CN104640418A - Heat dissipating module - Google Patents
Heat dissipating module Download PDFInfo
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- CN104640418A CN104640418A CN201310565952.3A CN201310565952A CN104640418A CN 104640418 A CN104640418 A CN 104640418A CN 201310565952 A CN201310565952 A CN 201310565952A CN 104640418 A CN104640418 A CN 104640418A
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- radiating fin
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Abstract
The invention discloses a heat dissipating module comprising a heat tube set, a heat dissipating baseplate and a heat dissipating fin set. The heat dissipating baseplate is provided with a plurality of hollowed-out areas. Riveting grooves of heat dissipating fins are formed in the first surface of the heat dissipating baseplate, two opposite edges, in each hollowed-out area, of a heat tube pier are arranged on the second surface of the heat dissipating baseplate, and the second surface contacts with a chip. The heat dissipating fin set is formed by cross distribution of a plurality of projection areas and a plurality of non-projection areas and fastening of a plurality of fasteners, each of the projection areas and the non-projection areas comprises a plurality of heat dissipating fins in parallel arrangement, each of the projection areas is provided with a plurality of heat tube accommodating grooves, the tail ends of the heat dissipating fins of the projection areas are bent to be L-shaped so as to abut against the chip, the projection areas of the heat dissipating fin set project from the hollowed-out areas of the heat dissipating baseplate respectively after riveting, the plane where the L-shaped abutting portions abut against the chip, the riveted second surface of the heat tube set in the hollowed-out areas and the second surface of the heat dissipating baseplate are on the same plane obviously.
Description
Technical field
The present invention is about a kind of radiating module, refer to a kind of radiating module being applied to 1U server or cutter point server especially, the heat pipe of high heat conduction efficiency is directly contacted with chip thermal source, and by chip the heat sent out directly be directed at radiating fin, use the performance improving 1U server radiating module.
Background technology
Be different from general desktop computer or notebook computer, user can carry out computer shutdown (or being at least in resting state) after a procedure.And server is except specific maintenance day, almost annual without stopping, in addition, the object of server service comprises large business user or cloud user, and the most of the time is all be in the state of running up.Therefore, for the cooling of CPU, the requirement of reliability is harsh especially.
Particularly 1U server, it is by every frame server, lies against in a frame.The height Jin Yue1UGe unit (4.445cm) of every station server, although can save space, also makes heat dissipation problem have more challenge.Another kind is space-efficient cutter point server more, and its feature is inserted in one by one on pedestal by computer plate, shares a power supply supply.Can infer, the latter is more far more than the former for the requirement of radiating module.In response to the challenge of harsh cooling condition, the cooling heat dissipation module of most high-order adopts conductive coefficient close to the temperature-uniforming plate (Vapor Chamber) of 100,000Watt/m-DEG C, allows the direct contact chip pyrotoxin of temperature-uniforming plate overcome.But temperature-uniforming plate manufacture difficulty is high, and cost is high, it is the solution that a kind of property favorable rates is high.
And the conductive coefficient of heat pipe is equally close to 100,000Watt/m-DEG C, in the industry trend pursuing high performance-price ratio (CP value), the heat pipe that ingenious R. concomitans is cheap and copper or aluminum soleplate, develop a kind of radiating module significantly low cost but still being possessed suitable excellent properties, become the trend of server radiating module.
One prior art, and be recognized the radiating module that can effectively reduce costs, please refer to the explosive view shown in Fig. 1.From bottom to top comprise radiating fin group 20, heat pipe heat 30, radiating bottom plate 40, copper coin 50.The thick about 1mm of copper coin 50 is contacted with thermal source (chip), such as, and cpu chip.The first surface 41 of radiating bottom plate 40, has the heat pipe storage tank 45 of heat pipe heat 30 to be formed at wherein, with accommodating heat pipe heat 30.Heat pipe heat shown in Fig. 1 comprises a S group and two horseshoe types.The second surface 42 of radiating bottom plate 40 has a depressed area 46 (label 46 points to edge, depressed area) with accommodating copper coin 50.Second face 32 part contact of heat pipe heat 30 is in copper coin 50, and first surface 31 is contacted with radiating fin group 20.
