CN221409548U - Heat radiation system of heating equipment - Google Patents
Heat radiation system of heating equipment Download PDFInfo
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- CN221409548U CN221409548U CN202322601701.8U CN202322601701U CN221409548U CN 221409548 U CN221409548 U CN 221409548U CN 202322601701 U CN202322601701 U CN 202322601701U CN 221409548 U CN221409548 U CN 221409548U
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- 230000005855 radiation Effects 0.000 title claims description 11
- 238000010438 heat treatment Methods 0.000 title abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 65
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of heat dissipation of electronic equipment, and particularly discloses a heat dissipation system of heating equipment, which comprises the following components: the shell is provided with an air inlet area and an air outlet area; the main board is arranged in the shell; the component is arranged on the main board and is suitable for generating heat during operation; the shielding cover is connected with the main board or is covered on the component in a connecting way; the shielding cover is provided with an air inlet and an air outlet, the air inlet is correspondingly arranged with the air inlet area, and the air outlet is correspondingly arranged with the air outlet area, so that a flow passage is formed between the air inlet area and the air outlet area, and the flow passage is suitable for heat flow formed by heat generated by the circulation components. According to the utility model, the air inlet area, the air inlet, the air outlet and the air outlet area are communicated in sequence to form the flow passage, and the heat generated by the components is circulated to the outside of the heating equipment in a heat flow mode through the flow passage, so that the problems that the heat dissipation effect of the heating equipment is poor and the service life of the equipment is influenced while the shielding cover provides a protection effect on the components are solved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation system of heating equipment.
Background
In recent years, with the rapid development of the electronic industry, the size of electronic products is also developed towards miniaturization and light weight, especially electronic products with more powerful system operation functions, the internal space arrangement is very compact, and the thickness is relatively thin, so that the design of the internal module heat dissipation system of the electronic products becomes a key point and a difficult point in the structural design process of the products.
Taking a portable ultrasonic device for clinical application as an example, a power supply and a core chip are main heating sources during operation, the electronic components are often required to be protected by a shielding cover, when an air inlet and outlet area of an electronic product is blocked by the shielding cover, the air inlet and outlet area for heat dissipation is difficult to play a role, and the electronic product operates for a long time under the condition of unsatisfactory heat dissipation effect, so that the service life of the device can be greatly influenced.
Disclosure of utility model
In view of the above, the present utility model provides a heat dissipation system for a heat generating device, so as to solve the problem that the heat dissipation effect of the heat generating device is poor and the service life of the device is affected.
The utility model provides a heat dissipation system of heating equipment, comprising: the shell is provided with an air inlet area and an air outlet area; a main board mounted in the housing; the components are arranged on the main board and are suitable for generating heat during operation; the shielding cover is connected with the main board or is covered on the component in a connecting way; the shielding cover is provided with an air inlet and an air outlet, the air inlet is correspondingly arranged with the air inlet area, the air outlet is correspondingly arranged with the air outlet area, so that the shielding cover forms a flow passage between the air inlet area and the air outlet area, and the flow passage is suitable for circulating heat flow formed by heat generated by the components.
The beneficial effects are that: according to the heat dissipation system of the heating equipment, the air inlet and the air outlet are arranged on the shielding cover, the air inlet area and the air outlet area are matched with the air inlet area, the air outlet area and the air outlet area which are arranged on the shell, the air inlet area, the air outlet area and the air outlet area are communicated in sequence to form the flow passage, heat generated by components is circulated to the outside of the heating equipment in a heat flow mode through the flow passage, the shielding cover is kept to provide a protection effect on the components, meanwhile, the blocking influence of the shielding cover on the air inlet area and the air outlet area on the shell is reduced, good heat dissipation effect of the components is achieved through the flow passage, and the problems that the heat dissipation effect of the heating equipment is poor and the service life of the equipment is influenced are solved.
