CN104952817A - Tower-type heat radiating component for computer CPU (central processing unit) - Google Patents
Tower-type heat radiating component for computer CPU (central processing unit) Download PDFInfo
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- CN104952817A CN104952817A CN201510257393.9A CN201510257393A CN104952817A CN 104952817 A CN104952817 A CN 104952817A CN 201510257393 A CN201510257393 A CN 201510257393A CN 104952817 A CN104952817 A CN 104952817A
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- heat
- tower
- heat radiating
- radiating
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Abstract
The invention discloses a tower-type heat radiating component for a computer CPU (central processing unit). The tower-type heat radiating component comprises a heat radiating baseplate, a mounting support which extends outwards is arranged at each of four corners of the heat radiating baseplate, a protrusion positioning frame matched with a CPU module is arranged in the middle of the front of the heat radiating baseplate, a plurality of heat radiating fins are uniformly arranged on the back of the heat radiating baseplate along an air draft direction, a tower-type pointed top is formed on the upper portion of each tower-type pointed top, a heat-conducting supporting plate is arranged on each pointed top, multiple arc-shaped embedding grooves are formed in each heat-conducting supporting plate side by side, and a heat-radiating copper pipe is embedded in each arc-shaped embedding groove. The tower-type heat radiating component is simple and reasonable in structure and convenient to mount and use; a heat radiating fin set is designed to be tower-shaped, so that heat emitted by the CPU module can be transmitted to the heat-radiating copper pipes efficiently and quickly along a heat conducting part from bottom to top and is less prone to accumulating, heat conducting efficiency is improved effectively, and heat radiating effect of the CPU module is improved.
Description
Technical field
The present invention relates to computer fittings field, be specially the tower radiating subassembly of a kind of computer CPU.
Background technology
The CPU of computer is the main heat-generating units of computer equipment, needs to carry out effective heat radiation auxiliary, to ensure the runnability of computer.Existing cpu heat radiating effect is not good, and between its heat conduction original paper and CPU module, heat transfer is comparatively slow, and heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, radiating efficiency is not high.
Summary of the invention
The object of this invention is to provide the tower radiating subassembly of a kind of computer CPU, not good to solve cpu heat radiating effect traditional in prior art, between its heat conduction original paper and CPU module, heat transfer is slower, heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, the problem that radiating efficiency is not high.
For achieving the above object, the technical solution used in the present invention is:
The tower radiating subassembly of a kind of computer CPU, it is characterized in that: include radiating bottom plate, described radiating bottom plate corner is provided with outward extending mounting bracket, the positive Middle face of described radiating bottom plate is provided with the protruding posting matched with CPU module, the back side is evenly provided with some fin along exhausting direction, tower pinnacle is formed at described fin top, and on pinnacle, be provided with heat conduction supporting plate, described heat conduction supporting plate is provided with multiple arc caulking groove side by side, in described arc caulking groove, is embedded with heat dissipation copper pipe.
The described tower radiating subassembly of a kind of computer CPU, is characterized in that: described heat dissipation copper pipe one end extends laterally, and is provided with heat dissipation grid.
Beneficial effect of the present invention is:
The present invention is simple and reasonable, easy to install, adopt and design in the radiating fin group in turriform, the heat that CPU module is sent efficiently can conduct to heat dissipation copper pipe fast from bottom to top along conducting-heat elements, heat not easily gathers, effectively improve heat transfer efficiency, improve the radiating effect of CPU module.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As shown in Figure 1, the tower radiating subassembly of a kind of computer CPU, include radiating bottom plate 1, radiating bottom plate 1 four jiaos is provided with outward extending mounting bracket 2, and the positive Middle face of radiating bottom plate 1 is provided with the protruding posting 3 matched with CPU module, and the back side is evenly provided with some fin 4 along exhausting direction, tower pinnacle is formed at fin 4 top, and on pinnacle, be provided with heat conduction supporting plate 5, heat conduction supporting plate 5 is provided with side by side multiple arc caulking groove, in arc caulking groove, is embedded with heat dissipation copper pipe 6.
Heat dissipation copper pipe 6 one end extends laterally, and is provided with heat dissipation grid 7.
Claims (2)
1. the tower radiating subassembly of computer CPU, it is characterized in that: include radiating bottom plate, described radiating bottom plate corner is provided with outward extending mounting bracket, the positive Middle face of described radiating bottom plate is provided with the protruding posting matched with CPU module, the back side is evenly provided with some fin along exhausting direction, tower pinnacle is formed at described fin top, and on pinnacle, be provided with heat conduction supporting plate, described heat conduction supporting plate is provided with multiple arc caulking groove side by side, in described arc caulking groove, is embedded with heat dissipation copper pipe.
2. the tower radiating subassembly of a kind of computer CPU according to claim 1, is characterized in that: described heat dissipation copper pipe one end extends laterally, and is provided with heat dissipation grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257393.9A CN104952817A (en) | 2015-05-20 | 2015-05-20 | Tower-type heat radiating component for computer CPU (central processing unit) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257393.9A CN104952817A (en) | 2015-05-20 | 2015-05-20 | Tower-type heat radiating component for computer CPU (central processing unit) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104952817A true CN104952817A (en) | 2015-09-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510257393.9A Pending CN104952817A (en) | 2015-05-20 | 2015-05-20 | Tower-type heat radiating component for computer CPU (central processing unit) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104952817A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108536255A (en) * | 2017-03-02 | 2018-09-14 | 李寅菡 | Cpu radiating and wind guiding systems |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5873406A (en) * | 1997-11-04 | 1999-02-23 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation device |
| TW525800U (en) * | 2000-08-11 | 2003-03-21 | Taiwan Cooler Tech Co | Structure improvement of CPU heat dissipation plate |
| CN1517830A (en) * | 2003-01-14 | 2004-08-04 | 马・研究公司 | Detachable heat dissipating for internal memory module of computer |
| CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
| CN102332437A (en) * | 2011-10-25 | 2012-01-25 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
| CN202870718U (en) * | 2012-08-29 | 2013-04-10 | 深圳市威斯纳科技有限公司 | Passive central processing unit (CPU) heat dissipation structure |
| CN103135715A (en) * | 2011-12-01 | 2013-06-05 | 英业达股份有限公司 | Cooling module |
-
2015
- 2015-05-20 CN CN201510257393.9A patent/CN104952817A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5873406A (en) * | 1997-11-04 | 1999-02-23 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation device |
| TW525800U (en) * | 2000-08-11 | 2003-03-21 | Taiwan Cooler Tech Co | Structure improvement of CPU heat dissipation plate |
| CN1517830A (en) * | 2003-01-14 | 2004-08-04 | 马・研究公司 | Detachable heat dissipating for internal memory module of computer |
| CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
| CN102332437A (en) * | 2011-10-25 | 2012-01-25 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
| CN103135715A (en) * | 2011-12-01 | 2013-06-05 | 英业达股份有限公司 | Cooling module |
| CN202870718U (en) * | 2012-08-29 | 2013-04-10 | 深圳市威斯纳科技有限公司 | Passive central processing unit (CPU) heat dissipation structure |
Non-Patent Citations (3)
| Title |
|---|
| 刘瑞新: "《多媒体电脑组装与维护短训教程》", 31 May 2006, 北京：机械工业出版社 * |
| 易建勋: "《计算机维修技术 第3版》", 31 January 2014, 清华大学出版社 * |
| 电脑报: "《装机圣手 2007全新版》", 31 March 2007, 汕头大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108536255A (en) * | 2017-03-02 | 2018-09-14 | 李寅菡 | Cpu radiating and wind guiding systems |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150930 |