CN216120282U - MOS manages heat radiation structure - Google Patents
MOS manages heat radiation structure Download PDFInfo
- Publication number
- CN216120282U CN216120282U CN202122267251.4U CN202122267251U CN216120282U CN 216120282 U CN216120282 U CN 216120282U CN 202122267251 U CN202122267251 U CN 202122267251U CN 216120282 U CN216120282 U CN 216120282U
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- bottom plate
- heat
- pcb
- machine shell
- silica gel
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- 230000005855 radiation Effects 0.000 title claims description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 5
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 8
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a MOS tube heat dissipation structure which comprises a machine shell bottom plate, a PCB and an insulating heat-conducting silica gel gasket, wherein the machine shell bottom plate is arranged at the bottom of a machine shell of an AUU energy-saving controller and is made of a cold-rolled plate material, the PCB is arranged on the machine shell bottom plate through two studs, the PCB is parallel to the machine shell bottom plate, the distance between the PCB and the machine shell bottom plate is set according to the height of an MOS tube, the insulating heat-conducting silica gel gasket is arranged below the PCB and is attached to the machine shell bottom plate, the MOS tube is arranged on the PCB, and the lower end of the MOS tube is attached to the insulating heat-conducting silica gel gasket. According to the utility model, the MOS tube is attached to the insulating heat-conducting silica gel gasket and then attached to the bottom plate of the machine shell, so that the emitted heat is conducted to the surface of the machine shell, heat is transferred and dissipated, the heat dissipation problem can be greatly improved by dissipating the heat through the surface of the machine shell, and the heat-dissipating device is safe, reliable and strong in operability, meanwhile, the use of other heat-dissipating devices is reduced, and the use cost is greatly reduced.
Description
Technical Field
The utility model belongs to the field of electrical equipment industry, and particularly relates to a MOS tube heat dissipation structure.
Background
An AUU energy-saving controller is a device for saving energy and reducing consumption for a 5G base station. Specifically, the 5G AAU device has a high power, and because of the influence of the service change, there is still a large amount of time that there are no active 5G users near the base station all day, and at this time, the 5G base station can intelligently enter the "off mode" through the energy-saving controller to save electric energy, and for the direct-current power supply AAU, it is a relatively ideal scheme to control the AAU switch by using the MOS tube.
The MOS transistor is a metal-oxide-semiconductor (semiconductor) field effect transistor, or referred to as a metal-insulator-semiconductor (insulator). The MOS tube is a power semiconductor device commonly used in an electronic circuit, can be used as an electronic switch, controllable rectification and the like, is a voltage-driven device, is frequently used in an AUU energy-saving controller, but has very large heat productivity when working, and can possibly cause the burning of the MOS tube and further possibly cause the damage of the whole circuit board if the heat dissipation effect of the MOS tube is poor and the temperature is too high. At present, the industry generally adopts the design of a radiating fin and heat conducting insulating silica gel to directly radiate heat in a contact manner. Although the heat dissipation effect of the heat dissipation structure is achieved, the structure space is large due to the addition of the heat dissipation fins, and the cost is increased correspondingly.
Disclosure of Invention
The utility model aims to provide a MOS tube heat dissipation structure aiming at the defects of the prior art, which can greatly improve the heat dissipation problem of an energy-saving controller and has simple structure and low use cost.
The technical scheme adopted by the utility model is as follows: the utility model provides a MOS manages heat radiation structure, includes casing bottom plate, PCB board, insulating heat conduction silica gel gasket, casing bottom plate sets up in the bottom of AUU energy-saving controller's casing, and casing bottom plate adopts the cold rolled sheet material preparation, the PCB board is installed on casing bottom plate through two double-screw bolts, and the PCB board is parallel with casing bottom plate, and the interval size of PCB board and casing bottom plate is according to the high settlement of MOS pipe, insulating heat conduction silica gel gasket sets up in the below of installation PCB board and laminates on casing bottom plate, the MOS pipe is installed on the PCB board, and its lower extreme and the laminating of insulating heat conduction silica gel gasket, install a plurality of MOS pipes as required on every PCB board.
Furthermore, the two adjacent MOS tubes are tightly pressed and fixed on the bottom plate of the machine shell through a pressing strip, so that the MOS tubes and the insulating heat-conducting silica gel gasket are kept in a flat state, and the pressing strip is locked through a screw.
Compared with the prior art, the method has the following advantages:
according to the utility model, the MOS tube is attached to the insulating heat-conducting silica gel gasket and then attached to the bottom plate of the shell, so that the heat emitted is conducted to the bottom plate of the shell, the heat is transferred and dissipated, the heat dissipation problem can be greatly improved by dissipating the heat through the bottom plate of the shell, and the MOS tube heat dissipation device is safe, reliable and strong in operability, meanwhile, the use of other heat dissipation devices is reduced, and the use cost is greatly reduced.
