CN201751711U - Heat-radiating structure for LED (light-emitting diode) lamp - Google Patents
Heat-radiating structure for LED (light-emitting diode) lamp Download PDFInfo
- Publication number
- CN201751711U CN201751711U CN201020000552XU CN201020000552U CN201751711U CN 201751711 U CN201751711 U CN 201751711U CN 201020000552X U CN201020000552X U CN 201020000552XU CN 201020000552 U CN201020000552 U CN 201020000552U CN 201751711 U CN201751711 U CN 201751711U
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- CN
- China
- Prior art keywords
- led
- heat
- lamp
- thermal conductivity
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 11
- 239000010439 graphite Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 7
- 239000004411 aluminium Substances 0.000 claims description 17
- 239000003921 oil Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a radiator structure for an LED (light-emitting diode) lamp, which comprises heat-radiating fins, wherein a thermal conducting graphite sheet and an aluminum substrate are sequentially arranged between the heat-radiating fins and an LED encapsulation stent, a silicon oxide layer is attached to the upper surface of the aluminum substrate to form insulation with the LED encapsulation stent, and the LED encapsulation stent is connected with the aluminum substrate through an insulating bolt. By adopting the aluminum substrate additionally provided with the silicon oxide layer, the thermal conductivity can reach 10W / (m DEG C); and simultaneously, the thermal conducting graphite sheet with the thermal conductivity close to that of copper is used for replacing thermal conducting oil, with the thermal conductivity reaching 300W / (m DEG C), so that heat generated by an LED can be transferred to the heat-radiating fins, so as to dramatically increase the heat-radiating performance of the LED lamp, thus reducing light attenuation and prolonging service life.
Description
Technical field
The utility model relates to a kind of radiator structure, especially a kind of radiator structure that is used for the LED lamp.
Background technology
In the recent period, along with the development of LED rapid technological improvement, the form with the street lamp demonstration project is presented in people's the life LED lamp in many cities just gradually.Because the light decay degree of the street lamp that demonstration project is showed is still fast a lot of than what everybody imagined, is difficult to reach 50,000 hours service life, so large-scale LED street lamp application does not still also begin.Tracing it to its cause, mainly is the problem of heat radiation, and the continuous operation meeting reduces the service life of LED greatly under the environment of high temperature, is to solve light decay, prolong the LED effective way in service life so improve the radiating effect of LED lamp.
At present, the radiator structure that the LED street lamp uses all be basically will encapsulation single LEDs light source or module led light source be fixed on the aluminum-based circuit board earlier by package support or directly be encapsulated in led chip on the aluminum-based circuit board, and then the light source that will have aluminum-based circuit board is fixed on the aluminium section bar fin of fin, to use conduction oil or thermal conductive silicon film with its tight connection in the time of fixedly, employed aluminum-based circuit board of this interconnection technique and conduction oil, their thermal conductivity is very low, be respectively 1.2W/ (m ℃) and 3.0W/ (m ℃), wherein the thermal conductivity of aluminum-based circuit board is low is because be to press together by epoxide-resin glue between aluminium base and the copper sheet, the insulating properties of epoxy resin is very good, well solved the Insulation Problems between package support and the fin, but it is hot very poor; The thermal conductivity of conduction oil is low to be because in its component due to a large amount of semi-conducting material, more than used two kinds of materials be difficult to improve again their thermal conductivity, the heat that led light source produced is subjected to the influence of above-mentioned two materials when conduction on the radiator direction, can't fast heat be derived, and forms bottleneck.No matter on fin, add fan and still adopt semiconductor cooling device, all can not thoroughly solve the heat dissipation problem of LED lamp.The anxious radiator structure of higher radiating effect for the treatment of occurs on the market, along with 09 the end of the year 10W the appearing on the market of led chip, this trend is more obvious.
The utility model content
At above problem, the utility model provides a kind of novel radiator structure, and it is applied on the LED lamp source, can effectively improve the derivation ability of heat, strengthens radiating effect.
The purpose of this utility model is to be achieved through the following technical solutions:
A kind of heat spreader structures that is used for the LED lamp comprises fin, between described fin and LED package support conductive graphite sheet, aluminium base is installed successively, and described aluminium base upper surface is attached with silicon oxide layer and described LED package support forms insulation.
Further, described LED package support is connected with described aluminium base by insulated bolt; Described aluminium base, conductive graphite sheet, fin adopt bolt to be pressed together on one.
