CN212084981U - Heat dissipation heat transmitter of chip - Google Patents
Heat dissipation heat transmitter of chip Download PDFInfo
- Publication number
- CN212084981U CN212084981U CN202020661559.XU CN202020661559U CN212084981U CN 212084981 U CN212084981 U CN 212084981U CN 202020661559 U CN202020661559 U CN 202020661559U CN 212084981 U CN212084981 U CN 212084981U
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- Prior art keywords
- heat
- metal
- chip
- heat transfer
- planes
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Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims abstract description 92
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000010273 cold forging Methods 0.000 claims description 5
- 238000003801 milling Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
Images
Abstract
The utility model discloses a heat dissipation heat transmitter of chip belongs to chip heat dissipation technical field. A heat radiation and transmission device of a chip comprises a heat radiation body, a heat conduction pipe and a plurality of heat transmission interfaces, wherein the heat transmission interfaces are arranged on the upper edge, the lower edge, the left edge and the right edge of the heat radiation body; the heat transfer interfaces are arranged on a plurality of smooth and flat metal planes on the heat radiation body, the heat transfer interfaces are metal planes which are formed by metal blocks and heat conduction pipes in a single or combined mode and are used for heat transfer, the metal planes are formed by one surface of each metal block on the heat radiation body, or the metal planes which are formed by a plurality of surfaces of the metal blocks on the heat radiation body and flattened surfaces of the heat conduction pipes together, and the plurality of metal planes and the chip heating planes are parallel or vertical to each other; the metal plane not contacted with the chip is used for closely contacting other heat dissipation devices; the utility model provides a problem that the chip radiating effect is not good among the prior art.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field specifically is a heat dissipation heat transmitter of chip.
Background
The chip is also in continuous upgrading as the important part of computer, cell-phone for the chip has more powerful function, but the calorific capacity of chip has also increased thereupon, and the heat dissipation measure effect of chip is not good among the prior art, piles up because of the heat of chip and causes the chip to age with higher speed and damage easily, consequently the utility model provides a heat dissipation heat transmitter of chip, with the solution above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
1. The to-be-solved technical problem of the utility model
An object of the utility model is to provide a heat dissipation heat transfer ware of chip to solve the problem that proposes in the above-mentioned background art:
(1) in the prior art, the service life of the chip is shortened due to poor heat dissipation effect.
2. Technical scheme
In order to achieve the above object, the utility model provides a following technical scheme:
a heat dissipation and transmission device of a chip comprises a heat dissipation body, a heat conduction pipe and a plurality of heat transmission interfaces, wherein the heat transmission interfaces are arranged at two ends of the edge of the heat dissipation body, and a plurality of metal heat dissipation fins are arranged on the heat dissipation body.
Preferably, the plurality of heat transfer interfaces are arranged on two smooth and flat metal planes on the heat radiator, the heat transfer interfaces are metal planes which are formed by a metal block and a heat conduction pipe in a single or combined mode and are used for heat transfer, the metal planes are formed by one surface of the metal block on the heat radiator, or metal planes which are formed by a plurality of surfaces of the metal block on the heat radiator and flattened surfaces of the heat conduction pipes together, the plurality of metal planes and the chip heating plane are parallel or vertical to each other, the parallel or vertical error is less than 5 degrees, and each metal plane can be respectively and independently in close contact with the chip or in close contact with the chip through heat conduction paste; the metal plane not in contact with the chip is used to closely contact other heat dissipating devices.
Preferably, the heat radiation body consists of a plurality of metal blocks and metal flakes; the metal block is made into metal scales through extrusion, cold forging, milling, relieving and other modes, and the metal block and the metal scales are welded and connected; the metal block and the metal scale are connected with the heat conduction pipe in a welding mode or in a squeezing contact mode; and part of the surface of the metal block and the flattened surface of the heat conduction pipe are components of the heat transfer interface.
Preferably, the heat sink is composed of a metal block.
Preferably, the heat transfer interfaces are located on two opposite sides of the heat dissipation body, one of the heat transfer interfaces is in contact with the chip, the other heat transfer interface is in contact with the other heat dissipation device, and the rest of the heat transfer interfaces are perpendicular to the heat generation plane of the chip.
Preferably, a plurality of semicircular grooves are formed in the metal plate of the heat radiation body, and semicircular heat conduction pipes are arranged in the semicircular grooves.
Preferably, the heat radiation body and the heat transfer interface are provided with at least three mounting holes for mounting the columns by screws.