So, thermal source passes to heat pipe heat 30 indirectly by the copper coin 50 that conductive coefficient is good.Large-area radiating fin group 20 is directly conducted heat to again by heat pipe heat 30.Therefore, though heat transfer efficiency is slightly poorer than temperature-uniforming plate, can reduce costs by certain degree.The assembly of above-mentioned radiating module: the combination of radiating fin group 20, heat pipe heat 30, radiating bottom plate 40, copper coin 50 is combined by each assembly and through Overwelding and rewelding furnace, each assembly soldering is combined into the radiating module of a soldering after clamping.Fig. 2 A is the stereogram of combination, and Fig. 2 B is front view, and wherein, the first surface of radiating bottom plate 40 is flat.
For reducing costs further, another prior art is combined with welding riveting technology at heat pipe heat 30, radiating fin group 20 and radiating bottom plate (aluminium matter) 40.Assembly 20,30,40 combination of radiating module does not need through Overwelding and rewelding furnace, please refer to the explosive view of Fig. 3.Fig. 4 A is the stereogram of combination finished product.The first surface 41 of radiating bottom plate 40 is provided with the riveted ditch 44 of radiating fin group 20.Second surface 42 has heat pipe storage tank 45, refers to the second surface 42 of radiating bottom plate 40 shown in Fig. 4 B.Fig. 4 C is front view, and the first surface 41 of radiating bottom plate 40 has radiating fin group 20 riveted ditch 44.The heat pipe heat 30 of high heat conduction efficiency is directly contacted with thermal source.But heat pipe heat 30 is not directly contacted with radiating fin group 20, in be spaced the poor aluminium matter radiating bottom plate of a heat conduction efficiency 40 (coefficient of heat conduction of aluminium is about 205Watt/m-DEG C of copper and is about 400Watt/m-DEG C), make its heat dissipation of the more difficult performance of radiating fin group 20.Though the combination of the assembly 20,30,40 of this radiating module does not need through Overwelding and rewelding furnace, aluminum soleplate or radiating fin must through nickel plating, and also save expensive copper soleplate, though can significantly reduce costs, performance is far inferior to temperature-uniforming plate.
In view of this, object of the present invention will develop one can significantly reduce costs, and can meet the radiating module of the harsh heat dispersion requirement of 1U server.
Summary of the invention
The technical problem that the present invention solves is to provide a kind of radiating module to meet the harsh heat dispersion requirement of cutter point server.
The invention discloses a kind of radiating module, described radiating module comprises a heat pipe heat, one radiating bottom plate, radiating bottom plate is provided with most transmission districts in wherein, the first surface of radiating bottom plate is provided with the riveted ditch of radiating fin, be provided with heat pipe bridge pier in two opposite side in each transmission district at second surface, second surface is contacted with chip, one radiating fin group, be interspersed by most protrusion districts and most non-protruding districts, fastened by most fasteners again and formed, it is arranged in parallel that each protrusion district comprises multiple radiating fin, it is arranged in parallel that each non-protruding district also comprises multiple radiating fin, described protrusion district is provided with most heat pipe storage tanks in wherein, and the described radiating fin end in described protrusion district is converted into L-type support division to support chip, make after the riveted ditch riveted of the described first surface of this radiating fin group and this radiating bottom plate, this radiating fin group is protruded heat pipe storage tank in district and this heat pipe heat and is combined after riveting puts down, the heat pipe bridge pier of this heat pipe heat and this radiating bottom plate combine riveting flat after, described radiating fin group is protruded district and is protruded from this radiating bottom plate transmission district respectively, and the plane that this L-type support division and described chip offset, in this transmission district heat pipe heat put down by riveting after second all to show with the second surface of this radiating bottom plate and be in same plane.
Above-mentioned heat pipe heat is the copper pipe of multistage bending, and copper pipe can be continuous or discontinuous, the copper pipe of such as branched bending, to increase heat pipe coverage rate.
Above-mentioned protrusion district and transmission district are not limited to most, and such as one protrudes a corresponding transmission district of district.