In an alternative embodiment, the components at least comprise a first component and a second component arranged side by side, the shielding cover at least comprises a first shielding cover and a second shielding cover, the first shielding cover is arranged on the first component, and the second shielding cover is arranged on the second component; the first shielding cover is provided with a first air inlet and a first air outlet, the second shielding cover is provided with a second air inlet and a second air outlet, the first air inlet and the air inlet area are correspondingly arranged, the second air inlet and the first air outlet are correspondingly arranged, and the second air outlet and the air outlet area are correspondingly arranged.
The beneficial effects are that: when the first components and the second components are arranged on the main board side by side, as shown in the figure, the first shielding cover and the second shielding cover are correspondingly covered on the first components and the second components, and the air inlet and the air outlet are arranged on the first shielding cover and the second shielding cover and correspond to the air inlet area and the air outlet area, so that an overcurrent channel can be formed by the air inlet area, the first air inlet, the first air outlet, the second air inlet, the second air outlet and the air outlet area in sequence, heat generated during operation of the first components and the second components flows outside heating equipment in the form of heat flow through the overcurrent channel, and the diversion operation of the heat generated during operation of the two components is realized.
In an alternative embodiment, the first component is a power supply and the second component is a heat generating chip disposed on a printed wiring board.
The beneficial effects are that: the power supply and the printed circuit board are main heating elements, and the two main heating elements are arranged between the through-flow channels through the shielding cover with the vent holes, so that a good heat dissipation effect is achieved, and the overall heat dissipation effect of the electronic device is improved.
In an alternative embodiment, the heat dissipation system of the heat generating device further includes: the radiating pipe is communicated with the shielding cover in a flow guiding way; and the radiating fins are communicated with the radiating pipes in a diversion way and are arranged towards the air outlet area.
The beneficial effects are that: the heat generated by the operation of the components is transferred to the shielding cover, the shielding cover is guided to the radiating fins through the radiating pipes, the air inlet area and the air outlet area are arranged on the housing in a matched mode, the air inlet and the air outlet are arranged on the shielding cover, the air inlet area, the air inlet, the air outlet, the radiating fins and the air outlet area are communicated in sequence to form a through-flow channel, and the heat generated by the operation of the components flows outside heating equipment in the form of heat flow through the through-flow channel, so that the radiating efficiency is further improved.
In an alternative embodiment, the heat dissipation system of the heat generating device further includes: the air inlet fan is positioned between the air inlet area and the component and is arranged towards the component; and the air outlet fan is positioned between the component and the air outlet area and is arranged towards the radiating fins.
The beneficial effects are that: through set up air inlet fan and air-out fan on the casing, air inlet and air outlet that cooperation set up on the casing and air intake and air outlet that set up on the shield cover to and cooling tube and radiator fin, link up by air inlet district, air inlet fan, air intake, air outlet, air-out fan, radiator fin, air-out district in proper order and form the passageway that overflows, and the heat that produces when components and parts are operated circulates to the equipment outside of generating heat through the passageway with the form of heat flow, still further improves radiating efficiency.
In an alternative embodiment, a limit groove is formed in the shell, and the air inlet fan and the air outlet fan are respectively arranged in the limit groove.
The beneficial effects are that: the air inlet fan and the air outlet fan are arranged in the corresponding limiting grooves, so that vibration and displacement generated when the air inlet fan and the air outlet fan run are avoided, and the running stability of the air inlet fan and the air outlet fan is improved.
In an alternative embodiment, a buffer pad is arranged between the air inlet fan and the shell; and/or a buffer cushion is arranged between the air outlet fan and the shell.
The beneficial effects are that: vibration generated when the air inlet fan or the air outlet fan runs is reduced by arranging the buffer cushion, and the running stability of the air inlet fan or the air outlet fan is further improved.
In an alternative embodiment, the shielding case is provided as a heat sink, which is connected to the component.
