CN100482059C - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN100482059C CN100482059C CNB2005101211975A CN200510121197A CN100482059C CN 100482059 C CN100482059 C CN 100482059C CN B2005101211975 A CNB2005101211975 A CN B2005101211975A CN 200510121197 A CN200510121197 A CN 200510121197A CN 100482059 C CN100482059 C CN 100482059C
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- China
- Prior art keywords
- radiator
- mentioned
- heat abstractor
- fan
- fin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling device for helping cooling electronic components, includes a radiator, fans located on one side of radiator, and fans fixtures located between fans and radiator. The fan fixture includes a panel for fix the fan and a cover for shielding the end of radiator. A part of fan extends from the cover and radiator, so that some air of the fan passes through the radiator and the outside the space to cool the electronic components.
Description
[technical field]
The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that is used for electronic component especially.
[background technology]
As everyone knows, electronic component such as central processing unit produces a large amount of heat in running.For preventing that thereby this heat-generating electronic elements from causing its temperature rising to cause its fluctuation of service, this electronic component need install a heat abstractor usually additional with auxiliary its heat radiation because of the accumulation of heat.
Usually, a heat abstractor comprises a conductive sole plate and is located at some radiating fins on this base plate.During use, a bottom surface of this base plate is close to heat-generating electronic elements and is absorbed heat, thereby and this heat transferred to fin is distributed to surrounding space.
But along with the development of computer industry, the function of electronic component is become stronger day by day, thereby produces increasing heat.Above-mentioned simple heat abstractor by heat conducting and radiating can not distribute the heat that electronic component produces timely, thereby increasing heat accumulation influences the runnability of electronic component on electronic component.For improving the heat dispersion of this heat abstractor, usually a fan is installed on this fin, thereby the strong convection air is provided and quickens heat radiation to this fin.Yet, the development of computer industry, the integrated level and the function of electronic component constantly promote, cause more heat to produce, and more and more electronic component need heat radiation, in addition, the miniaturization of computer volume trend all needs this heat abstractor further to optimize, to satisfy radiating requirements.
[summary of the invention]
In view of this, be necessary to provide a kind of heat dispersion good and be the heat abstractor of a plurality of electronic element radiatings.
A kind of heat abstractor, be used for the auxiliary electron element radiating, it comprises a radiator, is located at the fan of this radiator one side and the fan fixer between this radiator and fan, this fan fixer comprises the panel of fixing this fan and the cover body of this radiator one end of shade, the part of this fan stretches out this cover body and radiator, thereby the part air communication of this fan is crossed this radiator, and the part air communication is crossed the space beyond the radiator.
Compared with prior art, the part of fan stretches out cover body and radiator in the heat abstractor, thereby the part air communication that this fan produces is crossed this radiator, cools off this electronic component, and the part air communication is crossed the space beyond the radiator, the cooling other electron component.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the stereogram of fan fixer among Fig. 1.
Fig. 3 is the part assembly drawing of heat abstractor of the present invention.
Fig. 4 is the three-dimensional assembly diagram of heat abstractor of the present invention.
Fig. 5 is the inversion figure of Fig. 4.
[embodiment]
See also Fig. 1, one heat abstractor is used for being located at electronic component such as central processing unit (figure does not show) heat radiation on the circuit board (figure does not show), and this heat abstractor comprises a base 10, first fins group 30, second fins group 50, a fan fixer 70, a fan 80 and a lid 90.
See also Fig. 1 and Fig. 5, this base 10 comprises that one first plate body 11 and is embedded at second plate body 12 of these first plate body, 11 lower surfaces.The upper surface correspondence of the lower surface of this first plate body 11, second plate body 12 is provided with two parallel grooves (not indicating), thereby forms two column passages (not indicating).The corresponding above-mentioned passage of one ora terminalis of this first plate body 11 is provided with two otch 111.One lateral margin of first plate body 11 is provided with two screws 113 that are used in conjunction with fan fixer 70.Two " L " shape heat pipe 20 respectively has first heat transfer segment 21 that is bonded in the above-mentioned passage and reaches second heat transfer segment 22 that upwards stretches out first plate body 11 from the otch 111 of above-mentioned first plate body 11.
See also Fig. 3, first fins group 30 is bonded to the upper surface of first plate body 11 of base 10 by its lower hem 313,323.Second fins group 50 is bonded on second heat transfer segment 22 of heat pipe 20 by through hole 517.
See also Fig. 1 and Fig. 2, fan fixer 70 places a side of first and second fins group 30,50.This fixture 70 comprises that a cover body 710 and with shade first fins group 30 front ends is formed on this cover body 710 panel 730 with fan attachment 80.This cover body 710 comprises two relative side plates 711 and connects the top board 713 of this two side plate 711.The ora terminalis of this top board 713 bending downwards extends a location-plate 714.The mutual panel 730 that connects near extending of one corresponding part of this two side plate 711, thus this cover body 710 forms by the passage (indicate) (ginseng back described) of panel 730 to the expansion of first and second fins group 30,50 extensions.This panel 730 roughly is square, and its middle part is provided with an opening 731, and this panel 730 and this opening 731 further extend upward and exceed top board 713.Four jiaos of fixing holes 733 that are provided with fan attachment 80 of this panel 730.This two side plate 711 stretches out two stators 715 in panel 730 both sides, and the screw 113 of each stator 715 corresponding base 10 is provided with a fixing hole 717.
See also Fig. 1, fan 80 comprises that a framework 81 and is located at the impeller 83 in this framework 81.The fixing hole 733 of the panel 730 of four jiaos of corresponding fixtures 70 of this framework 81 is provided with screw.
