CN204335265U - Electronic cooling module and cartridge electronic radiator - Google Patents

Abstract

The utility model provides an electronic heat dissipation module, which includes a heat-conducting substrate with a heat-absorbing base surface, and a plurality of heat-dissipating fins are arranged at intervals on the end surface of the other side of the heat-conducting substrate relative to the heat-absorbing base surface. The connection line between the free ends of the heat dissipation fins is in the shape of a taper with the middle part being higher and the two sides gradually lower, and the two ends of the heat conduction substrate parallel to the heat dissipation fins are provided with a connection base surface that can be assembled and connected between different heat conduction substrates . The electronic cooling module described in the utility model can facilitate integrated assembly of the radiator. The utility model also relates to a cylindrical electronic radiator assembled from the electronic heat dissipation module.

Description

Electronic cooling module and cartridge electronic radiator

technical field

The utility model relates to a heat dissipation device for power electronics, in particular to an electronic heat dissipation module. The utility model also relates to a cylindrical electronic radiator assembled from the electronic heat dissipation module.

Background technique

The development direction of existing electronic technology is changing from traditional power electronics based on low-frequency technology to modern power electronics based on high-frequency technology. It has a great influence on the stable operation of electronic devices. At present, in order to reduce the volume and weight of the electronic radiator, the integrated assembly between the radiators can be carried out, and the number of electronic devices installed can be increased by using the multiple outer end faces of the integrated radiator structure. direction. However, the existing electronic heat sink structure is not convenient for integrated assembly, which is not conducive to the reduction of the volume and weight of the heat sink.

Utility model content

In view of this, the utility model aims to provide an electronic cooling module to facilitate the integrated assembly of the radiator.

In order to achieve the above object, the technical solution of the utility model is achieved in that:

An electronic heat dissipation module, comprising a heat-conducting substrate having a heat-absorbing base surface, a plurality of heat-dissipating fins are arranged at intervals on the end surface of the heat-conducting substrate opposite to the heat-absorbing base surface, and each heat-dissipating fin The connection line between the free ends is in the shape of a taper with the middle part being higher and the two sides gradually lowering. The two ends parallel to the heat conduction substrate and the heat dissipation fins are provided with connection bases for assembling and connecting different heat conduction substrates.

Further, the cross-section of the side end surface of the thermal conduction substrate connected to the heat dissipation fin along the direction perpendicular to the heat dissipation fin is arc-shaped with a high middle part and low sides.

Further, corrugated heat dissipation teeth are provided on the outer surface of the heat dissipation fins.

Further, at least one quick installation groove is provided on the heat-absorbing base surface of the heat-conducting substrate.

Further, the quick installation slot is a T-shaped slot or a dovetail slot.

Another object of the present utility model is to propose a cylindrical electronic radiator, which includes a plurality of heat dissipation modules connected together in a ring shape, the heat dissipation modules have the structure of the electronic heat dissipation module as described above, and the heat dissipation modules The modules are connected via connection bases on adjacent heat-conducting substrates.

Further, the connection base surfaces on both sides of the heat dissipation substrates are provided with recessed semi-fixed grooves that can be buckled and connected when adjacent heat dissipation substrates are connected.

Further, a fixing groove is provided on the side end surface of the heat-conducting substrate perpendicular to the heat-absorbing base surface.

Compared with the prior art, the utility model has the following advantages:

(1) In the electronic heat dissipation module described in the utility model, the connection line between the free ends of each heat dissipation fin is in an arc shape with a high middle part and low sides, so that the heat dissipation fins on both sides of each module are relatively short, There will be no interference when the two modules are connected at an angle, so that multiple modules can be assembled and connected into a cylindrical structure by using the connection base, which avoids the existing heat sink structure that is inconvenient for integrated assembly due to the interference of the heat dissipation structure on it It can achieve the purpose of increasing the installation surface of the electronic components of the heat sink, and while ensuring the small size of the heat sink, it can also use the layout characteristics of the heat dissipation fins to ensure the heat dissipation effect of the heat sink.

(2) The end surface connected with the heat dissipation fins is set to be a curved surface with a high center and low sides, which can be combined with the layout characteristics of the heat dissipation fins to further facilitate the integration and assembly of different modules.

(3) Arranging heat dissipation teeth on the heat dissipation fins can further enhance the heat dissipation effect of the heat dissipation fins, and setting quick installation slots can facilitate the rapid installation of electronic devices on the heat dissipation module, so as to facilitate the use of the module.

