CN220020085U - Heat radiation structure and projection equipment - Google Patents
Heat radiation structure and projection equipment Download PDFInfo
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- CN220020085U CN220020085U CN202321402187.9U CN202321402187U CN220020085U CN 220020085 U CN220020085 U CN 220020085U CN 202321402187 U CN202321402187 U CN 202321402187U CN 220020085 U CN220020085 U CN 220020085U
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- heat
- fan
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- heat conduction
- pipe
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- 230000005855 radiation Effects 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 claims abstract description 62
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation structure and projection equipment, wherein the heat radiation structure comprises a first heat conduction substrate, a first heat conduction pipe, a heat radiation assembly and a fan assembly; the heat dissipation assembly comprises a second heat conduction substrate and at least two heat radiators, and the at least two heat radiators are arranged on the second heat conduction substrate and are in heat conduction connection with the second heat conduction substrate; the fan assembly is arranged on one side of the heat dissipation assembly, and comprises at least two fans, and the air outlet end of each fan is opposite to each radiator; one end of the first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, and the other end of the first heat conduction pipe is in heat conduction connection with the second heat conduction substrate; the first heat conduction substrate is used for being in heat conduction connection with the heating device. The technical scheme of the utility model can improve the heat dissipation efficiency.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure and projection equipment.
Background
The projection device is a device capable of projecting videos, images or characters onto a curtain for display, is widely applied to families, offices, schools and entertainment places, and provides great convenience for life, study and entertainment of people.
With advances in technology and improvements in mass consumption, consumers have placed higher demands on the brightness of projection devices. The higher the brightness of the projection device, the more heat is generated and the higher the heat dissipation requirement. In the prior art, the projection equipment generally adopts a combination structure of a fan, a heat conduction pipe and a radiator to radiate heat, and the heat conduction pipe and the radiator are matched in a perforation welding or surface welding mode, so that the projection equipment has a single structural form and cannot adapt to complex radiating requirements. Moreover, the contact area between the heat conduction pipe and the radiator is limited, so that the heat exchange efficiency is low, and the heat dissipation efficiency is affected.
Disclosure of Invention
The utility model mainly aims to provide a heat dissipation structure which aims to improve heat dissipation efficiency.
The utility model aims to solve the problems by adopting the following technical scheme:
the heat dissipation structure is characterized by comprising a first heat conduction substrate, a first heat conduction pipe, a heat dissipation assembly and a fan assembly;
the heat dissipation assembly comprises a second heat conduction substrate and at least two heat radiators, and the at least two heat radiators are arranged on the second heat conduction substrate and are in heat conduction connection with the second heat conduction substrate; the fan assembly is arranged on one side of the heat dissipation assembly, and comprises at least two fans, and the air outlet end of each fan is opposite to each radiator; one end of the first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, and the other end of the first heat conduction pipe is in heat conduction connection with the second heat conduction substrate; the first heat conduction substrate is used for being in heat conduction connection with the heating device.
Preferably, the heat dissipation assembly further comprises a second heat conduction pipe, the second heat conduction pipe is arranged between the second heat conduction substrate and the at least two radiators, one side of the second heat conduction pipe is in heat conduction connection with the second heat conduction substrate, and the other side of the second heat conduction pipe is in heat conduction connection with the at least two radiators.
Preferably, a mounting groove is formed in a side, facing the at least two heat sinks, of the second heat conduction substrate, and the second heat conduction pipe is arranged in the mounting groove.
Preferably, the at least two heat sinks include a first heat sink and a second heat sink, and the first heat sink and the second heat sink are arranged side by side on a first side surface of the second heat conductive substrate;
the at least two fans comprise a first fan and a second fan, the air outlet end of the first fan is opposite to the first radiator, and the air outlet end of the second fan is opposite to the second radiator.
Preferably, the air outlet end of the first fan is abutted with the first radiator, and the air outlet end of the second fan is abutted with the second radiator.
Preferably, the first heat conduction pipe comprises a first installation section, a connection section and a second installation section which are sequentially connected; the first installation section is connected to one side of the first heat conducting substrate, the second installation section is connected to the second side of the second heat conducting substrate, and at least part of the connection section corresponds to a gap between the first fan and the second fan.
Preferably, the heat dissipation structure further comprises a third heat sink and a third heat conduction pipe; one end of the third heat conduction pipe is in heat conduction connection with the first heat conduction substrate, and the other end of the third heat conduction pipe is in heat conduction connection with the third radiator.
Preferably, the fan assembly is disposed between the heat dissipation assembly and the third heat sink.
Preferably, the first heat conducting pipe and the third heat conducting pipe are connected to a first side surface of the first heat conducting substrate, and a second side surface of the first heat conducting substrate is used for being in heat conducting connection with the heating device.