The beneficial effects are that: the shielding cover, namely the second shielding cover, is arranged as a radiating plate so as to improve the radiating efficiency of the radiating plate, and the radiating efficiency of the component, namely the heating chip, is further improved by matching the radiating pipes and the radiating fins.
In an alternative embodiment, the heat spreader plate is connected to the component by a thermally conductive silicone block.
The beneficial effects are that: the heat conduction silica gel block has excellent heat conduction coefficient, and the boss in the second shielding cover arranged as the heat dissipation plate is connected with the heating chip of the component through the heat conduction silica gel block, and the heat dissipation efficiency of the component, namely the heating chip, is improved by further matching with the second shielding cover, the heat dissipation pipe and the heat dissipation fins.
In an alternative embodiment, the heat generating device is a portable ultrasound device.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation system of a heat generating device according to the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation system of a heat generating device according to another view angle of the present utility model;
FIG. 3 is a partial exploded view of a heat dissipating system of a heat generating device according to the present utility model;
Fig. 4 is a schematic structural view of a second shielding case according to the present utility model;
FIG. 5 is a cross-sectional view of a second shield provided by the present utility model;
Fig. 6 is a schematic structural diagram of a third shielding case provided by the present utility model.
Reference numerals illustrate:
1. a housing; 101. an air inlet area; 102. an air outlet area;
2. A main board; 201. an interface; 202. a buckle;
3. A component; 301. a first component; 3011. a power supply; 302. a second component; 3021. a printed wiring board; 3022. a heat generating chip; 3023. a joint; 303. a third component; 3031. an integrated circuit;
4. A shield; 401. a first shield; 4011. a first air inlet; 4012. a first air outlet; 402. a second shield; 4021. a second air inlet; 4022. a second air outlet; 4023. a first positioning rib; 4024. a boss; 403. a third shield; 4031. second positioning ribs; 4032. a connecting sheet;
5. A heat radiating pipe; 501. an auxiliary radiating pipe;
6. A heat radiation fin; 601. auxiliary heat radiation fins;
7. an air intake fan; 8. an air outlet fan; 9. and a heat conducting silica gel block.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Embodiments of the present utility model are described below in conjunction with fig. 1-6.
According to an embodiment of the present utility model, there is provided a heat dissipation system of a heat generating device, as shown in fig. 1 to 3, including: the device comprises a shell 1, an air inlet area 101, an air outlet area 102, a main board 2, components 3, a shielding case 4, an air inlet, an air outlet, an overcurrent channel and the like.
An air inlet area 101 and an air outlet area 102 are arranged on the shell 1; the main board 2 is arranged in the shell 1; the component 3 is arranged on the main board 2, and the component 3 is suitable for generating heat during operation; the shielding cover 4 is connected with the main board 2 or is covered on the component 3 in a connecting way; the shielding cover 4 is provided with an air inlet and an air outlet, the air inlet is arranged corresponding to the air inlet area 101, the air outlet is arranged corresponding to the air outlet area 102, so that the shielding cover 4 forms a flow passage between the air inlet area 101 and the air outlet area 102, and the flow passage is suitable for flowing heat flow formed by heat generated by the components 3.
Specifically, the shielding case 4 provides protection for the components 3 arranged on the main board 2, and simultaneously prevents heat dissipation of the components 3, through the air inlet and the air outlet arranged on the shielding case 4, the air inlet area 101 and the air outlet area 102 arranged on the housing 1 are matched, the air inlet area 101, the air inlet, the air outlet and the air outlet area 102 are sequentially communicated to form a through-flow channel, and heat generated during operation of the components 3 flows to the outside of the heating equipment in the form of heat flow through the through-flow channel.
