CN202206709U - Bent heat-insulating fin structure - Google Patents

Bent heat-insulating fin structure Download PDF

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Publication number
CN202206709U
CN202206709U CN2011203239497U CN201120323949U CN202206709U CN 202206709 U CN202206709 U CN 202206709U CN 2011203239497 U CN2011203239497 U CN 2011203239497U CN 201120323949 U CN201120323949 U CN 201120323949U CN 202206709 U CN202206709 U CN 202206709U
Authority
CN
China
Prior art keywords
heat
main body
insulating fin
circuit board
heat sink
Prior art date
Application number
CN2011203239497U
Other languages
Chinese (zh)
Inventor
陈泉留
Original Assignee
昆山锦泰电子器材有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山锦泰电子器材有限公司 filed Critical 昆山锦泰电子器材有限公司
Priority to CN2011203239497U priority Critical patent/CN202206709U/en
Application granted granted Critical
Publication of CN202206709U publication Critical patent/CN202206709U/en

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Abstract

The utility model discloses a bent heat-insulating fin structure which comprises a heat-insulating fin main body. The heat-insulating fin main body is arranged on a circuit board. The bent heat-insulating fin structure is characterized in that the heat-insulating fin main body is provided with a screw hole for fixing an electronic element, two ends of the heat-insulating fin main body are bent in the shape of L, a connecting pin corresponding to an insertion slot on the circuit board is arranged at the lower end of the heat-insulating main body, and the lower ends of the bent parts of two ends and a middle part of the heat-insulating fin main body are respectively provided with at least one connecting pin. The bent heat-insulating fin structure disclosed by the utility model is mainly applied to auxiliary heat insulation of the circuit board and has the advantages of simple structure, saved space, convenience for installation, good heat insulation, high stability and strong applicability.

Description

A kind of bending heat radiating fin structure

Technical field

The utility model belongs to circuit board heat radiation field, particularly a kind of bending heat radiating fin structure.

Background technology

On the circuit board owing to integrated a large amount of electronic components; Can discharge a large amount of heats during work, cause the circuit board temperature to raise, the too high job stability that can influence electronic component of temperatures at localized regions; Therefore need to improve the radiating effect of circuit board; Reduce working temperature, guarantee its stability, increase the service life.

Common radiating mode is a finned on circuit board, through the heat fast Absorption of fin with circuit board, and through its radiating surface heat transferred is gone out; Thereby reach cooling-down effect, but traditional fin shape is merely the plane of a full wafer, the area of its radiating effect and radiating surface is directly proportional; Strengthen radiating effect if desired, then radiating surface need be to expansion all around, and the electronic component to the circuit board upper periphery has interference easily; It installs and also to receive the restriction that electronic component is arranged on the circuit board, and traditional fin also has upright chip, but its easy unbalance stress and to two tilt; Tilt and to have influence on the electronic devices and components of periphery when excessive; And the installation of traditional heat-dissipating sheet mainly through screw on circuit board, or also need weld operation inconvenience and easy-maintaining not with circuit board.

Summary of the invention

The utility model technical problem to be solved is to overcome the deficiency that exists in the prior art, provides a kind of simple in structure, saves the space, and easy to assembly, thermal diffusivity is good, the high and adaptable a kind of bending heat radiating fin structure of stability.

For solving the problems of the technologies described above; The utility model provides a kind of bending heat radiating fin structure, comprises heat sink body, and said heat sink body is installed on the circuit board; It is characterized in that: said heat sink body is provided with the screw that is used for fixing electronic component; The equal bending in said heat sink body two ends is the L type, said heat sink body lower end be provided with circuit board on the corresponding pin of inserting groove, the bending part at said heat sink body two ends and the lower end of pars intermedia all are provided with a pin at least.The two ends bending of heat sink body is the L type, and not only more flexible than traditional upright chip fin in the utilization in space, adaptability is stronger; And it is more stable that the L type bending at two ends makes heat sink body be assemblied on the circuit board structure, and side direction can obtain to support, can run-off the straight or distortion; Stability is better; Use pin to be connected to make and install more conveniently, dismantle also simplyr during maintenance, reduced workload with the inserting groove of circuit board; Screw on the heat sink body is used for fixing electronic component, has expanded the usability of fin.

