CN219812395U - Heat dissipation mechanism and energy storage equipment - Google Patents
Heat dissipation mechanism and energy storage equipment Download PDFInfo
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- CN219812395U CN219812395U CN202320510234.5U CN202320510234U CN219812395U CN 219812395 U CN219812395 U CN 219812395U CN 202320510234 U CN202320510234 U CN 202320510234U CN 219812395 U CN219812395 U CN 219812395U
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Abstract
本申请涉及散热结构技术领域，具体公开一种散热机构及储能设备，应用于储能设备，储能设备包括基板以及设置于基板的发热元件，散热机构包括第一散热器和第二散热器。第一散热器固定于基板并与发热元件间隔设置。第二散热器与第一散热连接并可相对第一散热器移动，第二散热器被配置为贴合发热元件。本申请中第二散热器能够相对与第一散热器移动，以便于根据发热元件的位置，调整第二散热器的位置，以使第二散热器能够对基板上不同位置的发热元件进行散热。
This application relates to the technical field of heat dissipation structures, and specifically discloses a heat dissipation mechanism and energy storage equipment, which are used in energy storage equipment. The energy storage equipment includes a base plate and a heating element provided on the base plate. The heat dissipation mechanism includes a first radiator and a second radiator. . The first heat sink is fixed on the base plate and is spaced apart from the heating element. The second heat sink is connected to the first heat sink and can move relative to the first heat sink, and the second heat sink is configured to fit the heating element. In this application, the second heat sink can move relative to the first heat sink, so that the position of the second heat sink can be adjusted according to the position of the heating element, so that the second heat sink can dissipate heat to the heating elements at different positions on the substrate.
Description
Technical Field
The present disclosure relates to heat dissipation structures, and particularly to a heat dissipation mechanism and an energy storage device.
Background
The energy storage mobile power supply is used as a safe and portable small energy storage device, is widely applied to the fields of electric power, travel, household energy storage and the like, and can solve the problem of outdoor electricity utilization.
When the energy storage device works, the electronic element in the energy storage device can generate heat. At present, in order to ensure that a heat-generating electronic component can instantly dissipate heat, a radiator is arranged on the electronic component, but the radiator is generally fixed on a substrate, and the position of the radiator cannot be adjusted according to the electronic component so as to dissipate heat of different electronic components.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a heat dissipation mechanism and an energy storage device, which can solve the heat dissipation problem of the heating element at different positions on the substrate.
The embodiment of the utility model provides a heat dissipation mechanism which is applied to energy storage equipment, wherein the energy storage equipment comprises a substrate and a heating element arranged on the substrate, and the heat dissipation mechanism comprises a first radiator and a second radiator. The first radiator is fixed on the substrate and is arranged at intervals with the heating element. The second radiator is connected with the first radiator and can move relative to the first radiator, and the second radiator is configured to be attached to the heating element.
The heat dissipation mechanism has the advantages that the second radiator can move relative to the first radiator so as to adjust the position of the second radiator according to the position of the heating element, so that the second radiator can better dissipate heat for the heating elements at different positions on the substrate, and the application range of the heat dissipation mechanism is widened.
In at least one embodiment, the heat dissipation mechanism further comprises a locking member, the second heat sink is provided with a mounting hole, the locking member is configured to penetrate through the mounting hole and fix the second heat sink to the first heat sink, and the locking member is detachably connected with the first heat sink.
In the above embodiment, the locking member can fix the second heat sink to the first heat sink to connect the first heat sink and the second heat sink. The locking piece is detached, and the first radiator and the second radiator can be unlocked, so that the second radiator can move relative to the first radiator, and the position of the second radiator can be adjusted. After the second radiator is moved to a required position according to the position of the heating element, the locking piece penetrates through the mounting hole and is connected with the first radiator, so that the second radiator is connected with the first radiator, and the position of the second radiator is adjusted. Through the cooperation of mounting hole on retaining member and the second radiator, can adjust the position of second radiator to the second radiator can dispel the heat to the heating element of different positions on the circuit board.
In at least one embodiment, the second heat sink includes a heat dissipating portion and a mounting portion, the mounting hole is provided in the mounting portion, the heat dissipating portion has a heat dissipating surface configured to be attached to the heat generating element.
