CN219179887U - Radiating assembly of notebook computer - Google Patents
Radiating assembly of notebook computer Download PDFInfo
- Publication number
- CN219179887U CN219179887U CN202223505349.XU CN202223505349U CN219179887U CN 219179887 U CN219179887 U CN 219179887U CN 202223505349 U CN202223505349 U CN 202223505349U CN 219179887 U CN219179887 U CN 219179887U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- area
- heat
- flat
- flat heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 87
- 238000005452 bending Methods 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 17
- 238000012546 transfer Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a notebook computer radiating component, which comprises a left radiating area, a right radiating area and a sinking area, wherein the sinking area is positioned between the left radiating area and the right radiating area, the lower surface of the sinking area is in contact with a high-temperature heat source and a low-temperature heat source which are arranged at intervals in front and back, a first flat heat pipe, a second flat heat pipe and a third flat heat pipe are arranged on the upper surface of a radiating thin plate, one end of the first flat heat pipe is correspondingly arranged above the low-temperature heat source, the other end of the first flat heat pipe extends to the left radiating area, the middle section of the second flat heat pipe is correspondingly arranged above the high-temperature heat source, one end of the second flat heat pipe is positioned between the first flat heat pipe and the third flat heat pipe, the other end of the second flat heat pipe extends to the right radiating area, and one end of the third flat heat pipe is correspondingly arranged above the high-temperature heat source. The notebook computer heat dissipation assembly increases the whole heat dissipation area, and improves the uniformity of heat distribution on the heat dissipation sheet, thereby improving the whole heat dissipation efficiency.
Description
Technical Field
The utility model relates to the field of heat dissipation of electronic products, in particular to a notebook computer heat dissipation assembly.
Background
With the development of the age, the utilization rate of the notebook computer is higher and higher, a great amount of heat is generated when the notebook computer works, and the redundant heat cannot be rapidly dissipated, and is accumulated to generate high temperature, so that the notebook computer in work is likely to be destroyed, and the problem is generally solved through a radiator of the notebook computer. At present, the working principle of the used notebook computer radiator is to forcedly blow out the heat generated by the heating elements of the notebook computer, introduce cold air and increase the air flow at the bottom of the notebook computer, so that each heating element in the notebook computer is radiated.
However, in order to meet the requirements of portability and portability, the notebook computer design adopts a miniaturized design, particularly, the thickness is thinner and thinner, so that the heat dissipation area of the heating element is limited, and the local overheating of the heating element is caused, thereby seriously affecting the normal use of the notebook computer.
Disclosure of Invention
The utility model aims to provide a notebook computer radiating component which increases the whole radiating area and improves the uniformity of heat distribution on a radiating sheet, thereby improving the whole radiating efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a notebook computer heat sink assembly, comprising: the heat dissipation sheet further comprises a left heat dissipation area, a right heat dissipation area and a sinking area, wherein the sinking area is positioned between the left heat dissipation area and the right heat dissipation area, and the lower surface of the sinking area is contacted with a high-temperature heat source and a low-temperature heat source which are arranged at intervals in the front and the back;
the upper surface of the heat radiation thin plate is provided with a first flat heat pipe, a second flat heat pipe and a third flat heat pipe, one end of the first flat heat pipe is correspondingly arranged above the low-temperature heat source, the other end of the first flat heat pipe extends to the left heat radiation area, the middle section of the second flat heat pipe is correspondingly arranged above the high-temperature heat source, one end of the second flat heat pipe is positioned between the first flat heat pipe and the third flat heat pipe, the other end of the second flat heat pipe extends to the right heat radiation area, one end of the third flat heat pipe is positioned at the left heat radiation area, the other end of the third flat heat pipe extends to the right heat radiation area, and the middle section of the third flat heat pipe is correspondingly arranged above the high-temperature heat source.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the second flat heat pipe has a first bending portion, and the first bending portion is located at the right heat dissipation area and extends in a direction away from the third flat heat pipe.
2. In the above scheme, the third flat heat pipe has a second bending portion, and the second bending portion is located in the right heat dissipation area and extends in a direction opposite to the direction away from the second flat heat pipe.
3. In the above scheme, the upper surface of the left heat dissipation area is provided with a space avoidance area, and the first flat heat pipe and the third flat heat pipe are positioned between the space avoidance area and the edge of the heat dissipation thin plate.
4. In the scheme, the sinking area is provided with a sinking groove for embedding and installing the bolts.
5. In the above scheme, the edge of the heat dissipation sheet is provided with a plurality of mounting plates, and the mounting plates are provided with mounting holes.
6. In the scheme, heat conduction paste is filled between the sinking area and the high-temperature heat source and between the sinking area and the low-temperature heat source.