Another feasible technical scheme of the present invention combines radiating module in a welding manner, now, the first surface of radiating bottom plate flat does not have riveted ditch, the root edge that radiating fin group and base plate first surface or CPU directly contact has L-type support division, welding clamping fixture is inserted again according to beneath operation, a tin cream is first coated in the interface of palpus solder bond assembly by (), b the protrusion district of () radiating fin group upward, c the transmission district of () radiating bottom plate corresponds to protrudes district, the radiating fin in the first surface contact non-protruding district of periphery of radiating bottom plate, d second of () heat pipe heat faces up and is placed in radiating bottom plate that heat pipe bridge pier supports and protrudes in the heat pipe storage tank in district 22, wherein, second of heat pipe heat, the second surface of the plane that the described radiating fin L-type support division in protrusion district and described chip offset and radiating bottom plate, three shows and is in same plane, e () is found the assembly clamped and is put into reflow oven and weld by above-mentioned group.It should be noted that this programme use second of heat pipe heat must leveling in advance, therefore, the usual semicircular in shape of heat pipe heat or flat.
Above-mentioned welding radiating module, although functional, cost also can decline to a great extent than heat radiating module of temperature equalization plate, by higher than the cost of riveted welding radiating module.
The present invention has following characteristics and advantage:
1, radiating module of the present invention adopts riveting method by each assembly riveted, and aluminum soleplate or fins group do not need nickel plating, do not need Overwelding and rewelding furnace to carry out high temperature soldering, tool low cost, environmental protection and the benefit of saving man-hour.
2, second of heat pipe, the plane that offsets of radiating bottom plate second surface, L-type support division and chip, three is same plane, make thermal source direct contact heat pipe group, radiating fin group, and heat pipe also directly contacts radiating fin protrusion district, heat directly can be directed at the heat radiation of radiating fin group.Therefore, greatly improve welding riveting technology in prior art, heat pipe heat and radiating fin group are separated by aluminum soleplate, solve the problem that heat pipe does not directly contact radiating fin.
3, heat pipe heat of the present invention and radiating fin group direct contact heat source (chip), must contact thermal source through copper soleplate again than existing solder technology more direct.Therefore heat dispersion can be askd to join one with temperature-uniforming plate, but cost can significantly reduce.
Accompanying drawing explanation
The following drawings is only intended to do schematic view and explanation to the present invention, not delimit the scope of the invention.Wherein:
Fig. 1 is the explosive view of the radiating module of soldering in prior art;
Fig. 2 A is the stereogram of the radiating module of soldering in prior art;
Fig. 2 B is the front view of the radiating module of soldering in prior art;
Fig. 3 is the explosive view without the radiating module of soldering in prior art;
Fig. 4 A is the stereogram without the radiating module of soldering in prior art;
Fig. 4 B is the second surface upward view without the radiating bottom plate of the radiating module of soldering in prior art, and second surface is provided with heat pipe storage tank;
Fig. 4 C is the front view without the radiating module of soldering in prior art;
Fig. 5 A is the explosive view before the radiating module riveted of one embodiment of the invention;
Fig. 5 B is the explosive view after the radiating module riveted of one embodiment of the invention;
Fig. 6 A be one embodiment of the invention radiating module combination after finished figure, with chip contact-making surface upward;
Fig. 6 B is the vertical view before the radiating fin of the radiating module of one embodiment of the invention is unkitted heat pipe;
Fig. 6 C is the end view of the radiating module of one embodiment of the invention.
Critical piece label declaration:
Embodiment
In order to there be understanding clearly to technical characteristic of the present invention, object and effect, now contrast accompanying drawing and the specific embodiment of the present invention is described.
Explosive view before the radiating module riveted of Fig. 5 A designed by foundation one embodiment of the invention.As shown in Figure 5A, be from top to bottom radiating fin group 20, radiating bottom plate 40 and a heat pipe heat 30 respectively.Heat pipe heat 30 is by a S shape and two horseshoe type heat pipe combination, and heat pipe combination shape is not as limit.Radiating bottom plate 40 is radiating bottom plates 40 of an aluminium matter.Radiating bottom plate 40 can see 3 Ge Juxing transmission districts 43 by diagram.First surface 41 is provided with the riveted ditch 44 of radiating fin, and it comprises U-shaped radiating fin riveted ditch 442 and V-arrangement radiating fin riveted ditch 441,442 and 441 is staggered to form.Be provided with heat pipe bridge pier 47 in two opposite side in each transmission district 43 at second surface 42, heat pipe bridge pier 47 is other is provided with fin 48, and escapes hopper 49, and this second surface 42 is contacted with thermal source, such as CPU.The cross section of the heat pipe of heat pipe heat 30 is circular.
