CN203645910U - Heat-dissipating device for PCB and power electronic device - Google Patents
Heat-dissipating device for PCB and power electronic device Download PDFInfo
- Publication number
- CN203645910U CN203645910U CN201320763983.5U CN201320763983U CN203645910U CN 203645910 U CN203645910 U CN 203645910U CN 201320763983 U CN201320763983 U CN 201320763983U CN 203645910 U CN203645910 U CN 203645910U
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- electronic device
- power electronic
- pcb board
- heat
- hole
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Abstract
The utility model discloses a heat-dissipating device for a PCB and a power electronic device. The heat-dissipating device comprises the power electronic device, the PCB, and a heat-dissipating metallic base block which are successively arranged from top to bottom. A metallic heat-dissipating block is arranged at the bottom of the power electronic device. A metallic heat-dissipating block carried by the power electronic device itself is placed above the PCB. The top face and the bottom face of the PCB are both coated with tin coating layers. A plurality of through holes are formed in the area of the tin coating layers of the PCB and are arranged in a rectangular or polygonal array manner. Heat-dissipating adhesive is arranged on the bottom surface of the tin coating layer on the bottom of the PCB and is in contact with the top surface of the heat-dissipating metallic base block. By the above manner, the heat-dissipating device for the PCB and the power electronic device is low in cost, simple in technology, and reliable in heat-dissipating performance.
Description
Technical field
The utility model relates to a kind of heat abstractor of electronic device, especially relates to a kind of pcb board and power electronic device heat abstractor.
Background technology
In electronic circuit, the method for power electronic device heat radiation is generally to adopt the heat radiation forms such as radiator fan, heat dissipation metal piece, thermally induced flow pipe, but above electronic power components radiating mode cost is high, takies circuit board space large.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of pcb board and power electronic device heat abstractor, and this pcb board and power electronic device heat abstractor cost are low, and technique is simple, heat dispersion is reliable.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of pcb board and power electronic device heat abstractor are provided, it comprises the power electronic device setting gradually from top to bottom, pcb board and heat radiating metal matrix, the bottom of described power electronic device is self-contained heat dissipation metal piece, described heat dissipation metal piece is positioned at the top of described pcb board, the end face of described pcb board and bottom surface are all laid with tin coating, the described tin coating region division of described pcb board has multiple through holes, described multiple through hole is arranged with rectangle or polygon array way, on the bottom surface of the described bottom surface tin coating of described pcb board, be provided with thermal paste, the top plane contact of described thermal paste and described heat radiating metal matrix.
In preferred embodiment of the utility model, on the hole wall of described through hole, be laid with through hole cover tin.
In preferred embodiment of the utility model, the diameter of described through hole is 0.1mm～1.0mm.
In preferred embodiment of the utility model, a part for described thermal paste enters in described multiple through hole and forms multiple thermal paste heating columns, and the end face of described multiple thermal paste heating columns contacts with described heat dissipation metal piece.
In preferred embodiment of the utility model, between described thermal paste and described heat radiating metal matrix, be fixedly connected with by securing member.
The beneficial effects of the utility model are: this pcb board and power electronic device heat abstractor cost are low, and technique is simple, heat dispersion is reliable.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of the utility model pcb board and power electronic device heat abstractor.
Fig. 2 is the matrix arrangements figure of through hole in Fig. 1.
Fig. 3 is the structural representation of the thermal paste heating column in the utility model.
In figure, the mark of each parts is as follows: 1, power electronic device, 2, pcb board end face tin coating, 3, pcb board bottom surface tin coating, 4, heat radiating metal matrix, 5, heat dissipation metal piece, 6, through hole, 7, pcb board, 8, securing member, 9, thermal paste, 10, through hole cover tin, 11, thermal paste heating column.
Embodiment
To the technical scheme in the utility model embodiment be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1 to Fig. 3, pcb board of the present utility model and power electronic device heat abstractor comprise the power electronic device 1 setting gradually from top to bottom, pcb board 7 and heat radiating metal matrix 4, the bottom of described power electronic device 1 is self-contained heat dissipation metal piece 5, described heat dissipation metal piece 5 is positioned at the top of described pcb board 7, it is pcb board end face tin coating 2 and pcb board bottom surface tin coating 3 that the end face of described pcb board 7 and bottom surface are all laid with tin coating, the described tin coating region division of described pcb board has multiple through holes 6, described multiple through hole 6 is arranged with rectangle or polygon array way, on the bottom surface of described pcb board bottom surface tin coating 3, be provided with thermal paste 9, the top plane contact of described thermal paste 9 and described heat radiating metal matrix 4.Heat dissipation metal piece 5 contacts with pcb board end face tin coating 2.