7. In the above scheme, the first flat heat pipe, the second flat heat pipe and the third flat heat pipe are welded with the heat dissipation sheet.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
the utility model discloses a notebook computer radiating component, wherein a sinking area, the lower surface of which is contacted with a high-temperature heat source and a low-temperature heat source which are arranged at intervals from front to back, is positioned between a left radiating area and a right radiating area, a first flat heat pipe, a second flat heat pipe and a third flat heat pipe are arranged on the upper surface of a radiating sheet, one end of the first flat heat pipe is positioned above the corresponding upper part of the low-temperature heat source, the other end of the first flat heat pipe extends to the left radiating area, the middle section of the second flat heat pipe is positioned above the corresponding upper part of the high-temperature heat source, one end of the second flat heat pipe is positioned between the first flat heat pipe and the third flat heat pipe, the other end of the third flat heat pipe extends to the right radiating area, one end of the third flat heat pipe is positioned above the left radiating area, the other end of the third flat heat pipe extends to the right radiating area, and the middle section of the third flat heat pipe is positioned above the corresponding upper part of the high-temperature heat source, and the radiating sheet transfers and diffuses absorbed heat.
Drawings
FIG. 1 is a schematic diagram of a front structure of a heat dissipating assembly of a notebook computer according to the present utility model;
FIG. 2 is an enlarged view of the utility model at A of FIG. 1;
fig. 3 is a schematic diagram of a back structure of the heat dissipation assembly of the notebook computer according to the present utility model.
In the above figures: 1. a heat radiation sheet; 101. a left heat dissipation area; 102. a right heat dissipation area; 103. a sinking region; 104. a avoidance zone; 2. a first flat heat pipe; 3. a second flat heat pipe; 31. a first bending part; 4. a third flat heat pipe; 41. a second bending part; 5. sinking grooves; 6. a mounting plate; 7. a mounting hole; 9. a high temperature heat source; 10. a low temperature heat source.
Detailed Description
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a notebook computer heat sink assembly, comprising: the heat dissipation sheet 1, the heat dissipation sheet 1 further comprises a left heat dissipation area 101, a right heat dissipation area 102 and a sinking area 103, the sinking area 103 is located between the left heat dissipation area 101 and the right heat dissipation area 102, and the lower surface of the sinking area 103 is in contact with a front-back heat source 9 and a low-temperature heat source 10 which are arranged at intervals;
a first flat heat pipe 2, a second flat heat pipe 3 and a third flat heat pipe 4 are arranged on the upper surface of the heat dissipation thin plate 1, one end of the first flat heat pipe 2 is correspondingly arranged above the low-temperature heat source 10, the other end of the first flat heat pipe extends to the left heat dissipation area 101, the middle section of the second flat heat pipe 3 is correspondingly arranged above the high-temperature heat source 9, one end of the second flat heat pipe 3 is positioned between the first flat heat pipe 2 and the third flat heat pipe 4, the other end of the second flat heat pipe extends to the right heat dissipation area 102, one end of the third flat heat pipe 4 is positioned in the left heat dissipation area 101, the other end of the third flat heat pipe extends to the right heat dissipation area 102, and the middle section of the second flat heat pipe is correspondingly arranged above the high-temperature heat source 9;
the sinking groove of the heat radiation sheet is tightly connected with the high-temperature heat source and the low-temperature heat source, and the first flat heat pipe, the second flat heat pipe and the third flat heat pipe which are welded on the upper surface of the sinking groove are used for diffusing the heat from the high-temperature heat source and the low-temperature heat source to the left heat radiation area and the right heat radiation area while transmitting and diffusing the absorbed heat, so that the whole heat radiation area is increased, and the uniformity of the heat distribution on the heat radiation sheet is improved.
The second flat heat pipe 3 has a first bending portion 31, and the first bending portion 31 is located in the right heat dissipation area 102 and extends away from the third flat heat pipe 4; the third flat heat pipe 4 has a second bending portion 41, and the second bending portion 41 is located in the right heat dissipation area 102 and extends in a direction away from the second flat heat pipe 3, and is disposed away from the third flat heat pipe 4 through the first bending portion 31, so as to further improve the uniformity of heat distribution of the second flat heat pipe 3 and the third flat heat pipe 4 in the right heat dissipation area.
The upper surface of the left heat dissipation area 101 has a space area 104, and the first flat heat pipe 2 and the third flat heat pipe 4 are located between the space area 104 and the edge of the heat dissipation sheet 1.
The sinking area 103 is provided with a sinking groove 5 for embedding and installing bolts.
The first flat heat pipe 2, the second flat heat pipe 3, and the third flat heat pipe 4 are welded to the heat dissipation sheet 1.
The high temperature heat source 9 is positioned at the front side of the low temperature heat source 10; the number of the low-temperature heat sources 10 is two, and the two low-temperature heat sources 10 are arranged at intervals left and right.