The core 20C of radiating fin group 20 is (corresponding to the interval of Ju Xing transmission district 43 all and between Ju Xing transmission district 43, please also refer to Fig. 6 A and 6B) be interspersed by most protrusions district 22 (corresponding to transmission district 43) and most non-protruding districts 21 (interval corresponding between transmission district 43), the periphery 20P (with reference to figure 6B) on core 20C side is then non-protruding district, and the both sides of every a slice of radiating fin group 20 are provided with buckling parts and comprise clasp sheet and buckle formed in the buckle of adjacent heat radiation fin for a clip.About the details of clasp sheet, buckle and clip can with reference to inventor on September 8th, 2003 in another new patent of TaiWan, China application, patent No. M267819, provides reference in the lump at this.It is arranged in parallel that each protrusion district 22 comprises multiple radiating fin, it is arranged in parallel that each non-protruding district also comprises multiple radiating fin, described protrusion district 22 radiating fin is provided with most heat pipe storage tanks 227 in wherein, and the described radiating fin end in described protrusion district 22 is converted into L-type support division 23 to support chip, when this radiating fin group 20 and first surface 41 riveted of this radiating bottom plate 40, heat pipe storage tank 227 in the protrusion district 22 of this radiating fin group is put down with this heat pipe heat 30 riveting, after the heat pipe bridge pier of this this radiating bottom plate 40 of heat pipe heat 30 cross-over connection is flat to second surface 42 riveting, described protrusion district 22 protrudes from described transmission district 43 respectively, and the plane that this L-type support division and described chip offset, in this transmission district heat pipe put down by riveting after second all to show with this second surface 42 and be in same plane.
Explosive view after the radiating module riveted of Fig. 5 B designed by foundation one embodiment of the invention.Before riveted, radiating fin inserts U-shaped radiating fin riveted ditch 442, during riveted tool by V-arrangement radiating fin riveted ditch 441 extrded material by radiating fin and U-shaped radiating fin riveted ditch 442 riveted.Another riveting technology is that heat pipe heat 30 is positioned over heat pipe storage tank 227 and heat pipe bridge pier 47, and put down in radiating bottom plate 40 by riveting, the heat pipe heat flat by riveting represents with 30 ', and as shown in Figure 5 B, heat pipe heat 30 ' has one by flat the second face 32 of riveting.And a material part for above-mentioned fin 48 escapes hopper 49 because backfill is put down in riveting, another part material is then escaped to heat pipe heat 30, the gap between the heat pipe bridge pier 47 having filled and led up heat pipe heat and base plate.Therefore, the explosive view after the riveted shown in Fig. 5 B, heat pipe bridge pier is other without fin 48 and escape hopper 49.
Fin 48 and to escape hopper 49 be optionally, they can make heat pipe more firm.When there is no fin 48 and escaping hopper 49, for making heat pipe heat 30 more firm, also can oppositely on riveting flat-die tool, make the fin that corresponds to above-mentioned fin position, in the flat front-end-of-line of riveting, antetype extrudes the gap between heat pipe bridge pier 47 that aluminium fills and leads up heat pipe heat and base plate, then by immediately following the flat back segment operation of posterior riveting, the riveting completing bridge pier section base plate and heat pipe is put down, and heat pipe heat 30 can be made equally more firm.
Fig. 6 A is the finished figure after combination.Fig. 6 B is the vertical view (or by the upward view looked up bottom Fig. 6 A finished product) that heat pipe heat 30 installs front radiating fin group 20.Radiating fin group 20 shown in Fig. 6 B comprises protrudes district 22, non-protruding district 21 and heat pipe storage tank 227.Fig. 6 C is an end view of Fig. 6 A finished product.
Heat pipe heat before the present invention's combination can be circular, semicircle, or flat, but after riveting is flat, the second face 32 of the heat pipe in transmission district directly will contact with CPU thermal source with L-type support division 23.
Above-mentioned heat pipe heat 30 is copper pipes of three multistages bending, but should as limit, the copper pipe of such as single multistage bending also can, but, the copper pipe of branched multistage bending can increase heat pipe coverage rate.
Above-mentioned protrusion district 22 and transmission district 43 are not limited to most, and such as also can in a corresponding transmission district of a protrusion district.
