CN202307863U - Radiator for vertical MOS-transistor-type electronic component - Google Patents
Radiator for vertical MOS-transistor-type electronic component Download PDFInfo
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- CN202307863U CN202307863U CN2011204387195U CN201120438719U CN202307863U CN 202307863 U CN202307863 U CN 202307863U CN 2011204387195 U CN2011204387195 U CN 2011204387195U CN 201120438719 U CN201120438719 U CN 201120438719U CN 202307863 U CN202307863 U CN 202307863U
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- fixed block
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Abstract
Disclosed is a radiator for vertical MOS-transistor-type electronic component, comprising an integrally formed substrate (1), radiating fins (2), and a fixed block (3), wherein the substrate is of a rectangular shape; the radiating fins (2) are arranged in the same side of the substrate (1) in a uniformly spaced manner; the fixed block (3) is arranged between two of the radiating fins (2); the bottom of the substrate (1) is provided with two welding columns (4); the substrate (1) and the fixed block (3) are cooperatively provided with at least one installing hole (5); and the back side of the substrate (1) is provided with a ceramic chip (6) at a position corresponding to every installing hole (5). The radiator, after being fixedly installed to the electronic component, is welded upon a PCB together with the electronic component via the welding columns, thereby ensuring the excellent applying to the electronic component and satisfying the heat radiating requirements. The radiator features simple processing technology, low cost, easy operation, and fool proofing design, and is applicable to mass industrial production.
Description
Technical field
The utility model relates to a kind of heat dissipation equipment, particularly relates to a kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component.
Background technology
As everyone knows, high temperature is the formidable enemy of integrated circuit, and high temperature not only can cause the Circuits System operation unstable, and shorten useful life, even some parts is burnt.Radiator be used for conducting, the general designation of a series of devices of release heat, most radiators absorb heat through contact with the heat generating components surface, again through the whole bag of tricks with heat transferred at a distance, completion is dispelled the heat.
Extensively adopt metal-oxide-semiconductor electron-like element in the high-power medical power supply; Temperature is very important performance parameter of this class component, and it can greatly have influence on service behaviour, and the structure of metal-oxide-semiconductor class component is as shown in Figure 4; In the PCB of high-power medical power supply circuit; It will stand on that PCB goes up and through pin (7) and pcb board firm welding, so the heat abstractor of this type electronic component need select rational mounting process, and guarantee that good applying dispels the heat.
The utility model content
The purpose of the utility model promptly is to overcome the deficiency of present technology, provide that a kind of processing technology is simple, cost is low, easy operating, can fool proof, be applicable to the radiator that is used for metal-oxide-semiconductor class erect type electronic component of industrial mass production.
The utility model is realized through following technical scheme: a kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component; Comprise the substrate, fin and the fixed block that are wholely set; Described substrate is rectangle, and described fin is with a side that is arranged at interval substrate, and fixed block is arranged on wherein between two fin; The below of substrate is provided with welding column; Be equipped with at least one installing hole on substrate and the fixed block, the position of corresponding each installing hole in the back side of substrate all is provided with potsherd, and corresponding installing hole place is provided with perforation on the potsherd.
Described fin is elongated.
The height of said fixed block is lower than the height of fin.
Described welding column adopts brass plating mist tin formula welding column.
The beneficial effect of the utility model is: after the electronic component fixed installation; Be welded on the pcb board together through welding column and electronic component; Guaranteed and electronic component between good applying; Satisfy the heat radiation requirement, the utility model has also that processing technology is simple, cost is low, easy operating, can fool proof and be applicable to the advantage of industrial mass production.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the rearview of the utility model;
Fig. 3 is the cutaway view of the utility model;
Fig. 4 is the structural representation of metal-oxide-semiconductor class erect type electronic component;
Fig. 5 is the scheme of installation of the utility model and metal-oxide-semiconductor class erect type electronic component;
Among the figure, 1-substrate, 2-fin, 3-fixed block, 4-welding column, 5-installing hole, 6-potsherd, 7-pin, 8-electronic element, 9-screw.