(4) Set a fixed groove on the heat conduction substrate, or set a semi-fixed groove on the connection base surface that is snapped and connected when adjacent heat dissipation substrates are connected, so that when multiple modules are assembled into a heat sink structure, they can be connected to each other on the heat sink. A fixing groove with a complete structure is formed at the adjacent heat dissipation module, so that components such as a cooling fan can be fixedly installed on the radiator through the fixing groove.

Description of drawings

The accompanying drawings constituting a part of the utility model are used to provide a further understanding of the utility model, and the schematic embodiments of the utility model and their descriptions are used to explain the utility model, and do not constitute improper limitations to the utility model. In the attached picture:

Fig. 1 is a schematic structural diagram of the electronic cooling module described in Embodiment 1 of the present utility model;

Fig. 2 is a schematic structural view of the cylindrical electronic radiator described in the second embodiment of the utility model;

Fig. 3 is a schematic structural view of the electronic cooling module with semi-fixed slots described in Embodiment 2 of the present invention;

FIG. 4 is a schematic structural view of the cylindrical electronic radiator with a fixing groove structure described in Embodiment 2 of the present invention.

Explanation of reference signs:

1-thermal conduction substrate, 2-radiating fins, 3-heat-absorbing base surface, 4-quick installation groove, 5-connecting base surface, 6-semi-fixed groove, 7-fixed groove.

Detailed ways

It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

The utility model will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

Embodiment one

This embodiment relates to an electronic cooling module, as shown in Figure 1, it includes a thermally conductive substrate 1, on one side of the thermally conductive substrate 1 is a planar heat-absorbing base surface 3, the heat-absorbing base surface 3 is used for electronic devices and be closely attached to the heat-generating parts of the electronic devices, so that the heat of the electronic devices can be transferred to the heat-conducting substrate 1. Of course, the heat-absorbing base surface 3 can also be flat as shown in FIG. Curved surfaces with different shapes. On the other side of the heat-conducting substrate 1 relative to the heat-absorbing base surface 3, a plurality of heat-dissipating fins 2 arranged at intervals are connected, and on both sides of the heat-conducting substrate 1 parallel to the heat-dissipating fins 2, there are provided different heat-conducting substrates 1 Connected base surface 5 . The heat conduction substrate 1 and the heat dissipation fins 2 can be made of 6063-T5 aluminum profile.

In this embodiment, the connection base surfaces 5 on both sides are composed of the entire side end surface of the heat-conducting substrate 1. The connection base surfaces 5 also form an included angle with the heat dissipation fins 2 along the height direction shown in FIG. 1, and the two sides The connection bases 5 on both sides are also inclined towards the inner side of the heat dissipation fin 2 , so that the connection bases 5 on both sides of the heat conduction substrate 1 form a figure-eight shape. In this embodiment, the free ends of the heat dissipation fins 2, that is, the connection line between the heat dissipation fins 2 and the other end connected to the heat conduction substrate 1 is in the shape of a taper with the middle part high and the two sides gradually lower, so that the heat dissipation The height of the cooling fins 2 on the module presents a structure in which the middle is higher and the two sides are gradually lower, and the free end of the higher cooling fins 2 in the middle and the free ends of the lower cooling fins 2 on one side The connection line can also be coplanar with the connection base surface 5 on this side. Of course, in addition to the above-mentioned coplanar arrangement, the connection line between the free ends of the heat dissipation fins 2 is in the form of a straight line, the connection line between the free ends of the heat dissipation fins 2 on the heat conducting substrate 1 can also be arc-shaped with a high middle part and low sides. .

In this embodiment, the cross-section of the side end surface of the heat-conducting substrate 1 connected to the heat-dissipating fins 2 along the direction perpendicular to the direction of the heat-dissipating fins 2 is also set in an arc shape with a high middle part and low sides, so as to match the height characteristics of each heat-dissipating fin 2 adapt. On the heat-absorbing base surface 3 of the heat-conducting substrate 1, at least one quick installation groove 4 is provided, and the number of quick installation grooves 4 can be two arranged at intervals as shown in FIG. 1 , and the quick installation groove 4 It can also be designed as a T-shaped slot as shown in FIG. 1 . Of course, the quick installation slot 4 can also be designed as a dovetail slot with the same effect, so as to facilitate the rapid installation of electronic devices on the heat-conducting substrate 1 . In addition, in this embodiment, in order to enhance the heat dissipation effect of the heat dissipation fins 2 , corrugated heat dissipation teeth can also be provided on the outer surface of each heat dissipation fin 2 , such as triangular teeth or semicircular teeth.