Preferably, on the hole wall of described through hole 6, be laid with through hole cover tin 10.
Preferably, the diameter of described through hole is 0.1mm～1.0mm.The diameter of through hole 6 is determined according to the watt level of power electronic device 1, and the power of power electronic device 1 is large, selects the large parameter of through hole 6 diameter; The power of power electronic device 1 is little, and this selects through hole 6 diameter small parameters.Also will consider pcb board 7 Mechanical Structure Strengths, BCB plate 7 Mechanical Structure Strengths are large simultaneously, and through hole 6 can be selected the large parameter of diameter, otherwise select through hole 6 diameter small parameters.
Preferably, a part for described thermal paste 9 enters the multiple thermal paste heating columns 11 of the interior formation of described multiple through hole 6, and the end face of described multiple thermal paste heating columns 11 contacts with described heat dissipation metal piece 5.
Preferably, between described thermal paste 9 and described heat radiating metal matrix 4, be fixedly connected with by securing member 8.Securing member 8 is screw or bolt etc.
Further, the heat that power electronic device 1 work produces conducts to heat dissipation metal piece 5, heat dissipation metal piece 5 is delivered to thermal paste 9 by thermal paste heating column 11 by heat again, transfer heat to heat radiating metal matrix 4 by thermal paste 9 again, the heat radiation producing when heat radiating metal matrix 4 is worked power electronic device 1, to atmosphere, reaches effect of power electronic device heat radiation.
In addition, pcb board 7 also can change similar plane, curved surface sheet material into, and the mode of processing through hole on plane or curved surface sheet material is dispelled the heat to power device.
Be different from prior art, pcb board of the present utility model and power electronic device heat abstractor cost are low, and technique is simple, heat dispersion is reliable.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. a pcb board and power electronic device heat abstractor, it is characterized in that: comprise the power electronic device setting gradually from top to bottom, pcb board and heat radiating metal matrix, the bottom of described power electronic device is self-contained heat dissipation metal piece, described heat dissipation metal piece is positioned at the top of described pcb board, the end face of described pcb board and bottom surface are all laid with tin coating, the described tin coating region division of described pcb board has multiple through holes, described multiple through hole is arranged with rectangle or polygon array way, on the bottom surface of the described bottom surface tin coating of described pcb board, be provided with thermal paste, the top plane contact of described thermal paste and described heat radiating metal matrix.
2. pcb board according to claim 1 and power electronic device heat abstractor, is characterized in that, is laid with through hole cover tin on the hole wall of described through hole.
3. pcb board according to claim 1 and power electronic device heat abstractor, is characterized in that, the diameter of described through hole is 0.1mm～1.0mm.
4. pcb board according to claim 1 and power electronic device heat abstractor, it is characterized in that, a part for described thermal paste enters in described multiple through hole and forms multiple thermal paste heating columns, and the end face of described multiple thermal paste heating columns contacts with described heat dissipation metal piece.
5. pcb board according to claim 1 and power electronic device heat abstractor, is characterized in that, between described thermal paste and described heat radiating metal matrix, is fixedly connected with by securing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320763983.5U CN203645910U (en) | 2013-11-29 | 2013-11-29 | Heat-dissipating device for PCB and power electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320763983.5U CN203645910U (en) | 2013-11-29 | 2013-11-29 | Heat-dissipating device for PCB and power electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203645910U true CN203645910U (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320763983.5U Expired - Fee Related CN203645910U (en) | 2013-11-29 | 2013-11-29 | Heat-dissipating device for PCB and power electronic device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203645910U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596357A (en) * | 2013-11-29 | 2014-02-19 | 沙洲职业工学院 | Radiator of PCB and power electronic device |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
| CN106993371A (en) * | 2017-06-01 | 2017-07-28 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
| CN107027237A (en) * | 2017-06-01 | 2017-08-08 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
| CN107426913A (en) * | 2017-06-01 | 2017-12-01 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
-
2013
- 2013-11-29 CN CN201320763983.5U patent/CN203645910U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596357A (en) * | 2013-11-29 | 2014-02-19 | 沙洲职业工学院 | Radiator of PCB and power electronic device |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
| CN106993371A (en) * | 2017-06-01 | 2017-07-28 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
| CN107027237A (en) * | 2017-06-01 | 2017-08-08 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
| CN107426913A (en) * | 2017-06-01 | 2017-12-01 | 深圳市金威源科技股份有限公司 | A kind of printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20171129 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |