CN218004052U - Heat dissipation type machine case based on Intel platform - Google Patents
Heat dissipation type machine case based on Intel platform Download PDFInfo
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- CN218004052U CN218004052U CN202221983342.6U CN202221983342U CN218004052U CN 218004052 U CN218004052 U CN 218004052U CN 202221983342 U CN202221983342 U CN 202221983342U CN 218004052 U CN218004052 U CN 218004052U
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Abstract
The utility model relates to a heat dissipation type chassis based on an Intel platform, which comprises a chassis shell, a mainboard, a switching card and an extension module; the mainboard comprises an Intel C3558 processor chip; a first heat dissipation module is arranged for an Intel C3558 processor chip, and first heat dissipation fins of the first heat dissipation module are arranged corresponding to first yielding holes of a case shell and exposed out of the first yielding holes; the first heat dissipation module is detachably connected to the case shell through a first heat insulation block; a second heat dissipation module is arranged aiming at the expansion module, second heat dissipation fins of the second heat dissipation module are arranged corresponding to second abdicating holes of the case shell and are exposed out of the second abdicating holes, and the second heat dissipation module is detachably connected to the case shell through a second heat insulation block; the heat dissipation device enables heat on an Intel C3558 processor chip and an expansion module to be dissipated through corresponding heat dissipation modules in a centralized mode, and the heat dissipation device cannot be dispersed to a case shell, so that the heat dissipation effect is improved, a fan-free centralized heat dissipation mode is achieved, and normal heat dissipation can be guaranteed without a fan.
Description
Technical Field
The utility model belongs to the technical field of the case technique and specifically relates to indicate a heat dissipation type machine case based on Intel platform.
Background
With the development of network technology, electronic devices have become indispensable devices in the work and life of most people, and the chassis is used as an important component of electronic device accessories, and mainly plays a role in bearing and protecting various electronic components installed inside the chassis, and meanwhile, various types of interfaces need to be provided to the outside.
Most industrial control equipment in the prior art adopts a cooling fan for cooling, which is not favorable for operating environments with more dust and needing to be sealed; some industrial control equipment with a heat dissipation device without a heat dissipation fan is provided, but the heat dissipation device is often directly connected with the shell, so that heat is easily conducted to the shell, and the service life of electronic devices in the shell is influenced due to overhigh temperature of the shell of the machine case.
Therefore, in the patent application of the present invention, the applicant has studied a heat dissipation type case based on the Intel platform to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to above-mentioned prior art exist not enough, main aim at provides a heat dissipation type machine case based on Intel platform, and it makes the heat on Intel C3558 treater chip and the expansion module can all concentrate and dispel the heat through corresponding heat radiation module, and can not disperse to the casing on, is favorable to improving the radiating effect, has realized the concentrated radiating mode of exempting from the fan formula moreover, need not the fan and also can guarantee normal heat dissipation.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a heat dissipation type chassis based on an Intel platform comprises a chassis shell, a main board, a switching card and an expansion module, wherein the main board, the switching card and the expansion module are arranged in the chassis shell;
the mainboard comprises an Intel C3558 processor chip, the Intel C3558 processor chip is connected with an expansion module through a switching card, and the mainboard and the expansion module are arranged side by side from left to right;
the first heat dissipation module is used for dissipating heat of the Intel C3558 processor chip and is provided with a plurality of first heat dissipation fins, a first abdicating hole is formed in the right side of the case shell, the first heat dissipation fins are arranged corresponding to the first abdicating hole and exposed out of the first abdicating hole, and the first heat dissipation module is detachably connected to the inner bottom wall of the case shell through a first heat insulation block;
the second heat dissipation module is used for dissipating heat of the expansion module and provided with a plurality of second heat dissipation fins, a second abdicating hole is formed in the left side of the case shell, the second heat dissipation fins are arranged corresponding to the second abdicating hole and exposed out of the second abdicating hole, and the second heat dissipation module is detachably connected to the inner bottom wall of the case shell through a second heat insulation block.
