CN202101201U - Heat dissipation structure for high-power light-emitting diode (LED) - Google Patents
Heat dissipation structure for high-power light-emitting diode (LED) Download PDFInfo
- Publication number
- CN202101201U CN202101201U CN2011201326077U CN201120132607U CN202101201U CN 202101201 U CN202101201 U CN 202101201U CN 2011201326077 U CN2011201326077 U CN 2011201326077U CN 201120132607 U CN201120132607 U CN 201120132607U CN 202101201 U CN202101201 U CN 202101201U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- led
- heat
- layer
- great power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a heat dissipation structure for a high-power light-emitting diode (LED), which is good in heat dissipation performance. The technical scheme is that the heat dissipation structure is arranged at the bottom of a high-power LED light-emitting chip, and the heat dissipation structure comprises a heat dissipation metal layer, a metal adhesion layer and a bottom heat dissipation piece which are all sequentially arranged from top to bottom. The heat dissipation metal layer which is a metal copper piece is arranged at the bottom of a support for fixing the LED light-emitting chip, the metal adhesion layer which is a tin cadmium layer is arranged outside the bottom of the support, and the bottom heat dissipation piece is a grilling-shaped aluminum material heat dissipation piece. The heat of the LED is directly and quickly conducted to the metal layer, the heat-conducting property of a whole LED heat dissipation piece can be effectively improved, the heat-conducting coefficient of the whole heat dissipation piece can be increased to over 200 W/M.K, and the heat dissipation conditions of the LED are greatly improved.
Description
Technical field
The utility model relates to the great power LED technical field, and more particularly, the utility model relates to a kind of radiator structure of great power LED.
Background technology
LED as the 4th generation lighting source be widely used in showing and illuminator equipment; And great power LED has also stepped into commercialization; But the optoelectronic transformation efficiency of great power LED is lower, and like the great power LED greater than the 1W level, its electro-optical efficiency is about 15%; Remaining 85% is converted into heat energy, the actual heat that changed into of so most of electric energy.The size of LED luminescence chip is merely 1mm * 1mm～2.5mm * 2.5mm; The LED centralized heat energy is in small-sized chip and can not effectively shed; Will cause the temperature of chip to raise, thereby cause the sharp decrease in efficiency of penetrating of non-well-balanced distribution, chip light emitting efficient and fluorescent material of thermal stress.Therefore, how improving heat-sinking capability is that great power LED is realized one of key technology difficult problem that industrialization needs to be resolved hurrily.
Existing great power LED cooling structure is roughly divided three layers: PPA plastic layer, insulating barrier Heat Conduction Material, aluminium fin.The LED luminescence chip is fixed in the support, and the approach of its heat transfer is the PPA plastic cement material through frame bottom, via the insulating barrier Heat Conduction Material heat is conducted to the aluminium fin.Owing to conduct heat through heat-conducting glue, and best insulation material thermal conductivity factor is merely 3W/M.K at present, so this layer radiator structure seriously stopped effective conduction of heat, must improve.
The utility model content
The purpose of the utility model is to overcome shortcoming of the prior art with not enough, and a kind of great power LED cooling structure of perfect heat-dissipating is provided.
In order to achieve the above object; The utility model is achieved through following technical proposals: a kind of radiator structure of great power LED; Be arranged on the bottom of great power LED luminescence chip; It is characterized in that said radiator structure is followed successively by heat radiating metallic layer, metallic bond coat and bottom fin from top to bottom; Described heat radiating metallic layer is arranged on the frame bottom that is used for fixing the LED luminescence chip.
Said heat radiating metallic layer is meant the metallic copper lamella; The heat-conductive characteristic of metallic copper is good, can heat effectively conducted.
Said metallic bond coat is a tin pick layer, and it is arranged on outside the frame bottom; The characteristic of tin pick not only can be conducted heat, and can metallic copper and bottom fin effectively be made up, and forms the passage of heat conduction.
Described bottom fin is the aluminium fin, and the bottom fin is that grid-like aluminium fin is a preferred version, helps the radiation of heat.
Compared with prior art, the utlity model has following advantage and beneficial effect:
1, the utility model conducts to the heat of LED on metal (copper or the aluminium) layer directly, apace, can effectively improve the overall thermal conductivity ability of LED fin, solves the great power LED cooling problem.
2, the heat abstractor of the utility model is increased to 200W/M.K with the thermal conductivity factor of entire heat dissipation sheet, can improve the radiating condition of LED greatly.
Description of drawings
Fig. 1 is the sketch map of the radiator structure of great power LED.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described in further detail.