The utility model also provides projection equipment, which comprises the heat dissipation structure.
The beneficial effects are that: according to the technical scheme, the first heat conducting substrate transfers heat generated by the heating device to the first heat conducting pipe, and the heat transferred by the first heat conducting pipe is split to at least two radiators through the second heat conducting substrate, so that the second heat conducting substrate and the at least two radiators are utilized to jointly radiate heat, the heat exchange area is increased, and the heat radiation efficiency is improved; and at least two fans of the fan assembly are in one-to-one correspondence with at least two radiators of the radiating assembly, and air flow generated by each fan is utilized to blow to each radiator, so that heat on each radiator is rapidly taken away, and the radiating efficiency is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a heat dissipation structure according to a first view angle of an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation structure according to a second view angle of an embodiment of the present utility model;
FIG. 3 is a schematic view of a heat dissipation structure according to another embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a second view of another embodiment of a heat dissipation structure according to the present utility model.
Reference numerals illustrate:
the above description is given of the drawings.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is involved in the embodiment of the present utility model, the directional indication is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional indication is correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The utility model provides a heat dissipation structure, which aims to improve heat dissipation efficiency. .
As shown in fig. 1 to 4, in an embodiment of the present utility model, the heat dissipation structure includes a first heat conductive substrate 10, a first heat conductive pipe 20, a heat dissipation assembly and a fan assembly; the heat dissipation assembly comprises a second heat conduction substrate 31 and at least two heat sinks, wherein the at least two heat sinks are arranged on the second heat conduction substrate 31 and are in heat conduction connection with the second heat conduction substrate 31; the fan assembly is arranged on one side of the heat dissipation assembly, and comprises at least two fans, and the air outlet end of each fan is opposite to each radiator; one end of the first heat-conducting pipe 20 is in heat-conducting connection with the first heat-conducting substrate 10, and the other end of the first heat-conducting pipe 20 is in heat-conducting connection with the second heat-conducting substrate 31; the first heat conducting substrate 10 is used for being connected with a heating device.
In the technical scheme of the utility model, the first heat conducting substrate 10 transfers the heat generated by the heating device to the first heat conducting pipe 20, and then the second heat conducting substrate 31 shunts the heat transferred by the first heat conducting pipe 20 to at least two radiators, and the second heat conducting substrate 31 and the at least two radiators are utilized to jointly radiate, so that the heat exchange area is increased, and the heat radiation efficiency is improved; and at least two fans of the fan assembly are in one-to-one correspondence with at least two radiators of the radiating assembly, and air flow generated by each fan is utilized to blow to each radiator, so that heat on each radiator is rapidly taken away, and the radiating efficiency is further improved.
The heating device can be a light source, a control main board, a chip and other heating components; the first heat conductive substrate 10 and the second heat conductive substrate 31 may be made of a metal material with high thermal conductivity, such as aluminum or copper. The heat radiation structure can be applied to the projection equipment to radiate heat for the heating device in the projection equipment. It will be appreciated that the heat dissipation structure may be applied to other electronic devices requiring heat dissipation.
In some embodiments, as shown in fig. 1 and 3, a mounting portion 11 is disposed on one side of the first heat conductive substrate 10; the mounting part 11 is used for mounting a heating device; and a first end of the first heat conductive pipe 20 is connected to a side of the first heat conductive substrate 10 facing away from the mounting portion 11. A heat conductive silicone grease may be further disposed between the mounting portion 11 and the heat generating device to enhance heat conduction, so that heat generated from the heat generating device is rapidly transferred to the first heat conductive substrate 10. The heat generated by the heating device is quickly absorbed through the first heat conduction substrate 10, and then the heat is transferred to the heat dissipation component through the first heat conduction pipe 20 for heat dissipation treatment, so that the heat transfer can be enhanced, the temperature of the heating device is reduced, and the heat dissipation efficiency is improved.
Specifically, in some embodiments, as shown in fig. 1-4, the heat dissipation assembly further includes a second heat conduction pipe 50, where the second heat conduction pipe 50 is disposed between the second heat conduction substrate 31 and the at least two heat sinks, one side of the second heat conduction pipe 50 is in heat conduction connection with the second heat conduction substrate 31, and the other side of the second heat conduction pipe 50 is in heat conduction connection with the at least two heat sinks. By providing the second heat conductive pipe 50 between the second heat conductive substrate 31 and at least two heat sinks, the second heat conductive pipe 50 has a high heat conductive capability, and the heat transfer efficiency between the second heat conductive substrate 31 and at least two heat sinks can be improved, thereby improving the heat dissipation efficiency.