As a preferable scheme, the first heat dissipation module comprises a first cooling pipe and a first heat conduction seat extending along the left-right direction;
the bottom end of the left side of the first heat-conducting seat is tightly attached to an Intel C3558 processor chip, and the right side of the bottom end of the first heat-conducting seat is detachably connected to the inner bottom wall of the case shell through a first mounting bracket;
the right end face of the first heat conducting seat is detachably connected with a first supporting block, and the first supporting block is detachably connected to the inner bottom wall of the case shell through a first heat insulation block;
a plurality of first heat radiation fins are arranged on the right end face of the first support block in an integrated forming mode, first accommodating grooves which are connected with each other and used for accommodating first cooling pipes are formed in the upper end face of the first heat conduction seat and the left end face of the first support block, and the first cooling pipes are embedded in the first accommodating grooves.
As a preferable scheme, the first mounting bracket comprises a first longitudinal portion extending along the front-rear direction, and a first front vertical portion and a first rear vertical portion integrally connected to the front end and the rear end of the first longitudinal portion respectively;
the upper end surface of the first longitudinal part is provided with a convex column, and the first heat conducting seat is connected with the first longitudinal part through the convex column; the lower end of the first front vertical part is integrally bent and extends forwards to form a first front mounting part;
the lower extreme an organic whole of first back vertical portion is buckled and is extended backward and be formed with first back installation department, the interior diapire of chassis casing is connected respectively with first preceding installation department to first back installation department.
Preferably, the first supporting block is detachably connected to the chassis housing through a second mounting bracket.
Preferably, the second mounting bracket has a second longitudinal portion, and a second front vertical portion and a second rear vertical portion integrally connected to the left and right sides of the second longitudinal portion;
the second longitudinal part, the second front vertical part and the second rear vertical part form a first mounting space for placing the first supporting block, and the first supporting block and the plurality of first radiating fins are all positioned in the first mounting space; the left side and the right side of the second longitudinal portion are integrally bent and extend downwards to form a first stopping portion and a second stopping portion respectively, the left side of the first supporting block is limited by the first stopping portion, and the plurality of first radiating fins are located on the left side of the first stopping portion.
As a preferable scheme, the lower end of the front vertical portion of the second is integrally bent and extends forwards to form a front second mounting portion, the lower end of the rear vertical portion of the second is integrally bent and extends backwards to form a rear second mounting portion, and the rear second mounting portion and the front second mounting portion are respectively connected with the inner bottom wall of the chassis housing.
As a preferred scheme, the integrative bending forward of right-hand member of installation department extends and is formed with first side installation department before the second, the integrative bending backward of right-hand member of installation department extends and is formed with second side installation department behind the second, first side installation department and second side installation department are connected the interior right side wall of chassis casing respectively.
As a preferable scheme, the second heat dissipation module comprises a second heat conduction seat and a second cooling pipe;
the second heat conducting seat is of an L-shaped structure and is provided with a transverse heat conducting part and a longitudinal heat conducting part which is integrally connected to the right end of the transverse heat conducting part;
the bottom end of the right side of the transverse heat conducting part and the bottom end of the longitudinal heat conducting part are tightly attached to the expansion module;
the left end face of the transverse heat conducting part is detachably connected with a second supporting block, and the second supporting block is detachably connected to the inner bottom wall of the case shell through a second heat insulation block;
the plurality of second heat dissipation fins are integrally formed from the left end face of the second supporting block, second accommodating grooves which are connected with each other and used for accommodating second cooling pipes are formed in the upper end face of the second heat conduction seat and the left end face of the second supporting block, and the second cooling pipes are embedded in the second accommodating grooves.
Preferably, the second support block is detachably connected to the chassis housing through a third mounting bracket.
Preferably, the third mounting bracket has a third longitudinal portion, and a third front vertical portion and a third rear vertical portion integrally connected to left and right sides of the third longitudinal portion, respectively;
the third longitudinal part, the third front vertical part and the third rear vertical part form a second mounting space for placing a second supporting block, and the second supporting block and the plurality of second radiating fins are positioned in the second mounting space; the left side and the right side of the third longitudinal part are integrally bent and extend downwards to form a third stopping part and a fourth stopping part respectively, the right side of the second supporting block is limited by the third stopping part, and the plurality of second radiating fins are located at the left of the fourth stopping part.
