CN104869785A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN104869785A CN104869785A CN201410058595.6A CN201410058595A CN104869785A CN 104869785 A CN104869785 A CN 104869785A CN 201410058595 A CN201410058595 A CN 201410058595A CN 104869785 A CN104869785 A CN 104869785A
- Authority
- CN
- China
- Prior art keywords
- heat
- electronic equipment
- heat pipe
- electronic device
- condensation segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An electronic equipment disclosed by the present invention comprises an electronic device, a heat pipe and a driving member, liquid metal is arranged in the heat pipe, and the heat pipe is a looped pipe and comprises an evaporation section, a condensation section, a first conducting section and a second conducting section which are connected orderly. The evaporation section is arranged on the electronic device and is used to absorb the heat radiated by the electronic device, and the driving member is used to drive the liquid metal to circulate in the heat pipe, so that that the liquid metal of absorbing the heat can flow to the condensation section via the first conducting section to radiate the heat, and then circulates to the evaporation section to absorb the heat via the second conducting section.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment.
Background technology
Along with the development of science and technology and the progress of society, electronic equipment such as computer, mobile phone, TV have become an indispensable part in people's live and work.
In order to ensure that the electronic device in electronic equipment can normally work, in electronic equipment, be usually provided with radiating element.Particularly, described electronic equipment comprises: the electronic device (as central processing unit, heat-generating electronic elements etc.) of evolution of heat during work and heat pipe, water or hydrogen chloride is provided with in described heat pipe, described heat pipe one end is evaporation ends, the other end is condensation end, described evaporation ends is arranged on described electronic device, liquid state in described evaporation ends is evaporated for the heat absorbing described electronic device and distribute, and flow to that described condensation end carries out dispelling the heat, condensation, condensed liquid state flows to the heat absorption of described evaporation ends again, so circulates.
But present inventor in the process realizing technical scheme, at least find that above-mentioned prior art exists following technical problem:
Because by the effect of gravity when described liquid state flows back to described evaporation ends from described condensation end, therefore, the position of described evaporation ends must be made during use lower than the position of described condensation end, and evaporation ends described in the flow direction that can ensure described condensation end, causes the use being not easy to user.
Summary of the invention
The application provides a kind of electronic equipment, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
The application provides a kind of electronic equipment, described electronic equipment comprises electronic device, heat pipe and actuator, liquid metal is provided with in described heat pipe, described heat pipe is a back-shaped pipe, described heat pipe comprises the evaporation section, condensation segment, the first conductive sections and the second conductive sections that connect in turn, described evaporation section is arranged on described electronic device, for absorbing the heat that described electronic device distributes; Described actuator is for driving described liquid metal at described heat pipe Inner eycle, make the liquid metal absorbing described heat can flow to described condensation segment by described first conductive sections and carry out heat and distribute, then being recycled to the heat absorption of described evaporation section by described second conductive sections.
Preferably, described actuator is specially electromagnetic pump.
Preferably, described condensation segment is provided with multiple radiating fin for increasing heat radiation area.
Preferably, described electronic equipment also comprises airflow accelerator, and described airflow accelerator is arranged on described condensation segment.
Preferably, described electronic equipment also comprises the container filling heat absorption liquid, and described condensation segment is arranged in described container, and contacts with described heat absorption liquid.
Preferably, the pipe thickness of described heat pipe is less than 1mm.
Preferably, between described evaporation section and described electronic device, equipment has heat conductive pad.
Preferably, described electronic equipment also comprises the fixture for fixing described heat pipe.
The application's beneficial effect is as follows:
Above-mentioned electronic equipment by arranging liquid metal in heat pipe, and by arranging described actuator to drive described liquid metal, to make described liquid metal after the evaporation section of described heat pipe absorbs the heat that described electronic device distributes, flow to described condensation segment by described first conductive sections and carry out heat and distribute, be recycled to described evaporation section by described second conductive sections again and absorb the heat that described electronic device distributes, thus the heat that described electronic device produces is distributed, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
By arranging described heat conductive pad between described evaporation section and described electronic device, thus increase the heat conduction efficiency of described evaporation section and described electronic device, the heat that described electronic device is produced can conduct timely, improves the radiating effect of described electronic device further.