3. Advantageous effects
The metal block and the scale in the utility model are welded and connected, or a plurality of metal scales are formed on the metal block by extruding, cold forging, milling, forming a plurality of semicircular, U or groove openings, the groove openings are welded or pressed and connected with the heat conduction pipe, and the pressing part can be coated with heat conduction paste, such as silicone grease or graphene material; the heat conduction pipe is a copper heat pipe, which is a material commonly used in the existing electronic radiator and is bent, flattened, pressed into a semicircle, plated with nickel on the surface and the like; the heat transfer interface is a metal plane which is formed by the metal block and the heat conducting pipe in a single or combined mode and is used for heat transfer, the metal plane can be formed by one surface of one metal block on the heat radiator, or can be formed by a plurality of surfaces of a plurality of metal blocks on the heat radiator and flattened surfaces of a plurality of heat conducting pipes, and the two metal planes are in parallel relation; the heat dissipation heat transmitter is provided with a plurality of screw holes and through holes for fixing the chip, the heat dissipation heat transmitter and other heat dissipation devices; and a spare heat transfer interface is added on the basis of the existing chip radiator, so that the durability is improved (one heat transfer interface is damaged and the other heat transfer interface can be used), the chip radiator can be used as a heat transfer tool, the heat of the chip is effectively transferred to other devices, the expansibility is improved, and the heat exchange efficiency of the chip is improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the present invention;
FIG. 3 is a schematic view of a part of the structure of the present invention;
FIG. 4 is a schematic view of a part of the structure of the present invention;
FIG. 5 is a schematic view of a part of the structure of the present invention;
FIG. 6 is a schematic view of a part of the structure of the present invention;
FIG. 7 is a partial schematic structural view of the present invention;
fig. 8 is a partial structural schematic view of the present invention;
fig. 9 is a partial structural schematic view of the present invention;
fig. 10 is a partial structural schematic view of the present invention;
fig. 11 is a schematic view of the overall structure of the present invention;
fig. 12 is a schematic view of the overall structure of the present invention;
fig. 13 is a partial structural schematic view of the present invention;
fig. 14 is a partial structural schematic view of the present invention;
fig. 15 is a partial structural schematic view of the present invention;
fig. 16 is a partial structural schematic view of the present invention;
fig. 17 is a partial schematic structural view of the present invention;
fig. 18 is a schematic view of the overall structure of the present invention.
The reference numbers in the figures illustrate:
1. a heat sink; 2. a heat conducting pipe; 3. a heat transfer interface.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-18, a heat dissipation and heat transfer device for a chip includes a heat dissipation body 1, a heat pipe 2 and a plurality of heat transfer interfaces 3, wherein the plurality of heat transfer interfaces 3 are disposed at two ends of an edge of the heat dissipation body 1, and a plurality of metal heat dissipation fins are disposed on the heat dissipation body 1;
the heat transfer interfaces 3 arranged on the two smooth and flat metal planes on the heat radiator 1 are metal planes which are formed by a metal block and a heat conduction pipe 2 in a single or combined mode and are used for heat transfer, the metal planes are formed by one surface of the metal block on the heat radiator 1 or formed by a plurality of surfaces of the metal block on the heat radiator 1 and flattened surfaces of the heat conduction pipes 2 together, the plurality of metal planes and the chip heating plane are parallel or vertical to each other, the parallel or vertical error is less than 5 degrees, and each metal plane can be respectively and independently in close contact with a chip or in close contact with the chip through heat conduction paste; the metal plane which is not contacted with the chip is used for being closely contacted with other heat dissipation devices;
the heat dissipation body 1 consists of a plurality of metal blocks and metal flakes; the metal scale is made on the metal block through the modes of extrusion, cold forging, milling, relieving and the like, and the metal block is connected with the metal scale in a welding way; the metal block and the metal scale are connected with the heat conduction pipe 2 in a welding way or in a squeezing contact way; part of the surface of the metal block and the flattened surface of the heat conduction pipe 2 are components of the heat transfer interface 3;
the heat radiating body 1 is composed of a metal block.
