JPWO2008004280A1 - Radiation unit, radiator and electronic device - Google Patents

Abstract

Heat is transmitted from the first and second heat conducting members (19) to the first and second radiating fins (18). The first and second radiating fins (18) radiate heat to the atmosphere with a large surface area. The second radiating fin member (17) faces the tip of the second radiating fin (18) at a predetermined interval with the first radiating fin member (17). As a result, hot air concentrates on the second radiating fin member (17). The temperature difference between the second radiating fin member (17) and the periphery of the second radiating fin member (17) increases. A so-called chimney effect is realized. Heat is efficiently released into the atmosphere from the radiation fins (18). The efficiency of heat dissipation is higher than ever. In order to realize the same effect as the conventional one, it is sufficient that the surface area of the heat dissipating fin (18) is set smaller than before. The radiating fin (18), that is, the radiating unit (15) is reduced in size.

Description

  The present invention relates to a heat dissipation unit incorporated in an electronic apparatus such as a display device.

For example, a heat sink is incorporated in the housing of the display device. The heat sink includes a heat receiving plate received by the electronic component and a plurality of heat radiation fins rising from the heat receiving plate. The heat receiving plate transfers heat from the electronic component to the radiating fin. Heat is released from the radiating fins into the atmosphere. Based on the temperature difference between the periphery of the radiating fin and the outside of the casing, natural convection is caused in the radiating fin from the inlet of the casing into the casing. Based on natural convection, heat is released to the outside from the exhaust port of the housing.
Japanese Unexamined Patent Publication No. 2002-343912 Japanese Unexamined Patent Publication No. 2000-283670 Japanese Unexamined Patent Publication No. 10-163388

  In general, the heat dissipation rate per unit area is very small in the heat dissipation fin. Therefore, in order to improve the heat dissipation efficiency of the heat dissipation fin, the heat dissipation fin requires a large surface area. To secure a large surface area, the radiating fin is enlarged. The display device becomes large. In addition, as the size of the radiating fin increases, the thermal resistance of the radiating fin increases. The efficiency of heat dissipation of the heat sink is getting worse.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a heat radiating unit, a heat radiating device, and an electronic apparatus that can maintain the efficiency of heat radiating while being downsized more than ever.

  In order to achieve the above object, according to the present invention, a first heat dissipating fin member including a plurality of first heat dissipating fins extending in parallel to each other and connected to each other by a first heat conducting member is parallel to each other. A second heat dissipating fin member that includes a plurality of second heat dissipating fins that are connected to each other by a second heat conducting member and that faces the first heat dissipating fin member at a predetermined interval. A heat dissipating unit is provided.

  In the first radiating fin member, the first radiating fins spread in parallel with each other. The first heat dissipating fins are connected to each other by a first heat conducting member. Similarly, in the second radiating fin member, the second radiating fins spread in parallel with each other. The second radiating fins are connected to each other by a second heat conducting member. Heat is transmitted from the first and second heat conducting members to the first and second radiating fins. The first and second radiating fins radiate heat to the atmosphere with a large surface area.

  The second radiating fin member faces the first radiating fin member at a predetermined interval with the tip of the second radiating fin. As a result, hot air concentrates on the second radiating fin member. The temperature difference between the radiator and the surroundings of the radiator increases. A so-called chimney effect is realized. Heat is efficiently released from the radiating fins into the atmosphere. The efficiency of heat dissipation is higher than ever. In order to realize the same effect as the conventional one, it is sufficient that the surface area of the heat radiating fin is set smaller than before. The radiating fin, that is, the radiating unit is reduced in size.

  In such a heat radiating unit, the tips of the second heat radiating fins may be arranged along a virtual inclined surface that intersects the vertical direction at a predetermined angle. At this time, the tip of the second radiating fin only needs to face the first radiating fin member at a constant interval. On the other hand, the tips of the second radiating fins may be arranged along a virtual vertical plane including the vertical direction. At this time, the tip of the second radiating fin only needs to face the first radiating fin member at a constant interval.