In the present invention, the plane that second face 32 of heat pipe, the second surface 42 of radiating bottom plate, L-type support division 23 offset with chip, three is same plane, make thermal source direct contact heat pipe group 30, radiating fin group 20, and heat pipe heat 30 also directly contacts the protrusion district 22 of radiating fin, heat directly can be directed at radiating fin group 20 and dispel the heat.Therefore, greatly improve welding riveting technology in prior art, heat pipe heat 30 and radiating fin group 20 are radiating bottom plate 40(aluminium matter) separated, solve the problem that heat pipe does not directly contact radiating fin.
Heat pipe heat 30 of the present invention and radiating fin group 20 direct contact heat source (chip), must contact thermal source through copper soleplate 50 again than existing solder technology more direct.Therefore heat dispersion can be askd to join one with temperature-uniforming plate, but cost can significantly reduce.
The concept of the direct contact chip of heat pipe of the present invention and radiating fin group 20, certainly the mode of welding is also applicable to, namely the first surface of radiating bottom plate flat does not have riveted ditch, the root edge that radiating fin group 20 contacts with radiating bottom plate 40 or CPU has L-type support division, welding clamping fixture is inserted again according to beneath operation, a tin cream is first coated in the interface of palpus solder bond assembly by (), b the transmission district 43 of () radiating bottom plate 40 corresponds to protrudes district 22, the first surface 41 of radiating bottom plate 40 contacts the radiating fin in the non-protruding district 21 of periphery 20P, c second face 32 of () heat pipe heat 30 is placed in the radiating bottom plate 40 that heat pipe bridge pier 47 supports and the heat pipe storage tank 227 protruding district 22 upward, wherein, second face 32 of heat pipe heat 30 (is provided with and shows plane area, such as semi-circular tube or flat tube), the second surface 42 of the plane that the described radiating fin L-type support division 23 in protrusion district 22 and described chip offset and radiating bottom plate 40, three shows and is in same plane, e () is found the assembly clamped and is put into reflow oven and weld by above-mentioned group.
Above-mentioned welding radiating module, although functional, cost also can decline to a great extent than heat radiating module of temperature equalization plate, by higher than the cost of riveted welding radiating module.
Technology of the present invention, except can be applicable to 1U server or cutter point server, is applied to other PC or general radiator also can play the benefit improving cost performance equally.
The foregoing is only the schematic embodiment of the present invention, and be not used to limit scope of the present invention.Any those skilled in the art, equivalent variations done under the prerequisite not departing from design of the present invention and principle and amendment, all should belong to the scope of protection of the invention.
Claims (9)
1. a radiating module, is characterized in that, described radiating module comprises:
One heat pipe, it comprises a flat horizontal surface;
One radiating bottom plate, be provided with at least one transmission district in wherein, the first surface of described radiating bottom plate is provided with the riveted ditch of radiating fin, and second surface is provided with heat pipe bridge pier in two opposite side in transmission district described in each, and described second surface is contacted with chip; And
One radiating fin group, be made up of the non-protruding district of at least one protrusion district and periphery, described protrusion district and non-protruding district are fastened by most fasteners again, it is arranged in parallel that described protrusion district comprises multiple radiating fin, the number in described transmission district is equal and corresponding with described protrusion district quantity, it is arranged in parallel that non-protruding district described in periphery also comprises multiple radiating fin, described protrusion district is provided with heat pipe storage tank in wherein, and the described radiating fin end in described protrusion district is converted into L-type support division to support chip, described heat pipe, described radiating bottom plate, the annexation of described radiating fin group is: the radiating fin of described radiating fin group is connected with the riveted ditch of described radiating bottom plate, described protrusion district and described transmission district are connected respectively, described heat pipe is positioned on described heat pipe storage tank and described heat pipe bridge pier, and make the plane that described L-type support division and described chip offset, the described flat horizontal surface of heat pipe in described transmission district, the second surface of described radiating bottom plate, three is positioned at same plane.
2. radiating module as claimed in claim 1, it is characterized in that, before described heat pipe and described radiating bottom plate and protrusion district radiating fin riveted, described heat pipe bridge pier is other to be provided with fin and adjacently to escape hopper, riveting put down after described in escape hopper and filled and led up because of the deformation of described fin material.
3. radiating module as claimed in claim 1, is characterized in that, described heat pipe is the copper pipe of multistage bending.