Embodiment two

This embodiment relates to a cylindrical electronic heat sink, as shown in Figure 2, which includes a plurality of electronic heat dissipation modules connected together in a ring shape with the structure described in Embodiment 1, and each electronic heat dissipation module passes through the corresponding Adjacent to the connection base surface 5 on the thermally conductive substrate 1 is connected, and the connection method may be by adhesion. In this embodiment, in order to further increase the convenience of use of the heat sink, as shown in Figure 3, the connection base surface 5 on both sides of the heat dissipation substrate 1 is provided with a joint that can be fastened when the adjacent heat dissipation substrate 1 is connected. Connected concave semi-fixed slots 6, and the structure of the cylindrical electronic radiator under the buckled state of the semi-fixed slots 6 on each electronic heat dissipation module can be shown in Figure 4. At this time, each buckled connected semi-fixed slot The grooves 6 form a plurality of fixing grooves 7 with a complete structure on the heat sink.

The fixing groove 7 can be conveniently used for the installation of components such as cooling fans. Of course, in addition to adopting the above-mentioned method of setting the semi-fixing groove 6 on the connection base surface 5 of each heat-conducting substrate 1 to form the fixing groove 7 by buckling, this embodiment In this example, the fixing groove 7 can also be made by machining on the cylindrical electronic radiator structure as shown in FIG. 2 . Besides, the fixing groove 7 can be arranged at the junction of each heat-conducting substrate 1, or it can also be separately arranged on each heat-conducting substrate 1 in the form of machining on the cylindrical electronic radiator structure as shown in FIG. 2 . other locations. In addition to being installed in the fixing groove 7 or the fixing groove structure having the same effect as the fixing groove 7, the cooling fan can also be installed on the quick installation groove 4 on the heat conducting substrate 1 simultaneously.

When the cartridge type electronic heat sink is in use, the electronic components are installed on the heat sink through the quick installation slots 4 on each heat dissipation module. Since the heat sink has multiple heat-absorbing base surfaces 3, a single heat sink can be used to realize multiple heat sinks. cooling requirements of an electronic component. The heat dissipation fan is installed in the fixed groove 7. When the electronic components are working, the heat generated by it enters the heat conduction substrate 1 from the heat-absorbing base surface 3, and then transfers to the heat dissipation fins 2, and finally can be passed by the forced air of the heat dissipation fan. Cold and quick to pass out.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included in the Within the protection scope of the present utility model.

Claims (8)

1. an electronic radiation module, comprise the heat-conducting substrate with heat absorption basal plane, the opposite side end face of described heat-conducting substrate relative to described heat absorption basal plane is interval with multiple radiating fin, it is characterized in that: the line between described each radiating fin free end is the gradually low class tapers in high both sides, middle part, and the two ends that described heat-conducting substrate and radiating fin parallel are provided with the connection basal plane that can make assembly and connection between different heat-conducting substrate.

2. electronic radiation module according to claim 1, is characterized in that: the side end face that described heat-conducting substrate is connected with radiating fin is along perpendicular to the cross section in described radiating fin direction being the low arcs in high both sides, middle part.

3. electronic radiation module according to claim 1, is characterized in that: on the lateral surface of described radiating fin, be provided with undulatory radiation tooth.

4. electronic radiation module according to claim 1, is characterized in that: on the heat absorption basal plane of described heat-conducting substrate, be provided with at least one Fast Installation groove.

5. electronic radiation module according to claim 4, is characterized in that: described Fast Installation groove is T-slot or dovetail groove.

6. a cartridge type electronic heat sink, comprise the multiple radiating modules be connected together in the form of a ring, it is characterized in that: described radiating module has the structure of the electronic radiation module according to any one of claim 1 to 5, and described radiating module is connected via the connection basal plane on adjacent heat-conducting substrate.

7. cartridge type electronic heat sink according to claim 6, is characterized in that: on the connection basal plane of described heat-radiating substrate both sides, be equipped with the semifixed groove that can fasten the indent be connected when adjacent heat radiation substrate connects.

8. cartridge type electronic heat sink according to claim 6, is characterized in that: on the side end face of described heat-conducting substrate perpendicular to described heat absorption basal plane, be provided with holddown groove.