In the above embodiment, the heat dissipation portion is attached to the heating element through the heat dissipation surface, so that the contact area between the heat dissipation portion and the heating element can be increased, and the heat of the heating element can be transferred to the heat dissipation portion, thereby improving the heat dissipation efficiency of the second heat sink to the heating element.
In at least one embodiment, the heat dissipation mechanism further comprises a heat conducting member disposed on the heat dissipation surface, and the heat conducting member is configured to be attached to the heating element.
In the above embodiment, compared with the case that the heat radiating surface is directly attached to the heating element, the heat conducting member in the embodiment is used as a heat conducting medium between the heat radiating surface and the heating element, so that heat dissipation can be performed on the heating element more quickly, and the heat dissipation efficiency is further improved.
In at least one embodiment, the thermally conductive member is a thermally conductive paste.
In the above embodiments, the heat conductive paste is used as a high-performance paste heat conductive material, and has ultra-low thermal resistance. The heat conduction mud has good adhesion on the radiating surface, and can increase the contact area between the heat conduction mud and the radiating surface, so that the heat transfer efficiency between the radiating surface and the second radiator can be improved, and the heat dissipation efficiency of the radiating part to the heating element is further improved.
In at least one embodiment, the second heat sink is provided in plurality, and the plurality of second heat sinks are provided on different sides of the first heat sink. The locking pieces and the second radiators are the same in number and correspond to each other one by one.
In the above embodiment, the plurality of second heat sinks can simultaneously radiate heat from the heating elements located on different sides of the first heat sink, so that the heat radiation efficiency of the heat radiation mechanism on the heating elements on the substrate is improved.
In at least one embodiment, the substrate has a mounting surface, the first heat sink is disposed on the mounting surface, a direction perpendicular to the mounting surface is a first direction, and a length direction of the mounting hole is consistent with the first direction.
In the above embodiment, the direction of the mounting hole is perpendicular to the direction of the mounting surface, so that the position of the locking member in the mounting hole can be adjusted according to the height of the heating element along the first direction, thereby adjusting the height of the second radiator, so that the second radiator can adapt to the heights of different heating elements.
In at least one embodiment, the substrate has a mounting surface, the first heat sink is disposed on the mounting surface, a direction perpendicular to the mounting surface is a first direction, and a length direction of the mounting hole is perpendicular to the first direction.
In the above embodiment, the length direction of the mounting hole is perpendicular to the first direction, so that the position of the locking member in the mounting hole can be adjusted according to the position of the heating element on the substrate, thereby improving the adaptability of the second radiator to the heating element at different positions on the base surface.
The embodiment of the utility model also provides energy storage equipment, which comprises a shell, a battery module and the heat dissipation mechanism in any embodiment, wherein the shell is provided with an accommodating space, the battery module and the heat dissipation mechanism are arranged in the accommodating space, and the heat dissipation mechanism is arranged in the battery module.
In the above embodiment, the position of the second radiator in the heat dissipation mechanism is adjusted, so that the second radiator can radiate heat of the heating elements at different positions on the substrate, thereby improving the heat dissipation efficiency of the internal structure of the energy storage device, and ensuring that the energy storage device is not easy to damage due to overhigh internal temperature.
In at least one embodiment, the energy storage device further comprises a fan, the fan is arranged in the accommodating space, the shell is provided with an air inlet and an air outlet, the fan is configured to suck air from the air inlet, and the air is discharged from the air outlet after flowing through the first radiator and/or the second radiator.
In the above-mentioned embodiment, the fan can inhale the outside air of energy storage equipment in the shell to improve the inside circulation of air effect of energy storage equipment, so that the air can take out the heat of energy storage equipment inside, thereby reduce the heat accumulation of energy storage equipment.
Drawings
Fig. 1 is a schematic diagram of the overall structure of an energy storage device according to an embodiment of the present utility model.
Fig. 2 is a schematic diagram of an inverter module according to an embodiment of the present utility model.
Fig. 3 is an enlarged view of a portion a in fig. 2.
Fig. 4 is a schematic structural diagram of a second heat sink according to an embodiment of the present utility model.
Fig. 5 is a schematic diagram of an exploded structure of an energy storage device in one embodiment of the utility model.