4. a radiating module, is characterized in that, described radiating module comprises:
One heat pipe heat, by branched heat pipe combination;
One radiating bottom plate, be provided with most transmission districts in wherein, the first surface of described radiating bottom plate is provided with the riveted ditch of radiating fin, and be provided with heat pipe bridge pier in two opposite side in transmission district described in each at second surface, described second surface is contacted with chip;
One radiating fin group, its core comprises most protrusion districts and is interspersed corresponding to described transmission district and most non-protruding districts, the periphery of described core is non-protruding district, described protrusion district and non-protruding district are fastened by most fasteners again, it is arranged in parallel that each described protrusion district comprises multiple radiating fin, it is arranged in parallel that each described non-protruding district also comprises multiple radiating fin, described protrusion district is provided with most heat pipe storage tanks in wherein, and the described radiating fin end in described protrusion district is converted into L-type support division to support chip, described heat pipe, described radiating bottom plate, the annexation of described radiating fin group is: the radiating fin of described radiating fin group is connected with the riveted ditch of described radiating bottom plate, a most described protrusion district and a majority described transmission district are connected respectively, described heat pipe is positioned on described heat pipe storage tank and described heat pipe bridge pier, and make the plane that described L-type support division and described chip offset, the described flat horizontal surface of heat pipe in described transmission district, the second surface of described radiating bottom plate, three is positioned at same plane.
5. radiating module as claimed in claim 4, it is characterized in that, described heat pipe and radiating bottom plate and before protruding district's radiating fin riveted, described heat pipe bridge pier is other to be provided with fin and adjacently to escape hopper, riveting put down after described in escape hopper and filled and led up because of the deformation of described fin material.
6. radiating module as claimed in claim 4, is characterized in that, described heat pipe is the copper pipe of multistage bending.
7. a radiating module, is characterized in that, described radiating module comprises:
One heat pipe, second of described heat pipe in plane;
One radiating bottom plate, be provided with at least one transmission district in wherein, the second surface of described radiating bottom plate is provided with heat pipe bridge pier in two opposite side in transmission district described in each, and described second surface is contacted with chip; And
One radiating fin group, by at least one protrusion district to correspond to described transmission district, periphery beyond described protrusion district is non-protruding district, described protrusion district and non-protruding district are fastened by most fasteners again, it is arranged in parallel that described protrusion district comprises multiple radiating fin, it is arranged in parallel that the non-protruding district of described periphery also comprises multiple radiating fin, described protrusion district is provided with heat pipe storage tank in wherein, and described radiating fin end is all converted into L-type support division, the L-type support division protruding district is beneficial to and supports chip, and the L-type support division in non-protruding district is beneficial to welding; And
The annexation of described radiating module is: the protrusion district of (a) described radiating fin group upward, b the transmission district of () described radiating bottom plate corresponds to described protrusion district, the radiating fin in non-protruding district described in the first surface contact periphery of described radiating bottom plate, second of (c) described heat pipe face up be placed in described radiating bottom plate that described heat pipe bridge pier supports and described protrusion district described heat pipe storage tank in, wherein, second of described heat pipe, the second surface three of the plane that the L-type support division of the described radiating fin in described protrusion district and described chip offset and described radiating bottom plate is in same plane.
8. radiating module as claimed in claim 1, is characterized in that, when described transmission district and described protrusion district are most, number is equal, and having the first interval between described transmission district and transmission district, between described protrusion district and protrusion district, interval is with non-protruding district, to coordinate described first interval.
9. radiating module as claimed in claim 7, is characterized in that, described heat pipe is semicircle or the flat copper tube of multistage bending, with second that provides described heat pipe smooth.