The sketch map of the radiator structure of the great power LED of the utility model is as shown in Figure 1, and radiator structure is followed successively by heat radiating metallic layer 2, metallic bond coat 3 and bottom fin 4 from top to bottom; Described heat radiating metallic layer 2 is arranged on support 1 bottom that is used for fixing the LED luminescence chip.Said heat radiating metallic layer 2 is meant the metal copper sheet; Metallic bond coat 3 is tin pick layers, and it is arranged on outside support 1 bottom; Described bottom fin 4 is grid-like aluminium fin.
The radiator structure of the utility model is to install like this: LED luminescence chip bottom is the same with prior art; Insulating barrier is set to prevent supporting band earlier; Be fixed on the support then; Contact with the heat radiating metallic layer 2 in being arranged on radiator structure frame bottom, the utility model, metallic bond coat 3 is arranged on outside support 1 bottom, and metallic bond coat 3 directly contacts with bottom fin 4.The heat of LED luminescence chip just through heat radiating metallic layer 2, metallic bond coat 3 and bottom fin 4 effectively conduct radiation come out.
The foregoing description is the utility model preferred implementation; But the embodiment of the utility model is not restricted to the described embodiments; Other any do not deviate from change, the modification done under spirit and the principle of the utility model, substitutes, combination, simplify; All should be the substitute mode of equivalence, be included within the protection domain of the utility model.
Claims (5)
1. the radiator structure of a great power LED is arranged on the bottom of great power LED luminescence chip, it is characterized in that said radiator structure is followed successively by heat radiating metallic layer, metallic bond coat and bottom fin from top to bottom; Described heat radiating metallic layer is arranged on the frame bottom that is used for fixing the LED luminescence chip.
2. the radiator structure of great power LED according to claim 1 is characterized in that, said heat radiating metallic layer is meant the metallic copper lamella.
3. the radiator structure of great power LED according to claim 1 is characterized in that, said metallic bond coat is meant tin pick layer, and said tin pick layer is arranged on outside the said frame bottom.
4. the radiator structure of great power LED according to claim 1 is characterized in that, said bottom fin is meant the aluminium fin.
5. the radiator structure of great power LED according to claim 4 is characterized in that, said aluminium fin is meant grid-like aluminium fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201326077U CN202101201U (en) | 2011-04-29 | 2011-04-29 | Heat dissipation structure for high-power light-emitting diode (LED) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201326077U CN202101201U (en) | 2011-04-29 | 2011-04-29 | Heat dissipation structure for high-power light-emitting diode (LED) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202101201U true CN202101201U (en) | 2012-01-04 |
Family
ID=45387210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201326077U Expired - Fee Related CN202101201U (en) | 2011-04-29 | 2011-04-29 | Heat dissipation structure for high-power light-emitting diode (LED) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202101201U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
-
2011
- 2011-04-29 CN CN2011201326077U patent/CN202101201U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201697088U (en) | Superconducting heat radiator of heat pipes used for illumination of high-power semiconductor | |
| CN203481273U (en) | LED light source module based on AlSiC composite substrate | |
| CN201396607Y (en) | High-power integrated LED light source illumination lamp | |
| CN202082883U (en) | Integral high-power LED heat pipe heat dissipation device | |
| CN201204203Y (en) | Radiating device for high-power LED | |
| CN205664140U (en) | Possesses lamp plate from heat radiation structure's LED | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN202101201U (en) | Heat dissipation structure for high-power light-emitting diode (LED) | |
| CN201462739U (en) | Radiating device | |
| Yang et al. | Thermal analysis and design of high-power LED street light | |
| CN201396653Y (en) | Heat radiation improved structure for high-power LED street lamp | |
| CN202580779U (en) | Led light source module | |
| CN202521431U (en) | Light-emitting diode (LED) street lamp | |
| CN202469988U (en) | Wing plate type three-dimensional light emitting diode (LED) heat radiator | |
| CN201621652U (en) | Heat radiation LED lamp circuit board and tube | |
| CN201420995Y (en) | LED street lamp with good heat dissipation function | |
| CN201589145U (en) | LED street lamp cap | |
| CN201163627Y (en) | Forced heat radiating device for semiconductor lighting device | |
| CN203131698U (en) | Radiating lampshade of high power light-emitting diode (LED) lamp | |
| CN208635073U (en) | A kind of free convection heat-pipe radiator | |
| CN202259439U (en) | Large-power LED heat dissipating substrate | |
| CN202647316U (en) | LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate | |
| CN102486304A (en) | Cooling device of LED (light-emitting diode) light source | |
| CN203099379U (en) | Straight-tube type LED (light emitting diode) lamp | |
| CN201992414U (en) | Light-emitting diode (LED) daylight lamp capable of dissipating heat through heat conduction holes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20180429 |