CN102427655A - Radiating fin structure - Google Patents
Radiating fin structure Download PDFInfo
- Publication number
- CN102427655A CN102427655A CN2011102550356A CN201110255035A CN102427655A CN 102427655 A CN102427655 A CN 102427655A CN 2011102550356 A CN2011102550356 A CN 2011102550356A CN 201110255035 A CN201110255035 A CN 201110255035A CN 102427655 A CN102427655 A CN 102427655A
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- CN
- China
- Prior art keywords
- radiating fin
- circuit board
- heat sink
- sink body
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiating fin structure comprising a radiating fin main body. The radiating fin main body is installed on a circuit board. The radiating fin structure is characterized in that: the radiating fin main body is provided with a screw hole which is used to fix an electronic component; the radiating fin main body is bended into an L shape; a lower end of the radiating fin main body is provided with pins corresponding to plug-in slots of the circuit board; there are two or more pins; the lower end of the radiating fin main body is also provided with a groove which matches with a projecting part of the circuit board. The radiating fin structure is mainly used to perform auxiliary heat dissipation to the circuit board. A structure is simple. A space can be saved. Assembling is convenient and the heat dissipation is good. Stability is high and adaptability is strong.
Description
Technical field
The invention belongs to circuit board heat radiation field, particularly a kind of heat radiating fin structure.
Background technology
On the circuit board owing to integrated a large amount of electronic components; Can discharge a large amount of heats during work, cause the circuit board temperature to raise, the too high job stability that can influence electronic component of temperatures at localized regions; Therefore need to improve the radiating effect of circuit board; Reduce working temperature, guarantee its stability, increase the service life.
Common radiating mode is a finned on circuit board, through the heat fast Absorption of fin with circuit board, and through its radiating surface heat transferred is gone out; Thereby reach cooling-down effect, but traditional fin shape is merely the plane of a full wafer, the area of its radiating effect and radiating surface is directly proportional; Strengthen radiating effect if desired, then radiating surface need be to expansion all around, and the electronic component to the circuit board upper periphery has interference easily; It is installed and also receives the restriction that electronic component is arranged on the circuit board; And the installation of traditional heat-dissipating sheet mainly through screw on circuit board, or also need weld operation inconvenience and easy-maintaining not with circuit board.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiency that exists in the prior art, provides a kind of simple in structure, saves the space, and easy to assembly, thermal diffusivity is good, the high and adaptable a kind of heat radiating fin structure of stability.
For solving the problems of the technologies described above, the present invention provides a kind of heat radiating fin structure, comprises heat sink body; Said heat sink body is installed on the circuit board; It is characterized in that: said heat sink body is provided with the screw that is used for fixing electronic component, and said heat sink body bending is the L type, said heat sink body lower end be provided with circuit board on the corresponding pin of inserting groove; Said pin is two or more, said heat sink body lower end also be provided with circuit board on the groove that is complementary of protuberance.Pin that heat sink body is provided with through its lower end and the corresponding grafting of inserting groove on the circuit board be not so that stable being vertically fixed on the circuit board of heat sink body ability need be used screw or welding during installation; Assembly and disassembly all makes things convenient for, and the radiating surface of its heat sink body can extend perpendicular to circuit board, has enlarged area of dissipation when saving the space; Improve radiating effect, the bending of L type is handled and is made heat sink body fixing more stable on circuit board, can not topple over to both sides; Improve the stability of fin; The groove that the heat sink body lower end is provided with can make heat sink body make somebody a mere figurehead corresponding protuberance on circuit board at this place, avoids the interference to the protuberance on the circuit board, also is provided with screw on the said heat sink body; Can be used for fixing electronic component, adaptability is strong.
Aforesaid a kind of heat radiating fin structure is characterized in that, said pin is the lug pin, and said lug pin is symmetrical biconvex ear pin in both sides or one-sided lug pin.One-sided lug pin or monosymmetric biconvex ear pin can make more stable the fixing with circuit board of heat sink body.
The beneficial effect that the present invention reached:
Simple in structure, save the space, easy to assembly, thermal diffusivity is good, and stable height and adaptability are strong.