Further, in this embodiment, the number of the components 3 arranged on the overcurrent channel is not limited, when a plurality of components 3 are disposed on the motherboard 2, a plurality of shielding cases 4 are correspondingly covered on the components 3, and an air inlet and an air outlet are disposed on each shielding case 4, the air inlet of the shielding case 4 close to the air inlet area 101 is correspondingly disposed with the air inlet area 101, the air outlets of the adjacent two shielding cases 4 are correspondingly disposed with the air inlet, and the air outlets of the shielding cases 4 close to the air outlet area 102 are correspondingly disposed with the air outlet area 102, so that the overcurrent channel sequentially passing through the air inlet area 101, the plurality of groups of air outlets, the plurality of groups of air inlets and the air outlet area 102 is formed, and the diversion operation of the heat generated when the plurality of components 3 run is realized.
According to the heat dissipation system of the heating equipment, through the air inlet and the air outlet which are formed in the shielding cover 4, the air inlet area 101 and the air outlet area 102 which are arranged on the housing 1 are matched, the air inlet area 101, the air inlet, the air outlet and the air outlet area 102 are sequentially communicated to form a flow passage, heat generated by the components 3 is circulated to the outside of the heating equipment in a heat flow mode through the flow passage, the shielding cover 4 provides a protection effect on the components 3, meanwhile, the blocking influence of the shielding cover 4 on the air inlet area 101 and the air outlet area 102 on the housing 1 is reduced, the good heat dissipation effect of the components 3 is realized through the flow passage, and the problem that the heat dissipation effect of the heating equipment is poor and the service life of the equipment is influenced is solved.
In one embodiment, as shown in fig. 1-3, the component 3 includes at least a first component 301 and a second component 302 disposed side by side, the shielding case 4 includes at least a first shielding case 401 and a second shielding case 402, the first shielding case 401 is disposed over the first component 301, and the second shielding case 402 is disposed over the second component 302; the first shielding cover 401 is provided with a first air inlet 4011 and a first air outlet 4012, the second shielding cover 402 is provided with a second air inlet 4021 and a second air outlet 4022, the first air inlet 4011 is correspondingly arranged in the air inlet area 101, the second air inlet 4021 is correspondingly arranged in the first air outlet 4012, and the second air outlet 4022 is correspondingly arranged in the air outlet area 102.
Specifically, when the first component 301 and the second component 302 are disposed on the motherboard 2 side by side, as shown in fig. 1, the first shielding cover 401 and the second shielding cover 402 are correspondingly disposed on the first component 301 and the second component 302, and the air inlet and outlet areas 101 and 102 are disposed on the first shielding cover 401 and the second shielding cover 402, that is, the air inlet area 101, the first air inlet 4011, the first air outlet 4012, the second air inlet 4021, the second air outlet 4022, and the air outlet area 102 are sequentially communicated to form a flow passage, and when the first component 301 and the second component 302 operate, heat generated by the operation of the two components 3 flows to the outside of the heat generating device through the flow passage in a heat flow manner, so as to realize a flow guiding operation of the heat generated by the operation of the two components.
In one embodiment, as shown in fig. 1-3, the first component 301 is a power supply 3011 and the second component 302 is a heat generating chip 3022 disposed on a printed wiring board 3021.
Specifically, the power source 3011 and the printed circuit board 3021 are main heating elements, and the two main heating elements are arranged between the through-flow channels by arranging the shielding cover with the ventilation holes, so that a good heat dissipation effect is achieved, and the overall heat dissipation effect of the electronic device is improved.
Further, a first shielding cover 401 is arranged on the outer side cover of the power supply 3011, and a buckle 202 welded on the main board 2 connects the first shielding cover 401 to the main board 2 through deformation clamping; the printed wiring board 3021 is provided with a connector 3023, the motherboard 2 is provided with an interface 201 corresponding to the connector 3023, and the printed wiring board 3021 is mounted on the motherboard 2 at the interface 201 through the connector 3023.
Further, the clip 202 is configured as a metal clip, and electroless nickel plating is required on the surface to improve solderability.
Further, the heat generating chip 3022 is a COME core module.
In one embodiment, as shown in fig. 1 to 6, the heat dissipation system of the heat generating device further includes: a radiating pipe 5 and radiating fins 6.