  Such a heat radiating unit includes a pair of first connecting members fixed to the first heat radiating fin member and extending in parallel to each other, and fixed to the second heat radiating fin member and extending in parallel to each other. You may further provide the 2nd connection member connected individually.

  Thus, the first and second radiating fin members are connected by the first and second connecting members. The connecting members can be easily removed. The heat dissipation unit can be easily disassembled. Therefore, the number of radiating fin members can be easily adjusted according to the required cooling performance. A heat dissipation unit can be established with a size according to the cooling performance.

  The heat dissipating unit includes a first refrigerant flow passage defined in the first heat conducting member, a first connection member defining a second refrigerant flow passage connected to one end of the first refrigerant flow passage, and a first connection member. A second connection member that defines a third refrigerant flow passage that extends in parallel with the first refrigerant flow passage and is connected to the other end of the first refrigerant flow passage, a fourth refrigerant flow passage that is divided within the second heat conducting member, A third coupling member received by the coupling member and defining a fifth refrigerant flow path connected to one end of the fourth refrigerant flow path and the second refrigerant flow path; and a second coupling member extending in parallel with the third coupling member And a fourth connecting member that divides the sixth refrigerant flow passage connected to the other end of the fourth refrigerant flow passage and the third refrigerant flow passage.

  A plurality of heat radiators may be used to realize the heat radiating unit as described above. The radiator includes a heat dissipating fin member including a plurality of heat dissipating fins extending in parallel to each other and connected to each other by a heat conducting member, and a pair of connecting members fixed to the heat dissipating fin member and extending in parallel to each other. You should prepare.

  The heat dissipation unit as described above may be incorporated in an electronic device. At this time, the electronic device includes a housing, a first heat dissipating fin member including a plurality of first heat dissipating fins housed in the housing and extending in parallel with each other and connected to each other by the first heat conducting member, A second heat dissipating fin that includes a plurality of second heat dissipating fins that extend in parallel with each other and are connected to each other by a second heat conducting member, and that faces the tip of the second heat dissipating fin at a predetermined interval to the first heat dissipating fin member What is necessary is just to provide a member. According to such an electronic device, the same operational effects as described above can be realized.

  Such an electronic device includes an electronic component that is disposed within the housing and transfers heat to the first and second heat conducting members, and is disposed between the electronic component and the first and second radiating fin members. And a heat insulating member disposed on the surface. The heat transfer from the first and second radiating fin members toward the electronic component is blocked by the function of the heat insulating member. The temperature rise of the electronic components is avoided.

1 is a perspective view schematically showing an external appearance of a specific example of an electronic apparatus according to the present invention, that is, a server computer apparatus. It is a fragmentary sectional view which shows the structure of a server computer apparatus roughly. It is a perspective view showing roughly the structure of the heat dissipation unit concerning one embodiment of the present invention. It is a figure which shows schematically the refrigerant | coolant flow path in a heat exchanger plate. It is a perspective view which shows roughly the structure of the thermal radiation unit which concerns on a comparative example. It is a perspective view which shows roughly the structure of the thermal radiation unit which concerns on the other specific example of this invention. It is a perspective view which shows roughly the structure of the thermal radiation unit which concerns on the other specific example of this invention. It is a side view which shows the structure of a thermal radiation unit roughly. It is a figure which shows roughly the structure of the thermal radiation unit which concerns on the other specific example of this invention. It is a figure which shows roughly the structure of the thermal radiation unit which concerns on the other specific example of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 schematically shows an external appearance of a specific example of an electronic apparatus according to the present invention, that is, a server computer apparatus 11. The server computer device 11 includes a housing 12 that houses a motherboard. The motherboard includes a CPU (Central Processing Unit) chip. The CPU chip performs arithmetic processing based on, for example, an OS (operating system) or application software. For example, a keyboard and a display device (not shown) are connected to the server computer device 11.