Wherein in some embodiments, a side of the second heat conductive substrate 31 facing the at least two heat sinks is provided with a mounting groove, and the second heat conductive pipe 50 is disposed in the mounting groove. By disposing the second heat conductive pipe 50 in the mounting groove, it is possible to ensure that at least two heat sinks are simultaneously in contact with the second heat conductive substrate 31 and the second heat conductive pipe 50, and heat transfer efficiency can be improved, thereby improving heat dissipation efficiency.
Specifically, as shown in fig. 1 and 3, the heat sink includes a first heat sink 32 and a second heat sink 33, and the first heat sink 32 and the second heat sink 33 are disposed side by side on a first side surface of the second heat conductive substrate 31. The fan assembly comprises a first fan 41 and a second fan 42; the air outlet end of the first fan 41 is opposite to the first radiator 32, and the air outlet end of the second fan 42 is opposite to the second radiator 33. Wherein, the air outlet end of the first fan 41 is abutted with the first radiator 32; the air outlet end of the second fan 42 abuts against the second radiator 33.
Wherein, first fan 41 and second fan 42 are centrifugal fan, and first fan 41 and second fan 42 all are equipped with two air inlet ends and an air-out end, and two air inlet ends and the second heat conduction base plate 31 parallel arrangement of first fan 41 and second fan 42, the air-out end of first fan 41 and second fan 42 respectively with first radiator 32, second radiator 33 butt, can avoid the air current backward flow, make first fan 41 and second fan 42 exhaust air current flow through first radiator 32 and second radiator 33 as far as possible to improve radiating efficiency.
It can be understood that the first fan 41 and the second fan 42 may be axial fans, and at this time, the air inlet ends and the air outlet ends of the first fan 41 and the second fan 42 are opposite to each other, and similarly, the air outlet ends of the first fan 41 and the second fan 42 are respectively abutted against the first radiator 32 and the second radiator 33.
Specifically, the second heat-conducting substrate 31 includes a first heat-dissipating portion and a second heat-dissipating portion disposed side by side, and the first heat sink 32 is connected to the first heat-dissipating portion for heat-dissipating the first heat-dissipating portion of the second heat-conducting substrate 31; the second heat sink 33 is connected to the second heat dissipation portion for heat dissipation treatment of the second heat dissipation portion of the second heat conductive substrate 31.
Specifically, in some embodiments, the first heat conducting pipe 20 is connected to the first heat dissipating portion of the second heat conducting substrate 31, and the first heat sink 32 connected to the first heat dissipating portion receives more heat, so that the rotation speed of the first fan 41 is greater than that of the second fan 42, so as to improve the heat dissipating efficiency of the first heat sink 32.
Wherein the second heat dissipation part is a left side structure of the second heat conduction substrate 31; the first heat dissipation part is a right side structure of the second heat conduction substrate 31; of course, the structure may be an up-down structure or a front-back structure, and is not limited herein.
The heat radiation efficiency of the heat radiation assembly can be improved by combining the first fan 41 and the second fan 42 with the first heat radiator 32 and the second heat radiator 33, respectively.
Specifically, in some embodiments, the first heat sink 32 includes a plurality of first heat dissipating fins disposed side by side; a first heat dissipation gap is formed between two adjacent first heat dissipation fins; the air outlet end of the first fan 41 faces the first heat dissipation gap, so that the air flow generated by the first fan 41 flows through the first heat dissipation gap, and heat on the first radiator 32 is taken away.
Specifically, in some embodiments, the second heat sink 33 includes a plurality of second heat radiating fins arranged side by side; a second heat dissipation gap is formed between two adjacent second heat dissipation fins; the air outlet end of the second fan 42 faces the second heat dissipation gap, so that the air flow generated by the second fan 42 flows through the second heat dissipation gap, and heat on the second radiator 33 is taken away.
Specifically, in some embodiments, as shown in fig. 2 and 4, the first heat conductive pipe 20 includes a first mounting section 21, a connection section 22, and a second mounting section 23 connected in sequence; the first mounting section 21 is connected to one side of the first heat conductive substrate 10, the second mounting section 23 is connected to the second side of the second heat conductive substrate 31, and at least part of the connecting section 22 corresponds to a gap between the first fan 41 and the second fan 42. The first heat conductive pipe 20 may be a hollow first heat conductive pipe or a solid first heat conductive pipe. The flexibility and stability of assembly can be ensured by the multi-stage first heat pipe 20, and the heat dissipation effect can be ensured.
Specifically, in some of these embodiments, the second mounting section 23 is connected to the first heat sink portion. In other embodiments, the second mounting section 23 is attached to the second heat sink portion.
Specifically, in some embodiments, as shown in fig. 3 and 4, the heat dissipation structure further includes a third heat conductor 62 and a third heat conductor pipe 61; one end of the third heat pipe 61 is in heat conduction connection with the first heat conduction substrate 10, and the other end of the third heat pipe 61 is in heat conduction connection with the third heat conductor 62. For some heating devices, the heat productivity is very large during the operation, the heat dissipation requirement is higher, if the heat can not be discharged in time, the heating devices are possibly damaged, the heat dissipation efficiency can be further improved by arranging the third heat conductor 62 and the third heat conductor 61, and the normal operation of the heating devices is ensured.
