CN106876554A - A kind of high-heat-dispersion LED surface-mounted integrated circuit - Google Patents
A kind of high-heat-dispersion LED surface-mounted integrated circuit Download PDFInfo
- Publication number
- CN106876554A CN106876554A CN201710241461.1A CN201710241461A CN106876554A CN 106876554 A CN106876554 A CN 106876554A CN 201710241461 A CN201710241461 A CN 201710241461A CN 106876554 A CN106876554 A CN 106876554A
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- China
- Prior art keywords
- heat
- circuit board
- conducting layer
- mounted integrated
- thermal column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000006185 dispersion Substances 0.000 title claims abstract description 18
- 239000002250 absorbent Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to circuit board technology field,A kind of especially high-heat-dispersion LED surface-mounted integrated circuit,Including circuit board,The circuit board is rectangular-shaped,Electronic component is installed on the circuit board,It is equidistant on the circuit board to offer one group of louvre,Thermal column is inserted with the louvre,The bottom of the thermal column passes through heat abstractor,The second heat-conducting layer is filled between the gap of the heat abstractor and circuit board lower surface,The top of the thermal column is fixed on heat sink by fixed circlip,The first heat-conducting layer is filled between the heat sink and the upper surface gap of circuit board,The upper surface of the circuit board is further opened with mounting hole between louvre,LED chip is provided with the mounting hole,Through hole is offered on the heat sink,The top of the LED chip is located in through hole,Simple structure of the present invention,Ensure the heat dispersion of LED surface-mounted integrated circuits,Improve the service life of LED surface-mounted integrated circuits.
Description
Technical field
The present invention relates to circuit board technology field, more particularly to a kind of high-heat-dispersion LED surface-mounted integrated circuit.
Background technology
LED is widely used to the aspects such as LED liquid crystal displays, LED illumination, ad decoration at present, relative to conventional light source,
LED has the advantages that energy-conservation, long lifespan, environmental protection, low energy are efficient, and the area of existing LED circuit board is small, produces again more preferable
Function so that product produces substantial amounts of thermal source, is unfavorable for the radiating of product.
The content of the invention
The invention aims to solve to exist in the prior art, radiating effect is poor, and service life is low, and influence uses effect
Really, a kind of high-heat-dispersion LED surface-mounted integrated circuit for proposing.
To achieve these goals, present invention employs following technical scheme：
A kind of high-heat-dispersion LED surface-mounted integrated circuit, including circuit board are designed, the circuit board is rectangular-shaped, is pacified on the circuit board
Equipped with electronic component, equidistant offering in one group of louvre, the louvre is inserted with thermal column on the circuit board, institute
The bottom of thermal column is stated by heat abstractor, the second heat conduction is filled between the heat abstractor and the gap of circuit board lower surface
Layer, the top of the thermal column is fixed on heat sink by fixed circlip, the upper surface gap of the heat sink and circuit board
Between be filled with the first heat-conducting layer, the upper surface of the circuit board is further opened with mounting hole, the installation between louvre
LED chip is provided with hole, through hole is offered on the heat sink, the top of the LED chip is located in through hole.
Preferably, the heat abstractor include a heat-absorbent surface and a radiating surface, the heat-absorbent surface by the second heat-conducting layer with
Circuit board lower surface is connected, and the radiating surface has been equidistantly positioned radiating fin.
Preferably, first heat-conducting layer is identical with the second heat-conducting layer, and using heat conductive silica gel, epoxy resin or rubber
Glue.
Preferably, the thermal column and heat abstractor are formed in one structure.
Preferably, in the gap between the thermal column and louvre be filled with the 3rd heat-conducting layer, and the 3rd heat-conducting layer with
First heat-conducting layer, the second heat-conducting layer are identical.
A kind of high-heat-dispersion LED surface-mounted integrated circuit proposed by the present invention, beneficial effect is：By opening up scattered on circuit boards
Hot hole, and thermal column is plugged in louvre, effectively the heat inside circuit board can be shed, it is ensured that the work of circuit board
Efficiency, heat sink is installed by the one side in circuit board, and heat abstractor is installed in the another side of circuit board, and will by thermal column
Heat abstractor is connected with heat sink, can greatly increase the integral heat sink efficiency of board structure of circuit, and reduces radiator
Production cost, the first heat-conducting layer and the second heat-conducting layer are filled by the both sides of circuit board, further increase dissipating for circuit board
Hot merit energy, simple structure of the present invention, it is ensured that the heat dispersion of LED surface-mounted integrated circuits, improve the use longevity of LED surface-mounted integrated circuits
Life.
Brief description of the drawings
Fig. 1 is a kind of structural representation of high-heat-dispersion LED surface-mounted integrated circuit proposed by the present invention；
Fig. 2 is a kind of structural representation of high-heat-dispersion LED surface-mounted integrated circuit proposed by the present invention.
In figure：Circuit board 1, heat sink 2, thermal column 3, fixed circlip 4, through hole 5, LED chip 6, louvre 7, first are led
Thermosphere 8, heat abstractor 9, the second heat-conducting layer 10, radiating fin 11.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.