The utility model is used new material and has been designed the defective that exists in the existing heat dissipation technology of new construction solution, adopts aluminium base additional silicon oxide layer to replace aluminum-based circuit board, provides a kind of thermal conductivity high insulating property to satisfy the heat sinking structure of LED lamp work safety regulation; Silica material itself has good insulation performance is arranged, but because the crystal structure of silica molecule itself, make between the molecule again very slight gap of tool, can guarantee good thermal conductivity, can improve whole heat conductivility, thermal conductivity can reach 10W/ (m ℃), and the heat that can timely LED be produced passes.Simultaneously, with the conductive graphite sheet replacement conduction oil of thermal conductivity near copper, its thermal conductivity can reach 300W/ (m ℃), and the heat dispersion of LED lamp is significantly improved, thereby the light decay phenomenon of LED lamp is effectively improved, and the life-span prolongs greatly.
Description of drawings
With embodiment the utility model is described in further detail with reference to the accompanying drawings below.
Fig. 1 is the radiator structure schematic diagram of the described LED of the being used for lamp of the utility model embodiment.
Fig. 2 is the decomposition chart of the radiator structure of the described LED of the being used for lamp of the utility model embodiment;
Among the figure:
1, fin; 2, conductive graphite sheet; 3, aluminium base; 4, silicon oxide layer; 5, LED package support; 6, insulated bolt; 7, bolt.
The specific embodiment
Shown in Fig. 1-2, provided the radiator structure figure of the LED of being used for lamp described in the utility model, it constitutes: conductive graphite sheet 2, aluminium base 3 are installed between described fin 1 and LED package support successively, and described aluminium base 3 upper surfaces are attached with silicon oxide layer 4 and encapsulate 5 supports formation insulation with described LED.
For making LED package support 5 form insulation with aluminium base 3, satisfy the connection in series-parallel installation requirement of LED lamp, described LED package support 5 is connected with described aluminium base 3 by insulated bolt 6; Aluminium base 3, conductive graphite sheet 2, fin 1 adopt bolt 7 to be pressed together on one.。
Silica material itself has good insulation performance is arranged, but, can improve whole heat conductivility because the silica unusual slight gap of tool again itself can guarantee good thermal conductivity, thermal conductivity can reach 10W/ (m ℃), and the heat that can timely LED be produced passes.Simultaneously, with the conductive graphite sheet 2 replacement conduction oils of thermal conductivity near copper, its thermal conductivity can reach 300W/ (m ℃), and the heat dispersion of LED lamp is significantly improved, thereby the light decay phenomenon of LED lamp is effectively improved, and the life-span prolongs greatly.
Claims (3)
1. radiator structure that is used for the LED lamp, comprise fin, it is characterized in that, between described fin and LED package support conductive graphite sheet, aluminium base are installed successively, described aluminium base upper surface is attached with silicon oxide layer and described LED package support forms insulation.
2. the radiator structure that is used for the LED lamp according to claim 1 is characterized in that, described LED package support is connected with described aluminium base by insulated bolt.
3. the radiator structure that is used for the LED lamp according to claim 1 is characterized in that, described aluminium base, conductive graphite sheet, fin adopt bolt to be pressed together on one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020000552XU CN201751711U (en) | 2010-01-08 | 2010-01-08 | Heat-radiating structure for LED (light-emitting diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020000552XU CN201751711U (en) | 2010-01-08 | 2010-01-08 | Heat-radiating structure for LED (light-emitting diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201751711U true CN201751711U (en) | 2011-02-23 |
Family
ID=43602119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020000552XU Expired - Fee Related CN201751711U (en) | 2010-01-08 | 2010-01-08 | Heat-radiating structure for LED (light-emitting diode) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201751711U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768998A (en) * | 2011-05-05 | 2012-11-07 | 优杰精密机械(苏州)有限公司 | Substrate for high-power electronic device module |
| CN107203116A (en) * | 2013-11-29 | 2017-09-26 | 佳能株式会社 | Image heater |
-
2010
- 2010-01-08 CN CN201020000552XU patent/CN201751711U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768998A (en) * | 2011-05-05 | 2012-11-07 | 优杰精密机械(苏州)有限公司 | Substrate for high-power electronic device module |
| CN107203116A (en) * | 2013-11-29 | 2017-09-26 | 佳能株式会社 | Image heater |
| CN107203116B (en) * | 2013-11-29 | 2021-03-30 | 佳能株式会社 | Image heating apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN JINHUIWEI ELECTRIC CO.,LTD. Free format text: FORMER OWNER: LI LEI Effective date: 20121031 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518048 SHENZHEN, GUANGDONG PROVINCE TO: 518049 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121031 Address after: First, sixth floor, 518049 Industrial Zone, Meilin Road, Shenzhen, Guangdong, Futian District Patentee after: Shenzhen JinHuiWei Electric Co., Ltd. Address before: 518048 Guangdong city of Shenzhen province Futian District Xinzhou City Garden Road 5 13D Xuan. Patentee before: Li Lei |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110223 Termination date: 20130108 |