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| CN201310565952.3A CN104640418A (en) | 2013-11-14 | 2013-11-14 | Heat dissipating module |
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| CN201310565952.3A CN104640418A (en) | 2013-11-14 | 2013-11-14 | Heat dissipating module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050358A (en) * | 2015-06-30 | 2015-11-11 | 安徽博隆节能电器有限公司 | Plate-fin radiator with high heat transfer efficiency |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967440A (en) * | 2005-11-17 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat sink |
| CN101039571A (en) * | 2006-03-16 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat radiator and base holder thereof |
| US20070215327A1 (en) * | 2006-03-15 | 2007-09-20 | Cheng-Tien Lai | Heat dissipation device |
| CN101146433A (en) * | 2007-10-12 | 2008-03-19 | 苏州聚力电机有限公司 | Heat pipe structure of radiator |
| CN101236937A (en) * | 2008-02-06 | 2008-08-06 | 黄崇贤 | Heat radiator improvement for attached heat pipe |
| US7451806B2 (en) * | 2006-07-24 | 2008-11-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| CN201171257Y (en) * | 2008-02-02 | 2008-12-24 | 国格金属科技股份有限公司 | Package structure for cooling fin |
| CN201174852Y (en) * | 2008-04-01 | 2008-12-31 | 黄崇贤 | Combined construction of radiating rib module group |
| US7520316B2 (en) * | 2005-10-05 | 2009-04-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
| US7610948B2 (en) * | 2007-07-25 | 2009-11-03 | Tsung-Hsien Huang | Cooler module |
| CN101588706A (en) * | 2008-05-23 | 2009-11-25 | 中山伟强科技有限公司 | A kind of radiating module and welding method thereof |
| CN201422221Y (en) * | 2009-03-24 | 2010-03-10 | 采融科技有限公司 | Heat dissipating device |
| US7746640B2 (en) * | 2007-07-12 | 2010-06-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7753109B2 (en) * | 2007-05-23 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| CN102196716A (en) * | 2011-05-23 | 2011-09-21 | 东莞汉旭五金塑胶科技有限公司 | Heat-pipe-attached radiator with heat-radiating fins adhered to bottom |
| CN202127008U (en) * | 2011-06-22 | 2012-01-25 | 东莞展茂塑胶五金模具有限公司 | Non-welding type radiator |
| CN202285480U (en) * | 2011-09-15 | 2012-06-27 | 升业科技股份有限公司 | Heat dissipation bottom plate structure and combination structure of heat dissipation bottom plate structure and heat pipe |
| CN202385449U (en) * | 2011-12-30 | 2012-08-15 | 奇鋐科技股份有限公司 | Heat dissipating device |
| CN103188920A (en) * | 2011-12-30 | 2013-07-03 | 奇鋐科技股份有限公司 | Radiating device |
-
2013
- 2013-11-14 CN CN201310565952.3A patent/CN104640418A/en active Pending
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7520316B2 (en) * | 2005-10-05 | 2009-04-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
| CN1967440A (en) * | 2005-11-17 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat sink |
| US20070215327A1 (en) * | 2006-03-15 | 2007-09-20 | Cheng-Tien Lai | Heat dissipation device |
| CN101039571A (en) * | 2006-03-16 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat radiator and base holder thereof |
| US7451806B2 (en) * | 2006-07-24 | 2008-11-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7753109B2 (en) * | 2007-05-23 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7746640B2 (en) * | 2007-07-12 | 2010-06-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7610948B2 (en) * | 2007-07-25 | 2009-11-03 | Tsung-Hsien Huang | Cooler module |
| CN101146433A (en) * | 2007-10-12 | 2008-03-19 | 苏州聚力电机有限公司 | Heat pipe structure of radiator |
| CN201171257Y (en) * | 2008-02-02 | 2008-12-24 | 国格金属科技股份有限公司 | Package structure for cooling fin |
| CN101236937A (en) * | 2008-02-06 | 2008-08-06 | 黄崇贤 | Heat radiator improvement for attached heat pipe |
| CN201174852Y (en) * | 2008-04-01 | 2008-12-31 | 黄崇贤 | Combined construction of radiating rib module group |
| CN101588706A (en) * | 2008-05-23 | 2009-11-25 | 中山伟强科技有限公司 | A kind of radiating module and welding method thereof |
| CN201422221Y (en) * | 2009-03-24 | 2010-03-10 | 采融科技有限公司 | Heat dissipating device |
| CN102196716A (en) * | 2011-05-23 | 2011-09-21 | 东莞汉旭五金塑胶科技有限公司 | Heat-pipe-attached radiator with heat-radiating fins adhered to bottom |
| CN202127008U (en) * | 2011-06-22 | 2012-01-25 | 东莞展茂塑胶五金模具有限公司 | Non-welding type radiator |
| CN202285480U (en) * | 2011-09-15 | 2012-06-27 | 升业科技股份有限公司 | Heat dissipation bottom plate structure and combination structure of heat dissipation bottom plate structure and heat pipe |
| CN202385449U (en) * | 2011-12-30 | 2012-08-15 | 奇鋐科技股份有限公司 | Heat dissipating device |
| CN103188920A (en) * | 2011-12-30 | 2013-07-03 | 奇鋐科技股份有限公司 | Radiating device |
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