The heat transfer interfaces 3 are positioned at two opposite sides of the heat radiation body 1, one heat transfer interface 3 is contacted with the chip, the other heat transfer interface 3 is contacted with other heat radiation devices, and the other heat transfer interfaces 3 are vertical to the heating plane of the chip;
a plurality of semicircular grooves are formed in a metal plate of the heat radiation body 1, and semicircular heat conduction pipes 2 are arranged in the semicircular grooves;
at least three mounting holes for mounting the columns by screws are arranged on the heat radiator 1 and the heat transfer interface 3;
the metal block and the scale in the utility model are welded and connected, or a plurality of metal scales are formed on the metal block by extruding, cold forging, milling, forming a plurality of semicircular, U or groove openings, the groove openings are welded or pressed and connected with the heat conduction pipe, and the pressing part can be coated with heat conduction paste, such as silicone grease or graphene material; the heat conduction pipe 2 is a copper heat pipe, which is a material commonly used in the existing electronic radiator and is bent, flattened, pressed into a semicircle, plated with nickel on the surface and the like; the heat transfer interface 3 is a metal plane formed by a metal block and a heat pipe separately or in a combined manner for heat transfer, the metal plane may be formed by one surface of one metal block on the heat sink 1, or may be formed by a plurality of surfaces of a plurality of metal blocks on the heat sink 1 and a plurality of flattened surfaces of the heat pipe 2, and the plurality of metal planes are in a parallel relationship or a perpendicular relationship; the heat dissipation heat transmitter is provided with a plurality of screw holes and through holes for fixing the chip, the heat dissipation heat transmitter and other heat dissipation devices; and a spare heat transfer interface 3 is added on the basis of the existing chip radiator, so that the durability is improved (one heat transfer interface is damaged and the other heat transfer interface can be used), the chip radiator can be used as a heat transfer tool, the heat of the chip is effectively transferred to other devices, the expansibility is improved, and the heat exchange efficiency of the chip is improved.
The above description is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the improvement concept of the present invention within the technical scope disclosed in the present invention.
Claims (7)
1. The utility model provides a heat dissipation heat transfer ware of chip, includes radiator (1), heat pipe (2) and a plurality of heat transfer interface (3), its characterized in that: the heat transfer interfaces (3) are arranged on the upper edge, the lower edge, the left edge and the right edge of the heat radiation body (1), and the heat radiation body (1) is provided with a plurality of metal heat radiation fins.
2. The heat dissipating and heat transferring device of a chip as set forth in claim 1, wherein: the heat transfer interfaces (3) are arranged on a plurality of smooth and flat metal planes on the heat radiator (1), the heat transfer interfaces (3) are metal planes which are formed by metal blocks and heat conduction pipes (2) in an independent or combined mode and are used for heat transfer, the metal planes are formed by one surface of each metal block on the heat radiator (1), or metal planes which are formed by a plurality of surfaces of the metal blocks on the heat radiator (1) and flattened surfaces of the heat conduction pipes (2) together, the metal planes and the chip heating planes are parallel or vertical to each other, the parallel or vertical error is less than 5 degrees, and each metal plane can be respectively and independently in close contact with a chip or in close contact with the chip through heat conduction paste; the metal plane not in contact with the chip is used to closely contact other heat dissipating devices or to closely contact the chip through a thermal conductive paste.
3. The heat dissipating and heat transferring device of a chip as set forth in claim 2, wherein: the sizes of the heat transfer interfaces (3) can be equal or unequal, and the length and the width of each heat transfer interface (3) are not less than 3 cm.
4. The heat dissipating and heat transferring device of a chip as set forth in claim 2, wherein: the heat dissipation body (1) consists of a plurality of metal blocks and metal flakes; the metal block is made into metal scales through extrusion, cold forging, milling and relieving, and the metal block and the metal scales are welded and connected; the metal block and the metal scale are connected with the heat conduction pipe (2) in a welding way or in a pressing contact way; part of the surface of the metal block and the flattened surface of the heat conduction pipe (2) are components of the heat transfer interface (3).
5. The heat dissipating and heat transferring device of a chip as set forth in claim 2, wherein: the heat radiator (1) is composed of metal blocks.
6. The heat dissipating and heat transferring device of a chip as set forth in claim 4, wherein: the heat transfer interfaces (3) are positioned on two opposite sides of the heat radiation body (1), one of the heat transfer interfaces (3) is in contact with the chip, the other heat transfer interface (3) is in contact with other heat radiation devices, and the rest of the heat transfer interfaces (3) are perpendicular to a chip heating plane.
7. The heat dissipating and heat transferring device of a chip as set forth in claim 4, wherein: a plurality of semicircular grooves are formed in a metal plate of the heat radiation body (1), and semicircular heat conduction pipes (2) are arranged in the semicircular grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020661559.XU CN212084981U (en) | 2020-04-26 | 2020-04-26 | Heat dissipation heat transmitter of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020661559.XU CN212084981U (en) | 2020-04-26 | 2020-04-26 | Heat dissipation heat transmitter of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212084981U true CN212084981U (en) | 2020-12-04 |
Family
ID=73592830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020661559.XU Expired - Fee Related CN212084981U (en) | 2020-04-26 | 2020-04-26 | Heat dissipation heat transmitter of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212084981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
-
2020
- 2020-04-26 CN CN202020661559.XU patent/CN212084981U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201204 |