CN201422221Y - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

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Publication number
CN201422221Y
CN201422221Y CN2009200068009U CN200920006800U CN201422221Y CN 201422221 Y CN201422221 Y CN 201422221Y CN 2009200068009 U CN2009200068009 U CN 2009200068009U CN 200920006800 U CN200920006800 U CN 200920006800U CN 201422221 Y CN201422221 Y CN 201422221Y
Authority
CN
China
Prior art keywords
heat pipe
heat
flat
pedestal
center section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200068009U
Other languages
Chinese (zh)
Inventor
秦志仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lu Baiqing
PROLIMA TECH Co Ltd
Original Assignee
Lu Baiqing
PROLIMA TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lu Baiqing, PROLIMA TECH Co Ltd filed Critical Lu Baiqing
Priority to CN2009200068009U priority Critical patent/CN201422221Y/en
Application granted granted Critical
Publication of CN201422221Y publication Critical patent/CN201422221Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a heat dissipating device, which is characterized in that a flat-type heat pipe and a heat conducting fin are arranged between a base and a heat-dissipating fin group, wherein an accommodating groove is arranged on the heat conducting fin in a penetrating way, and the flat-type heat pipe is embedded in the accommodating groove. Accordingly, when the utility model is arranged on a central processing unit and other electronic components, the heat absorbed by the base is conducted to the flat-type heat pipe, is evenly diffused by the flat-type heat pipe and the heat conducting fin surrounding the flat-type heat pipe, and then is emitted into the air by the heat-dissipating fin group so as to effectively cool the central processing unit.

Description

Heat abstractor
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to being provided with flat heat pipe and having great heat radiation effect and can be made as the heat abstractor of a reduced size.
Background technology
Progress along with material and technology, be used in the computer in order to processing instruction, the CPU of data or the like, frequency during its operation constantly rises, the calculation ability also improves thereupon, but incident is that caloric value also significantly increases, because the rising of temperature can cause CPU usefulness to reduce during running, therefore how to make the exploitation of the thermal management technology that this heat effectively disperses also enjoy attention, particularly be applied to the occasion of server when this CPU, because server special requirement when operation need keep stability, therefore for the requirement of radiating effect than general computer height, so will and be formed at the heat abstractor that radiating fin constituted on this copper/aluminium block by one bronze medal/aluminium block in the prior art and be positioned over the mode of dispersing in order to supplemental heat the CPU top and do not met demand;
For improving the deficiency of above-mentioned heat dissipation technology, then there is the dealer to develop the technology that copper/aluminium block integral body is replaced with a heat pipe, so can absorb the heat of CPU and heat is evenly distributed in order to being distributed by radiating fin by this heat pipe, but the manufacturing cost of heat pipe is higher, thereby the shortcoming that has the cost that causes heat abstractor significantly to rise;
In addition, the overall dimensions of server are to be formulated by EIA (EIA) standard specification is arranged, can be divided into as the rack type version server 1U or 2U etc. are arranged, wherein this U is meant the height of server, 1U equals 4.445cm, therefore the server of 1U specification its highly be 4.445cm, by that analogy, the external form of hence one can see that server is to have certain height, so its overall dimensions of heat abstractor of using for server also are restricted, therefore how designing with low cost in limited size range and have the heat abstractor of great heat radiation effect, is the problem that the utility model institute desire solves.
Summary of the invention
Because the problem of above-mentioned existing heat abstractor, the purpose of this utility model provides a kind of heat abstractor, and it also can not cause cost significantly to increase except having great heat radiation effect.
For achieving the above object, the utility model provides a heat abstractor, and it includes:
One pedestal is by the made lamellar body of Heat Conduction Materials such as copper, aluminium;
At least one flat heat pipe, it is arranged on the described pedestal upper side;
One conducting strip, be by the made lamellar body of the Heat Conduction Material identical or different with pedestal, it runs through the storage tank that is formed with the described flat heat pipe external form of coupling, conducting strip is arranged on the described pedestal flat heat pipe is embedded in the storage tank, and the end face of its end face and flat heat pipe is in the same plane;
One radiating fin group includes a plurality of fins that are set in distance, and the radiating fin group is arranged on described conducting strip and the flat heat pipe.
The utility model in use, the central processing unit etc. that is arranged at server has the electronic component top of radiating requirements, and make described pedestal contact with the central processing unit surface, the heat that this central processing unit like this is produced when operation can conduct on the pedestal, this heat and spread for described flat heat pipe absorbs apace along heat pipe, and further conduct to the described conducting strip that surrounds flat heat pipe, heat can evenly be distributed, then distribute in air via described radiating fin group.
From the above, the utility model is by described flat heat pipe and conducting strip heat evenly to be distributed in order to dispersing from radiating fin, its radiating effect is better than the existing heat abstractor that does not use heat pipe, and cost of manufacture also is lower than the existing heat abstractor that copper/aluminium block integral body is replaced with a heat pipe, and, therefore can produce the less heat abstractor of size to be used on server owing to be to use flat heat pipe.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present utility model.
Fig. 2 is a side view cutaway drawing of the present utility model.
The main element symbol description:
(10) pedestal (20) flat heat pipe
(21) first heat pipes (22) second heat pipes
(221) center section part (222) terminal part
(30) conducting strip (31) storage tank
(40) radiating fin group
Embodiment
Referring to Figure 1 and Figure 2, heat abstractor of the present utility model includes a pedestal 10, at least one flat heat pipe 20, a conducting strip 30, a radiating fin group 40, wherein:
This pedestal 10 is a lamellar body, and its downside is used for contacting with the surface of the electronic components such as CPU of a server, and pedestal 10 is rectangular in the present embodiment, and it can be made by Heat Conduction Materials such as copper, aluminium;
This flat heat pipe 20 is arranged on described pedestal 10 upper sides, be provided with one first heat pipe 21 and two second heat pipes 22 in the present embodiment, wherein first heat pipe 21 is to be the vertical bar shape, and having one respectively, second heat pipe 22 is the center section part 221 of vertical bar shape and the terminal part 222 towards the curved bending in the same side from center section part 221 two ends, this two second heat pipe 22 is arranged at the dual-side of first heat pipe 21 respectively and is posted by first heat pipe 21 with center section part 221, this first heat pipe 21 be arranged at the centre of pedestal 10 and two ends toward the two opposite sides end of pedestal 10, the terminal part 222 of this second heat pipe 22 is positioned at four corners of pedestal 10 respectively relatively;
This conducting strip 30 is by the Heat Conduction Material made lamellar body identical or different with pedestal 10, it runs through the storage tank that is formed with described flat heat pipe 20 external forms of coupling, be formed with the storage tank 31 of first, second heat pipe 22 of coupling in the present embodiment, conducting strip 30 is arranged at first, second heat pipe 22 is embedded in the storage tank 31, and the end face of its end face and first, second heat pipe 22 is in the same plane;
This radiating fin group 40 includes a plurality of fins that are set in distance, and it can be made by Heat Conduction Materials such as copper, aluminium, and radiating fin group 40 is arranged to be on described conducting strip 30 and the flat heat pipe 20 and is in contact with one another.
Heat abstractor of the present utility model uses seasonal described pedestal 10 for example to be contacted with, and the desires such as CPU of server make on the electronic component of its cooling, so this pedestal 10 can absorb heat and conduct to flat heat pipe 20, and for this flat heat pipe 20 and be surrounded on 30 evenly diffusions of conducting strip around the flat heat pipe 20, be distributed in the air for radiating fin group 40 subsequently.

