CN106061099A - Printed circuit board and mobile terminal having the same - Google Patents
Printed circuit board and mobile terminal having the same Download PDFInfo
- Publication number
- CN106061099A CN106061099A CN201610507602.5A CN201610507602A CN106061099A CN 106061099 A CN106061099 A CN 106061099A CN 201610507602 A CN201610507602 A CN 201610507602A CN 106061099 A CN106061099 A CN 106061099A
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- CN
- China
- Prior art keywords
- copper
- printed circuit
- heat
- circuit board
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Central Heating Systems (AREA)
Abstract
The invention discloses a printed circuit board and a mobile terminal having the same. The printed circuit board comprises a main board, a heating element, heat conduction elements, and tin paste layers. A copper exposing layer is formed on the lower surface of the main board; and the heating element is arranged on the upper surface of the main board and corresponds to the position of the copper exposing layer in an up-down direction. Via holes extending to the copper exposing layer and the heating element are formed in the main board; the heat condition elements are arranged in the via holes to heat the heating element and the copper exposing layer; and the tin paste layers are arranged on the copper exposing layer. According to the embodiment of the invention, the printed circuit board has the excellent heat radiation performance; the operation stability and reliability of the printed circuit board are improved; and thus the service life of the board is prolonged.
Description
Technical field
The present invention relates to technical field of mobile terminals, especially relate to a kind of printed circuit board (PCB) and there is this printed circuit board (PCB)
Mobile terminal.
Background technology
Mobile terminal in correlation technique, fuselage increasingly trends towards lightly changing, therefore, the printing electricity within mobile terminal
The space layout of road plate is more and more compacter, and therefore, the heat that heater element produces in running cannot effectively spread, shadow
Ring runnability and stability, cause the lost of life of product.
Summary of the invention
It is contemplated that at least solve one of technical problem present in prior art.To this end, one object of the present invention
Being to propose a kind of printed circuit board (PCB), this printed circuit board radiating ability is relatively strong, and the operation stability of printed circuit board (PCB) is with reliable
Property improve.
Further object is that a kind of mobile terminal with above-mentioned printed circuit board (PCB) of proposition.
The printed circuit board (PCB) of embodiment according to a first aspect of the present invention, including: mainboard, the lower surface of described mainboard is formed
There is dew layers of copper；Heater element, described heater element is located on the upper surface of described mainboard and with described dew layers of copper at above-below direction
Upper position is corresponding, and described mainboard is provided with and extends to described dew layers of copper and the via of described heater element；Heat-conducting piece, described heat conduction
It is interior so that described heater element and described dew layers of copper are carried out heat conduction that part is located at described via；Stannum pick layer, described stannum pick layer is located at institute
State in dew layers of copper.
The heat-sinking capability of printed circuit board (PCB) according to embodiments of the present invention strengthens, the operation stability of printed circuit board (PCB) and can
Improving by property, service life extends.
It addition, can also have the technical characteristic added as follows according to the printed circuit board (PCB) of the present invention:
According to some embodiments of the present invention, the floor projection of described heater element is positioned at the floor projection of described dew layers of copper
In.
According to some embodiments of the present invention, described via includes the multiple of spaced apart setting.
Alternatively, multiple described vias are equidistantly distributed.
Further, described via is formed as the bearing of trend of cylindrical hole and described via and the thickness side of described mainboard
To identical.
According to some embodiments of the present invention, described stannum pick layer includes the multiple of spaced apart setting.
Alternatively, multiple described stannum pick layers are equidistantly distributed.
According to some embodiments of the present invention, the inner circumferential wall of the outer peripheral face described via of laminating of described heat-conducting piece.
According to some embodiments of the present invention, described heat-conducting piece is formed as copper post.
The mobile terminal of embodiment according to a second aspect of the present invention, including according to the present invention above-mentioned first aspect embodiment
Printed circuit board (PCB).