  An intake port 13 is defined in the side wall of the housing 12. Outside air is introduced into the housing 12 from the air inlet 13. An exhaust port 14 is defined in the top plate of the housing 12. The outside air thus introduced into the housing 12 is discharged from the exhaust port 14. The intake port 13 and the exhaust port 14 may be configured by a large number of through holes, for example.

  As shown in FIG. 2, a heat dissipation unit 15 is incorporated in the housing 12. The heat radiating unit 15 includes, for example, five heat radiators 16. The radiator 16 is arranged in the vertical direction along the side wall of the housing 12. The front surface of the heat radiating unit 15 faces the air inlet 13. An exhaust port 14 is defined above the heat radiating unit 15.

  Each radiator 16 includes a radiation fin member 17. The heat radiating fin member 17 includes a plurality of heat radiating fins 18 extending in parallel to each other, and a heat conductive member that connects the heat radiating fins 18, that is, a heat transfer plate 19. The heat radiating fins 18 rise from the surface of the heat transfer plate 19. The heat radiating fins 18 may be formed from, for example, a flat plate. An airflow passage is defined between the radiating fins 18. A refrigerant flow path is defined in the heat transfer plate 19. The radiating fins 18 and the heat transfer plate 19 are made of a metal material such as aluminum.

  Each radiator 16 includes connecting members, that is, connecting pipes 21 and 21 connected to both ends of the heat transfer plate 19. The connecting pipe 21 defines a refrigerant flow path. The connecting pipes 21 and 21 extend in parallel to each other. The connection pipe 21 connects the radiators 16 so as to be detachable. The lower end of the connection pipe 21 of the radiator 16 disposed on the upper side is individually connected to the upper end of the connection pipe 21 of the radiator 16 adjacent to the lower side thereof.

  The tips of the radiating fins 18 face the back surface of the heat transfer plate 19 of the radiator 16 adjacent to the upper side thereof at a predetermined interval. The tips of the radiating fins 18 are arranged along a virtual inclined surface 24 that intersects the vertical direction at a predetermined angle α. The distance between the tips of the radiating fins 18 and the back surface of the heat transfer plate 19 may be defined to be constant.

  A heat insulating member, that is, a heat insulating plate 25 is disposed in the housing 12. For example, the heat insulating plate 25 may extend in parallel to the side wall of the housing 12. The heat insulating plate 25 partitions the first and second spaces 26 and 27 in the housing 12. The heat dissipation unit 15 is arranged in the first space 26. A motherboard 28 is disposed in the second space 27. Air circulation between the first and second spaces 26 and 27 is blocked by the action of the heat insulating plate 25. Thus, the movement of heat from the heat radiation unit 15 toward the mother board 28 is blocked.

  The mother board 28 includes electronic components, that is, CPU chips 31 mounted on the surface of the printed circuit board 29. A heat receiving plate 32 is received on the CPU chip 31. A refrigerant flow passage is defined in the heat receiving plate 32. The heat radiating unit 15 is connected downstream of the heat receiving plate 32. A tank 33 is connected downstream of the heat dissipation unit 15. A pump 34 is connected downstream of the tank 33. A heat receiving plate 32 is connected downstream of the pump 34. In this way, a refrigerant circulation path that makes a round from the heat receiving plate 32 is established. The pump 34 circulates the refrigerant in the circulation path. The heat radiating unit 15, the heat receiving plate 32, the tank 33 and the pump 34 constitute a liquid cooling unit.

  As shown in FIG. 3, in each radiator 16, one connection pipe 21 is connected to one end of the heat transfer plate 19. Thus, the refrigerant flow passage of the connecting pipe 21 is connected to one end of the refrigerant flow passage of the heat transfer plate 19. Similarly, the other connecting pipe 21 is connected to the other end of the heat transfer plate 19. Thus, the refrigerant flow passage of the connection pipe 21 is connected to the other end of the refrigerant flow passage of the heat transfer plate 19.