By the pipe thickness of described heat pipe being set to be less than 1mm, thus reducing to cause because tube wall is blocked up described heat pipe to take space in described electronic equipment, being beneficial to the development trend that electronic equipment is frivolous.
By arranging multiple radiating fin on described condensation segment, thus increasing heat radiation area, body rises radiating effect, improves the radiating efficiency of described condensation segment.
Described airflow accelerator being set by being arranged on described condensation segment, to accelerate the flowing velocity in the space around described condensation segment, improving the radiating efficiency of described condensation segment.
Fill the container of heat absorption liquid by arranging, and described condensation end is arranged in described container contacts with described heat absorption liquid, make described condensation end and described heat absorption liquid carry out heat exchange, thus improve the radiating efficiency of described condensation end.
By arranging the fixture being used for described heat pipe, to prevent described heat pipe to be subjected to displacement in described electronic equipment, ensure radiating efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the vertical view of the application one better embodiment electronic equipment;
Fig. 2 is the upward view of electronic equipment in Fig. 1.
Embodiment
The embodiment of the present application is by providing a kind of electronic equipment, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of electronic equipment, described electronic equipment comprises electronic device, heat pipe and actuator, liquid metal is provided with in described heat pipe, described heat pipe is a back-shaped pipe, described heat pipe comprises the evaporation section, condensation segment, the first conductive sections and the second conductive sections that connect in turn, described evaporation section is arranged on described electronic device, for absorbing the heat that described electronic device distributes; Described actuator is for driving described liquid metal at described heat pipe Inner eycle, make the liquid metal absorbing described heat can flow to described condensation segment by described first conductive sections and carry out heat and distribute, then being recycled to the heat absorption of described evaporation section by described second conductive sections.
Above-mentioned electronic equipment by arranging liquid metal in heat pipe, and by arranging described actuator to drive described liquid metal, to make described liquid metal after the evaporation section of described heat pipe absorbs the heat that described electronic device distributes, flow to described condensation segment by described first conductive sections and carry out heat and distribute, be recycled to described evaporation section by described second conductive sections again and absorb the heat that described electronic device distributes, thus the heat that described electronic device produces is distributed, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
As shown in Figure 1, be the vertical view of the application first better embodiment electronic equipment 100.Described electronic equipment 100 can be mobile phone, computer, PAD, TV etc.Described electronic equipment 100 comprises electronic device 10, heat pipe 20 and actuator 30.
Consult Fig. 2 simultaneously, can the evolution of heat when electronic device 10 works, described electronic device 10 can be central processing unit, chip etc.
Liquid metal is provided with in described heat pipe 20.Described heat pipe 20 is a back-shaped pipe.Described heat pipe 20 comprises evaporation section 21, condensation segment 22, first conductive sections 23 and the second conductive sections 24, described evaporation section 21, described condensation segment 22, described first conductive sections 23 are connected in turn with described second conductive sections 24, with the loop Inner eycle making described liquid metal can be formed at described evaporation section 21, described condensation segment 22, described first conductive sections 23, described second conductive sections 24 and described evaporation section 21.Under force, described liquid metal can enter the first conductive sections 23 from described evaporation section 21, described condensation segment 22 is entered again from described first conductive sections 23, described second conductive sections 24 is entered again from described condensation segment 22, enter described evaporation section 21 from described second conductive sections 24 again, so circulate.Described evaporation section 21 is arranged on described electronic device 10, for absorbing the heat that described electronic device 10 distributes, under force, the liquid metal absorbing described heat enters described condensation segment 22 by described first conductive sections 23 and carries out condensation, after carrying out condensation, enter described evaporation section 21 through described second conductive sections 24 and continue to absorb the heat that distributes of described electronic device 10.
Described actuator 30 is for driving described liquid metal at described heat pipe 20 Inner eycle, make the liquid metal absorbing the heat that described electronic device 10 distributes can flow to described condensation segment 22 by described first conductive sections 23 and carry out heat to distribute, then be recycled to described evaporation section 21 by described second conductive sections 24 and absorb the heat that described electronic device 10 distributes.
Particularly, described actuator 30 is specifically as follows electromagnetic pump.Described electromagnetic pump is be in energising fluid in the magnetic field pump to certain orientation flowing under electromagnetic force, utilize the interaction of electric current in magnetic field and conductor fluid, make fluid be subject to electromagnetic force and produce barometric gradient, thus a kind of device of propelling fluid motion.