The mobile terminal of embodiment according to a second aspect of the present invention, by arranging embodiment according to a first aspect of the present invention
Printed circuit board (PCB), can effectively dispel the heat, and improves operation stability and reliability, such that it is able to increase the service life.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become
Substantially with easy to understand, wherein:
Fig. 1 is the profile of the printed circuit board (PCB) according to the embodiment of the present invention.
Reference:
100: printed circuit board (PCB)；
1: mainboard；2: heater element；3: heat-conducting piece；4: stannum pick layer；10: via；11: dew layers of copper.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
Describe the printed circuit board (PCB) 100 of embodiment according to a first aspect of the present invention, i.e. pcb board below in conjunction with Fig. 1 in detail, be somebody's turn to do
Printed circuit board (PCB) 100 can be used for mobile terminal, but is not limited to this.Wherein, above-below direction with the above-below direction shown in Fig. 1 is
Accurate.
As it is shown in figure 1, printed circuit board (PCB) 100 according to embodiments of the present invention may include that mainboard 1, heater element 2, leads
Warmware 3 and stannum pick layer 4.
Specifically, as it is shown in figure 1, could be formed with dew layers of copper 11 on the lower surface of mainboard 1, heater element 2 can set
On the upper surface of mainboard 1, and heater element 2 can be corresponding, such that it is able to pass through with dew layers of copper 11 position in the vertical direction
Dew layers of copper 11 conducts the heat that heater element 2 produces.
Can be provided with on mainboard 1 and extend to reveal layers of copper 11 and the via 10 of heater element 2, heat-conducting piece 3 can be located at via 10
In, so that heater element 2 is carried out heat conduction with dew layers of copper 11, improve heat transfer efficiency.
As it is shown in figure 1, stannum pick layer 4 can be located in dew layers of copper 11, thus through heat-conducting piece 3 conduction to the heat revealing layers of copper 11
Can be diffused by stannum pick layer 4, such that it is able to strengthen heat-sinking capability, effectively dispel the heat, reduce the heat of printed circuit board (PCB) 100,
Improve printed circuit board (PCB) 100 and the operation stability of heater element 2 and reliability.
Printed circuit board (PCB) 100 according to embodiments of the present invention, by forming dew layers of copper 11 on the lower surface of mainboard 1, will
Heater element 2 is located on the upper surface of mainboard 1 and corresponding with dew layers of copper 11 position in the vertical direction, arranges and prolong on mainboard 1
Extend dew layers of copper 11 and the via 10 of heater element 2, and heat-conducting piece 3 is set in via 10, utilize heat-conducting piece 3 to heater element
2 carry out heat conduction with dew layers of copper 11, and arrange stannum pick layer 4 in dew layers of copper 11, utilize stannum pick layer 4 to realize heat radiation, such that it is able to increase
Strong heat-sinking capability, effectively dispels the heat, and reduces the heat of printed circuit board (PCB) 100, and then can improve printed circuit board (PCB) 100 and heating
The operation stability of element 2 and reliability, increase the service life.
According to some embodiments of the present invention, as it is shown in figure 1, the floor projection of heater element 2 can be located at dew layers of copper 11
In floor projection, say, that heater element 2 in the horizontal direction be smaller in size than or equal to dew layers of copper 11 in the horizontal direction
Size, the size of dew layers of copper 11 is relatively big, and area of dissipation is bigger, such that it is able to dispel the heat for heater element 2 further, reduction
The heat accumulation of heater element 2.
In some embodiments of the invention, via 10 can include the multiple of spaced apart setting, such that it is able to utilize many
Heater element 2 is run the heat conduction extremely dew layers of copper 11 of generation by the via 10 of individual spaced apart setting, and heat conduction efficiency is high, thus
The local temperature rise that can avoid heater element 2 is too high.
Alternatively, multiple vias 10 can equidistantly be distributed.Thus, it is possible to put forward highly thermally conductive speed further with uniform
Property, the performance making printed circuit board (PCB) 100 is more excellent.