  As shown in FIG. 4, a refrigerant flow passage 35 is defined in the heat transfer plate 19. The refrigerant flow path 35 includes a first straight path 35a, a first curved path 35b connected to the first straight path 35, a second straight path 35c connected to the first curved path 35b, and a second straight path 35c. The second curved path 35d connected to the second curved path 35d and the third straight path 35e connected to the second curved path 35d. The first to third straight paths 35a, 35c, and 35e may extend in parallel to each other. Thus, the refrigerant flow passage 35 extends while meandering in an S shape, for example, toward one end and the other end of the heat transfer plate 19.

  The first straight path 35 a is connected to the refrigerant flow path of one of the connection pipes 21. The third straight path 35e is connected to the refrigerant flow path of the other connecting pipe 21. In this way, the refrigerant only has to flow through the refrigerant flow passage of one of the connection pipes 21, the refrigerant flow passage 35 of the heat transfer plate 19, and the refrigerant flow passage of the other connection pipe 21 in order. The refrigerant flow passages are connected to each other between the one connection pipes 21 and between the other connection pipes 21.

  During operation of the CPU chip 31, the CPU chip 31 generates heat. The heat of the CPU chip 31 is transmitted to the heat receiving plate 32. The heat receiving plate 32 diffuses the heat of the CPU chip 31 over a wide range. The heat thus diffused is transferred to the refrigerant. The refrigerant flows to the heat radiating unit 15. The refrigerant flows from one connecting pipe 21 into the heat transfer plate 19. Heat is transferred from the refrigerant to the heat transfer plate 19. The heat of the refrigerant is transmitted from the heat transfer plate 19 to the heat radiating fins 18. The radiating fins 18 dissipate heat from the surface with a large surface area into the atmosphere. The temperature of the refrigerant decreases. The refrigerant flows from the other connecting pipe 21 to the tank 33.

  The temperature of the air rises between the radiating fins 18 and between the radiators 16. Hot air rises along the heat insulating plate 25 from behind the heat radiating unit 15. Hot air is discharged from the exhaust port 14 to the outside of the housing 12. At the same time, the air expands between the radiating fins 18 and between the radiators 16 based on the temperature rise of the air. The density of air decreases. Air is drawn between the radiating fins 18 and between the radiators 16. Natural convection is caused. Outside air is introduced from the intake port 13. Thus, the temperature rise of the LSI chip 31 is effectively suppressed.

  In the server computer apparatus 11 as described above, the tips of the radiating fins 17 face the back surface of the heat transfer plate 19 of the adjacent radiator 16 at a constant interval. As a result, hot air concentrates on each radiator 16. The temperature difference between the radiator 16 and the outside of the housing 12 increases. A so-called chimney effect is realized. Heat is efficiently released from the radiating fins 18 into the atmosphere. The efficiency of heat dissipation is higher than ever. In order to realize the same effect as the conventional one, it is sufficient that the surface area of the heat dissipating fins 18 is set smaller than before. The radiating fins 18, that is, the radiating units 15 are reduced in size. The space for disposing the heat radiation unit 15 in the housing 12 is greatly reduced.

  Moreover, the tips of the radiating fins 18 are arranged along a virtual inclined surface 24 that intersects the vertical direction at a predetermined angle α. Based on the chimney effect, air flows from the front of the heat radiating unit 15 facing the air inlet 13 to the back of the heat radiating unit 15. Based on the temperature rise of the air, the air rises in the vertical direction along the heat insulating plate 25 behind the heat radiating unit 15. The circulation of hot air is avoided from the radiator 16 disposed on the upstream side toward the radiator 16 disposed on the downstream side. Equal heat dissipation efficiency can be achieved with all the heatsinks 16.

  Further, the radiators 16 are connected to each other by a connecting pipe 21. The connecting pipes 21 can be easily removed. The heat dissipation unit 15 can be easily disassembled. Therefore, the number of radiators 16 can be easily adjusted according to the required cooling performance. The heat dissipation unit 15 can be established with a size according to the cooling performance.