Above-mentioned electronic equipment 100 by arranging liquid metal in heat pipe 20, and by arranging described actuator 30 to drive described liquid metal, to make described liquid metal after the evaporation section 21 of described heat pipe 20 absorbs the heat that described electronic device 10 distributes, flow to described condensation segment 22 by described first conductive sections 23 and carry out heat and distribute, be recycled to described evaporation section 21 by described second conductive sections 24 again and absorb the heat that described electronic device 10 distributes, thus the heat that described electronic device 10 produces is distributed, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
Particularly, in order to increase the heat conduction efficiency before described evaporation section 21 and described electronic device 10, between described evaporation section 21 and described electronic device 10, heat conductive pad 40 is provided with.Described heat conductive pad is high-performance gap-fill Heat Conduction Material, be mainly used in the transmission interface between electronic equipment and fin or product casing, there is good viscosity, flexibility, good compression performance and there is excellent pyroconductivity, make it that the air between electronic original part and fin in use can be made completely to discharge, to reach contact fully, radiating effect increases.By arranging described heat conductive pad 40 between described evaporation section 21 and described electronic device 10, thus increase the heat conduction efficiency of described evaporation section 21 and described electronic device 10, the heat that described electronic device 10 is produced can conduct timely, improves the radiating effect of described electronic device 10 further.
Particularly, the size of described heat pipe 20 comprises length, diameter, wall thickness etc. and can arrange according to the size in the space in described electronic equipment 100, in mini-plant, in order to reduce the space that described heat pipe 20 takies, the pipe thickness of described heat pipe 20 can be set to be less than 1mm.By the pipe thickness of described heat pipe 20 being set to be less than 1mm, thus reducing to cause because tube wall is blocked up described heat pipe 20 to take space in described electronic equipment 100, being beneficial to the development trend that electronic equipment 100 is frivolous.
In order to increase the radiating effect of described condensation segment 22, can increase to the heat abstractor of described condensation end 22 heat radiation on described condensation segment 22, particularly, described heat abstractor can be one or more following combination.
The first, described heat abstractor is radiating fin 51, and that is, described electronic equipment 100 comprises the multiple radiating fins 51 on the outer surface being arranged at described condensation segment 22, and described radiating fin 51, for increasing heat radiation area, improves radiating efficiency.By arranging multiple radiating fin 51 on described condensation segment 22, thus increasing heat radiation area, body rises radiating effect, improves the radiating efficiency of described condensation segment 22.
The second, described heat abstractor is air-flow accelerator module 52, and that is, described electronic equipment 100 also comprises airflow accelerator 52, and described airflow accelerator 52 is arranged on described condensation segment 22.Described airflow accelerator 52, for accelerating the flowing velocity of air-flow, for accelerating the flowing velocity in the space around described condensation segment 22, thus improves the radiating efficiency of described condensation segment 22.Described airflow accelerator 52 can be air pump, fan.Described airflow accelerator 22 being set by being arranged on described condensation segment 22, to accelerate the flowing velocity in the space around described condensation segment 22, improving the radiating efficiency of described condensation segment 22.
The third, described heat abstractor also can for filling the container of heat absorption liquid, that is, in other embodiments, described electronic equipment 100 also comprises the container filling heat absorption liquid, and described condensation segment 22 is arranged in described container, and contacts with described heat absorption liquid.Fill the container of heat absorption liquid by arranging, and described condensation end 22 is arranged in described container contacts with described heat absorption liquid, make described condensation end 22 carry out heat exchange with described heat absorption liquid, thus improve the radiating efficiency of described condensation end 22.
In addition, particularly, described electronic equipment 100 also comprises the fixture 60 for fixing described heat pipe 20.By arranging the fixture 60 being used for described heat pipe 20, to prevent described heat pipe 20 to be subjected to displacement in described electronic equipment 100, ensure radiating efficiency.