Description of the main reference signs
Heat dissipation mechanism-100 energy storage device-200
First radiator-11 second radiator-12 heat conduction piece-13
Base plate-21 heating element-22 casing-23
Inversion module-24 fans-25 wind scoopers-26
Through hole-111 fixing hole-112 mounting hole-121
Radiating part-122 mounting part-123 mounting surface-211
Air inlet-231 air outlet-232 first ventilation opening-261
Second vent-262 radiating surface-1221 first direction-Y
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the technical solutions according to the embodiments of the present utility model will be given with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
In the description of embodiments of the present utility model, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more unless explicitly defined otherwise.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
It should be noted that, the dimensions of thickness, length, width, etc. of the various components and the dimensions of the overall thickness, length, width, etc. of the integrated device in the embodiments of the present utility model shown in the drawings are only illustrative, and should not be construed as limiting the present utility model.
The energy storage mobile power supply is used as a safe and portable small energy storage device, is widely applied to the fields of electric power, travel, household energy storage and the like, and can solve the problem of outdoor electricity utilization.
When the energy storage device works, the electronic element in the energy storage device can generate heat. At present, in order to ensure that a heat-generating electronic component can instantly dissipate heat, a radiator is arranged on the electronic component, but the radiator is generally fixed on a substrate, and the position of the radiator cannot be adjusted according to the electronic component so as to dissipate heat of different electronic components.
In view of the above, an embodiment of the present utility model provides a heat dissipation mechanism applied to an energy storage device, the energy storage device includes a substrate and a heating element disposed on the substrate, and the heat dissipation mechanism includes a first heat sink and a second heat sink. The first radiator is fixed on the substrate and is arranged at intervals with the heating element. The second radiator is connected with the first radiator and can move relative to the first radiator, and the second radiator is configured to be attached to the heating element.
The heat dissipation mechanism has the advantages that the second radiator can move relative to the first radiator so as to adjust the position of the second radiator according to the position of the heating element, so that the second radiator can better dissipate heat for the heating element at different positions on the substrate, and the application range of the heat dissipation mechanism is improved.
Embodiments of the present utility model will be further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, an embodiment of the present utility model provides a heat dissipation mechanism 100 applied to an energy storage device 200, where the energy storage device 200 includes a substrate 21 and a heating element 22 disposed on the substrate 21. The heat dissipation mechanism 100 can dissipate heat of different heating elements 22 on the substrate 21, so as to improve the heat dissipation efficiency of the internal structure of the energy storage device 200.
Referring to fig. 2, in one embodiment, the substrate 21 has a mounting surface 211, the heating elements 22 are disposed on the mounting surface 211, and the mounting surface 211 is provided with a plurality of heating elements 22.
Referring to fig. 2 and 3, in an embodiment, the heat dissipation mechanism 100 includes a first heat sink 11 and a second heat sink 12. The first heat sink 11 is fixed to the substrate 21 and is spaced apart from the heating element 22. This arrangement enables the first heat sink 11 to dissipate heat from the substrate 21. The first heat sink 11 can not only radiate heat from the heating element 22 by its own heat radiation effect, but also the first heat sink 11 and the heating element 22 are separated from each other, and the heat radiation is performed by air flow between the first heat sink 11 and the heating element 22.
The second heat sink 12 is connected to the first heat sink 11 and movable relative to the first heat sink 11, the second heat sink 12 being configured to fit the heating element 22. This arrangement can facilitate adjusting the position of the second heat sink 12 according to the position of the different heating elements 22 when the heat dissipating mechanism 100 is assembled to the energy storage device 200, so that the second heat sink 12 can better provide heat dissipation for the heating elements 22.
Referring to fig. 3 and 4, in an embodiment, the heat dissipation mechanism 100 further includes a locking member (not shown) that is configured to penetrate through the mounting hole 121 and fix the second heat dissipation member 12 to the first heat dissipation member 11, and the locking member is detachably connected to the first heat dissipation member 11. For example, the locking member clamps the second heat sink 12 together with the first heat sink 1 so that the second heat sink 12 is fixed with the first heat sink 11.
In an embodiment, the locking member is a screw, the first heat sink 11 is provided with a plurality of through holes 111, the inner wall of each through hole 111 is provided with threads, the locking member and the first heat sink 11 are connected by adopting threads, and the screw penetrates through the mounting hole 121 and passes through one of the through holes 111, so that the second heat sink 12 is fixed on the first heat sink 11. By loosening the screws and mating the screws with different through holes 111, the position of the second heat sink 12 can be adjusted to adapt the second heat sink 12 to the heating elements 22 in different positions.
It will be appreciated that in other embodiments, the locking member may be a bolt or pin.