2. a kind of bending heat radiating fin structure according to claim 1, it is characterized in that: the screw on the said heat sink body has two rows.Two row's screws are used to install the electronic component of differing heights demand, improve the adaptability of heat sink body.

The beneficial effect that the utility model reached:

Simple in structure, save the space, easy to assembly, thermal diffusivity is good, and stable height and adaptability are strong.

Description of drawings

Fig. 1 is the structural representation of the utility model one embodiment;

Fig. 2 is the structural representation of another embodiment of the utility model.

Embodiment

Below in conjunction with accompanying drawing the utility model is further described.

Like Fig. 1, shown in Figure 2; Heat sink body 1 two ends all are bent into the L type; Its wrap direction can be bending in the same way (like Fig. 1) or reverse bending (like Fig. 2), and its heat sink body 1 lower end is provided with three pins 2, lays respectively at the bending part at heat sink body 1 two ends and the lower end of pars intermedia; Said heat sink body 1 is provided with two row's screws 3, so that the electronic component of differing heights demand can be installed on the same heat sink body simultaneously.

The utility model is mainly used in circuit board is carried out auxiliary heat dissipation, and it is simple in structure, saves the space, and easy to assembly, thermal diffusivity is good, and stable height and adaptability are strong.

Above embodiment limits the utility model never in any form, every above embodiment is made with the equivalent transformation mode other improve and use, all belong to the protection range of the utility model.

Claims (2)

1. bending heat radiating fin structure; Comprise heat sink body; Said heat sink body is installed on the circuit board, it is characterized in that: said heat sink body is provided with the screw that is used for fixing electronic component, and the equal bending in said heat sink body two ends is the L type; Said heat sink body lower end be provided with circuit board on the corresponding pin of inserting groove, the bending part at said heat sink body two ends and the lower end of pars intermedia all are provided with a pin at least.
2. a kind of bending heat radiating fin structure according to claim 1, it is characterized in that: the screw on the said heat sink body has two rows.
CN2011203239497U 2011-08-31 2011-08-31 Bent heat-insulating fin structure CN202206709U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203239497U CN202206709U (en) 2011-08-31 2011-08-31 Bent heat-insulating fin structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203239497U CN202206709U (en) 2011-08-31 2011-08-31 Bent heat-insulating fin structure

Publications (1)

Publication Number Publication Date
CN202206709U true CN202206709U (en) 2012-04-25

Family

ID=45970798

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203239497U CN202206709U (en) 2011-08-31 2011-08-31 Bent heat-insulating fin structure

Country Status (1)

Country Link
CN (1) CN202206709U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102427655A (en) * 2011-08-31 2012-04-25 昆山锦泰电子器材有限公司 Radiating fin structure
CN102427697A (en) * 2011-08-31 2012-04-25 昆山锦泰电子器材有限公司 Bending radiating fin structure
CN104604353B (en) * 2012-09-07 2017-07-14 Lg伊诺特有限公司 Heat radiation member, radiant heat circuit board and heat abstractor encapsulation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102427655A (en) * 2011-08-31 2012-04-25 昆山锦泰电子器材有限公司 Radiating fin structure
CN102427697A (en) * 2011-08-31 2012-04-25 昆山锦泰电子器材有限公司 Bending radiating fin structure
CN104604353B (en) * 2012-09-07 2017-07-14 Lg伊诺特有限公司 Heat radiation member, radiant heat circuit board and heat abstractor encapsulation
US10028371B2 (en) 2012-09-07 2018-07-17 Lg Innotek Co., Ltd. Heat radiation member, heat radiation circuit board, and heat emission device package

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120425

Termination date: 20120831

C17 Cessation of patent right