Above-mentioned electronic equipment 100 by arranging liquid metal in heat pipe 20, and by arranging described actuator 30 to drive described liquid metal, to make described liquid metal after the evaporation section 21 of described heat pipe 20 absorbs the heat that described electronic device 10 distributes, flow to described condensation segment 22 by described first conductive sections 23 and carry out heat and distribute, be recycled to described evaporation section 21 by described second conductive sections 24 again and absorb the heat that described electronic device 10 distributes, thus the heat that described electronic device 10 produces is distributed, solve in prior art because of the effect by gravity when described liquid state flows back to described evaporation ends from described condensation end, cause must ensureing the position of the position of described evaporation ends lower than described condensation end when using, cause the technical problem being not easy to user's use.
By arranging described heat conductive pad 40 between described evaporation section 21 and described electronic device 10, thus increase the heat conduction efficiency of described evaporation section 21 and described electronic device 10, the heat that described electronic device 10 is produced can conduct timely, improves the radiating effect of described electronic device 10 further.
By the pipe thickness of described heat pipe 20 being set to be less than 1mm, thus reducing to cause because tube wall is blocked up described heat pipe 20 to take space in described electronic equipment 100, being beneficial to the development trend that electronic equipment 100 is frivolous.
By arranging multiple radiating fin 51 on described condensation segment 22, thus increasing heat radiation area, body rises radiating effect, improves the radiating efficiency of described condensation segment 22.
Described airflow accelerator 22 being set by being arranged on described condensation segment 22, to accelerate the flowing velocity in the space around described condensation segment 22, improving the radiating efficiency of described condensation segment 22.
Fill the container of heat absorption liquid by arranging, and described condensation end 22 is arranged in described container contacts with described heat absorption liquid, make described condensation end 22 carry out heat exchange with described heat absorption liquid, thus improve the radiating efficiency of described condensation end 22.
By arranging the fixture 60 being used for described heat pipe 60, to prevent described heat pipe 20 to be subjected to displacement in described electronic equipment 100, ensure radiating efficiency.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. an electronic equipment, described electronic equipment comprises:
Electronic device;
Heat pipe, be provided with liquid metal in described heat pipe, described heat pipe is a back-shaped pipe, and described heat pipe comprises the evaporation section, condensation segment, the first conductive sections and the second conductive sections that connect in turn, described evaporation section is arranged on described electronic device, for absorbing the heat that described electronic device distributes;
Actuator, for driving described liquid metal at described heat pipe Inner eycle, make the liquid metal absorbing described heat can flow to described condensation segment by described first conductive sections and carry out heat and distribute, then being recycled to the heat absorption of described evaporation section by described second conductive sections.
2. electronic equipment as claimed in claim 1, it is characterized in that, described actuator is specially electromagnetic pump.
3. electronic equipment as claimed in claim 1, is characterized in that, described condensation segment is provided with multiple radiating fin for increasing heat radiation area.
4. the electronic equipment as described in claim arbitrary in claim 1-3, it is characterized in that, described electronic equipment also comprises airflow accelerator, described airflow accelerator is arranged on described condensation segment.
5. the electronic equipment as described in claim arbitrary in claim 1-3, it is characterized in that, described electronic equipment also comprises the container filling heat absorption liquid, described condensation segment is arranged in described container, and contacts with described heat absorption liquid.
6. the electronic equipment as described in claim arbitrary in claim 1-3, is characterized in that, the pipe thickness of described heat pipe is less than 1mm.
7. the electronic equipment as described in claim arbitrary in claim 1-3, is characterized in that, between described evaporation section and described electronic device, equipment has heat conductive pad.
