CN101600325B - Combination heat sink of closed shell electronic equipment - Google Patents
Combination heat sink of closed shell electronic equipment Download PDFInfo
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- CN101600325B CN101600325B CN2009100876842A CN200910087684A CN101600325B CN 101600325 B CN101600325 B CN 101600325B CN 2009100876842 A CN2009100876842 A CN 2009100876842A CN 200910087684 A CN200910087684 A CN 200910087684A CN 101600325 B CN101600325 B CN 101600325B
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- heat pipe
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- fan
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Abstract
The invention discloses a combination heat sink of a fan, heat pipe and the like of closed shell electronic equipment, aiming at solving the conflict between high protection grade and excellent heat dissipation required by the closed shell electronic equipment. The key of the technical proposal is as follows: the combination heat sink of the closed shell electronic equipment comprises the structures of the fan, the shell with heat sinks, a heat conduction film, a PCB fixed bracket, a heat conducting pipe and a chip heat conducting plate. The heat conducting pipe connects the chip heat conducting plate and the PCB fixed bracket, the vertical section shape of the side plate of the PCB fixed bracket is of wedge shape, the wedge-shaped face is in tight contact with the inner wall of the shell, the inner side of the shell and the matching face of the side plate of the PCB fixed bracket are inclined planes with the same angle, the heat conduction film is arranged between the contact faces to ensure the tight contact between the PCB fixed bracket and the inner wall of the shell; the outer shell side of the shell is platy heat dissipation structure; the end of the heat sinks is fixed with the fan to form an air passage, thus providing air cooling and convection heat dissipation for the heat sinks. The invention is suitable for the heat dissipation of the closed shell electronic equipment.
Description
Technical field
The present invention relates to the combination heat dissipation technology field of electronic equipment, more particularly, relate to the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc.
Background technology
Electronic equipments such as industrial, military exchange, server, rack are limited by adverse circumstances, often need housing to adopt closed structure; In the equipment operation, devices such as exchange chip, power module can produce heat, and the device interior ambient temperature is raise, and influence the useful life and the performance of electronic devices and components.Traditional implementation method is that the heat of chip is transmitted to the engine housing radiated rib by inner heat-transfer device and dispels the heat; Radiating effect is limited, and pcb board is changed, safeguards inconvenient.Chinese patent grant number CN2599502Y, January 14 2004 Granted publication day, the utility model name is called the airtight radiator of heat pipe-type, this granted patent discloses by improving the layout general layout of radiator, rely on the separate part effect to improve heat exchange, the radiating efficiency of airtight electrical control cubicles, its weak point is the maintainability that does not relate to by radiating element, can not control by the radiating effect of radiating element.
Summary of the invention
The objective of the invention is to overcome deficiency of the prior art, provide the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc. and inside to be changed easy to maintenance by radiating element.
Technical scheme of the present invention is that the combination construction for heat radiating device of this kind closed shell electronic equipment is made up of fan 1, flange-cooled housing 2, heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6.Heat pipe 5 connects chip heat-conducting plate 6 and PCB fixed support 4, and PCB fixed support 4 closely contacts with casing inner wall, and compressible heat conducting film 3 is arranged between machine PCB fixed support 4 and the casing inner wall contact-making surface, guarantees that PCB fixed support 4 closely contacts with casing inner wall; The housing shell side is the sheet radiator structure; The fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.
PCB fixed support 4 is metal or other heat-conductings;
Flange-cooled housing 2 is metal or other heat-conductings;
The radiating subassembly of internal mode blocking is made up of heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6, can plug on the guide rail in casing.
The invention has the beneficial effects as follows: solved the closed shell electronic equipment and not only required high-protection level, but also required the contradiction of good heat radiating.Modular structure is not influencing under the radiating effect condition, and the functional module integral replacing is convenient.
