CN101600325B - Combination heat sink of closed shell electronic equipment - Google Patents

Abstract

The invention discloses a combined heat dissipation device of a fan and a heat pipe of an airtight housing electronic equipment, aiming at solving the contradiction that the airtight housing electronic equipment requires both high protection level and good heat dissipation. The gist of the technical solution is that the combined heat dissipation device structure of the airtight shell electronic equipment is composed of a fan, a shell with heat sinks, a heat conduction film, a PCB fixing bracket, a heat conduction pipe, and a chip heat conduction plate. The heat pipe connects the heat conduction plate of the chip and the PCB fixing bracket. The vertical section shape of the side plate of the PCB fixing bracket is wedge-shaped, and the wedge-shaped surface is in close contact with the inner wall of the casing. There is a compressible heat conduction film between the surfaces to ensure that the PCB fixing bracket is in close contact with the inner wall of the casing; the side of the casing shell is a sheet-like heat dissipation structure; the end of the heat sink is fixed with a fan to form an air duct for air-cooling and convection heat dissipation for the heat sink. The invention is suitable for the heat dissipation of the electronic equipment in the airtight case.

Description

Combined heat dissipation device for electronic equipment with airtight housing

technical field

The invention relates to the technical field of combined heat dissipation of electronic equipment, and more specifically, relates to a combined heat dissipation device of a fan and a heat pipe of an electronic equipment with a closed casing.

Background technique

Electronic equipment such as industrial and military switches, servers, and cabinets are restricted by harsh environments, and often require a closed structure for the housing; during the operation of the equipment, components such as switching chips and power modules will generate heat, which will increase the internal temperature of the equipment and affect the electronics. Component life and performance. The traditional implementation method is that the heat of the chip is conducted to the heat dissipation fins of the casing through the internal heat conduction device to dissipate heat; the heat dissipation effect is limited, and it is inconvenient to replace and maintain the PCB board. Chinese patent authorization number CN2599502Y, authorized announcement date January 14, 2004, the name of the utility model is heat pipe type airtight radiator, the authorized patent discloses that by improving the layout of the radiator, relying on the efficacy of individual components to improve the efficiency of the airtight electric control cabinet The disadvantage of heat exchange and heat dissipation efficiency is that it does not involve the maintainability of the heat dissipation device and cannot control the heat dissipation effect of the heat dissipation device.

Contents of the invention

The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a combined heat dissipation device with airtight housing electronic equipment fans and heat pipes, and to facilitate the replacement and maintenance of internal heat dissipation devices.

The technical solution of the present invention is that the combined heat dissipation device structure of the airtight casing electronic equipment is composed of a fan 1, a casing with a heat sink 2, a heat conduction film 3, a PCB fixing bracket 4, a heat conduction pipe 5, and a chip heat conduction plate 6. The heat pipe 5 connects the chip heat conduction plate 6 and the PCB fixing bracket 4, and the PCB fixing bracket 4 is in close contact with the inner wall of the casing. 4. It is in close contact with the inner wall of the casing; the shell side of the casing is a sheet-like heat dissipation structure; a fan is fixed at the end of the heat sink to form an air duct for air-cooled convection heat dissipation for the heat sink.

The PCB fixing bracket 4 is made of metal or other heat-conducting materials;

The shell 2 with heat sink is made of metal or other heat-conducting materials;

The heat pipe 5 needs to be tightly fixed at the 6 end of the chip heat conduction plate and the 4 end of the PCB fixing bracket;

The fixing material of the heat pipe 5 at the end 6 of the chip heat conducting plate and the end 4 of the PCB fixing bracket is preferably made of a heat conducting material.

The speed of fan 1 is intelligently controlled. The working condition of fan 1 is controlled by the internal circuit of the casing. When the internal temperature is high, the speed increases, and when the temperature is low, the speed decreases. The fan control cable 9 is connected to the internal control circuit through the connector outside the casing.

The internal modular heat dissipation component is composed of heat conduction film 3, PCB fixing bracket 4, heat conduction pipe 5, and chip heat conduction plate 6, which can be plugged and unplugged on the guide rail inside the casing.

The beneficial effect of the invention is that it solves the contradiction that the airtight housing electronic equipment requires both high protection level and good heat dissipation. The modular structure makes it easy to replace the functional modules as a whole without affecting the heat dissipation effect.

Description of drawings

Figure 1 is the front view of the structure of the combined cooling device;

Figure 2 is a top view of the structure of the combined cooling device;

Figure 3 is a top view of the pluggable cooling module;

Figure 4 is the assembly diagram of the pluggable cooling module and the whole machine.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings.

