CN102307453A - U-shaped bent cooling fin - Google Patents
U-shaped bent cooling fin Download PDFInfo
- Publication number
- CN102307453A CN102307453A CN201110255042A CN201110255042A CN102307453A CN 102307453 A CN102307453 A CN 102307453A CN 201110255042 A CN201110255042 A CN 201110255042A CN 201110255042 A CN201110255042 A CN 201110255042A CN 102307453 A CN102307453 A CN 102307453A
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- CN
- China
- Prior art keywords
- cooling fin
- radiating surface
- fixing
- circuit board
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a U-shaped bent cooling fin which comprises a cooling fin main body and is characterized in that the cooling fin main body comprises a radiating surface, a fixing surface and a connecting surface, wherein the radiating surface and the fixing surface are respectively connected with the two opposite ends of the connecting surface; and the radiating surface, the connecting surface and the fixing surface are mutually connected so as to form a flat-bottom U-shaped body, the fixing surface is provided with a fixing screw hole, and a screw hole is arranged on the radiating surface and used for fixing an electronic component. The cooling fin provided by the invention is mainly used for carrying out auxiliary heat dissipation on a circuit board and has the advantages that the structure is simple, the space is saved, the installation is convenient, the heat dissipation effect is good, and the cooling fin is especially suitable for heat dissipation at edges of the circuit board.
Description
Technical field
The invention belongs to circuit board heat radiation field, particularly a kind of U type bending fin.
Background technology
On the circuit board owing to integrated a large amount of electronic components; Can discharge a large amount of heats during work; Cause the circuit board temperature to raise; The too high job stability that can influence electronic component of temperatures at localized regions; Therefore need to improve the radiating effect of circuit board; Reduce working temperature, guarantee its stability, increase the service life.
Common radiating mode is a finned on circuit board; Through the heat fast Absorption of fin with circuit board; And heat transferred is gone out through its radiating surface; Thereby reach cooling-down effect; Traditional fin shape is the plane of a full wafer; Directly be fixed on the circuit board through screw; Simultaneously can on fin, add electronic components, electronic component is dispelled the heat, but traditional heat radiating fin structure is too simple; It is too big on electric hot plate, to take up space; It is bigger that limitation is installed, and its stable installation property is also relatively poor, especially when fin is installed in board edge; Because of installing space on the circuit board limited; Usually the part fin is stretched out circuit board, fin has only part to link to each other with circuit board, and gravity distributes uneven; Be easy to generate loosening, poor stability.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiency that exists in the prior art, provides a kind of simple in structure, saves the space, the U type bending fin that is used for the heat radiation of board edge zone of easy for installation and good heat dissipation effect.
For solving the problems of the technologies described above; The present invention provides a kind of U type bending fin; Comprise heat sink body; It is characterized in that: said heat sink body comprises radiating surface, stationary plane and joint face; Said radiating surface is connected with the opposite end of joint face respectively with stationary plane; Said radiating surface, joint face and stationary plane interconnect and constitute flat U type, and said stationary plane is provided with fixing threaded hole, and said radiating surface is provided with the screw that is used for fixing electronic component.The heat sink body of flat U type bending structure is simple in structure, can be fastened in board edge, and is easy for installation, and the heat sink body part can not stretched out the circuit board outside, saves the space, and electronic component can be installed on the radiating surface good heat dissipation effect through screw.
Aforesaid U type bending fin is characterized in that, the said heat sink body structure that is formed in one.The heat sink body simple and stable structure of integrated formed structure.
Aforesaid U type bending fin is characterized in that said heat sink body is copper or aluminum.The heat sink body radiating effect of copper or aluminum is better.
The beneficial effect that the present invention reached:
Simple in structure, save the space, easy for installation, good heat dissipation effect and be particularly useful for the heat radiation of board edge zone.
Description of drawings
Fig. 1 has assembled the structural representation behind the electronic component for the present invention.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing.