The locking member can fix the second heat sink 12 to the first heat sink 11 to achieve connection of the first heat sink 11 and the second heat sink 12. The locking member is detachable from the first radiator 11, so that the second radiator 12 can be unlocked from the first radiator 11, and the position of the second radiator 12 can be adjusted. After the second radiator 12 is moved to a desired position according to the position of the heating element 22, the locking member penetrates through the mounting hole 121 and is connected with the first radiator 11, so that the second radiator 12 is fixed on the first radiator 11, and therefore position adjustment of the second radiator 12 is achieved. Through the cooperation of the locking piece and the mounting hole 121 on the second radiator 12, the position of the second radiator 12 can be adjusted, so that the second radiator 12 can radiate heat of the heating element 22 at different positions on the circuit board.
It will be appreciated that, in the case where a plurality of second heat sinks 12 are provided to the same first heat sink 11, the number of locking pieces is the same as and corresponds to the number of second heat sinks 12 one by one. Each locking member is capable of securing a corresponding second heat sink 12 to the first heat sink 11.
In an embodiment, the same second heat sink 12 may also be fixed by two locking members to improve the mounting stability of the second heat sink 12.
Referring to fig. 2 and 3, in an embodiment, the first heat spreader 11 is disposed on the mounting surface 211, a direction perpendicular to the mounting surface 211 is a first direction Y, and a length direction of the mounting hole 121 is consistent with the first direction Y. In this way, the locking member can be correspondingly adjusted according to the heights of different heating elements 22 along the first direction Y, so that the locking member penetrates through different positions in the mounting hole 121, and the height of the second radiator 12 can be adjusted, so that the second radiator 12 can adapt to the heights of different heating elements 22.
It will be appreciated that in another embodiment, the length direction of the mounting hole 121 may also be arranged perpendicular to the first direction Y. The positioning can adjust the position of the locking member in the mounting hole 121 according to the positions of different heating elements 22 on the substrate 21, so that the suitability of the second radiator 12 and the heating elements 22 at different positions on the mounting surface 211 is improved. For example, the first heat sink 11 may be rectangular parallelepiped, the height direction of the first heat sink 11 may be aligned with the first direction Y, and the second heat sink 12 may be disposed on different sides of the first heat sink 11 such that the longitudinal direction of the mounting hole 121 may be aligned with the first direction Y, or such that the longitudinal direction of the mounting hole 121 may be aligned with the longitudinal direction or the width direction of the first heat sink 11.
Referring to fig. 3 and 4, for example, the mounting hole 121 is a long waist hole, and the first heat sink 11 is provided with a fixing hole 112. In the mounting, the locking member is first passed through the mounting hole 121 and the fixing hole 112, and before the locking member is fixed, the second heat sink 12 is moved in the length direction of the mounting hole 121, that is, the second heat sink 12 is moved relative to the locking member, so that the relative positions of the second heat sink 12 and the locking member are changed. In adjusting the second radiator 12, the position of the locking member does not need to be changed, the locking member does not need to be completely detached, and the locking member only needs to be released so that the second radiator 12 can move relative to the locking member. It is obvious that only one fixing hole 112 is correspondingly arranged on each second radiator 12 to change the position of the second radiator 12. Of course, in order to improve the mounting stability of the second heat sinks 12, each of the second heat sinks 12 may correspond to two fixing holes 112 and may be connected to the first heat sink 11 through two locking members, and the provision of two fixing holes 112 may also increase the movable range of the second heat sink 12.
It will be appreciated that in other implementations, the number of securing holes 112 is not limited thereto and may be set according to the particular implementation.
Referring to fig. 2, in an embodiment, a plurality of second heat sinks 12 are provided, and the plurality of second heat sinks 12 are disposed on different sides of the first heat sink 11. For example, the first heat sink 11 has a substantially rectangular parallelepiped shape, two second heat sinks 12 are provided, and the two second heat sinks 12 are provided on two surfaces of the first heat sink 11 perpendicular to each other. The plurality of second heat sinks 12 can simultaneously radiate heat from the heating elements 22 located on different sides of the first heat sink 11, so that the heat radiation efficiency of the heat radiation mechanism 100 on the heating elements 22 on the substrate 21 is improved.
