CN100456205C

CN100456205C - Heat radiator

Info

Publication number: CN100456205C
Application number: CNB2005101211960A
Authority: CN
Inventors: 陈俊吉; 翁世勋; 余光; 周大远; 刘金标
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-12-23
Filing date: 2005-12-23
Publication date: 2009-01-28
Anticipated expiration: 2025-12-23
Also published as: CN1987730A

Abstract

A cooling device, installed into the computer case, contains a first radiator and a second radiator. The first radiator contacts with the electrical element, the second radiator is near the air vent of computer system. There is fan on each cooling device and air conductor cap between the two radiators, so it can form the air pathway between the two radiators. The two radiators, air cap with the outside of computer case form the through pathway, so the energy produced by the electrical element can be drain outside of the case by the fan of the system, and the efficient of heat exchange between the inside and outside of the case is improved.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that has wind scooper especially.

[background technology]

Along with developing rapidly of electronic industry, increase substantially as the arithmetic speed of electronic component in the computing machine, the heat of its generation also increases severely thereupon, and how the heat with electronic component distributes, and to guarantee its normal operation, is the essential problem that solves of dealer always.As everyone knows, the central processing unit that is installed on the motherboard is the core of computer system, and when computer moved, central processing unit produced heat.Too much heat can cause central processing unit normally to move.For effectively distributing the heat that central processing unit produces in operational process, on the central processing unit of circuit board, install a heating radiator additional usually so that the heat of its generation is distributed, a cooling fan places on the heating radiator cooling effectiveness with OverDrive CPU; One system fan is installed on air vent on the back side panel of computer casing and sentences just the thermal current in the housing is discharged.In the heat distribution and whole computer casing that central processing unit produces, discharge from air vent by system fan, yet because heat disperses, system fan can not in time be discharged housing with heat, the inside and outside heat transfer rate of housing is lower, temperature can not in time descend in the housing, this shows that the effect of system fan fails to be utilized effectively.

[summary of the invention]

In view of this, be necessary to provide a kind of and heat in the computer casing effectively can be dispersed into the outer heat abstractor of housing, system fan is utilized effectively.

A kind of heat abstractor, in order to be installed in the computer casing, comprise one first heating radiator and one second heating radiator, this first heating radiator contacts with electronic component, second heating radiator is near the ventilating opening place of computer system, one fan respectively is installed on this second radiator, and a wind scooper connects and is located between first and second heating radiator, thereby forms gas channel between second radiator.

The passage of first, second heating radiator of heat abstractor of the present invention, wind scooper formation one and computer casing external communications, thereby make heat that electronic component produces via this passage outside system fan is expelled to computer casing, improve in the housing and the outer heat transfer rate of housing.

The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.

[description of drawings]

Fig. 1 is the assembly drawing of heat abstractor of the present invention, and wherein this heat abstractor places a computer casing.

Fig. 2 is the part three-dimensional exploded view of Fig. 1.

[embodiment]

See also Fig. 1, disclose a heat abstractor of the embodiment of the invention, this heat abstractor places on the circuit board 10 in the computer casing 14 and contacts with central processing unit 12 (seeing also Fig. 2) on it with to its heat radiation.Place on this circuit board 10.This heat abstractor comprises one first heating radiator 30, one places the cooling fan 40 of first heating radiator, 30 1 sides, one second heating radiator 50, one connects the system fan 60 of this second heating radiator 50 and computer casing 14 side plates 140, one wind scooper 70 is connected between the cooling fan 40 and second heating radiator 50 and three heat pipes that are set up in parallel 80, this first heating radiator 30 comprises that one places the heat-conducting plate 20 on the central processing unit 12, and this heat pipe 80 places on the heat-conducting plate 20 and connects first and

second heating radiator

30,50.

Please consult Fig. 2 simultaneously, heat-conducting plate 20 is made of such as copper by thermal conductivity good metal material, is used to absorb the heat that central processing unit 12 produces.These heat-conducting plate 20 tops are provided with three grooves 22 and are used to accommodate corresponding heat pipe 80.Each heat pipe 80 comprises a horizontal endothermic section 82 and a pair of

vertical heat unit

84,84 ', and 82 two free ends bending extends upward this heat unit 84,84 ' from the endothermic section.Heat-conducting plate 20 tops are provided with a top board 90, these top board 90 shapes and size are similar to heat-conducting plate 20, this top board 90 is provided with three grooves 92 with heat-conducting plate 20 opposed bottom surface, this groove 92 welds the horizontal endothermic sections 82 of accommodating heat pipe 80 jointly with the groove 22 of heat-conducting plate 20, a pair of buckle ear 94 is located at top board 90 tops, screw 96 passes this buckle ear 94 and top board 90 and then is screwed with heat-conducting plate 20, thereby this buckle ear 94 is fixed on the heat-conducting plate 20.Fastener (not shown) thus passing this buckle ear 94 is fixed in heat abstractor on the circuit board 10.

First heating radiator 30 comprises some radiating fins 32 of being separated by and being provided with, and is formed with passage between the adjacent radiating fin 32, and each radiating fin 32 is provided with three through holes 320, and the heat unit 84 of heat pipe 80 is passed this through hole 320.

Cooling fan 40 is installed on a side of first heating radiator 30 by a pair of fastener 34, and this cooling fan 40 is used for first heating radiator 30 is dispelled the heat.The setting that roughly is square of this cooling fan 40, it comprises that a fan Fixture 42 and is contained in the impeller 44 in this fan Fixture 42.Thermal current in first heating radiator, 30 radiating fins, 32 passages can be sucked during these cooling fan 40 operations, this first heating radiator 30 is dispelled the heat.