Compared with the prior art, the utility model obvious advantage of output and beneficial effect particularly: the heat on the Intel C3558 processor chip and the expansion module can be completely concentrated to be radiated by the corresponding radiating module and can not be dispersed to the case shell by matching the first heat insulating block and the second heat insulating block, so that the radiating effect is improved, a fan-free concentrated radiating mode is realized, and normal radiating can be ensured without a fan;
through the cooperation of a plurality of installing supports, ensure first heat dissipation module and heat dissipation module stability and reliability at the heat dissipation in-process.
To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an exploded view of a preferred embodiment of the present invention (the top cover of the housing of the chassis is not shown);
fig. 2 is a schematic view of a second mounting bracket according to a preferred embodiment of the present invention.
The reference numbers illustrate:
101. the first yielding hole 102 and the second yielding hole
12. Bottom shell
21. Main board
211. Intel C3558 processor chip 212 and heat dissipation shell
22. Adapter card 23 and expansion module
30. First heat radiation module
31. First heat conduction seat 32 and first supporting block
33. First cooling pipe 331 and first accommodating groove
34. First heat dissipation fin
40. Second heat radiation module
41. The second heat conducting seat
411. Transverse heat-conducting portion 412 and longitudinal heat-conducting portion
42. Second supporting block 43 and second heat dissipating fins
44. Second cooling pipe 45 and second accommodating tank
51. First and second heat insulating blocks 52 and 52
60. First mounting bracket
61. A first longitudinal part 611, a convex column
62. First front vertical part 621 and first front mounting part
63. First rear vertical part 631, first rear mounting part
70. Second mounting bracket
71. Second longitudinal portion
711. A first stopper 712 and a second stopper
72. Second front vertical part
721. Second front mounting part 722, first side mounting part
73. Second rear vertical part
731. Second rear mounting part 732 and second side mounting part
80. Third mounting bracket 81, third longitudinal part
811. Third stop part
82. Third front vertical part 83 and third rear vertical part
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description.
As shown in fig. 1 and fig. 2, a heat dissipation chassis based on an Intel platform includes a chassis housing, and a motherboard 21, an adapter card 22, and an expansion module 23 installed in the chassis housing;
the main board 21 comprises an Intel C3558 processor chip 211, the Intel C3558 processor chip 211 is connected with the expansion module 23 through the adapter card 22, and the main board 21 and the expansion module 23 are arranged side by side from left to right;
a first heat dissipation module 30 for dissipating heat of the Intel C3558 processor chip 211 is disposed on the Intel C3558 processor chip 211, the first heat dissipation module 30 has a plurality of first heat dissipation fins 34, a first avoiding hole 101 is disposed on the right side of the chassis housing, the plurality of first heat dissipation fins 34 are disposed corresponding to the first avoiding hole 101 and exposed out of the first avoiding hole 101, and the first heat dissipation module 30 is detachably connected to the inner bottom wall of the chassis housing through a first heat insulation block 51; preferably, the first adiabatic block 51 is detachably coupled to the inner bottom wall of the cabinet housing and the below-described first support block 32 of the first heat dissipation module 30, respectively, by screws.
The first heat dissipation module 30 includes a first cooling pipe 33 and a first heat conduction seat 31 extending along the left-right direction; the left bottom end of the first heat conducting seat 31 is tightly attached to the Intel C3558 processor chip 211, preferably, the periphery of the Intel C3558 processor chip 211 is covered with a heat dissipation shell 212, and the left bottom end of the first heat conducting seat 31 is tightly attached to the upper end of the heat dissipation shell 212. The right side of the bottom end of the first heat conducting seat 31 is detachably connected to the inner bottom wall of the chassis shell through a first mounting bracket 60;
in this embodiment, the first mounting bracket 60 includes a first longitudinal portion 61 extending in the front-rear direction, and a first front vertical portion 62 and a first rear vertical portion 63 integrally connected to the front and rear ends of the first longitudinal portion 61;
a convex column 611 is arranged on the upper end surface of the first longitudinal part 61, and the first heat conducting seat 31 is connected with the first longitudinal part 61 through the convex column 611; the lower end of the first front vertical part 62 is integrally bent and extends forwards to form a first front mounting part 621;
the lower extreme of first back vertical portion 63 is integrative to be buckled and is extended backward to be formed with first back installation department 631, the interior diapire of chassis casing is connected respectively with first preceding installation department 621 to first back installation department 631.