Description of drawings
Fig. 1 is the structural representation behind the fit on electronic component of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
As shown in Figure 1, heat sink body 1 is bent into the L type, and heat sink body 1 lower end of its L type bending is provided with three pins; Wherein two is the symmetrical biconvex ear pins 2 in both sides, another be 3, three pins of one-sided lug pin with circuit board on corresponding inserting groove be connected; Make being installed on the circuit board that heat sink body 1 can be stable; Said heat sink body lower end also is provided with groove 4, and the protuberance on this groove 4 and the circuit board is complementary, and heat sink body 1 can be maked somebody a mere figurehead above protuberance on the circuit board at this place; Avoid interference to protuberance; Screw 5 on the heat sink body 1 is used to install electronic component 6, and the serviceability of expansion fin improves its adaptability.
The present invention is mainly used in circuit board is carried out auxiliary heat dissipation, and it is simple in structure, saves the space, and easy to assembly, thermal diffusivity is good, and stable height and adaptability are strong.
Above embodiment limits the present invention never in any form, and every other improvement and application that above embodiment is made with the equivalent transformation mode all belongs to protection scope of the present invention.
Claims (2)
1. heat radiating fin structure; Comprise heat sink body, said heat sink body is installed on the circuit board, it is characterized in that: said heat sink body is provided with the screw that is used for fixing electronic component; Said heat sink body bending is the L type; Said heat sink body lower end be provided with circuit board on the corresponding pin of inserting groove, said pin is two or more, said heat sink body lower end also be provided with circuit board on the groove that is complementary of protuberance.
2. a kind of heat radiating fin structure according to claim 1 is characterized in that, said pin is the lug pin, and said lug pin is symmetrical biconvex ear pin in both sides or one-sided lug pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102550356A CN102427655A (en) | 2011-08-31 | 2011-08-31 | Radiating fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102550356A CN102427655A (en) | 2011-08-31 | 2011-08-31 | Radiating fin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102427655A true CN102427655A (en) | 2012-04-25 |
Family
ID=45961583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102550356A Pending CN102427655A (en) | 2011-08-31 | 2011-08-31 | Radiating fin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102427655A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793599A (en) * | 2017-01-10 | 2017-05-31 | 无锡凌博电子技术有限公司 | Controller for electric vehicle and its assembly method |
| CN108092109A (en) * | 2017-12-25 | 2018-05-29 | 芜湖宏景电子股份有限公司 | A kind of radio cooling fin for installing ISO sockets |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200533A (en) * | 2002-12-20 | 2004-07-15 | Suzuka Fuji Xerox Co Ltd | Heat radiation structure of device |
| CN201001251Y (en) * | 2007-01-19 | 2008-01-02 | 深圳创维－Rgb电子有限公司 | Heat radiating device |
| CN201260286Y (en) * | 2008-10-06 | 2009-06-17 | 青岛海信电器股份有限公司 | Heat radiator and circuit board |
| CN201263283Y (en) * | 2008-09-22 | 2009-06-24 | 深圳创维－Rgb电子有限公司 | Heat radiator |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN201623949U (en) * | 2010-01-28 | 2010-11-03 | 深圳市同洲电子股份有限公司 | Radiator for electronic component |
| CN202206709U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Bent heat-insulating fin structure |
-
2011
- 2011-08-31 CN CN2011102550356A patent/CN102427655A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200533A (en) * | 2002-12-20 | 2004-07-15 | Suzuka Fuji Xerox Co Ltd | Heat radiation structure of device |
| CN201001251Y (en) * | 2007-01-19 | 2008-01-02 | 深圳创维－Rgb电子有限公司 | Heat radiating device |
| CN201263283Y (en) * | 2008-09-22 | 2009-06-24 | 深圳创维－Rgb电子有限公司 | Heat radiator |
| CN201260286Y (en) * | 2008-10-06 | 2009-06-17 | 青岛海信电器股份有限公司 | Heat radiator and circuit board |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN201623949U (en) * | 2010-01-28 | 2010-11-03 | 深圳市同洲电子股份有限公司 | Radiator for electronic component |
| CN202206709U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Bent heat-insulating fin structure |
Non-Patent Citations (2)
| Title |
|---|
| 三源金属制品: "散热片", 《福建省三源金属制品有限公司》 * |
| 互动百科: "散热片坯料", 《互动百科》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793599A (en) * | 2017-01-10 | 2017-05-31 | 无锡凌博电子技术有限公司 | Controller for electric vehicle and its assembly method |
| CN106793599B (en) * | 2017-01-10 | 2023-11-10 | 无锡凌博电子技术股份有限公司 | Electric vehicle controller and assembly method thereof |
| CN108092109A (en) * | 2017-12-25 | 2018-05-29 | 芜湖宏景电子股份有限公司 | A kind of radio cooling fin for installing ISO sockets |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120425 |