  The inventors verified the effect of the heat dissipation unit 15. An analysis simulation was carried out for verification. Specific examples and comparative examples were prepared. As shown in FIG. 5A, the analysis model of the above-described heat radiation unit 15 is established in the specific example. However, four radiators 16 were incorporated in the analysis model of the heat radiating unit 15.

  On the other hand, as shown in FIG. 5B, an analysis model of the heat dissipation unit 41 is established in the comparative example. The heat radiating unit 41 includes a heat transfer plate 42 rising in the vertical direction and a plurality of heat radiating fins 43 rising from the surface of the heat transfer plate 42. The radiating fins 43 are arranged in parallel to each other. An airflow passage is vertically defined between the radiating fins 43.

  The total surface area of the radiating fins 18 according to the specific example was set to half the total surface area of the radiating fins 43 according to the comparative example. The weight of the heat dissipation unit 15 according to the specific example was set to about 75% of the weight of the heat dissipation unit 41 according to the comparative example. The ambient temperature was set at 35 degrees Celsius. The total heat radiation amount of the heat radiation unit 15 according to the specific example and the heat radiation unit 41 according to the comparative example was both set to 100W. At this time, the cooling performance of the specific example and the comparative example was analyzed.

  As a result, the maximum temperature of 56.5 degrees Celsius was measured for both the heat transfer plate 19 according to the specific example and the heat transfer plate 42 according to the comparative example. In specific examples and comparative examples, it was confirmed that an equivalent amount of heat was released. Since the total surface area of the radiating fins 18 according to the specific example is set to half of the total surface area of the radiating fins 43 according to the comparative example, the specific example can establish a radiating efficiency twice as high as that of the comparative example. confirmed.

  In addition, since the specific example includes a plurality of radiators 16, a similar temperature boundary layer is established around each radiator 16. The thickness of the temperature boundary layer was set smaller than in the comparative example including one heat transfer plate 42. Since the temperature boundary layer can be easily destroyed in this way, it has been confirmed that the heat dissipation efficiency of the heat dissipation unit 15 according to the specific example is enhanced as compared with the heat dissipation unit 41 according to the comparative example.

  In addition, in the specific example, an air flow having a large flow velocity in the vertical direction behind the heat radiating unit 15 was confirmed. It was confirmed that the downstream radiator 16 is not affected by the air flowing from the upstream side. On the other hand, in the comparative example, air traveling in the vertical direction from the lower end of the heat transfer plate 42 toward the upper end was confirmed. Hot air rose from the upstream side to the downstream side. Such hot air hinders the heat radiation of the downstream radiation fins 43.

  As shown in FIG. 6, a heat dissipation unit 15 a may be incorporated in the housing 12 of the server computer apparatus 11 instead of the heat dissipation unit 15 described above. This heat radiation unit 15a includes, for example, five heat radiators 16a as described above. In this radiator 16a, a tube 45 is incorporated as a heat conducting member in place of the heat transfer plate 19 described above.

  The tube 45 connects the radiating fins 18 to each other. A refrigerant flow passage is defined in the tube 45. The tube 45 should just extend, for example in an S shape from the one end of the radiation fin member 17 to the other end. The tube 45 is made of a metal material such as aluminum. One connecting pipe 21 is connected to one end of the refrigerant flow passage of the tube 45. The other connecting pipe 21 is connected to the other end of the refrigerant flow passage of the tube 45. In this way, the refrigerant flows in order through the one connection pipe 21, the tube 45, and the other connection pipe 21.

  The tips of the radiating fins 18 face the base ends of the radiating fins 18 of the radiator 16a adjacent to the upper side at a predetermined interval. As described above, the tips of the radiating fins 18 are arranged along a virtual inclined surface that intersects the vertical direction at a predetermined angle α. The distance between the distal end of the radiating fin 18 and the base end of the radiating fin 18 may be defined to be constant. In addition, the same reference numerals are assigned to configurations and structures equivalent to those of the heat dissipation unit 15 described above.