Embodiment
Below in conjunction with embodiment the utility model is done further to specify, but the structure of the utility model is not limited only to following examples:
Like Fig. 1, Fig. 2, shown in Figure 3; A kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component comprises the substrate 1, fin 2 and the fixed block 3 that are wholely set, and described substrate 1 is rectangle; Described fin 2 is with a side that is arranged on substrate 1 at interval; Fixed block 3 is arranged on wherein between two fin 2, and the below of substrate 1 is provided with welding column 4, is equipped with at least one installing hole 5 on substrate 1 and the fixed block 3; The position of corresponding each installing hole 5 in the back side of substrate 1 all is provided with potsherd 6, and potsherd 6 corresponding installing holes 5 places are provided with perforation.
Described fin 2 is elongated.
The height of said fixed block 3 is lower than the height of fin 2, is convenient to heat radiation.
Described welding column 4 adopts brass plating mist tin formula welding column, is convenient to scolding tin.
The installation procedure of the utility model: like Fig. 4, shown in Figure 5; Electronic element 8 is placed on potsherd 6 positions; Pass respectively in potsherd 6, the electronic element 8 screw-in installing holes 5 with screw 9, be about to electronic element 8 and be fixed on the substrate 1, and electronic element 8 has good applying with substrate 1; Be weldingly fixed on the pcb board through welding column 4 and pin 7 again; Promptly accomplish and install, electronic element 8 heating backs are transmitted to this device through potsherd 6, dispel the heat through fin 2.
Claims (4)
1. radiator that is used for metal-oxide-semiconductor class erect type electronic component; It is characterized in that: comprise the substrate (1), fin (2) and the fixed block (3) that are wholely set; Described substrate (1) is rectangle, and described fin (2) is with a side that is arranged on substrate (1) at interval, and fixed block (3) is arranged on wherein between two fin (2); The below of substrate (1) is provided with welding column (4); Be equipped with at least one installing hole (5) on substrate (1) and the fixed block (3), the position of corresponding each installing hole in the back side of substrate (1) (5) all is provided with potsherd (6), and potsherd (6) is gone up corresponding installing hole (5) and located to be provided with perforation.
2. a kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component according to claim 1, it is characterized in that: described fin (2) is elongated.
3. a kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component according to claim 1 is characterized in that: the height of said fixed block (3) is lower than the height of fin (2).
4. a kind of radiator that is used for metal-oxide-semiconductor class erect type electronic component according to claim 1 is characterized in that: described welding column (4) adopts brass plating mist tin formula welding column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204387195U CN202307863U (en) | 2011-11-08 | 2011-11-08 | Radiator for vertical MOS-transistor-type electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204387195U CN202307863U (en) | 2011-11-08 | 2011-11-08 | Radiator for vertical MOS-transistor-type electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202307863U true CN202307863U (en) | 2012-07-04 |
Family
ID=46376704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204387195U Expired - Fee Related CN202307863U (en) | 2011-11-08 | 2011-11-08 | Radiator for vertical MOS-transistor-type electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202307863U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110085561A (en) * | 2019-06-06 | 2019-08-02 | 上海金卫实业有限公司 | A kind of Novel MOS tube and preparation method thereof |
| CN115741080A (en) * | 2022-11-17 | 2023-03-07 | 广州普今电子股份有限公司 | Lock MOS pipe and beat high pressure multi-functional frock as an organic whole |
-
2011
- 2011-11-08 CN CN2011204387195U patent/CN202307863U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110085561A (en) * | 2019-06-06 | 2019-08-02 | 上海金卫实业有限公司 | A kind of Novel MOS tube and preparation method thereof |
| CN115741080A (en) * | 2022-11-17 | 2023-03-07 | 广州普今电子股份有限公司 | Lock MOS pipe and beat high pressure multi-functional frock as an organic whole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20131108 |