Figure 1 is the front view of the structure of the combined heat sink, and Figure 2 is the top view of the structure of the combined heat sink, indicating that the combined heat sink consists of a fan 1, a shell with heat sink 2, a heat conducting film 3, a PCB fixing bracket 4, a heat pipe 5, and a chip heat conducting plate 6 composition. The above six components are divided into the internal chip heat conduction component part and the external heat dissipation device part. The internal chip heat conduction component part is composed of heat pipe 5, chip heat conduction plate 6, PCB fixing bracket 4, and heat conduction film 3. Heat pipe fixing plate 8 is fixed. The external cooling device part is composed of a fan 1 and a housing 2 with cooling fins. The PCB fixing bracket 4 , the heat pipe fixing plate 7 at the chip end, the heat pipe fixing plate 8 at the heat dissipation end, and the housing 2 with heat sinks are all made of aluminum alloy.

Heat conduction path: when the PCB chip is running, the heat is first conducted to the chip heat conduction plate 6, and then conducts to the aluminum alloy PCB fixing bracket 4 through the heat conduction pipe 5 and the heat pipe fixing plate 7 at the chip end (assisting to compress the heat pipe), and then conducts to the aluminum alloy PCB fixing bracket 4 through the heat conduction film 3. Housing with cooling fins 2. The vertical section shape of the side plate of the PCB fixing bracket 4 is wedge-shaped, and the wedge-shaped surface is in close contact with the inner wall of the casing. The inner side of the casing and the mating surface of the side plate of the PCB fixing bracket 4 are inclined at the same angle, and there is a compressible heat-conducting film between the contact surfaces 3 (about 1MM thick), to ensure that the guide rail is in close contact with the inner wall of the casing. The side of the shell shell is a sheet-shaped heat dissipation structure, and a fan is fixed at the end of the heat sink to form an air duct for air-cooling and convection heat dissipation for the heat sink.

Intelligent speed control of fan 1: the working condition of fan 1 is controlled by the internal circuit of the case, and the speed of fan 1 is controlled according to the working condition of the cooling devices (switching chip, CPU, power module, etc.) required by the internal circuit, and a temperature sensor is installed inside the case to detect Internal temperature, high internal temperature, high speed, low temperature, low speed. The fan control cable 9 is connected to the internal control circuit through the waterproof connector outside the casing.

Figure 3 is a top view of the pluggable heat dissipation module, and Figure 4 is the assembly drawing of the pluggable heat dissipation module and the whole machine, indicating the internal chip heat conduction components (composed of heat pipe 5, chip heat conduction plate 6, PCB fixing bracket 4, and heat conduction film 3 ) and PCB constitute a pluggable heat dissipation module, which can be plugged and pulled out on the guide rail in the casing, and locked through the panel, and can be replaced as a whole during engineering installation, function change, and later maintenance. The internal and external heat dissipation structures do not affect each other; the panel has a sealed structure, and after the panel and the casing are fixed, the protection level of the casing reaches IP67. Internal heat dissipation components are modularized for easy maintenance.

The above descriptions are only process and method embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and essence of the present invention shall be included in the protection of the present invention. within range.

Claims (8)

1. the combination heat abstractor of a closed shell electronic equipment, it is characterized in that, form by fan (1), flange-cooled housing (2), heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6), die terminals heat pipe fixed head (7) and radiating end heat pipe fixed head (8); Heat pipe (5) connects chip heat-conducting plate (6) and PCB fixed support (4), heat pipe (5) uses die terminals heat pipe fixed head (7) and radiating end heat pipe fixed head (8) to fix on chip heat-conducting plate (6) and PCB fixed support (4) respectively, PCB fixed support (4) side plate vertical cross-section is shaped as wedge shape, lozenges closely contacts with casing inner wall, the casing inboard is the inclined-plane of equal angular with PCB fixed support (4) side plate mating surface, compressible heat conducting film (3) is arranged between PCB fixed support (4) and the casing inner wall contact-making surface, guarantee that PCB fixed support (4) closely contacts with casing inner wall; The housing shell side is a fin; The fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.

2. combination heat abstractor according to claim 1 is characterized in that, PCB fixed support (4) is an aluminum alloy materials.

3. combination heat abstractor according to claim 1 is characterized in that, flange-cooled housing (2) is an aluminum alloy materials.

4. combination heat abstractor according to claim 1 is characterized in that, heat pipe (5) needs closely fixing at chip heat-conducting plate (6) end and PCB fixed support (4) end.

5. combination heat abstractor according to claim 4 is characterized in that, heat pipe (5) adopts aluminum alloy materials at the die terminals heat pipe fixed head (7) and the radiating end heat pipe fixed head (8) of chip heat-conducting plate (6) end and PCB fixed support (4) end.

6. combination heat abstractor according to claim 1 is characterized in that, fan (1) speed Based Intelligent Control, and fan (1) working condition is controlled by the casing internal circuit, the internal temperature height, rotating speed raises, and temperature is low, and rotating speed reduces.

7. according to claim 1 or 6 described combination heat abstractors, it is characterized in that fan control cable (9) is connected with internal control circuit through the hull outside water-proof connector.

8. combination heat abstractor according to claim 1 is characterized in that, the heat-conductive assembly of internal mode blocking is made up of heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6), can plug on the guide rail in casing.

Images