  In the heat radiating unit 15a as described above, the tips of the heat radiating fins 18 face the base ends of the radiating fins 18 adjacent to each other at a constant interval. Each radiator 16a realizes a chimney effect. Heat is efficiently released from the radiating fins 18 into the atmosphere. The efficiency of heat dissipation is higher than ever. The heat dissipation unit 15a can be reduced in size. In addition, the same operational effects as the above-described heat dissipation unit 15 can be realized.

  As shown in FIG. 7, a heat dissipation unit 15 b may be incorporated in the housing 12 of the server computer apparatus 11 instead of the heat dissipation units 15 and 15 a described above. The heat radiating unit 15 b includes five heat radiators 16. The radiator 16 is arranged in the horizontal direction. The heat transfer plate 19 rises in the vertical direction. An airflow passage is vertically defined between the radiating fins 18. Here, the refrigerant flow path in the heat transfer plate 19 defines both ends at one end of the heat transfer plate 19.

  One connection pipe 56 is connected to one end of the refrigerant flow path in the heat transfer plate 19. Similarly, the other connection pipe 56 is connected to the other end of the refrigerant flow passage in the heat transfer plate 19. The connecting pipe 56 defines a refrigerant flow path. In this way, the refrigerant flows in order through the one connection pipe 56, the heat transfer plate 19, and the other connection pipe 56. The connecting pipes 56 are connected to each other. In this way, the refrigerant flow passages are connected to each other between the connecting pipes 56.

  As shown in FIG. 8, the tips of the radiation fins 18 are arranged along a virtual vertical plane 57 including the vertical direction. The tips of the radiation fins 18 face the back surface of the heat transfer plate 19 of the adjacent radiator 16. The distance between the tips of the radiating fins 18 and the back surface of the heat transfer plate 19 may be defined to be constant. In addition, the same reference numerals are assigned to configurations and structures equivalent to those of the heat dissipation units 15 and 15a.

  In such a heat radiating unit 15b, the tips of the heat radiating fins 18 face the back surface of the adjacent heat transfer plates 19 at regular intervals. A chimney effect is realized by each radiator 16. In the heat radiating unit 15, an air flow is generated in the vertical direction. Heat is efficiently released from the radiating fins 18 into the atmosphere. The efficiency of heat dissipation is higher than ever. The heat dissipation unit 16 can be miniaturized. In addition, the same operational effects as those of the heat dissipation units 15 and 15a described above can be realized. However, it is desirable that the air intake port face the lower side of the heat dissipation unit 15b.

  As shown in FIG. 9, in the heat dissipation unit 15 described above, the heat dissipation unit 15 and the heat receiving plate 32 may be connected by a plurality of heat pipes 65. Here, the two heat pipes 65, 65 only need to extend between the heat receiving plate 32 and the individual radiators 16. The heat pipe 65 may be formed of a metal material such as copper. Thus, an air cooling unit may be established by the heat dissipation unit 15 and the heat receiving plate 32.

  A heat pipe 65 may be extended in the heat transfer plate 19 instead of the refrigerant flow passage. Similarly, a heat pipe 65 may extend in the heat receiving plate 32 instead of the refrigerant flow passage. Like reference numerals are attached to the structure or components equivalent to those described above. According to such a structure, the same effect as the above-described heat radiation unit 15 can be realized.

  As shown in FIG. 9, when two motherboards 28 and 28 a are incorporated in the housing 12, the radiator 16 may be individually connected to each motherboard 28 and 28 a. Two heat pipes 65, 65 may extend between the heat receiver 32 and the radiator 16. Like reference numerals are attached to the structure or components equivalent to those described above. According to such a structure, the same effect as the above-described heat radiation unit 15 can be realized.

