CN205846015U - A kind of copper column type high-heat-dispersion LED substrate - Google Patents
A kind of copper column type high-heat-dispersion LED substrate Download PDFInfo
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- CN205846015U CN205846015U CN201620651698.8U CN201620651698U CN205846015U CN 205846015 U CN205846015 U CN 205846015U CN 201620651698 U CN201620651698 U CN 201620651698U CN 205846015 U CN205846015 U CN 205846015U
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- organic resin
- heat
- copper
- resin substrate
- heat dissipating
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Abstract
The utility model discloses a kind of copper column type high-heat-dispersion LED substrate, including organic resin substrate, the described upper and lower two ends of organic resin substrate are symmetrically arranged with Graphene heat dissipating layer, are provided with copper foil layer outside described Graphene heat dissipating layer；The square copper post of multiple connection levels Graphene heat dissipating layer it is provided with in described organic resin substrate, it is provided with multiple hemispherical groove at described organic resin substrate inner close fitting square copper post, being provided with cooling liquid in described hemispherical groove, described hemispherical groove is provided with sealing film on the contact surface of square copper post；The copper foil layer upper end on upper strata is provided with reflector cover, is provided with luminescence chip mounting groove, is provided with the buckle for installing transparent cover plate inside described reflector cover upper end in described reflector cover.This new structural design is reasonable, has splendid heat dispersion, improves service life and the reliability of luminescence chip, and meet high-power LED encapsulation technology extensively applies requirement；Good airproof performance, easy for installation, strengthen light efficiency.
Description
Technical field
This utility model relates to a kind of LED-baseplate, specifically a kind of copper column type high-heat-dispersion LED substrate.
Background technology
LED is a kind of novel semi-conductor solid light source, has that security reliability is strong, power consumption is few, luminous efficiency is high, suitable
By advantages such as property is strong, good stability, response time are short, color changeables, beneficially environmental protection, its performance is the most perfect, extensively
It is applied to illumination, the field such as display.
Although LED has a many merits, but be intended to make LED commercially can be widely used yet suffer from many
Problem, wherein LED heat radiation is wherein one of problem.LED chip can produce substantial amounts of heat in the middle of use process equally, especially
It is LED be point-like illuminating source, produced heat concentrates in minimum region, if produce heat cannot be timely and effective
Distribute, the junction temperature of PN junction can be caused to raise, thus speed-up chip and potting resin is aging, it is also possible to cause solder joint to melt
Changing, make chip failure, and then directly affect service life and the luminous efficiency of LED, particularly great power LED, in the process of use
Produced by, heat is bigger, requires higher to heat dissipation technology, it may be said that LED heat dissipation problem is directly connected to its development prospect,
The heat-sinking capability of LED product to be promoted, crucial being still searches out a kind of method that can accelerate LED heat radiation.
Utility model content
The purpose of this utility model is to provide a kind of copper column type high-heat-dispersion LED substrate, to solve in above-mentioned background technology
The problem proposed.
For achieving the above object, the following technical scheme of this utility model offer:
A kind of copper column type high-heat-dispersion LED substrate, including organic resin substrate, the described upper and lower two ends of organic resin substrate are symmetrical
It is provided with Graphene heat dissipating layer, outside described Graphene heat dissipating layer, is provided with copper foil layer；It is provided with in described organic resin substrate
The square copper post of multiple connection levels Graphene heat dissipating layers, is provided with many at described organic resin substrate inner close fitting square copper post
Individual hemispherical groove, is provided with the contact surface of cooling liquid, described hemispherical groove and square copper post in described hemispherical groove
On be provided with sealing film；The copper foil layer upper end on upper strata is provided with reflector cover, is provided with luminescence chip in described reflector cover
Mounting groove, is provided with the buckle for installing transparent cover plate inside described reflector cover upper end.
As further program of the utility model: described cooling liquid is cooling oil.
As this utility model further scheme: the cross section length of side of described square copper post is 0.2mm.
As this utility model further scheme: the thermal conductivity of described square copper post is more than 150W/m K.
Compared with prior art, the beneficial effects of the utility model are: arrange Graphene heat dissipating layer, improve LED greatly
The heat dispersion that substrate is overall；Square copper post is set, connects the Graphene heat dissipating layer of levels, fully luminescence chip is worked
Time the heat that produces from the upper layer graphene heat dissipating layer lower layer graphene heat dissipating layer of conduction, and be ultimately conducted to outside LED-baseplate, can make
The operating temperature of luminescence chip maintains reduced levels, and can improve service life and the reliability of luminescence chip；Hemisphere is set
Connected in star, is provided with cooling liquid in described hemispherical groove, can absorb the heat that square copper post is derived, and effectively solves existing skill
A difficult problem for LED-baseplate poor radiation in the presence of art, meet high-power LED encapsulation technology extensively applies requirement；Arrange close
Sealing film, it is to avoid in hemispherical groove, cooling liquid spills, improves sealing；Reflector cover is set, increases luminescence chip and produce
The reflection angle of light, strengthen light efficiency；Buckle is set so that the transparent cover plate above luminescence chip mounting groove is easy for installation, carries
High workload efficiency.
In sum, this new structural design is reasonable, has splendid heat dispersion, improve luminescence chip service life and
Reliability, meet high-power LED encapsulation technology extensively applies requirement；Good airproof performance, easy for installation, strengthen light efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of copper column type high-heat-dispersion LED substrate.