Referring to fig. 3 and 4, in an embodiment, the second heat sink 12 includes a heat dissipating portion 122 and a mounting portion 123, the mounting hole 121 is disposed on the mounting portion 123, the heat dissipating portion 122 has a heat dissipating surface 1221, and the heat dissipating surface 1221 is configured to be attached to the heat generating element 22. The shape of the heat dissipating surface 1221 may be set according to the surface shape of the heating element 22 to improve the adhesion between the heat dissipating surface 1221 and the surface of the heating element 22. For example, the heating element 22 is an inductor, and the inductor has an arc surface, and the radiating surface 1221 is also an arc surface adapted to the surface of the inductor.
The heat dissipation portion 122 is attached to the heating element 22 via the heat dissipation surface 1221, so that the contact area between the heat dissipation portion 122 and the heating element 22 can be increased, and the heat of the heating element 22 can be transferred to the heat dissipation portion 122, thereby improving the heat dissipation efficiency of the second heat sink 12 to the heating element 22.
Referring to fig. 3 and 4, in an embodiment, the heat dissipation mechanism 100 further includes a heat conducting member 13, the heat conducting member 13 is disposed on the heat dissipation surface 1221, and the heat conducting member 13 is configured to be attached to the heat generating element 22. The heat conductive member 13 is directly attached to the heat generating element 22 with respect to the heat radiating surface 1221, and serves as a medium for heat conduction between the heat radiating surface 1221 and the heat generating element 22, so that the heat generating element 22 can be radiated more quickly, and the heat radiation efficiency can be further improved.
In one embodiment, the heat conducting member 13 is a heat conducting paste, which is a high-performance paste-like heat conducting material having ultra-low thermal resistance. The heat conductive mud has good adhesion to the heat radiation surface 1221, and can increase the contact area with the heat radiation surface 1221, thereby improving the heat transfer efficiency between the heat radiation surface 1221 and the second heat sink 12, and further improving the heat radiation efficiency of the heat radiation part 122 to the heating element 22.
In another implementation, the heat conducting member 13 may also be a heat conducting pad. The heat conduction gasket has strong flexibility, can well cover uneven surfaces of parts, has longer service life, and is beneficial to long-term use of equipment. The heat conduction principle is that the temperature of the heating element 22 rises in the use process, so that the heat conduction gasket becomes soft and creeps, and the effect of increasing the contact area is achieved.
In other embodiments, the heat conducting member 13 may also be a heat conducting silica gel, which has good heat conductivity, electrical insulation property, and can be adhered to the second heat sink 12 and the heating element 22.
The second heat sink 12 and the first heat sink 11 can be relatively moved, so that the position of the second heat sink 12 can be adjusted according to the position of the heating element 22, and the second heat sink 12 can better provide heat dissipation effect for the heating element 22 at different positions on the substrate 21.
Referring to fig. 1, fig. 2 and fig. 5, an embodiment of the utility model further provides an energy storage device 200, which includes a housing 23, a battery module (not shown) and the heat dissipation mechanism 100 in any of the foregoing embodiments, wherein the housing 23 is provided with an accommodating space, the battery module and the heat dissipation mechanism 100 are disposed in the accommodating space, and the heat dissipation mechanism 100 is disposed in the battery module.
Referring to fig. 2 and 5, in an embodiment, the energy storage device 200 includes an inverter module 24, where the inverter module 24 is disposed in the accommodating space and is electrically connected to the battery module. The inverter module 24 includes a substrate 21 and a plurality of heating elements 22, and the heating elements 22 are distributed on the substrate 21. The first heat sinks 11 are also provided with a plurality of second heat sinks 12, and the number of the second heat sinks 12 on each first heat sink 11 is set according to actual needs.
Referring to fig. 2 and 5, in an embodiment, the energy storage device 200 further includes a fan 25, the fan 25 is disposed in the accommodating space, the housing 23 is provided with an air inlet 231 and an air outlet 232, the fan 25 is configured to suck air from the air inlet 231, and the air is discharged from the air outlet 232 after flowing through the first radiator 11 and/or the second radiator 12.
The blower 25 can suck air outside the energy storage device 200 into the housing 23 to improve the air circulation effect inside the energy storage device 200, so that the air can take out heat inside the energy storage device 200, thereby reducing heat accumulation of the energy storage device 200.
In an embodiment, the energy storage device 200 further includes a wind scooper 26, where the wind scooper 26 is disposed on the first radiator 11 and/or the second radiator 12, the wind scooper 26 has a first ventilation opening 261 and a second ventilation opening 262, the first ventilation opening 261 is in communication with the air inlet 231, and the second ventilation opening 262 is in communication with the air outlet 232.