Claims (16)

  A first heat dissipating fin member including a plurality of first heat dissipating fins extending in parallel to each other and connected to each other by the first heat conducting member and connected to each other by the second heat conducting member extending in parallel to each other. A heat radiating unit comprising a plurality of second heat radiating fins and a second heat radiating fin member facing the first heat radiating fin member at a predetermined interval with the second heat radiating fin member facing each other.   The heat radiating unit according to claim 1, wherein tips of the second heat radiating fins are arranged along a virtual inclined surface intersecting the vertical direction at a predetermined angle.   The heat radiating unit according to claim 2, wherein tips of the second heat radiating fins are opposed to the first heat radiating fin members at regular intervals.   The heat radiating unit according to claim 1, wherein tips of the second heat radiating fins are arranged along a virtual vertical plane including a vertical direction.   The heat radiating unit according to claim 4, wherein tips of the second heat radiating fins are opposed to the first heat radiating fin members at regular intervals.   The heat radiating unit according to claim 1, wherein the pair of first connecting members are fixed to the first heat radiating fin member and extend in parallel to each other, and are fixed to the second heat radiating fin member and parallel to each other. And a second connecting member that is individually connected to the first connecting member.   The heat dissipation unit according to claim 1, wherein a first refrigerant flow path defined in the first heat conducting member and a second refrigerant flow path connected to one end of the first refrigerant flow path are defined. A first connecting member, a second connecting member extending in parallel to the first connecting member and defining a third refrigerant flow passage connected to the other end of the first refrigerant flow passage; and a compartment in the second heat conducting member A fourth refrigerant flow passage that is received, a third connection member that is received by the first connection member and that defines a fifth refrigerant flow passage that is connected to one end of the fourth refrigerant flow passage and the second refrigerant flow passage, A fourth coupling member that extends in parallel with the coupling member and is received by the second coupling member and that defines the sixth refrigerant flow path connected to the other end of the fourth refrigerant flow path and the third refrigerant flow path. Features a heat dissipation unit.   A heat dissipating fin member including a plurality of heat dissipating fins extending in parallel to each other and connected to each other by a heat conducting member, and a pair of connecting members fixed to the heat dissipating fin member and extending in parallel to each other. And a radiator.   A housing and a first heat dissipating fin member including a plurality of first heat dissipating fins housed in the housing and extending in parallel to each other and connected to each other by the first heat conducting member; A plurality of second heat radiating fins connected to each other by two heat conducting members, the first heat radiating fin member having a second heat radiating fin member facing the tip of the second heat radiating fin at a predetermined interval; Electronic equipment.   The electronic device according to claim 9, wherein the electronic component is disposed in the housing and transfers heat to the first and second heat conducting members, the electronic component is disposed in the housing, and the electronic component An electronic device, further comprising: a heat insulating member disposed between the first and second radiating fin members.   10. The electronic device according to claim 9, wherein tips of the second heat radiation fins are arranged along a virtual inclined surface that intersects the vertical direction at a predetermined angle.   10. The electronic device according to claim 9, wherein a tip end of the second radiating fin is opposed to the first radiating fin member at a constant interval.   10. The electronic device according to claim 9, wherein tips of the second heat radiation fins are arranged along a virtual vertical plane including a vertical direction.   14. The electronic apparatus according to claim 13, wherein a tip end of the second radiation fin is opposed to the first radiation fin member at a constant interval.   10. The electronic device according to claim 9, wherein the pair of first connecting members fixed to the first heat dissipating fin member and extending in parallel with each other are fixed to the second heat dissipating fin member and parallel to each other. And a second connecting member individually connected to the first connecting member.   The electronic device according to claim 9, wherein a first refrigerant flow path defined in the first heat conducting member and a second refrigerant flow path connected to one end of the first refrigerant flow path are defined. A first connecting member, a second connecting member extending in parallel to the first connecting member and defining a third refrigerant flow passage connected to the other end of the first refrigerant flow passage; and a compartment in the second heat conducting member A fourth refrigerant flow passage that is received, a third connection member that is received by the first connection member and that defines a fifth refrigerant flow passage that is connected to one end of the fourth refrigerant flow passage and the second refrigerant flow passage, A fourth coupling member that extends in parallel with the coupling member and is received by the second coupling member and that defines the sixth refrigerant flow path connected to the other end of the fourth refrigerant flow path and the third refrigerant flow path. Features electronic equipment.

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