The radiating pipe 5 is communicated with the shielding cover 4 in a diversion way; the radiating fins 6 are communicated with the radiating tube 5 in a diversion way, and the radiating fins 6 are arranged towards the air outlet area 102. The radiating pipe 5 is mounted on the outer surface of the shield case 4 through a first positioning rib 4023 as shown in fig. 4 and 5.
Specifically, heat generated by the operation of the component 3 is transferred to the shielding cover 4, the shielding cover 4 is guided to the radiating fins 6 through the radiating pipe 5, the air inlet area 101 and the air outlet area 102 arranged on the housing 1 are matched, and the air inlet and the air outlet arranged on the shielding cover 4 are sequentially communicated by the air inlet area 101, the air inlet, the air outlet, the radiating fins 6 and the air outlet area 102 to form a through-flow channel, and the heat generated by the operation of the component 3 flows to the outside of the heating equipment in a heat flow mode through the through-flow channel, so that the radiating efficiency is further improved.
Further, when the first component 301 and the second component 302 are disposed on the motherboard 2 side by side, as shown in fig. 1-3, heat generated by the operation of the second component 302 is transferred to the second shielding case 402, the second shielding case 402 is guided to the heat dissipation fins 6 by the heat dissipation tube 5, and in cooperation with the air inlet area 101 and the air outlet area 102 disposed on the housing 1, the first air inlet 4011 and the first air outlet 4012 disposed on the first shielding case 401, and the second air inlet 4021 and the second air outlet 4022 disposed on the second shielding case 402, the air inlet area 101, the first air inlet 4011, the first air outlet 4012, the second air inlet 4021, the second air outlet 4022, the heat dissipation fins 6 and the air outlet area 102 are sequentially communicated to form a flow passage, and the heat generated by the operation of the first component 301 and the second component 302 is circulated to the outside of the heat generating device through the flow passage, so as to further improve the heat dissipation efficiency.
Further, a heat radiation pipe and a heat radiation fin may be provided on the first component 301, and the heat radiation fin may be provided toward the air outlet area 102.
Further, as shown in fig. 3 and 6, a third component 303 is further disposed on the motherboard 2, and the third component 303 is specifically configured as an integrated circuit 3031, i.e., an FPGA module. The third shielding cover 403 is connected with the main board 2 through a connecting sheet 4032 and is covered on the third component 303, and the auxiliary radiating pipe 501 is communicated with the third shielding cover 403 in a flow guiding way; the auxiliary radiating fins 601 are communicated with the auxiliary radiating pipes 501 in a flow guiding mode, the auxiliary radiating fins 601 are arranged towards the air outlet area 102, and the auxiliary radiating pipes 501 are arranged on the outer surface of the third shielding cover 403 through the second positioning ribs 4031. As shown in fig. 3, an air inlet fan 7 and an air outlet fan 8 may be disposed at the position where the third component 303 is disposed, so that the heat dissipation efficiency is improved by the third component 303, i.e., the FPGA module.
Further, the radiating tube 5 is a radiating copper tube, and is made of copper C1020, hollow inside and excellent in heat conducting performance, and the surface of the radiating tube is required to be electroplated with electroless nickel to improve weldability.
Further, the aluminum alloy sheet of the heat radiation fin 6 has a thickness of 0.08mm-0.10mm, and has excellent heat radiation performance, and the surface of the aluminum alloy sheet is required to be electroplated with electroless nickel to improve solderability.
In one embodiment, as shown in fig. 1 to 3, the heat dissipation system of the heat generating device further includes: an air intake fan 7 and an air outlet fan 8.
The air inlet fan 7 is positioned between the air inlet area 101 and the component 3 and is arranged towards the component 3; the air outlet fan 8 is located between the component 3 and the air outlet area 102 and is disposed towards the heat dissipation fins 6.