Description of drawings
Fig. 1 makes up the construction for heat radiating device front view;
Fig. 2 makes up the construction for heat radiating device vertical view;
Fig. 3 can plug the radiating module vertical view;
Fig. 4 can plug the installation diagram of radiating module and complete machine.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
Fig. 1 makes up the construction for heat radiating device front view, Fig. 2 makes up the construction for heat radiating device vertical view, has indicated the combination heat abstractor to be made up of fan 1, flange-cooled housing 2, heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6.More than 6 parts be divided into inside chip heat-conductive assembly part and outside heat abstractor part.Inside chip heat-conductive assembly part is made up of heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, and heat pipe 5 is fixed with die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8 respectively on chip heat-conducting plate 6 and PCB fixed support 4.Outside heat abstractor part is made up of fan 1, flange-cooled housing 2.PCB fixed support 4, die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8, flange-cooled housing 2 are made by aluminum alloy materials.
Heat conduction path: the heat the during operation of PCB chip at first conducts to chip heat-conducting plate 6, conducts to aluminium alloy PCB fixed support 4 through heat pipe 5, die terminals heat pipe fixed head 7 (the auxiliary heat pipe that compresses) then, conducts to flange-cooled housing 2 through heat conducting film 3.PCB fixed support 4 side plate vertical cross-sections are shaped as wedge shape, lozenges closely contacts with casing inner wall, the casing inboard is the inclined-plane of equal angular with PCB fixed support 4 side plate mating surfaces, and compressible heat conducting film 3 (about 1MM is thick) is arranged between contact-making surface, guarantees that guide rail closely contacts with casing inner wall.The housing shell side is the sheet radiator structure, and the fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.
Fig. 3 can plug the installation diagram that radiating module vertical view, Fig. 4 can plug radiating module and complete machine, indicated formations such as inside chip heat-conductive assembly part (forming) and PCB can plug radiating module by heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, can in casing, plug on the guide rail, and by panel place locking, but when project installation, functional mapping, later maintenance integral replacing.Inside and outside radiator structure is independent of each other; Panel has hermetically-sealed construction, and after panel and casing were fixing, the housing degree of protection reached IP67.Internal heat dissipating device modularization is convenient to safeguard.
The above only is process of the present invention and method embodiment, in order to restriction the present invention, all any modifications of being made, is not equal to replacement, improvement etc. within spirit of the present invention and essence, all should be included within the protection range of the present invention.
Claims (8)
1. the combination heat abstractor of a closed shell electronic equipment, it is characterized in that, form by fan (1), flange-cooled housing (2), heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6), die terminals heat pipe fixed head (7) and radiating end heat pipe fixed head (8); Heat pipe (5) connects chip heat-conducting plate (6) and PCB fixed support (4), heat pipe (5) uses die terminals heat pipe fixed head (7) and radiating end heat pipe fixed head (8) to fix on chip heat-conducting plate (6) and PCB fixed support (4) respectively, PCB fixed support (4) side plate vertical cross-section is shaped as wedge shape, lozenges closely contacts with casing inner wall, the casing inboard is the inclined-plane of equal angular with PCB fixed support (4) side plate mating surface, compressible heat conducting film (3) is arranged between PCB fixed support (4) and the casing inner wall contact-making surface, guarantee that PCB fixed support (4) closely contacts with casing inner wall; The housing shell side is a fin; The fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.
2. combination heat abstractor according to claim 1 is characterized in that, PCB fixed support (4) is an aluminum alloy materials.
3. combination heat abstractor according to claim 1 is characterized in that, flange-cooled housing (2) is an aluminum alloy materials.
4. combination heat abstractor according to claim 1 is characterized in that, heat pipe (5) needs closely fixing at chip heat-conducting plate (6) end and PCB fixed support (4) end.
5. combination heat abstractor according to claim 4 is characterized in that, heat pipe (5) adopts aluminum alloy materials at the die terminals heat pipe fixed head (7) and the radiating end heat pipe fixed head (8) of chip heat-conducting plate (6) end and PCB fixed support (4) end.
6. combination heat abstractor according to claim 1 is characterized in that, fan (1) speed Based Intelligent Control, and fan (1) working condition is controlled by the casing internal circuit, the internal temperature height, rotating speed raises, and temperature is low, and rotating speed reduces.
7. according to claim 1 or 6 described combination heat abstractors, it is characterized in that fan control cable (9) is connected with internal control circuit through the hull outside water-proof connector.