The wind scooper 26 is generally U-shaped and covers the first radiator 11 and/or the second radiator 12.
The air guide cover 26 can guide the flow direction of air so that the air can enter the air guide cover 26 from the first ventilation opening 261 and be discharged from the second ventilation opening 262. In this process, the air flows through the first radiator 11 and/or the second radiator 12, so that the heat of the first radiator 11 and/or the second radiator 12 can be taken out, so as to improve the heat dissipation efficiency inside the energy storage device 200.
In the energy storage device 200, the position of the second radiator 12 in the heat dissipation mechanism 100 is adjusted, so that the second radiator 12 can dissipate heat of the heating elements 22 at different positions on the substrate 21, thereby improving the heat dissipation efficiency of the internal structure of the energy storage device 200, and making the energy storage device 200 difficult to be damaged due to the over high internal temperature.
Further, other variations within the spirit of the present utility model will occur to those skilled in the art, and it is intended, of course, that such variations be included within the scope of the present utility model as disclosed herein.
Claims (10)
1. The heat dissipation mechanism is applied to energy storage equipment, and comprises a substrate and a heating element arranged on the substrate, and is characterized by comprising a first heat radiator and a second heat radiator;
the first radiator is fixed on the substrate and is arranged at intervals with the heating element;
the second radiator is connected with the first radiator and can move relative to the first radiator, and the second radiator is configured to be attached to the heating element.
2. The heat dissipation mechanism of claim 1, further comprising a locking member, wherein the second heat sink is provided with a mounting hole, wherein the locking member is configured to extend through the mounting hole and secure the second heat sink to the first heat sink, and wherein the locking member is detachably coupled to the first heat sink.
3. The heat dissipating mechanism of claim 2, wherein the second heat sink comprises a heat dissipating portion and a mounting portion, the mounting hole is provided in the mounting portion, the heat dissipating portion has a heat dissipating surface configured to be attached to the heat generating element.
4. The heat dissipation mechanism of claim 3, further comprising a thermally conductive member disposed on the heat dissipation surface and configured to be attached to the heat generating element.
5. The heat dissipation mechanism as recited in claim 4, wherein said heat conducting member is a heat conducting paste.
6. The heat dissipation mechanism as recited in any one of claims 2-5, wherein a plurality of said second heat sinks are provided, a plurality of said second heat sinks being provided on different sides of said first heat sink;
the locking pieces and the second radiators are the same in number and in one-to-one correspondence.
7. The heat dissipating mechanism of any of claims 2 to 5, wherein said base plate has a mounting surface, said first heat sink is provided on said mounting surface, a direction perpendicular to said mounting surface is a first direction, and a length direction of said mounting hole coincides with said first direction.
8. The heat dissipating mechanism of any of claims 2-5, wherein said base plate has a mounting surface, said first heat sink is disposed on said mounting surface in a first direction perpendicular to said mounting surface, and a length direction of said mounting hole is perpendicular to said first direction.
9. An energy storage device, comprising a housing, a battery module, and a heat dissipation mechanism according to any one of claims 1 to 8, wherein the housing is provided with an accommodating space, the battery module and the heat dissipation mechanism are disposed in the accommodating space, and the heat dissipation mechanism is disposed in the battery module.
10. The energy storage device of claim 9, further comprising a blower disposed in the receiving space, the housing having an air inlet and an air outlet, the blower configured to draw air from the air inlet, the air flowing through the first heat sink of the heat dissipation mechanism and/or the second heat sink of the heat dissipation mechanism and exiting the air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320510234.5U CN219812395U (en) | 2023-03-09 | 2023-03-09 | Heat dissipation mechanism and energy storage equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320510234.5U CN219812395U (en) | 2023-03-09 | 2023-03-09 | Heat dissipation mechanism and energy storage equipment |
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| Publication Number | Publication Date |
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| CN219812395U true CN219812395U (en) | 2023-10-10 |
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| CN202320510234.5U Active CN219812395U (en) | 2023-03-09 | 2023-03-09 | Heat dissipation mechanism and energy storage equipment |
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| Country | Link |
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| CN (1) | CN219812395U (en) |
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2023
- 2023-03-09 CN CN202320510234.5U patent/CN219812395U/en active Active
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