Wherein, in some embodiments, the fan assembly is disposed between the heat sink assembly and the third heat conductor 62; and the first heat conductive pipe 20 and the third heat conductive pipe 61 are connected to a first side of the first heat conductive substrate 10, and a second side of the first heat conductive substrate 10 is used for heat conductive connection with a heat generating device. Through setting up fan subassembly between radiator unit and third heat conductor 62, not only utilized the space effectively, reduced heat radiation structure's volume, can make the air current that fan subassembly air inlet end flows flow through third heat conductor 62 again, improved radiating efficiency, reduced the temperature of the device that generates heat.
The third heat conductor 62 includes a plurality of third heat dissipation fins arranged side by side, and a third heat dissipation gap is formed between two adjacent third heat dissipation fins, and because the third heat conductor 62 is arranged close to the fan assembly, negative pressure is generated when the fan assembly works, airflow flowing at the air inlet end can flow through the third heat dissipation gap to take away heat on the third heat conductor 62.
The utility model also provides a projection device, which comprises a heat dissipation structure, wherein the specific structure of the heat dissipation structure refers to the embodiment, and because the projection device adopts all the technical schemes of all the embodiments, the projection device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. The heat dissipation structure is characterized by comprising a first heat conduction substrate, a first heat conduction pipe, a heat dissipation assembly and a fan assembly;
the heat dissipation assembly comprises a second heat conduction substrate and at least two heat radiators, and the at least two heat radiators are arranged on the second heat conduction substrate and are in heat conduction connection with the second heat conduction substrate; the fan assembly is arranged on one side of the heat dissipation assembly, and comprises at least two fans, and the air outlet end of each fan is opposite to each radiator; one end of the first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, and the other end of the first heat conduction pipe is in heat conduction connection with the second heat conduction substrate; the first heat conduction substrate is used for being in heat conduction connection with the heating device.
2. The heat dissipating structure of claim 1 wherein said heat dissipating assembly further comprises a second heat pipe disposed between said second heat conducting substrate and said at least two heat sinks, one side of said second heat pipe being in heat conducting connection with said second heat conducting substrate and the other side of said second heat pipe being in heat conducting connection with said at least two heat sinks.
3. A heat dissipating structure according to claim 2, wherein a side of said second heat conducting substrate facing said at least two heat sinks is provided with a mounting groove, and said second heat conducting pipe is provided in said mounting groove.
4. A heat dissipating structure according to any one of claims 1 to 3, wherein said at least two heat sinks comprise a first heat sink and a second heat sink, said first heat sink and said second heat sink being disposed side by side on a first side of said second thermally conductive substrate;
the at least two fans comprise a first fan and a second fan, the air outlet end of the first fan is opposite to the first radiator, and the air outlet end of the second fan is opposite to the second radiator.
5. The heat dissipating structure of claim 4 wherein the air outlet end of said first fan is in contact with said first heat sink and the air outlet end of said second fan is in contact with said second heat sink.
6. The heat dissipating structure of claim 4 wherein said first heat pipe comprises a first mounting section, a connecting section and a second mounting section connected in sequence; the first installation section is connected to one side of the first heat conducting substrate, the second installation section is connected to the second side of the second heat conducting substrate, and at least part of the connection section corresponds to a gap between the first fan and the second fan.
7. A heat dissipating structure according to any one of claims 1 to 3, further comprising a third heat sink and a third heat pipe; one end of the third heat conduction pipe is in heat conduction connection with the first heat conduction substrate, and the other end of the third heat conduction pipe is in heat conduction connection with the third radiator.
8. The heat dissipating structure of claim 7, wherein said fan assembly is disposed between said heat dissipating assembly and said third heat sink.
9. The heat dissipating structure of claim 7 wherein said first heat pipe and said third heat pipe are connected to a first side of said first heat conductive substrate, and a second side of said first heat conductive substrate is adapted for heat conductive connection to a heat generating device.
10. Projection device, characterized in that it comprises a heat dissipating structure according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321402187.9U CN220020085U (en) | 2023-06-02 | 2023-06-02 | Heat radiation structure and projection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321402187.9U CN220020085U (en) | 2023-06-02 | 2023-06-02 | Heat radiation structure and projection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220020085U true CN220020085U (en) | 2023-11-14 |
Family
ID=88671948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321402187.9U Active CN220020085U (en) | 2023-06-02 | 2023-06-02 | Heat radiation structure and projection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220020085U (en) |
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2023
- 2023-06-02 CN CN202321402187.9U patent/CN220020085U/en active Active
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