Claims (4)

1, a kind of heat abstractor is characterized in that, includes:
One pedestal, it is a lamellar body;
At least one flat heat pipe, it is arranged on the described pedestal upper side;
One conducting strip, it runs through the storage tank that is formed with the described flat heat pipe external form of coupling, and conducting strip is arranged on the described pedestal flat heat pipe is embedded in the storage tank, and the end face of its end face and flat heat pipe is in the same plane;
One radiating fin group, it is arranged on described conducting strip and the flat heat pipe.
2, heat abstractor according to claim 1 is characterized in that: described flat heat pipe includes one first heat pipe, its be the vertical bar shape and be arranged at the centre of described pedestal and two ends toward the two opposite sides end of pedestal.
3, heat abstractor according to claim 1 is characterized in that:
Described pedestal is rectangular;
Described flat heat pipe includes two second heat pipes, this two second heat pipe has one respectively and is the center section part of vertical bar shape and the terminal part towards the curved bending in the same side from the center section part two ends, two second heat pipes are arranged on the described pedestal, its two center section part is adjacent, and its terminal part is positioned at four corners of pedestal respectively relatively.
4, heat abstractor according to claim 2 is characterized in that:
Described pedestal is rectangular;
Described flat heat pipe further includes two second heat pipes, this two second heat pipe has one respectively and is the center section part of vertical bar shape and the terminal part towards the curved bending in the same side from the center section part two ends, two second heat pipes are arranged at the dual-side of first heat pipe respectively and are posted by first heat pipe with center section part, and its terminal part is positioned at four corners of described pedestal respectively relatively.
CN2009200068009U 2009-03-24 2009-03-24 Heat dissipating device Expired - Fee Related CN201422221Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200068009U CN201422221Y (en) 2009-03-24 2009-03-24 Heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200068009U CN201422221Y (en) 2009-03-24 2009-03-24 Heat dissipating device

Publications (1)

Publication Number Publication Date
CN201422221Y true CN201422221Y (en) 2010-03-10

Family

ID=41808881

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200068009U Expired - Fee Related CN201422221Y (en) 2009-03-24 2009-03-24 Heat dissipating device

Country Status (1)

Country Link
CN (1) CN201422221Y (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130080A (en) * 2010-11-11 2011-07-20 华为技术有限公司 Heat radiation device
CN102906870A (en) * 2010-06-18 2013-01-30 夏普株式会社 Heat dissipation structure for electronic device
CN103582386A (en) * 2012-08-01 2014-02-12 英业达科技有限公司 Electronic device and heat radiation structure thereof
CN104640418A (en) * 2013-11-14 2015-05-20 升业科技股份有限公司 Heat dissipating module
CN105208827A (en) * 2014-06-17 2015-12-30 奇鋐科技股份有限公司 Heat dissipation structure of handheld device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102906870A (en) * 2010-06-18 2013-01-30 夏普株式会社 Heat dissipation structure for electronic device
CN102130080A (en) * 2010-11-11 2011-07-20 华为技术有限公司 Heat radiation device
CN102130080B (en) * 2010-11-11 2012-12-12 华为技术有限公司 Heat radiation device
US8737071B2 (en) 2010-11-11 2014-05-27 Huawei Technologies Co., Ltd. Heat dissipation device
CN103582386A (en) * 2012-08-01 2014-02-12 英业达科技有限公司 Electronic device and heat radiation structure thereof
CN103582386B (en) * 2012-08-01 2016-09-28 英业达科技有限公司 Electronic installation and radiator structure thereof
CN104640418A (en) * 2013-11-14 2015-05-20 升业科技股份有限公司 Heat dissipating module
CN105208827A (en) * 2014-06-17 2015-12-30 奇鋐科技股份有限公司 Heat dissipation structure of handheld device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100310

Termination date: 20170324