8. the electronic equipment as described in claim arbitrary in claim 1-3, is characterized in that, described electronic equipment also comprises the fixture for fixing described heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058595.6A CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058595.6A CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104869785A true CN104869785A (en) | 2015-08-26 |
| CN104869785B CN104869785B (en) | 2021-01-15 |
Family
ID=53915168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410058595.6A Active CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104869785B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105240284A (en) * | 2015-11-03 | 2016-01-13 | 安徽腾龙泵阀制造有限公司 | Practical cooling magnetic pump |
| CN106604615A (en) * | 2017-01-03 | 2017-04-26 | 联想(北京)有限公司 | Electronic device |
| CN107529327A (en) * | 2017-10-24 | 2017-12-29 | 山东大学 | Micro-move device active heat radiating device and the electronic equipment with the heat abstractor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2874396Y (en) * | 2005-10-21 | 2007-02-28 | 中国科学院理化技术研究所 | Pulse heat pipe radiator using low-melting point metal and common fluid as flowing working medium |
| CN201344754Y (en) * | 2009-01-22 | 2009-11-11 | 浙江大学 | Vapor-liquid bi-phase separation type radiator for gravity assisted heat pipe |
| US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| CN201674744U (en) * | 2009-07-23 | 2010-12-15 | 青岛海信日立空调系统有限公司 | Novel radiating device of air-conditioning variable frequency module |
| CN102056459A (en) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooling heat radiating device |
| CN102486355A (en) * | 2010-12-01 | 2012-06-06 | 富士通株式会社 | Cooling apparatus and electronic apparatus |
| CN102637542A (en) * | 2012-01-06 | 2012-08-15 | 西安交通大学 | Radiator based on circular radiating of liquid metal or alloy thereof for high-capacity direct-current circuit breaker |
-
2014
- 2014-02-20 CN CN201410058595.6A patent/CN104869785B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| CN2874396Y (en) * | 2005-10-21 | 2007-02-28 | 中国科学院理化技术研究所 | Pulse heat pipe radiator using low-melting point metal and common fluid as flowing working medium |
| CN201344754Y (en) * | 2009-01-22 | 2009-11-11 | 浙江大学 | Vapor-liquid bi-phase separation type radiator for gravity assisted heat pipe |
| CN201674744U (en) * | 2009-07-23 | 2010-12-15 | 青岛海信日立空调系统有限公司 | Novel radiating device of air-conditioning variable frequency module |
| CN102056459A (en) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooling heat radiating device |
| CN102486355A (en) * | 2010-12-01 | 2012-06-06 | 富士通株式会社 | Cooling apparatus and electronic apparatus |
| CN102637542A (en) * | 2012-01-06 | 2012-08-15 | 西安交通大学 | Radiator based on circular radiating of liquid metal or alloy thereof for high-capacity direct-current circuit breaker |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105240284A (en) * | 2015-11-03 | 2016-01-13 | 安徽腾龙泵阀制造有限公司 | Practical cooling magnetic pump |
| CN106604615A (en) * | 2017-01-03 | 2017-04-26 | 联想(北京)有限公司 | Electronic device |
| CN107529327A (en) * | 2017-10-24 | 2017-12-29 | 山东大学 | Micro-move device active heat radiating device and the electronic equipment with the heat abstractor |
| CN107529327B (en) * | 2017-10-24 | 2024-01-30 | 山东大学 | Micro-driving active heat dissipation device and electronic equipment with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104869785B (en) | 2021-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120291997A1 (en) | Liquid cooling device | |
| CN105101747A (en) | Thermal clamp apparatus for electronic systems | |
| CN101594739A (en) | Device embedded circuit board heat abstractor and processing method | |
| CN102548359A (en) | An electronic system changeable to accommodate an ehd air mover or mechanical air mover | |
| CN105623619A (en) | Flexible heat conduction/heat storage double-function composite material, method for manufacturing same and application of flexible heat conduction/heat storage double-function composite material | |
| CN104619146B (en) | A kind of heat abstractor and electronic equipment | |
| CN104869785A (en) | Electronic equipment | |
| CN106061099A (en) | Printed circuit board and mobile terminal having the same | |
| KR200491117Y1 (en) | staggered heat dissipation structure of interface card | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN201422221Y (en) | Heat dissipating device | |
| CN103378022A (en) | Radiating fin and manufacturing method thereof | |
| CN104600188A (en) | Combined effective cooling device | |
| WO2020135311A1 (en) | Heat dissipation apparatus and method | |
| CN109413929A (en) | Heat sink and its manufacturing method | |
| US8584743B2 (en) | Solid type heat dissipation device | |
| CN104347546A (en) | Multiple-effect chip liquid cooling device | |
| CN109257905A (en) | Electronics member radiator | |
| CN202151035U (en) | Heat radiator | |
| CN106211718B (en) | A kind of heat radiating fin structure of new radiator | |
| CN205584618U (en) | PCB circuit board convenient to heat dissipation | |
| CN201780974U (en) | Heat sink of heating electronic component | |
| CN205961656U (en) | Netcom's cramp formula increase type thermal current fin | |
| CN201421285Y (en) | Natural convection type and thermal radiation type heat pipe radiator | |
| CN205946488U (en) | Electric control device and air conditioner with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |