation device 2 can reach more than 60 w. If a high-power generation module is needed, a plurality of high-power temperature difference power generation modules can be combined and fixed on a large-area heat source, and then the needed power supply can be obtained.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A discrete thermoelectric power generation system using industrial waste heat, comprising: the high-power thermoelectric generation module comprises a heat storage metal plate, a semiconductor thermoelectric generation device and a heat dissipation water tank, wherein the semiconductor thermoelectric generation device is arranged at the top end of the heat storage metal plate, and the heat dissipation water tank is fixedly arranged at the top end of the semiconductor thermoelectric generation device;
the semiconductor thermoelectric power generation device is characterized by further comprising a power management module and an electric appliance, wherein one end of the power management module is electrically connected with the semiconductor thermoelectric power generation device, and the other end of the power management module is electrically connected with the electric appliance.
2. The discrete thermoelectric generation system using industrial waste heat according to claim 1, wherein a graphite heat conductive layer is disposed between the heat storage metal plate and the semiconductor thermoelectric generation device.
3. The discrete thermoelectric generation system using industrial waste heat according to claim 1 or 2, wherein one end surface of the semiconductor thermoelectric generation device at the heat dissipation water tank is coated with heat conductive silicone grease.
4. The discrete thermoelectric generation system using industrial waste heat according to claim 1, wherein a fixing clip is mounted on the heat-dissipating water tank, and the fixing clip is connected to the heat-accumulating metal plate by a bolt.
5. The discrete thermoelectric generation system using industrial waste heat according to claim 1, wherein a plurality of the semiconductor thermoelectric generation devices are provided, and a plurality of the semiconductor thermoelectric generation devices are connected in series.
6. The discrete thermoelectric generation system using industrial waste heat according to claim 5, wherein the number of the heat dissipation water tanks is the same as the number of the semiconductor thermoelectric generation devices, and the plurality of heat dissipation water tanks are communicated with each other by high temperature silicone tubes.
7. The discrete thermoelectric generation system using industrial waste heat according to claim 1 or 6, wherein the inside of the heat-dissipating water tank is processed into an M-shaped water channel.
8. The discrete thermoelectric generation system using industrial waste heat according to claim 1, wherein an end of the heat storage metal plate remote from the semiconductor thermoelectric generation device is provided as a plane or a curved surface depending on a shape of an installation place.
9. The discrete thermoelectric generation system using industrial waste heat according to claim 1, wherein the power management module employs a DC-DC voltage regulator or a DC-AC converter; and the electrical appliance is a direct current electrical appliance or an alternating current electrical appliance corresponding to the power management module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120489155.1U CN214674948U (en) | 2021-03-08 | 2021-03-08 | Discrete thermoelectric power generation system using industrial waste heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120489155.1U CN214674948U (en) | 2021-03-08 | 2021-03-08 | Discrete thermoelectric power generation system using industrial waste heat |
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| Publication Number | Publication Date |
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| CN214674948U true CN214674948U (en) | 2021-11-09 |
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| CN202120489155.1U Active CN214674948U (en) | 2021-03-08 | 2021-03-08 | Discrete thermoelectric power generation system using industrial waste heat |
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| CN (1) | CN214674948U (en) |
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2021
- 2021-03-08 CN CN202120489155.1U patent/CN214674948U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Discrete Thermoelectric System Using Industrial Waste Heat Effective date of registration: 20221008 Granted publication date: 20211109 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211109 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |