CN201639904U - Heat radiating structure of heat generating element - Google Patents
Heat radiating structure of heat generating element Download PDFInfo
- Publication number
- CN201639904U CN201639904U CN2010200267607U CN201020026760U CN201639904U CN 201639904 U CN201639904 U CN 201639904U CN 2010200267607 U CN2010200267607 U CN 2010200267607U CN 201020026760 U CN201020026760 U CN 201020026760U CN 201639904 U CN201639904 U CN 201639904U
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- China
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- heater element
- radiator
- heat
- generating element
- circular hole
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Abstract
The utility model relates to the technical field of a heat radiator, in particular to a heat radiating structure utilizing a heat generating element to radiate heat, comprising a heat generating element and a heat radiator, wherein the heat radiator is in direct contact with the heat generating element. A PCB (Printed Circuit Board) is arranged between the heat radiator and the heat generating element. The PCB is provided with a circular hole. The upper surface of the heat radiator is provided with a protruding point corresponding to the circular hole, and the protruding point is in direct contact with the heat generating element through the circular hole. As the protruding point is in direct contact with the heat generating element, and the contact between the heat generating element and the protruding point is good, so that the heat radiation speed is good, and the heat radiating effect is good; and the aluminum circuit board is used to replace the traditional PCB, thereby decreasing the cost of the product.
Description
Technical field
The utility model relates to the heat sink technology field, a kind of radiator structure that is beneficial to the heater element heat radiation of more specifically saying so.
Background technology
Heater element radiator structures such as traditional diode, SMD electronic building brick, generally adopting aluminium matter circuit board is intermediary, the heat that heater element is produced is transmitted to fin through the peraluminous circuit board, reach the purpose of heat radiation, but the aluminium matter circuit board that this technology adopts costs an arm and a leg, and causes product cost too high.
Heater element radiator structures such as at present a lot of diodes, SMD electronic building brick, being metal solder between radiator and the heater element fixes, because the difference of material, be subjected to very big influence in the welding position pyroconductivity, the diffusion velocity of heat from the heater element to the radiator is slow excessively, radiating effect is not ideal enough, quickens heat dissipation element and wears out.
Also there is at present relevant research improving above-mentioned technology, in Chinese patents, application number: 200620065924.0, patent name: a kind of diode aluminium base, comprise the aluminium base plate body that directly contacts with diode, the surface that the aluminium base plate body contacts with diode is glued with pcb board, the aluminium base plate body is the male and fomale(M﹠F) that for the benefit of dispels the heat of diode face dorsad, on pcb board, have and be used for the circular hole that diode passes, aluminium base plate body surface is close to by circular hole in the diode bottom, and fixes by a dismountable fixing assembly spring leaf.This utility model is reaching better radiating effect, but aluminium base contacts defective tightness with diode, fix that the assembly spring leaf is installed at product, pitch than being easier in the transportation, cause aluminium base and diode to connect separating and can not dispel the heat, influence the useful life of diode.
The utility model content
The utility model provides the radiator structure of a kind of heater element by the salient point on the radiator directly contacts with radiator, has contact and good heat dissipation effect, the advantage that product cost is low.
The purpose of this utility model realizes by following technical measures:
A kind of heater element radiator structure, the radiator that it comprises heater element, directly contacts with heater element, be provided with pcb board between radiator and the heater element, pcb board is provided with circular hole, the position of the corresponding circular hole of described radiator upper surface is provided with salient point, and salient point directly contacts with heater element by circular hole.
Described radiator is the casting integrated moulding of aluminium sheet punching press, and radiator and pcb board are fixed by screw, and heater element and pcb board are fixing by welding.
Described heater element is a light-emitting diode.
Described heater element is the SMD electronic building brick.
The beneficial effects of the utility model:
A kind of heater element radiator structure, the radiator that it comprises heater element, directly contacts with heater element, be provided with pcb board between radiator and the heater element, pcb board is provided with circular hole, the position of the corresponding circular hole of described radiator upper surface is provided with salient point, and salient point directly contacts with heater element by circular hole.The salient point of radiator of the present utility model directly contacts with heater element by circular hole, and heater element contacts with salient point well, and radiating rate is fast, good heat dissipation effect; And, reduced product cost with traditional PCB plate replacement aluminium matter circuit board.
Description of drawings
Fig. 1 is the structural representation of radiator of the present utility model;
Fig. 2 is a decomposition texture schematic diagram of the present utility model;
Fig. 3 is user mode figure of the present utility model.
Reference numeral
1---heater element 2---pcb board 3---circular hole
4---radiator 5---salient point
Embodiment
With the following Examples the utility model is further described:
The embodiment of a kind of heater element radiator structure of the present utility model as shown in Figure 1 to Figure 3, a kind of heater element radiator structure, the radiator 4 that it comprises heater element 1, directly contacts with heater element 1, be provided with pcb board 2 between radiator 4 and the heater element 1, pcb board 2 is provided with circular hole 3, the position of the corresponding circular hole 3 of described radiator 4 upper surfaces is provided with salient point 5, and salient point 5 directly contacts with heater element 1 by circular hole 3.
The salient point of radiator of the present utility model directly contacts with heater element by circular hole, and heater element contacts with salient point well, and radiating rate is fast, good heat dissipation effect; And, reduced product cost with traditional PCB plate replacement aluminium matter circuit board.
In addition, radiator 4 can also be fixed by rivet or adhesive agent with pcb board 2, and heater element 1 can also be fixed by adhesive agent with pcb board 2.
In the present embodiment, described heater element 1 is a light-emitting diode.In addition, heater element 1 can also be the SMD electronic building brick.The quantity of heater element 1 can be provided with as required, and heater element 1 and a circular hole 3, a salient point 5 are corresponding.In the present embodiment, each radiator 4 is provided with 5, pcb boards 2 of a salient point, and to have 3, pcb boards 2 of a plurality of circular holes corresponding with a plurality of radiator 4.
Above content only is preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (4)
1. heater element radiator structure, it comprises heater element (1), the radiator (4) that contacts with heater element (1), be provided with pcb board (2) between radiator (4) and the heater element (1), pcb board (2) is provided with circular hole (3), it is characterized in that: the position of the corresponding circular hole of described radiator (4) upper surface (3) is provided with salient point (5), and salient point (5) directly contacts with heater element (1) by circular hole (3).
2. a kind of heater element radiator structure according to claim 1, it is characterized in that: described radiator (4) is the casting integrated moulding of aluminium sheet punching press, radiator (4) is fixed by screw with pcb board (2), and heater element (1) is fixing by welding with pcb board (2).
3. a kind of heater element radiator structure according to claim 1 is characterized in that: described heater element (1) is a light-emitting diode.
4. a kind of heater element radiator structure according to claim 1 is characterized in that: described heater element (1) is the SMD electronic building brick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200267607U CN201639904U (en) | 2010-01-15 | 2010-01-15 | Heat radiating structure of heat generating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200267607U CN201639904U (en) | 2010-01-15 | 2010-01-15 | Heat radiating structure of heat generating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201639904U true CN201639904U (en) | 2010-11-17 |
Family
ID=43084412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200267607U Expired - Fee Related CN201639904U (en) | 2010-01-15 | 2010-01-15 | Heat radiating structure of heat generating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201639904U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401360A (en) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | High-power light emitting diode (LED) radiating structure |
| CN105081495A (en) * | 2014-05-22 | 2015-11-25 | 深圳市君瑞能电科技有限公司 | Novel radiator welding process method |
| CN106895378A (en) * | 2011-12-07 | 2017-06-27 | 株式会社神户制钢所 | LED illumination fin and its manufacture method |
| CN107666817A (en) * | 2016-07-29 | 2018-02-06 | 德昌电机(深圳)有限公司 | Controller assemblies, control box and blower fan |
| CN109519788A (en) * | 2018-12-14 | 2019-03-26 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
-
2010
- 2010-01-15 CN CN2010200267607U patent/CN201639904U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401360A (en) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | High-power light emitting diode (LED) radiating structure |
| CN106895378A (en) * | 2011-12-07 | 2017-06-27 | 株式会社神户制钢所 | LED illumination fin and its manufacture method |
| CN105081495A (en) * | 2014-05-22 | 2015-11-25 | 深圳市君瑞能电科技有限公司 | Novel radiator welding process method |
| CN107666817A (en) * | 2016-07-29 | 2018-02-06 | 德昌电机(深圳)有限公司 | Controller assemblies, control box and blower fan |
| CN107666817B (en) * | 2016-07-29 | 2021-05-25 | 德昌电机(深圳)有限公司 | Controller subassembly, control box and fan |
| CN109519788A (en) * | 2018-12-14 | 2019-03-26 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
| CN109519788B (en) * | 2018-12-14 | 2024-05-03 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20120115 |