See also Fig. 3 and Fig. 4, the front end of first and second fins group 30,50 of cover body 710 shades of fan fixer 70, its location-plate 714 inlay cards in the draw-in groove 33 of first fins group 30, its stator 715 by screw to base 10.Fan 80 by screw on the panel 730 of fixture 70, thereby the top of this fan 80 stretches out first and second fins group 30,50.Also insert and put an elastomeric pad 85 between this fan 80 and the panel 730.Lid 90 hides on the remainder of first and second fins group 30,50, and the top of first fins group 30 is exposed to external environment by awkward-sounding 913.First and second sidewall 93,95 of lid 90 places the outside of second, one fins group 50,30 respectively, the flow deflector 931 of the first side wall 93 is away from these second fins group, 50 oblique outer projections, thereby this lid 90 forms a bigger air inlet in the rear end of first and second fins group 30,50, and at least one system fan (figure does not show) is to should the air inlet setting.
During use, the central processing unit heat absorption is close in the bottom surface of heat abstractor base 10 second plate bodys 12, again by heat pipe 20 and first plate body 11 with heat transferred to first and second fins group 30,50, simultaneously, system fan provides low temperature strong convection air-flow to this heat abstractor, and fan 80 work are drawn to surrounding environment with high temperature air in first and second fins group 30,50.
Compared with prior art, the part of the fan 80 of this heat abstractor further stretches out first and second fins group 30,50, then the strong convection air-flow of its generation is partly by this first and second fins group 30,50, the cooling central processing unit, part is by the superjacent air space of this first and second fins group 30,50, thereby the cooling other electron component is as hard disk etc.
The fan 80 of this heat abstractor, fan fixer 70 and lid 90 match, guiding low temperature carries out heat exchange to first and second fins group 30,50 of air flow direction by force, and high temperature gas flow is derived first and second fins group 30,50, the heat dispersion of this heat abstractor is promoted.
This heat abstractor is provided with 30,50 liang of groups of first and second fins group fins group, and the area of dissipation of this heat abstractor is increased, and radiating effect promotes.
Insert and put elastomeric pad 85 between the panel 730 of fan 80 and fixture 70 in this heat abstractor, the vibrations that produce when reducing fan 80 work.
Claims (13)
1. heat abstractor, comprise a radiator, be located at the fan of this radiator one side and the fan fixer between this radiator and fan, it is characterized in that: this fan fixer comprises the panel of fixing this fan and the cover body of this radiator one end of shade, the part of this fan stretches out this cover body and radiator, thereby the part air communication of this fan is crossed this radiator, and the part air communication is crossed the space beyond the radiator.
2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned cover body comprises two side plates and connects the top board of this two side plate that this two side plate connects above-mentioned panel.
3. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned panel middle part is provided with an opening, and the size of this opening is corresponding with described fan, and this panel and this opening stretch out above-mentioned top board.
4. heat abstractor as claimed in claim 3 is characterized in that: above-mentioned two side plates are close mutually near above-mentioned faceplate part, thereby this cover body is formed with from the passage of above-mentioned panel to the expansion of radiator extension.
5. as claim 3 or 4 described heat abstractors, it is characterized in that: above-mentioned top board extends a location-plate to above-mentioned radiator, and this radiator is provided with draw-in groove that should location-plate.
6. heat abstractor as claimed in claim 4 is characterized in that: above-mentioned radiator comprises one group of first fin and lays respectively at one group of second fin of these first fin both sides that one end of first fin stretches out the respective end of second fin in cover body.
7. heat abstractor as claimed in claim 6 is characterized in that: above-mentioned radiator comprises a base, and above-mentioned first and second fin is parallel to be located on this base.
8. heat abstractor as claimed in claim 7 is characterized in that: above-mentioned radiator also comprises at least one heat pipe that is connected with this base, and piling up on this heat pipe has a fins group, and this fins group is positioned at a side of above-mentioned fin.
9. heat abstractor as claimed in claim 8 is characterized in that: an end of above-mentioned fins group is positioned at above-mentioned cover body.
10. as heat abstractor as described in each among claim 1-4, the 6-9, it is characterized in that: comprise that also one hides the lid on above-mentioned radiator, this lid comprises a roof and vertically extending two sidewalls that are positioned at these radiator both sides from these roof both sides.
11. heat abstractor as claimed in claim 10 is characterized in that: offer one awkward-sounding on the above-mentioned roof.
12. heat abstractor as claimed in claim 11 is characterized in that: the end of an above-mentioned wherein sidewall is away from the oblique outer flow deflector that extends of above-mentioned radiator.
13. as each described heat abstractor among claim 1-4, the 6-9, it is characterized in that: also be provided with a damping pad between said fans and the panel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101211975A CN100482059C (en) | 2005-12-23 | 2005-12-23 | Heat radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101211975A CN100482059C (en) | 2005-12-23 | 2005-12-23 | Heat radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1988783A CN1988783A (en) | 2007-06-27 |
CN100482059C true CN100482059C (en) | 2009-04-22 |
Family
ID=38185370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101211975A Expired - Fee Related CN100482059C (en) | 2005-12-23 | 2005-12-23 | Heat radiator |
Country Status (1)
Country | Link |
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CN (1) | CN100482059C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101355864B (en) * | 2007-07-27 | 2011-03-30 | 富准精密工业(深圳)有限公司 | Radiating device |
TWI495424B (en) * | 2010-10-21 | 2015-08-01 | Foxconn Tech Co Ltd | Heat dissipation device and electronic device having the same |
CN102458081B (en) * | 2010-10-22 | 2015-10-07 | 富瑞精密组件(昆山)有限公司 | Heat abstractor and use the electronic installation of this heat abstractor |
-
2005
- 2005-12-23 CN CNB2005101211975A patent/CN100482059C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN1988783A (en) | 2007-06-27 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20131223 |