8. combination heat abstractor according to claim 1 is characterized in that, the heat-conductive assembly of internal mode blocking is made up of heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6), can plug on the guide rail in casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100876842A CN101600325B (en) | 2009-07-02 | 2009-07-02 | Combination heat sink of closed shell electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100876842A CN101600325B (en) | 2009-07-02 | 2009-07-02 | Combination heat sink of closed shell electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101600325A CN101600325A (en) | 2009-12-09 |
| CN101600325B true CN101600325B (en) | 2011-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2009100876842A Active CN101600325B (en) | 2009-07-02 | 2009-07-02 | Combination heat sink of closed shell electronic equipment |
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| CN (1) | CN101600325B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647881A (en) * | 2011-02-16 | 2012-08-22 | 深圳市创智成科技股份有限公司 | Severe environment-resistant portable electronic product/equipment |
| CN104460910A (en) * | 2014-12-18 | 2015-03-25 | 山东超越数控电子有限公司 | Board-level radiating method for board cards |
| CN205883804U (en) * | 2015-12-30 | 2017-01-11 | 完美幻境(北京)科技有限公司 | Electronic device |
| CN105979757B (en) * | 2016-07-26 | 2018-07-03 | 国电南瑞科技股份有限公司 | A kind of radiating subassembly suitable for standard 4U cabinets |
| CN106507646A (en) * | 2016-12-19 | 2017-03-15 | 国网河北省电力公司衡水供电分公司 | A kind of cabinet not cooling system of dust stratification and the method that existing equipment is improved to the system |
| CN106783296A (en) * | 2017-02-23 | 2017-05-31 | 深圳供电局有限公司 | A kind of intelligent low-pressure switchs heat abstractor |
| CN106714525B (en) * | 2017-02-27 | 2019-04-19 | 华为机器有限公司 | Radiator and electronic equipment |
| CN109041506A (en) * | 2017-06-09 | 2018-12-18 | 杭州海康机器人技术有限公司 | Electronic equipment |
| DE102017222148A1 (en) * | 2017-12-07 | 2019-06-13 | Siemens Mobility GmbH | Fanless cooling system |
| CN108235597A (en) * | 2018-02-08 | 2018-06-29 | 惠州奔达电子有限公司 | The production method and PCB of a kind of PCB |
| CN109041548A (en) * | 2018-09-12 | 2018-12-18 | 中国电力科学研究院有限公司 | A kind of radiator for inside equipment |
| CN109348693A (en) * | 2018-12-05 | 2019-02-15 | 江苏华科永磁科技有限公司 | A kind of automatic heat radiation type motor servo driver |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2541893Y (en) * | 2002-03-18 | 2003-03-26 | 联想(北京)有限公司 | CPU radiator with its fan rotary speed controlled by CPU temp |
| CN2751511Y (en) * | 2004-11-30 | 2006-01-11 | 章祖文 | Power supply cooling frame |
| CN1877825A (en) * | 2005-06-08 | 2006-12-13 | 上海雷硕医疗器械有限公司 | Heat sink structure of medical apparatus |
| CN1953646A (en) * | 2005-10-18 | 2007-04-25 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator capable of preventing electromagnetic interference |
| CN201467613U (en) * | 2009-07-02 | 2010-05-12 | 北京东土科技股份有限公司 | Combined radiator for electronic device with enclosed shell |
-
2009
- 2009-07-02 CN CN2009100876842A patent/CN101600325B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2541893Y (en) * | 2002-03-18 | 2003-03-26 | 联想(北京)有限公司 | CPU radiator with its fan rotary speed controlled by CPU temp |
| CN2751511Y (en) * | 2004-11-30 | 2006-01-11 | 章祖文 | Power supply cooling frame |
| CN1877825A (en) * | 2005-06-08 | 2006-12-13 | 上海雷硕医疗器械有限公司 | Heat sink structure of medical apparatus |
| CN1953646A (en) * | 2005-10-18 | 2007-04-25 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator capable of preventing electromagnetic interference |
| CN201467613U (en) * | 2009-07-02 | 2010-05-12 | 北京东土科技股份有限公司 | Combined radiator for electronic device with enclosed shell |
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| Publication number | Publication date |
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| CN101600325A (en) | 2009-12-09 |
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