Drawings
FIG. 1 is a schematic structural diagram of a MOS tube heat dissipation structure of the present invention;
fig. 2 is a side view of the MOS transistor heat dissipation structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and features in the embodiments and embodiments in the present application may be combined with each other without conflict, and the present invention will be described in detail with reference to the drawings and with reference to the embodiments.
As shown in fig. 1 and 2, a MOS tube heat dissipation structure includes a case bottom plate 1, a PCB 2, and an insulating heat-conducting silicone gasket 3, where the case bottom plate 1 is disposed at the bottom of a case 10 of an AUU energy-saving controller, the case bottom plate 1 is made of a cold-rolled plate material and has good heat dissipation performance, the PCB 2 is mounted on the case bottom plate 1 through two studs 21, the PCB 2 is parallel to the case bottom plate 1, the distance between the PCB 2 and the case bottom plate 1 is set according to the height of a MOS tube 4, the insulating heat-conducting silicone gasket 3 is disposed below the PCB 2 and is attached to the case bottom plate 1, the MOS tube 4 is mounted on the PCB 2, the lower end of the MOS tube 4 is attached to the insulating heat-conducting silicone gasket 3, each PCB 2 is mounted with a plurality of MOS tubes 4 as required, the insulating heat-conducting silicone gasket 3 has good heat conduction effect, and heat generated by the MOS tube 4 is quickly conducted to the case bottom plate 1 through the insulating silicone gasket 3 The temperature of MOS pipe 4 is reduced by a wide margin, during the installation, MOS pipe 4 must paste flatly on insulating heat conduction silica gel gasket 3, just can maximize heat conduction, for reaching above-mentioned requirement, can set up a plurality of MOS pipes 4 as required on the insulating heat conduction silica gel gasket 3, two adjacent MOS pipes 4 compress tightly through a layering 41 and fix on casing bottom plate 1, lock layering 41 with the screw, guarantee that MOS pipe 4 keeps the state of pasting flatly with insulating heat conduction silica gel gasket 3.
When the heat-conducting silicon rubber sheet is used, the bottom surface of the machine shell 10 is pasted with the heat-conducting silicon rubber sheet, the PCB 2 is installed, the MOS tube 4 is pasted on the insulating heat-conducting silicon rubber gasket 3, the MOS tube 4 is pressed tightly by the pressing strip 41, the pressing strip 41 is locked by the screw, the flat pasting state of the MOS tube 4 and the insulating heat-conducting silicon rubber gasket 3 is ensured, heat generated by the MOS tube 4 is conducted to the machine shell bottom plate 1 when the heat-conducting silicon rubber sheet is used, large-area heat dissipation is carried out by the machine shell bottom plate 1, and the temperature of the MOS tube 4 is greatly reduced.
According to the utility model, the MOS tube is attached to the insulating heat-conducting silica gel gasket and then attached to the chassis base plate, so that the heat emitted is conducted to the chassis base plate, the heat is transferred and dissipated, the chassis base plate made of cold-rolled sheet material is used for dissipating heat, the heat dissipation problem can be greatly improved, and the MOS tube heat dissipation device is safe, reliable and strong in operability, meanwhile, the use of other heat dissipation devices is reduced, and the use cost is greatly reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (2)
1. The utility model provides a MOS manages heat radiation structure, includes casing bottom plate, PCB board, insulating heat conduction silica gel gasket, its characterized in that: the casing bottom plate is arranged at the bottom of a casing of the AUU energy-saving controller, the casing bottom plate is made of cold-rolled plate materials, the PCB is installed on the casing bottom plate through two studs, the PCB is parallel to the casing bottom plate, the distance between the PCB and the casing bottom plate is set according to the height of the MOS tube, the insulating and heat-conducting silica gel gasket is arranged below the PCB and is attached to the casing bottom plate, the MOS tube is installed on the PCB, the lower end of the MOS tube is attached to the insulating and heat-conducting silica gel gasket, and a plurality of MOS tubes are installed on each PCB as required.
2. The MOS transistor heat dissipation structure of claim 1, wherein: and the two adjacent MOS tubes are tightly pressed and fixed on the bottom plate of the machine shell through a pressing strip, so that the MOS tubes and the insulating heat-conducting silica gel gasket are kept in a flat state, and the pressing strip is locked through a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122267251.4U CN216120282U (en) | 2021-09-17 | 2021-09-17 | MOS manages heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122267251.4U CN216120282U (en) | 2021-09-17 | 2021-09-17 | MOS manages heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216120282U true CN216120282U (en) | 2022-03-22 |
Family
ID=80734655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122267251.4U Active CN216120282U (en) | 2021-09-17 | 2021-09-17 | MOS manages heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216120282U (en) |
-
2021
- 2021-09-17 CN CN202122267251.4U patent/CN216120282U/en active Active
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