The high temperature heat source has a heat dissipation power of 10 to 15W, specifically 12W in this embodiment, and the low temperature heat source has a heat dissipation power of 2 to 5W, specifically 4W in this embodiment.
Example 2: a heat dissipating assembly, comprising: the heat dissipation sheet 1, the heat dissipation sheet 1 further comprises a left heat dissipation area 101, a right heat dissipation area 102 and a sinking area 103, the sinking area 103 is located between the left heat dissipation area 101 and the right heat dissipation area 102, and the lower surface of the sinking area 103 is in contact with a front-back heat source 9 and a low-temperature heat source 10 which are arranged at intervals;
a first flat heat pipe 2, a second flat heat pipe 3 and a third flat heat pipe 4 are arranged on the upper surface of the heat dissipation thin plate 1, one end of the first flat heat pipe 2 is correspondingly arranged above the low-temperature heat source 10, the other end of the first flat heat pipe extends to the left heat dissipation area 101, the middle section of the second flat heat pipe 3 is correspondingly arranged above the high-temperature heat source 9, one end of the second flat heat pipe 3 is positioned between the first flat heat pipe 2 and the third flat heat pipe 4, the other end of the second flat heat pipe extends to the right heat dissipation area 102, one end of the third flat heat pipe 4 is positioned in the left heat dissipation area 101, the other end of the third flat heat pipe extends to the right heat dissipation area 102, and the middle section of the second flat heat pipe is correspondingly arranged above the high-temperature heat source 9;
the heat dissipation sheet transfers and diffuses the absorbed heat, and the sinking area absorbs the heat from the high-temperature heat source and the low-temperature heat source to the left heat dissipation area and the right heat dissipation area through the first flat heat pipe, the second flat heat pipe and the third flat heat pipe which are arranged on the surface of the heat dissipation sheet, so that the whole heat dissipation area is increased, and the uniformity of the distribution of the heat on the heat dissipation sheet is improved, and the whole heat dissipation efficiency is improved.
The second flat heat pipe 3 has a first bending portion 31, and the first bending portion 31 is located in the right heat dissipation area 102 and extends away from the third flat heat pipe 4.
The upper surface of the left heat dissipation area 101 has a space area 104, and the first flat heat pipe 2 and the third flat heat pipe 4 are located between the space area 104 and the edge of the heat dissipation sheet 1.
The sinking area 103 is provided with a sinking groove 5 for embedding and installing bolts. The heat radiation thin plate 1 is convenient to be tightly connected with the high-temperature heat source 9 and the low-temperature heat source 10, and the heat transfer between the heat radiation thin plate 1 and the high-temperature heat source 9 and the heat transfer between the heat radiation thin plate 10 are ensured.
The edge of the heat radiation sheet 1 is provided with a plurality of mounting plates 6, and the mounting plates 6 are provided with mounting holes 7.
A heat-conducting paste is filled between the sinking area 103 and the high-temperature heat source 9 and the low-temperature heat source 10.
The high temperature heat source has a heat dissipation power of 10 to 15W, specifically 14W in this embodiment, and the low temperature heat source has a heat dissipation power of 2 to 5W, specifically 3W in this embodiment.
The working principle of the utility model is as follows:
when the heat dissipation device works, the sinking groove of the heat dissipation thin plate is tightly connected with the high-temperature heat source and the low-temperature heat source, and the first flat heat pipe, the second flat heat pipe and the third flat heat pipe which are welded on the upper surface of the sinking groove are used for transferring and diffusing the absorbed heat, so that the sinking area absorbs the heat from the high-temperature heat source and the low-temperature heat source to the left heat dissipation area and the right heat dissipation area, the whole heat dissipation area is increased, and the uniformity of the distribution of the heat on the heat dissipation thin plate is improved.