In figure: 1-organic resin substrate, 2-copper foil layer, 3-Graphene heat dissipating layer, 4-reflector cover, 5-buckle, 6-hemisphere
Connected in star, 7-sealing film, 8-luminescence chip mounting groove, 9-square copper post.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
Referring to Fig. 1, a kind of copper column type high-heat-dispersion LED substrate, including organic resin substrate 1, described organic resin substrate 1
Two ends are symmetrically arranged with Graphene heat dissipating layer 3 up and down, are provided with copper foil layer 2 outside described Graphene heat dissipating layer 3；Described organic tree
The square copper post 9 of multiple connection levels Graphene heat dissipating layer 3, described organic resin substrate 1 inner close fitting it is provided with in aliphatic radical plate 1
Being provided with multiple hemispherical groove 6 at square copper post 9, be provided with cooling liquid in described hemispherical groove 6, described hemispherical is recessed
Groove 6 is provided with sealing film 7 on the contact surface of square copper post 9；Copper foil layer 2 upper end on upper strata is provided with reflector cover 4, described
It is provided with luminescence chip mounting groove 8 in reflector cover 4, is provided with for installing transparent cover plate inside described reflector cover 4 upper end
Buckle 5.
Operation principle of the present utility model is: arrange Graphene heat dissipating layer 3, improves the heat radiation that LED-baseplate is overall greatly
Performance；Square copper post 9 is set, connects the Graphene heat dissipating layer 3 of levels, the heat produced when fully luminescence chip being worked
From the lower layer graphene heat dissipating layer 3 of upper layer graphene heat dissipating layer 3 conduction, and it is ultimately conducted to outside LED-baseplate, luminescence chip can be made
Operating temperature maintains reduced levels, and can improve service life and the reliability of luminescence chip；Hemispherical groove 6, institute are set
It is provided with cooling liquid in stating hemispherical groove 6, the heat that square copper post 9 is derived can be absorbed, effectively solve institute in prior art
A difficult problem for the LED-baseplate poor radiation existed, meet high-power LED encapsulation technology extensively applies requirement；Sealing film is set
7, it is to avoid in hemispherical groove 6, cooling liquid spills, improve sealing；Reflector cover 4 is set, increases the light that luminescence chip produces
Reflection angle, strengthen light efficiency；Buckle 5 is set so that the transparent cover plate above luminescence chip mounting groove 8 is easy for installation, improves
Work efficiency.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this practicality in other specific forms new
Type.Therefore, no matter from the point of view of which point, all should regard embodiment as exemplary, and be nonrestrictive, this practicality is new
The scope of type is limited by claims rather than described above, it is intended that by the containing of equivalency in claim that fall
All changes in justice and scope are included in this utility model.Should not be considered as any reference in claim limiting
Involved claim.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment only wraps
Containing an independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should
Description can also be formed those skilled in the art through appropriately combined as an entirety, the technical scheme in each embodiment
May be appreciated other embodiments.
Claims (4)
1. a copper column type high-heat-dispersion LED substrate, including organic resin substrate, it is characterised in that on described organic resin substrate
Lower two ends are symmetrically arranged with Graphene heat dissipating layer, are provided with copper foil layer outside described Graphene heat dissipating layer；Described organic resin base
The square copper post of multiple connection levels Graphene heat dissipating layer, described organic resin substrate inner close fitting square copper post it is provided with in plate
Place is provided with multiple hemispherical groove, is provided with cooling liquid, described hemispherical groove and square copper in described hemispherical groove
It is provided with sealing film on the contact surface of post；The copper foil layer upper end on upper strata is provided with reflector cover, arranges in described reflector cover
There is luminescence chip mounting groove, inside described reflector cover upper end, be provided with the buckle for installing transparent cover plate.
Copper column type high-heat-dispersion LED substrate the most according to claim 1, it is characterised in that described cooling liquid is cooling oil.
Copper column type high-heat-dispersion LED substrate the most according to claim 1, it is characterised in that the limit, cross section of described square copper post
A length of 0.2mm.
Copper column type high-heat-dispersion LED substrate the most according to claim 1, it is characterised in that the thermal conductivity of described square copper post
More than 150W/m K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620651698.8U CN205846015U (en) | 2016-06-28 | 2016-06-28 | A kind of copper column type high-heat-dispersion LED substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620651698.8U CN205846015U (en) | 2016-06-28 | 2016-06-28 | A kind of copper column type high-heat-dispersion LED substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205846015U true CN205846015U (en) | 2016-12-28 |
Family
ID=57622190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620651698.8U Expired - Fee Related CN205846015U (en) | 2016-06-28 | 2016-06-28 | A kind of copper column type high-heat-dispersion LED substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN205846015U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
| CN110112263A (en) * | 2019-05-13 | 2019-08-09 | 电子科技大学中山学院 | Substrate for high-power LED packaging, substrate manufacturing method and packaging structure |
| CN111357121A (en) * | 2017-12-04 | 2020-06-30 | 东旭集团有限公司 | Upper substrate for micro LED device, and micro LED display device |
| CN111403362A (en) * | 2020-03-27 | 2020-07-10 | Tcl华星光电技术有限公司 | Chip on film packaging method, packaging structure, display device and electronic equipment |
-
2016
- 2016-06-28 CN CN201620651698.8U patent/CN205846015U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111357121A (en) * | 2017-12-04 | 2020-06-30 | 东旭集团有限公司 | Upper substrate for micro LED device, and micro LED display device |
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
| CN110112263A (en) * | 2019-05-13 | 2019-08-09 | 电子科技大学中山学院 | Substrate for high-power LED packaging, substrate manufacturing method and packaging structure |
| CN111403362A (en) * | 2020-03-27 | 2020-07-10 | Tcl华星光电技术有限公司 | Chip on film packaging method, packaging structure, display device and electronic equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20170628 |
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| CF01 | Termination of patent right due to non-payment of annual fee |