Specifically, through setting up air inlet fan 7 and air-out fan 8 on casing 1, the air inlet that sets up on the cooperation casing 1 district 101 and air-out district 102, air intake and the air outlet that set up on the shield cover 4, and cooling tube 5 and radiator fin 6, link up by air inlet district 101, air inlet fan 7, air intake, air outlet, air-out fan 8, radiator fin 6, air-out district 102 in proper order and form the circulation passageway, the heat that produces when components and parts 3 are operated is circulated to the equipment outside of generating heat through the circulation passageway with the form of heat flow, still further improves radiating efficiency.
Further, when the first component 301 and the second component 302 are disposed on the motherboard 2 in parallel, as shown in fig. 1-3, by disposing the air inlet fan 7 and the air outlet fan 8 on the housing 1, and matching with the air inlet area 101 and the air outlet area 102 disposed on the housing 1, the first air inlet 4011 and the first air outlet 4012 disposed on the first shielding cover 401, the second air inlet 4021 and the second air outlet 4022 disposed on the second shielding cover 402, and the heat dissipation tube 5 and the heat dissipation fins 6, the air inlet area 101, the air inlet fan 7, the first air inlet 4011, the first air outlet 4012, the second air inlet 4021, the second air outlet 4022, the air outlet fan 8, the heat dissipation fins 6 and the air outlet area 102 are sequentially communicated to form a flow passage, and heat generated when the first component 301 and the second component 302 operate flows to the outside of the heat generating device through the flow passage, so as to realize the heat dissipation operation of the heat generated when the two components 3 operate, and further improve the heat dissipation efficiency.
In one embodiment, the housing 1 is provided with a limiting groove, and the air inlet fan 7 and the air outlet fan 8 are respectively arranged in the limiting groove.
Specifically, the air inlet fan 7 and the air outlet fan 8 are arranged in the corresponding limiting grooves, so that vibration displacement generated when the air inlet fan 7 and the air outlet fan 8 run is avoided, and running stability of the air inlet fan 7 and the air outlet fan 8 is improved.
In one embodiment, a buffer pad is arranged between the air inlet fan 7 and the shell 1; and/or a buffer cushion is arranged between the air outlet fan 8 and the shell 1.
Specifically, vibration generated when the air inlet fan 7 or the air outlet fan 8 is operated is reduced by arranging the buffer pad, so that the operation stability of the air inlet fan 7 or the air outlet fan 8 is further improved.
In one embodiment, as shown in fig. 5, the shield case 4 is provided as a heat radiating plate, which is connected to the component 3.
Specifically, the shielding case 4, that is, the second shielding case 402 is provided as a heat dissipation plate to improve the heat dissipation efficiency thereof, and the heat dissipation efficiency of the component 3, that is, the heat generating chip 3022 is further improved by matching the heat dissipation tube 5 and the heat dissipation fins 6.
Further, the heat dissipation plate is made of AL6063 or ADC12, and has excellent heat dissipation performance, and the boss 4024 is designed on the heat dissipation plate and connected to the heat-generating chip component 3, i.e. the heat-generating chip 3022, and the surface of the heat dissipation plate needs to be electroplated with electroless nickel to improve solderability.
In one embodiment, as shown in fig. 5, the heat sink is connected to the component 3 by a thermally conductive silicone block 9.
Specifically, the heat-conducting silicone block 9 has an excellent heat conductivity coefficient, and the boss 4024 in the second shielding cover 402 configured as a heat dissipation plate is connected with the heat-generating chip 3022 of the component 3 through the heat-conducting silicone block 9, and further cooperates with the second shielding cover 402, the heat dissipation tube 5 and the heat dissipation fin 6 to improve the heat dissipation efficiency of the component 3, namely the heat-generating chip 3022.
In one embodiment, the heat generating device is a portable ultrasound device.
Although embodiments of the present utility model have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations fall within the scope of the utility model as defined by the appended claims.