The right end face of the first heat conducting seat 31 is detachably connected with a first supporting block 32, and the first supporting block 32 is detachably connected to the inner bottom wall of the case shell through a first heat insulation block 51;
the plurality of first heat dissipation fins 34 are integrally formed on the right end surface of the first support block 32, the upper end surface of the first heat conduction seat 31 and the left end surface of the first support block 32 are respectively provided with a first accommodating groove 331 which is connected with each other and is used for accommodating the first cooling pipe 33, and the first cooling pipe 33 is embedded in the first accommodating groove 331.
The first support block 32 is also removably attached to the chassis housing by a second mounting bracket 70. In the present embodiment, the second mounting bracket 70 has a second longitudinal portion 71, and a second front vertical portion 72 and a second rear vertical portion 73 integrally connected to the left and right sides of the second longitudinal portion 71;
the second longitudinal portion 71, the second front vertical portion 72 and the second rear vertical portion 73 form a first installation space for placing the first supporting block 32, and the first supporting block 32 and the plurality of first heat dissipation fins 34 are located in the first installation space; the left and right sides of the second longitudinal portion 71 are integrally bent and extend downward to form a first stopping portion 711 and a second stopping portion 712, the left side of the first supporting block 32 is limited by the first stopping portion 711, and the plurality of first heat dissipation fins 34 are all located on the left side of the first stopping portion 711.
Preferably, the lower end of the second front vertical portion 72 is integrally bent and extends forward to form a second front mounting portion 721, the lower end of the second rear vertical portion 73 is integrally bent and extends backward to form a second rear mounting portion 731, and the second rear mounting portion 731 and the second front mounting portion 721 are respectively connected to the inner bottom wall of the chassis housing.
The right end of the second front mounting part 721 is integrally bent and extends forwards to form a first side mounting part 722, the right end of the second rear mounting part 731 is integrally bent and extends backwards to form a second side mounting part 732, and the first side mounting part 722 and the second side mounting part 732 are respectively connected with the inner right side wall of the chassis shell.
The second heat dissipation module 40 used for dissipating heat of the expansion module 23 is arranged aiming at the expansion module 23, the second heat dissipation module 40 is provided with a plurality of second heat dissipation fins 43, the left side of the chassis shell is provided with a second yielding hole 102, the plurality of second heat dissipation fins 43 are arranged corresponding to the second yielding hole 102 and exposed out of the second yielding hole 102, and the second heat dissipation module 40 is detachably connected to the inner bottom wall of the chassis shell through a second heat insulation block 52.
The second heat dissipation module 40 includes a second heat conduction seat 41 and a second cooling pipe 44.
In this embodiment, the second heat conduction seat 41 has an L-shaped structure, and the second heat conduction seat 41 has a transverse heat conduction portion 411 and a longitudinal heat conduction portion 412 integrally connected to a right end of the transverse heat conduction portion 411;
the bottom end of the right side of the transverse heat conducting part 411 and the bottom end of the longitudinal heat conducting part 412 are both tightly attached to the expansion module 23;
the left end face of the transverse heat conducting part 411 is detachably connected with a second supporting block 42, and the second supporting block 42 is detachably connected to the inner bottom wall of the case shell through a second heat insulation block 52.
The plurality of second heat dissipation fins 43 are integrally formed from the left end surface of the second support block 42, the upper end surface of the second heat conduction seat 41 and the left end surface of the second support block 42 are respectively provided with a second accommodating groove 45 which are connected with each other and used for accommodating a second cooling pipe 44, and the second cooling pipe 44 is embedded in the second accommodating groove 45.