As it is shown in figure 1, via 10 can be formed as cylindrical hole, and the bearing of trend of via 10 can be with the thickness of mainboard 1
Degree direction is identical, say, that via 10 is formed as cylindrical hole, and the upper table of vertically extending and through mainboard 1
Face and lower surface.Thus, the size of via 10 is shorter, and convenient processing and manufacture is simple, and can carry highly thermally conductive further
Efficiency, it is ensured that radiating effect.
According to some embodiments of the present invention, as it is shown in figure 1, stannum pick layer 4 can include the multiple of spaced apart setting, thus
Multiple stannum pick layer 4 can be utilized to dispel the heat, and, by by the spaced apart setting of multiple stannum pick layer 4, can be to a certain extent
Improve stability and the uniformity of heat radiation, improve radiating efficiency further, improve radiating effect.
Alternatively, as described in Figure 1, multiple stannum pick layers 4 can equidistantly be distributed.Thus, it is possible to improve heat radiation further
Stability and uniformity, reduce heater element 2 and the temperature of mainboard 1, it is ensured that the performance of printed circuit board (PCB) 100.
In some embodiments of the invention, the outer peripheral face of heat-conducting piece 3 can be fitted the inner circumferential wall of via 10, namely
Saying, heat-conducting piece 3 can fill whole via 10.Thus, it is possible to improve radiating efficiency further, it is ensured that radiating effect.
According to some embodiments of the present invention, heat-conducting piece 3 can be formed as copper post, owing to copper post has the heat conductivity of excellence
Can, thus use copper post to carry out heat conduction and can pass to the heat that heater element 2 produces rapidly reveal layers of copper 11, thus pass through
Dew layers of copper 11 and stannum pick layer 4 realize dispelling the heat, and rapid heat dissipation, and good heat dissipation effect are meanwhile, easy to process, with low cost.
The mobile terminal of embodiment according to a second aspect of the present invention, including according to the present invention above-mentioned first aspect embodiment
Printed circuit board (PCB) 100.The control element etc. of mobile terminal can be arranged on printed circuit board (PCB) 100, controls element at printing electricity
Installation and printed circuit board (PCB) 100 installation etc. on mobile terminals on road plate 100 are to those skilled in the art
It is appreciated that and easily realizes, being not described in detail in this.
Mobile terminal according to embodiments of the present invention, by arranging printed circuit board (PCB) according to the above embodiment of the present invention
100, can effectively dispel the heat, improve operation stability and the reliability of mobile terminal, such that it is able to increase the service life.
Mobile terminal according to embodiments of the present invention can be mobile phone or panel computer etc., and other of mobile terminal are constituted
It is the most all known with operation, is not detailed herein.
In describing the invention, it is to be understood that term " " center ", " length ", " width ", " thickness ", " on ",
D score, " vertically ", " level ", " interior ", " outward ", " axially ", " radially ", " circumferential " etc. instruction orientation or position relationship be based on
Orientation shown in the drawings or position relationship, be for only for ease of the description present invention and simplify description rather than instruction or hint institute
The device that refers to or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
Bright restriction.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or imply relatively important
Property or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Person implicitly includes one or more this feature.In describing the invention, except as otherwise noted, " multiple " are meant that
Two or more.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Can
To be mechanical connection, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, can understand that above-mentioned term is at this with concrete condition
Concrete meaning in invention.
In the description of this specification, reference term " embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " concrete example " or " some examples " etc. means to combine this embodiment or the specific features of example description, knot
Structure, material or feature are contained at least one embodiment or the example of the present invention.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or spy
Point can combine in any one or more embodiments or example in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
These embodiments can be carried out multiple change in the case of departing from the principle of the present invention and objective, revise, replace and modification, this
The scope of invention is limited by claim and equivalent thereof.
Claims (10)
1. a printed circuit board (PCB), it is characterised in that including:
Mainboard, the lower surface of described mainboard is formed dew layers of copper；
Heater element, described heater element be located on the upper surface of described mainboard and with described dew layers of copper position in the vertical direction
Correspondence, described mainboard is provided with and extends to described dew layers of copper and the via of described heater element；
Heat-conducting piece, it is interior so that described heater element and described dew layers of copper are carried out heat conduction that described heat-conducting piece is located at described via；
Stannum pick layer, described stannum pick layer is located in described dew layers of copper.