When the notebook computer radiating component is adopted, the radiating thin plate transfers and diffuses the absorbed heat, and the sinking area absorbs the heat from the high-temperature heat source and the low-temperature heat source to the left radiating area and the right radiating area through the first flat heat pipe, the second flat heat pipe and the third flat heat pipe which are arranged on the surface of the radiating thin plate, so that the whole radiating area is enlarged, the uniformity of the distribution of the heat on the radiating thin plate is improved, and the whole radiating efficiency is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (8)
1. A notebook computer heat sink assembly, comprising: heat dissipation sheet (1), its characterized in that: the heat dissipation sheet (1) further comprises a left heat dissipation area (101), a right heat dissipation area (102) and a sinking area (103), wherein the sinking area (103) is positioned between the left heat dissipation area (101) and the right heat dissipation area (102), and the lower surface of the sinking area (103) is contacted with a high-temperature heat source (9) and a low-temperature heat source (10) which are arranged at intervals in front and back;
the heat dissipation thin plate (1) is characterized in that a first flat heat pipe (2), a second flat heat pipe (3) and a third flat heat pipe (4) are arranged on the upper surface of the heat dissipation thin plate (1), one end of the first flat heat pipe (2) is correspondingly arranged above the low-temperature heat source (10), the other end of the first flat heat pipe extends to the left heat dissipation area (101), the middle section of the second flat heat pipe (3) is correspondingly arranged above the left heat dissipation area (9), one end of the second flat heat pipe is located between the first flat heat pipe (2) and the third flat heat pipe (4), the other end of the second flat heat pipe extends to the right heat dissipation area (102), one end of the third flat heat pipe (4) is located in the left heat dissipation area (101), the other end of the third flat heat pipe extends to the right heat dissipation area (102), and the middle section of the second flat heat pipe (3) is correspondingly arranged above the left heat dissipation area (9).
2. The notebook computer heat sink assembly of claim 1, wherein: the second flat heat pipe (3) has a first bending part (31), and the first bending part (31) is located in the right heat dissipation area (102) and extends in a direction away from the third flat heat pipe (4).
3. The notebook computer heat sink assembly of claim 2, wherein: the third flat heat pipe (4) has a second bending part (41), and the second bending part (41) is located in the right heat dissipation area (102) and extends reversely away from the second flat heat pipe (3).
4. The notebook computer heat sink assembly of claim 1 or 2, wherein: the upper surface of the left heat dissipation area (101) is provided with a space avoidance area (104), and the first flat heat pipe (2) and the third flat heat pipe (4) are positioned between the space avoidance area (104) and the edge of the heat dissipation thin plate (1).
5. The notebook computer heat sink assembly of claim 1, wherein: the sinking area (103) is provided with a sinking groove (5) for embedding and installing bolts.
6. The notebook computer heat sink assembly of claim 1, wherein: the edge of the heat radiation sheet (1) is provided with a plurality of mounting plates (6), and the mounting plates (6) are provided with mounting holes (7).
7. The notebook computer heat sink assembly of claim 1, wherein: and heat conducting paste is filled between the sinking area (103) and the high-temperature heat source (9) and between the sinking area and the low-temperature heat source (10).
8. The notebook computer heat sink assembly of claim 1, wherein: the first flat heat pipe (2), the second flat heat pipe (3) and the third flat heat pipe (4) are welded with the heat radiation thin plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223505349.XU CN219179887U (en) | 2022-12-28 | 2022-12-28 | Radiating assembly of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223505349.XU CN219179887U (en) | 2022-12-28 | 2022-12-28 | Radiating assembly of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219179887U true CN219179887U (en) | 2023-06-13 |
Family
ID=86664513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223505349.XU Active CN219179887U (en) | 2022-12-28 | 2022-12-28 | Radiating assembly of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219179887U (en) |
-
2022
- 2022-12-28 CN CN202223505349.XU patent/CN219179887U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN213545202U (en) | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration | |
| CN219179887U (en) | Radiating assembly of notebook computer | |
| CN219936382U (en) | Novel heat dissipation module, mainboard and notebook computer | |
| CN210038688U (en) | Heat radiation module | |
| TW200930261A (en) | Cooling module | |
| CN213583756U (en) | Electronic chip packaging structure | |
| CN219269413U (en) | Electronic equipment heat radiation assembly | |
| CN212084981U (en) | Heat dissipation heat transmitter of chip | |
| CN219456825U (en) | Heat radiation module | |
| CN211403294U (en) | Notebook computer capable of dissipating heat through keyboard bracket | |
| CN210038689U (en) | Novel heat dissipation module | |
| CN2901579Y (en) | Heat conductive element | |
| CN220493447U (en) | Fin type radiator | |
| CN212965932U (en) | Heat radiator for notebook computer | |
| CN218548419U (en) | Heat radiation assembly | |
| CN215526589U (en) | Accelerated heat dissipation structure of fan-free industrial personal computer | |
| CN216218460U (en) | High-efficient natural heat radiation structure of signal processing board | |
| CN216927549U (en) | High-efficient heat abstractor is used to computer CPU | |
| CN216120280U (en) | Sunflower radiator | |
| CN219716055U (en) | Graphene radiator | |
| CN219269434U (en) | Heat dissipation connection structure | |
| CN219269435U (en) | Bidirectional radiator | |
| CN211980601U (en) | Circuit board convenient to heat dissipation | |
| CN213206048U (en) | Cooling fan suitable for server VR power module and server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240228 Address after: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Patentee after: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region after: China Address before: No. 388, Sanjia Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou pindai Electronic Technology Co.,Ltd. Country or region before: China |