The second support block 42 is also removably attached to the housing shell by a third mounting bracket 80. In the present embodiment, the third mounting bracket 80 has a third longitudinal portion 81, and a third front vertical portion 82 and a third rear vertical portion 83 integrally connected to the left and right sides of the third longitudinal portion 81, respectively;
the third longitudinal portion 81, the third front vertical portion 82 and the third rear vertical portion 83 form a second installation space for placing the second supporting block 42, and the second supporting block 42 and the plurality of second heat dissipation fins 43 are located in the second installation space; the left and right sides of the third longitudinal portion 81 are integrally bent and extend downward to form a third blocking portion 811 and a fourth blocking portion, the right side of the second supporting block 42 is limited by the third blocking portion 811, and the plurality of second heat dissipation fins 43 are all located at the left of the fourth blocking portion.
The chassis housing includes an upper cover and a bottom case 12, the upper cover being detachably connected to the bottom case 12.
The design key points of the utility model lie in that the cooperation of the first heat insulation block and the second heat insulation block ensures that the heat on the Intel C3558 processor chip and the expansion module can be totally concentrated and radiated by the corresponding radiating module without being dispersed to the case shell, thereby being beneficial to improving the radiating effect, realizing the fan-free concentrated radiating mode and ensuring normal radiating without a fan;
through the cooperation of a plurality of installing supports, ensure first heat dissipation module and heat dissipation module stability and reliability at the heat dissipation in-process.
Claims (10)
1. The utility model provides a heat dissipation type machine case based on Intel platform which characterized in that: the system comprises an organic case shell, a mainboard, a switching card and an expansion module, wherein the mainboard, the switching card and the expansion module are arranged in the case shell;
the mainboard comprises an Intel C3558 processor chip, the Intel C3558 processor chip is connected with the expansion module through the adapter card, and the mainboard and the expansion module are arranged side by side from left to right;
the first heat dissipation module is used for dissipating heat of the Intel C3558 processor chip and is provided with a plurality of first heat dissipation fins, a first abdicating hole is formed in the right side of the case shell, the first heat dissipation fins are arranged corresponding to the first abdicating hole and exposed out of the first abdicating hole, and the first heat dissipation module is detachably connected to the inner bottom wall of the case shell through a first heat insulation block;
the second heat dissipation module is used for dissipating heat of the expansion module and is arranged aiming at the expansion module, the second heat dissipation module is provided with a plurality of second heat dissipation fins, a second yielding hole is formed in the left side of the case shell, the second heat dissipation fins are arranged corresponding to the second yielding hole and exposed out of the second yielding hole, and the second heat dissipation module is detachably connected to the inner bottom wall of the case shell through a second heat insulation block.
2. The Intel platform based heat dissipation type chassis of claim 1, wherein: the first heat dissipation module comprises a first cooling pipe and a first heat conducting seat extending along the left-right direction;
the bottom end of the left side of the first heat-conducting seat is tightly attached to an Intel C3558 processor chip, and the right side of the bottom end of the first heat-conducting seat is detachably connected to the inner bottom wall of the case shell through a first mounting bracket;
the right end face of the first heat conducting seat is detachably connected with a first supporting block, and the first supporting block is detachably connected to the inner bottom wall of the case shell through a first heat insulation block;
a plurality of first heat radiation fins are arranged on the right end face of the first support block in an integrated forming mode, first accommodating grooves which are connected with each other and used for accommodating first cooling pipes are formed in the upper end face of the first heat conduction seat and the left end face of the first support block, and the first cooling pipes are embedded in the first accommodating grooves.
3. The Intel platform-based heat-dissipating chassis of claim 2, wherein: the first mounting bracket comprises a first longitudinal part extending along the front-back direction, and a first front vertical part and a first back vertical part which are respectively and integrally connected to the front end and the back end of the first longitudinal part;
the upper end surface of the first longitudinal part is provided with a convex column, and the first heat conducting seat is connected with the first longitudinal part through the convex column; the lower end of the first front vertical part is integrally bent and extends forwards to form a first front mounting part;
the lower extreme an organic whole of first back vertical portion is buckled and is extended backward and be formed with first back installation department, the interior diapire of chassis casing is connected respectively with first preceding installation department to first back installation department.