Pcb board the most according to claim 1, it is characterised in that the floor projection of described heater element is positioned at described dew copper
In the floor projection of layer.
Pcb board the most according to claim 1, it is characterised in that described via includes the multiple of spaced apart setting.
Pcb board the most according to claim 2, it is characterised in that multiple described vias are equidistantly distributed.
Pcb board the most according to claim 2, it is characterised in that described via is formed as cylindrical hole and described via
Bearing of trend is identical with the thickness direction of described mainboard.
Pcb board the most according to claim 1, it is characterised in that described stannum pick layer includes the multiple of spaced apart setting.
Pcb board the most according to claim 6, it is characterised in that multiple described stannum pick layers are equidistantly distributed.
Pcb board the most according to claim 1, it is characterised in that the outer peripheral face of described heat-conducting piece is fitted the interior of described via
Peripheral wall surfaces.
Pcb board the most according to claim 1, it is characterised in that described heat-conducting piece is formed as copper post.
10. a mobile terminal, it is characterised in that include according to the printed circuit board (PCB) according to any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507602.5A CN106061099A (en) | 2016-06-28 | 2016-06-28 | Printed circuit board and mobile terminal having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507602.5A CN106061099A (en) | 2016-06-28 | 2016-06-28 | Printed circuit board and mobile terminal having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106061099A true CN106061099A (en) | 2016-10-26 |
Family
ID=57200505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610507602.5A Pending CN106061099A (en) | 2016-06-28 | 2016-06-28 | Printed circuit board and mobile terminal having the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106061099A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106982544A (en) * | 2017-05-31 | 2017-07-25 | 江苏兆能电子有限公司 | A kind of radiator structure of high power density Switching Power Supply |
| CN107454737A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its circuit board assemblies |
| CN109526134A (en) * | 2018-12-18 | 2019-03-26 | 惠科股份有限公司 | A kind of driving mould group, production method and display device |
| CN110890062A (en) * | 2019-11-21 | 2020-03-17 | Tcl华星光电技术有限公司 | Display device |
Citations (4)
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|---|---|---|---|---|
| GB2325082A (en) * | 1997-05-08 | 1998-11-11 | Motorola Ltd | Thermal via arrangement |
| US6621705B1 (en) * | 2002-04-12 | 2003-09-16 | Cisco Technology, Inc. | Miniature surface mount heatsink element and method of use |
| CN202101201U (en) * | 2011-04-29 | 2012-01-04 | 广东科立盈光电技术有限公司 | Heat dissipation structure for high-power light-emitting diode (LED) |
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
-
2016
- 2016-06-28 CN CN201610507602.5A patent/CN106061099A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2325082A (en) * | 1997-05-08 | 1998-11-11 | Motorola Ltd | Thermal via arrangement |
| US6621705B1 (en) * | 2002-04-12 | 2003-09-16 | Cisco Technology, Inc. | Miniature surface mount heatsink element and method of use |
| CN202101201U (en) * | 2011-04-29 | 2012-01-04 | 广东科立盈光电技术有限公司 | Heat dissipation structure for high-power light-emitting diode (LED) |
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106982544A (en) * | 2017-05-31 | 2017-07-25 | 江苏兆能电子有限公司 | A kind of radiator structure of high power density Switching Power Supply |
| CN107454737A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its circuit board assemblies |
| CN109526134A (en) * | 2018-12-18 | 2019-03-26 | 惠科股份有限公司 | A kind of driving mould group, production method and display device |
| CN110890062A (en) * | 2019-11-21 | 2020-03-17 | Tcl华星光电技术有限公司 | Display device |
| WO2021097904A1 (en) * | 2019-11-21 | 2021-05-27 | Tcl华星光电技术有限公司 | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161026 |
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| RJ01 | Rejection of invention patent application after publication |