Reference picture 1-2, a kind of high-heat-dispersion LED surface-mounted integrated circuit, including circuit board 1, circuit board 1 are rectangular-shaped, circuit board 1
On electronic component is installed, it is equidistant on circuit board 1 to offer one group of louvre 7, is inserted with thermal column 3 in louvre 7, dissipate
The 3rd heat-conducting layer, and the 3rd heat-conducting layer and the first heat-conducting layer 8, the second heat conduction are filled with gap between plume 3 and louvre
10 structure of layer are identical, and by heat abstractor 9, heat abstractor 9 includes a heat-absorbent surface and a radiating surface, heat absorption for the bottom of thermal column 3
Face is connected by the second heat-conducting layer 10 with the lower surface of circuit board 1, and radiating surface has been equidistantly positioned radiating fin 11, can be quick
Used heat is shed, thermal column 3 and heat abstractor 9 are formed in one structure, can strengthen radiating effect, heat abstractor 9 and circuit
The second heat-conducting layer 10 is filled between the gap of the lower surface of plate 1, the first heat-conducting layer 8 is identical with the structure of the second heat-conducting layer 10, and adopts
With heat conductive silica gel, epoxy resin or rubber, the top of thermal column 3 is fixed on heat sink 2 by fixed circlip 4, heat sink 2 with
The first heat-conducting layer 8 is filled between the upper surface gap of circuit board 1, the upper surface of circuit board 1 also opens up between louvre 7
There is mounting hole, LED chip 6 is provided with mounting hole, through hole 5 is offered on heat sink 2, the top of LED chip 6 is located at through hole 5
It is interior.
Workflow：When using, when the electronic component on circuit board 1 produces used heat, the used heat of the upper surface of circuit board 1 leads to
Cross the first heat-conducting layer 8 to conduct to heat sink 2, heat sink 2 derives the used heat on the upper strata of circuit board 1, and the lower surface of circuit board 1 is useless
Heat is transmitted to the heat-absorbent surface of heat abstractor 9 by the second heat-conducting layer 10, then by the heat radiating fin on the radiating surface of heat abstractor 9
Piece 11 is shed, and the used heat that the middle part of circuit board 1 produces is conducted to heat sink 2 or heat abstractor 9 by thermal column 3, be ensure that
The heat dispersion of circuit board, improves the service life of circuit board.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technology according to the present invention scheme and its
Inventive concept is subject to equivalent or change, should all be included within the scope of the present invention.
Claims (5)
1. a kind of high-heat-dispersion LED surface-mounted integrated circuit, including circuit board（1）, the circuit board（1）It is rectangular-shaped, the circuit board
（1）On electronic component is installed, it is characterised in that：The circuit board（1）It is above equidistant to offer one group of louvre（7）, it is described
Louvre（7）Inside it is inserted with thermal column（3）, the thermal column（3）Bottom pass through heat abstractor（9）, the heat abstractor
（9）With circuit board（1）The second heat-conducting layer is filled between the gap of lower surface（10）, the thermal column（3）Top by solid
Determine jump ring（4）It is fixed on heat sink（2）On, the heat sink（2）With circuit board（1）Upper surface gap between be filled with first
Heat-conducting layer（8）, the circuit board（1）Upper surface near louvre（7）Between be further opened with mounting hole, set in the mounting hole
It is equipped with LED chip（6）, the heat sink（2）On offer through hole（5）, the LED chip（6）Top be located at through hole（5）
It is interior.
2. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterised in that：The heat abstractor（9）Bag
A heat-absorbent surface and a radiating surface are included, the heat-absorbent surface passes through the second heat-conducting layer（10）With circuit board（1）Lower surface is connected, described to dissipate
Hot face has been equidistantly positioned radiating fin（11）.
3. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterised in that：First heat-conducting layer（8）
With the second heat-conducting layer（10）Structure is identical, and using heat conductive silica gel, epoxy resin or rubber.
4. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterised in that：The thermal column（3）With dissipate
Thermal（9）Be formed in one structure.
5. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterised in that：The thermal column（3）With dissipate
The 3rd heat-conducting layer, and the 3rd heat-conducting layer and the first heat-conducting layer are filled with gap between hot hole（8）, the second heat-conducting layer（10）Knot
Structure is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710241461.1A CN106876554A (en) | 2017-04-13 | 2017-04-13 | A kind of high-heat-dispersion LED surface-mounted integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710241461.1A CN106876554A (en) | 2017-04-13 | 2017-04-13 | A kind of high-heat-dispersion LED surface-mounted integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106876554A true CN106876554A (en) | 2017-06-20 |
Family
ID=59162305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710241461.1A Withdrawn CN106876554A (en) | 2017-04-13 | 2017-04-13 | A kind of high-heat-dispersion LED surface-mounted integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106876554A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN108306442A (en) * | 2017-12-12 | 2018-07-20 | 安徽德科电气科技有限公司 | A kind of system's high-voltage generator peculiar to vessel |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
| CN109644553A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| WO2020042519A1 (en) * | 2018-08-29 | 2020-03-05 | 刘振亮 | Dual-heat-conducting-strip splint type led display unit module |
| CN112701047A (en) * | 2019-10-23 | 2021-04-23 | 华通电脑股份有限公司 | Method for manufacturing radiating fin |
-
2017
- 2017-04-13 CN CN201710241461.1A patent/CN106876554A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306442A (en) * | 2017-12-12 | 2018-07-20 | 安徽德科电气科技有限公司 | A kind of system's high-voltage generator peculiar to vessel |
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
| WO2020042519A1 (en) * | 2018-08-29 | 2020-03-05 | 刘振亮 | Dual-heat-conducting-strip splint type led display unit module |
| CN109644553A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| WO2020087408A1 (en) * | 2018-10-31 | 2020-05-07 | 北京比特大陆科技有限公司 | Circuit board and supercomputer device |
| CN109644553B (en) * | 2018-10-31 | 2021-10-08 | 北京比特大陆科技有限公司 | Circuit board and super computing device |
| CN112701047A (en) * | 2019-10-23 | 2021-04-23 | 华通电脑股份有限公司 | Method for manufacturing radiating fin |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170620 |