4. The Intel platform-based heat-dissipating chassis of claim 2, wherein: the first supporting block is also detachably connected to the case shell through a second mounting bracket.
5. The Intel platform-based heat-dissipating chassis of claim 4, wherein: the second mounting bracket is provided with a second longitudinal part, a second front vertical part and a second rear vertical part which are respectively connected to the left side and the right side of the second longitudinal part in an integrated manner;
the second longitudinal part, the second front vertical part and the second rear vertical part form a first mounting space for placing the first supporting block, and the first supporting block and the plurality of first radiating fins are all positioned in the first mounting space; the left side and the right side of the second longitudinal part are integrally bent and extend downwards to form a first stopping part and a second stopping part respectively, the left side of the first supporting block is limited by the first stopping part, and the plurality of first radiating fins are all positioned at the left side of the first stopping part.
6. The Intel platform-based heat-dissipation chassis of claim 5, wherein: the integrative bending of lower extreme of vertical portion extends forward before the second and is formed with installation department before the second, the integrative bending of lower extreme of vertical portion extends backward behind the second and is formed with installation department behind the second, installation department and installation department are connected the interior diapire of quick-witted case casing respectively before the second.
7. The Intel platform-based heat-dissipation chassis of claim 6, wherein: the right-hand member of installation department is integrative to be buckled and extends forward before the second and is formed with first side installation department, the right-hand member of installation department is integrative to be buckled and extends backward after the second and is formed with second side installation department, first side installation department and second side installation department are connected the interior right side wall of chassis casing respectively.
8. The Intel platform based heat dissipation type chassis of claim 1, wherein: the second heat dissipation module comprises a second heat conduction seat and a second cooling pipe;
the second heat conducting seat is of an L-shaped structure and is provided with a transverse heat conducting part and a longitudinal heat conducting part which is integrally connected to the right end of the transverse heat conducting part;
the bottom end of the right side of the transverse heat conducting part and the bottom end of the longitudinal heat conducting part are tightly attached to the expansion module;
the left end face of the transverse heat conducting part is detachably connected with a second supporting block, and the second supporting block is detachably connected to the inner bottom wall of the case shell through a second heat insulation block;
the plurality of second heat dissipation fins are integrally formed from the left end face of the second supporting block, second accommodating grooves which are connected with each other and used for accommodating second cooling pipes are formed in the upper end face of the second heat conduction seat and the left end face of the second supporting block, and the second cooling pipes are embedded in the second accommodating grooves.
9. The Intel platform based heat dissipation type chassis of claim 8, wherein: the second supporting block is detachably connected to the case shell through a third mounting bracket.
10. The Intel platform-based heat-dissipating chassis of claim 9, wherein: the third mounting bracket is provided with a third longitudinal part, a third front vertical part and a third rear vertical part which are respectively connected to the left side and the right side of the third longitudinal part in an integrated manner;
the third longitudinal part, the third front vertical part and the third rear vertical part form a second mounting space for placing a second supporting block, and the second supporting block and the plurality of second radiating fins are located in the second mounting space; the left side and the right side of the third longitudinal part are integrally bent and extend downwards to form a third stopping part and a fourth stopping part respectively, the right side of the second supporting block is limited by the third stopping part, and the plurality of second radiating fins are located at the left of the fourth stopping part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221983342.6U CN218004052U (en) | 2022-07-29 | 2022-07-29 | Heat dissipation type machine case based on Intel platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221983342.6U CN218004052U (en) | 2022-07-29 | 2022-07-29 | Heat dissipation type machine case based on Intel platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218004052U true CN218004052U (en) | 2022-12-09 |
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ID=84318175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221983342.6U Active CN218004052U (en) | 2022-07-29 | 2022-07-29 | Heat dissipation type machine case based on Intel platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218004052U (en) |
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2022
- 2022-07-29 CN CN202221983342.6U patent/CN218004052U/en active Active
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