As shown in Figure 1; The heat sink body of U type bending fin is made up of radiating surface 1, joint face 2 and stationary plane 3; Radiating surface 1 is connected with the opposite end of joint face 2 respectively with stationary plane 3; Radiating surface 1, joint face 2 and stationary plane 3 be one-body molded to be flat U type; Radiating surface 1 is provided with the screw 5 that is used for fixing electronic component 4; Stationary plane 3 is provided with fixing threaded hole 6, fixes through screw and circuit board.
Directly U type bending fin is fastened in board edge during use; Radiating surface 1 is close to circuit board, is screwed into screw from the below of stationary plane 3, through being screwed into of screw circuit board and radiating surface 1 is fitted tightly; Guarantee stable installation property, electronic component 4 is installed on the radiating surface through screw 7.
The present invention is mainly used in circuit board is carried out auxiliary heat dissipation, and it is simple in structure, saves the space, and is easy for installation, good heat dissipation effect and be particularly useful for the heat radiation of board edge zone.
Above embodiment limits the present invention never in any form, and every other improvement and application that above embodiment is made with the equivalent transformation mode all belongs to protection scope of the present invention.
Claims (3)
1.U type bending fin; Comprise heat sink body; It is characterized in that: said heat sink body comprises radiating surface, stationary plane and joint face; Said radiating surface is connected with the opposite end of joint face respectively with stationary plane; Said radiating surface, joint face and stationary plane interconnect and constitute flat U type; Said stationary plane is provided with fixing threaded hole, and said radiating surface is provided with the screw that is used for fixing electronic component.
2. U type bending fin according to claim 1 is characterized in that, the said heat sink body structure that is formed in one.
3. U type bending fin according to claim 2 is characterized in that said heat sink body is copper or aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255042A CN102307453A (en) | 2011-08-31 | 2011-08-31 | U-shaped bent cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255042A CN102307453A (en) | 2011-08-31 | 2011-08-31 | U-shaped bent cooling fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102307453A true CN102307453A (en) | 2012-01-04 |
Family
ID=45381233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110255042A Pending CN102307453A (en) | 2011-08-31 | 2011-08-31 | U-shaped bent cooling fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102307453A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020015273A1 (en) * | 2018-07-19 | 2020-01-23 | 广州视源电子科技股份有限公司 | Support structure, heat dissipation assembly using support structure, and electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135756A (en) * | 1999-11-02 | 2001-05-18 | Tdk Corp | Cooling fins |
| KR20080027027A (en) * | 2006-09-22 | 2008-03-26 | 우리산업 주식회사 | Fet mounting structure of blower motor |
| CN101511159A (en) * | 2008-02-14 | 2009-08-19 | 华硕电脑股份有限公司 | Radiating structure and use method thereof |
| CN201709073U (en) * | 2010-04-21 | 2011-01-12 | 东莞市艾炜特电子有限公司 | Heat sink |
| CN201830606U (en) * | 2010-10-20 | 2011-05-11 | 康佳集团股份有限公司 | Radiating fin |
| CN202206716U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | U-shaped bending radiating fin |
-
2011
- 2011-08-31 CN CN201110255042A patent/CN102307453A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135756A (en) * | 1999-11-02 | 2001-05-18 | Tdk Corp | Cooling fins |
| KR20080027027A (en) * | 2006-09-22 | 2008-03-26 | 우리산업 주식회사 | Fet mounting structure of blower motor |
| CN101511159A (en) * | 2008-02-14 | 2009-08-19 | 华硕电脑股份有限公司 | Radiating structure and use method thereof |
| CN201709073U (en) * | 2010-04-21 | 2011-01-12 | 东莞市艾炜特电子有限公司 | Heat sink |
| CN201830606U (en) * | 2010-10-20 | 2011-05-11 | 康佳集团股份有限公司 | Radiating fin |
| CN202206716U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | U-shaped bending radiating fin |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020015273A1 (en) * | 2018-07-19 | 2020-01-23 | 广州视源电子科技股份有限公司 | Support structure, heat dissipation assembly using support structure, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120104 |