Claims (10)
1. A heat dissipation system of a heat generating device, comprising:
A shell (1) provided with an air inlet area (101) and an air outlet area (102);
a main board (2) installed in the housing (1);
A component (3) arranged on the main board (2), the component (3) being adapted to generate heat during operation;
a shielding cover (4) which is connected with the main board (2) or is covered on the component (3);
an air inlet and an air outlet are formed in the shielding cover (4), the air inlet is arranged corresponding to the air inlet area (101), the air outlet is arranged corresponding to the air outlet area (102), the shielding cover (4) is enabled to form a flow passage between the air inlet area (101) and the air outlet area (102), and the flow passage is suitable for circulating heat flow formed by heat generated by the components (3).
2. A heat radiation system of a heat generating device according to claim 1, wherein said component (3) comprises at least a first component (301) and a second component (302) arranged side by side, said shield (4) comprises at least a first shield (401) and a second shield (402), said first shield (401) is arranged to cover said first component (301), said second shield (402) is arranged to cover said second component (302);
The novel air conditioner is characterized in that a first air inlet (4011) and a first air outlet (4012) are formed in the first shielding cover (401), a second air inlet (4021) and a second air outlet (4022) are formed in the second shielding cover (402), the first air inlet (4011) and the air inlet area (101) are correspondingly arranged, the second air inlet (4021) and the first air outlet (4012) are correspondingly arranged, and the second air outlet (4022) and the air outlet area (102) are correspondingly arranged.
3. The heat dissipation system of a heat generating device according to claim 2, wherein the first component (301) is a power supply (3011) and the second component (302) is a heat generating chip (3022) provided on a printed wiring board (3021).
4. A heat radiation system of a heat generating device according to any one of claims 1 to 3, further comprising:
the radiating pipe (5) is communicated with the shielding cover (4) in a diversion way;
And the radiating fins (6) are communicated with the radiating pipes (5) in a diversion way, and the radiating fins (6) are arranged towards the air outlet area (102).
5. The heat dissipating system of a heat generating device of claim 4, further comprising:
an air inlet fan (7) which is positioned between the air inlet area (101) and the component (3) and is arranged towards the component (3);
The air outlet fan (8) is positioned between the component (3) and the air outlet area (102) and is arranged towards the radiating fins (6).
6. The heat dissipation system of a heat generating device according to claim 5, wherein a limit groove is provided on the housing (1), and the air intake fan (7) and the air outlet fan (8) are respectively provided in the limit groove.
7. Heat dissipation system of a heat generating device according to claim 6, characterized in that a cushion is arranged between the air intake fan (7) and the housing (1); and/or a buffer cushion is arranged between the air outlet fan (8) and the shell (1).
8. Heat dissipation system of a heat generating device according to claim 4, characterized in that the shielding cover (4) is provided as a heat dissipation plate, which is connected to the component (3).
9. Heat dissipation system of a heat generating device according to claim 8, characterized in that the heat dissipation plate is connected to the component (3) by means of a heat conducting silicone block (9).
10. The heat dissipating system of a heat generating device of claim 1, wherein the heat generating device is a portable ultrasound device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322601701.8U CN221409548U (en) | 2023-09-25 | 2023-09-25 | Heat radiation system of heating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322601701.8U CN221409548U (en) | 2023-09-25 | 2023-09-25 | Heat radiation system of heating equipment |
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| Publication Number | Publication Date |
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| CN221409548U true CN221409548U (en) | 2024-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202322601701.8U Active CN221409548U (en) | 2023-09-25 | 2023-09-25 | Heat radiation system of heating equipment |
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| CN (1) | CN221409548U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118604698A (en) * | 2024-08-08 | 2024-09-06 | 四川省地球物理调查研究所 | A series magnetic field sensor group |
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2023
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118604698A (en) * | 2024-08-08 | 2024-09-06 | 四川省地球物理调查研究所 | A series magnetic field sensor group |
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