The shape structure of this second heating radiator 50 is roughly the same with first heating radiator 30, and this second heating radiator 50 comprises some radiating fins 52, and each radiating fin 52 is provided with three through holes 520, and the heat release section 84 ' of heat pipe 80 is arranged in this through hole 520.

Wind scooper 70 is connected between the cooling fan 40 and second heating radiator 50, this wind scooper 70 is provided with one towards the air inlet 72 of cooling fan 40 and towards the air outlet 74 of second heating radiator 50, the sectional area at these air outlet 74 places is big than air inlet 72 places, the air-flow that cooling fan 40 produces flows into this wind scooper 70 from the air inlet 72 of this wind scooper 70, and the air outlet 74 via this wind scooper 70 flows into second heating radiator 50 again.This wind scooper 70 comprises a wall portion 702 and encloses the passage 704 that forms by this

wall portion

702,74 directions increase the internal diameter of this passage 704 gradually along air inlet 72 to air outlet, the air inlet 72 of this wind scooper 70 and air outlet 74 places stretch out respectively and are provided with a lateral margin 720,740, wherein lateral margin 720 setting that is square, it fits in fan Fixture 42 1 sides of cooling fan 40.

One mounting bracket 76 is installed on fan Fixture 42 and wind scooper 70 lateral margins 720, is used for wind scooper 70 is fixed in radiator fan 40.The setting that is square of these mounting bracket 76 integral body, its quadra 78 by four hollows encloses and forms, each quadra 78 comprises a pair of relative minor face, the hollow block 77 that a pair of relative long limit and four is triangular shape, each block 77 connects the minor face of two adjacent quadras 78, and this block 77 is provided with four jiaos that lateral margin 720 that a receiving space 770 is used to accommodate and clamp wind scooper 70 and fan Fixture 42 combine.Second heating radiator, 50 radiating fins 52 are contained in the passage 704 at wind scooper 70 air outlets 74 places towards the lateral edges of wind scooper 70 air outlets 74, and wherein the lateral margin 740 of wind scooper 70 is used to tighten the lateral margin of radiating fin 52.

The shape structure of system fan 60 is roughly the same with cooling fan 40, this system fan 60 places on the side plate 140 of computer casing 14 and with external environment condition and is communicated with, this system fan 60 is installed on a side of second heating radiator 50 by a pair of fastener 54, the air-flow that is used for cooling fan 40 is produced is discharged outside the computer casing 14 via wind scooper 70, so, first heating radiator 30, cooling fan 40, wind scooper 70, second heating radiator 50 and system fan are joined together to form the passage of a sealing.

When central processing unit 12 was started working, the heat of its generation was passed to first and

second heating radiator

30,50 by heat pipe 80; Cooling fan 40 sucks the thermal current in radiating fin 32 passages, flows to second heating radiator 50 via wind scooper 70 and by system fan 60 thermal current is expelled to outside the computer casing 14.So, the heat that central processing unit 12 is produced is expelled to rapidly outside the computer casing 14, thereby the temperature in the whole computer casing 14 is reduced.

Claims

1. heat abstractor, in order to be installed in the computer casing, comprise one first heating radiator and one second heating radiator, this first heating radiator contacts with electronic component, second heating radiator is near the ventilating opening place of computer system, it is characterized in that: a fan respectively is installed on this second radiator, and a wind scooper connects and is located between first and second heating radiator, thereby forms the gas channel of sealing between second radiator.

2. heat abstractor as claimed in claim 1, it is characterized in that: described heat abstractor further comprises a heat pipe, described first heating radiator comprises a heat-conducting plate in order to contact with electronic component, and this heat pipe is installed on the described heat-conducting plate and connects first and second heating radiator.

3. heat abstractor as claimed in claim 2, it is characterized in that: described first heating radiator is provided with some first radiating fins, described second heating radiator is provided with some second radiating fins, described heat pipe comprises that one places endothermic section and two heat units on the described heat-conducting plate, and described two heat units are respectively through described first and second radiating fin.

4. heat abstractor as claimed in claim 2, it is characterized in that: described fan is a cooling fan and system fan, described first heating radiator, one side is installed a cooling fan, described second heating radiator, one side is installed a system fan, this system fan is relative with the computer system ventilating opening, described wind scooper is folded between this cooling fan and second heating radiator, and the air-flow that cooling fan produces is expelled to outside the computer casing by system fan via the wind scooper and second heating radiator.

5. heat abstractor as claimed in claim 4 is characterized in that: described wind scooper comprises a wall portion and encloses the passage that forms by this wall portion.

6. heat abstractor as claimed in claim 4 is characterized in that: described wind scooper is provided with an air inlet and the air outlet towards second heating radiator towards cooling fan, and wherein the sectional area of air outlet is big than the sectional area of air inlet.

7. heat abstractor as claimed in claim 6 is characterized in that: the internal diameter of the passage of described wind scooper increases to the air outlet direction gradually along air inlet.

8. heat abstractor as claimed in claim 7, it is characterized in that: the air inlet of described wind scooper and air outlet place stretch out respectively and are provided with a lateral margin, the lateral margin of described air inlet cooperates with described cooling fan, and the lateral margin of described air outlet cooperates with second heating radiator.

9. heat abstractor as claimed in claim 8 is characterized in that: described wind scooper is installed on the described cooling fan by a mounting bracket.

10. heat abstractor as claimed in claim 9, it is characterized in that: described mounting bracket is enclosed by four hollow frameworks and forms, each framework is provided with the long relatively limit of two relative minor faces and two, one hollow block connects the minor face of two adjacent frameworks, and this hollow block is fastened on the angle that wind scooper air inlet lateral margin cooperates with fan.