CN211403294U - Notebook computer capable of dissipating heat through keyboard bracket - Google Patents

Notebook computer capable of dissipating heat through keyboard bracket Download PDF

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Publication number
CN211403294U
CN211403294U CN202020155735.2U CN202020155735U CN211403294U CN 211403294 U CN211403294 U CN 211403294U CN 202020155735 U CN202020155735 U CN 202020155735U CN 211403294 U CN211403294 U CN 211403294U
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China
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heat
keyboard
metal substrate
notebook
notebook computer
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CN202020155735.2U
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Chinese (zh)
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杨利华
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Chuwi Innovation And Technology Shenzhen Co ltd
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Chuwi Innovation And Technology Shenzhen Co ltd
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Abstract

The utility model discloses a notebook computer radiating heat through a keyboard bracket, which is characterized in that the keyboard comprises a metal substrate, an elastic part, a membrane switch, a touch rod, keys and a keyboard bracket; the membrane switch is directly arranged on the metal substrate, a plurality of downward convex heat conduction convex parts are arranged on the metal substrate, the keyboard support is a metal support, the keyboard support and the metal substrate are directly connected through a plurality of metal connecting columns, and the heat conduction convex parts are in contact with heat conduction copper foils on the notebook mainboard. The utility model discloses unite two into one conventional backup pad and base plate, directly adopt the hard metal sheet to make keyboard support to on the part heat source conduction keyboard support on with the mainboard through the part, be favorable to further reduction notebook's thickness, still realize simultaneously carrying out radiating purpose through keyboard support, abundant utilization notebook computer's part realizes even radiating purpose.

Description

Notebook computer capable of dissipating heat through keyboard bracket
Technical Field
The utility model relates to a notebook heat dissipation technical field especially relates to a through radiating notebook computer of keyboard support.
Background
Compared with a large host, the notebook computer has a relatively smaller overall structure, more compact internal integrated components and more internal heating components, so that the heat dissipation problem is one of the core problems to be solved for the notebook computer. Various heat dissipation measures have been taken inside existing notebook computers, including the use of heat dissipation fans and the like. How to further improve the heat dissipation performance of the conventional heat dissipation mechanism is significant.
An important factor that actually affects heat dissipation is that heat dissipation of a notebook computer is a system engineering, and heat dissipation is prevented from being performed respectively through multiple types, so that the overall heat dissipation performance of a product meets the requirement. For a notebook computer, all exposed parts can be used as heat radiating parts, the surface area covered by the keyboard is the largest in a use state, the keyboard is combined by a plurality of keys, and a gap is reserved between each key and the shell. The existing notebook computer generally adopts the thin film keys, so the bottom of the actual thin film keys is provided with a substrate and a support plate, as shown in fig. 1 which is a schematic diagram of the composition of a common notebook keyboard, a main plate 3, a support plate 1, a metal substrate 2, an elastic element 5, a thin film switch 6, a contact rod 7 and keys 8. The supporting plate 1 is fixed on a main body shell of the notebook computer and is simultaneously connected with the main board 3, the metal substrate 2 is fixed on the supporting plate 1, the membrane switch 6 is arranged on the substrate, and a keyboard support 9 is arranged between intervals of keys. How to effectively utilize the keyboard area to realize that partial heat in the notebook computer is dissipated out of the machine body, and the keyboard area has help to improve the heat dissipation performance of the notebook computer.
SUMMERY OF THE UTILITY MODEL
The utility model aims to how effectively utilize the keyboard to realize improving notebook computer's heat dispersion.
The utility model provides a notebook computer radiating heat through a keyboard bracket, which is characterized in that the keyboard comprises a metal substrate, an elastic piece, a membrane switch, a touch rod, keys and a keyboard bracket; the membrane switch is directly arranged on the metal substrate, a plurality of downward convex heat conduction convex parts are arranged on the metal substrate, the keyboard support is a metal support, the keyboard support and the metal substrate are directly connected through a plurality of metal connecting columns, and the heat conduction convex parts are in contact with heat conduction copper foils on the notebook mainboard.
The notebook computer capable of dissipating heat through the keyboard support is characterized in that the metal substrate is made of a hard aluminum material, the periphery of the heating component of the computer mainboard is provided with a heat-conducting copper foil and heat dissipation holes, and heat on the notebook computer mainboard is conducted to the metal substrate through the heat-conducting convex parts.
The notebook computer capable of dissipating heat through the keyboard support is characterized in that the temperature of the keyboard support is not higher than 45 ℃ by controlling the contact quantity of the bottom of the metal substrate and the heat conducting copper foil on the notebook mainboard.
The notebook computer capable of dissipating heat through the keyboard support is characterized in that the heat-conducting convex part is in contact with the heat-radiating fin on the notebook mainboard through heat-conducting silica gel.
The utility model has the advantages that: the utility model discloses unite two into one conventional backup pad and base plate, directly adopt the hard metal sheet to make keyboard support to on the part heat source conduction keyboard support on with the mainboard through the part, be favorable to further reduction notebook's thickness, still realize simultaneously carrying out radiating purpose through keyboard support, abundant utilization notebook computer's part realizes even radiating purpose.
Drawings
FIG. 1 is a schematic diagram of a common notebook keyboard;
fig. 2 is a schematic diagram of the keyboard assembly and connection by heat dissipation of the keyboard support.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Fig. 2 is a schematic diagram of the composition and connection of a keyboard radiating through a keyboard support, the keyboard including a keyboard support 9, a metal substrate 2, an elastic member 5, a membrane switch 6, a touch rod 7 and a key 8; the membrane switch 6 directly sets up 2 on metal substrate, has a plurality of bellied heat conduction convex parts 14 downwards on the metal substrate 2, and keyboard support 9 is metal support, and keyboard support and metal substrate go up directly to be connected through a plurality of metal connecting post 10, and heat conduction convex part 14 contacts with the heat conduction copper foil on the notebook mainboard 3, carries out fixed connection through metal screw 13. The metal substrate adopts the duralumin material to make, adopts the duralumin material can realize that the better support intensity of thin thickness realization can realize better heat conduction effect simultaneously, and the quick even distribution of heat that will conduct through heat conduction convex part is to metal substrate 2. And then the metal connecting column 10 between the metal substrate 2 and the keyboard support 9 is rapidly transmitted to the keyboard support 9, and heat dissipation is realized through the keyboard support 9. The heat conduction convex part can also select partial and pass through heat conduction silica gel with the fin on the notebook mainboard and contact, realize heat conduction and even distribution on metal substrate 2 on the fin, and then the quick transmission of metal connecting post 10 between metal substrate 2 and the keyboard support 9 of rethread metal substrate is to the keyboard support 9, realizes the heat dissipation through keyboard support 9.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (4)

1. A notebook computer radiating heat through a keyboard bracket is characterized in that the keyboard comprises a metal substrate, an elastic piece, a film switch, a touch rod, keys and the keyboard bracket; the membrane switch is directly arranged on the metal substrate, a plurality of downward convex heat conduction convex parts are arranged on the metal substrate, the keyboard support is a metal support, the keyboard support and the metal substrate are directly connected through a plurality of metal connecting columns, and the heat conduction convex parts are in contact with heat conduction copper foils on the notebook mainboard.
2. The notebook computer capable of dissipating heat via a keyboard stand of claim 1, wherein the metal substrate is made of duralumin, the computer motherboard has a heat conductive copper foil and heat dissipating holes around the heat generating component, and the heat on the notebook motherboard is conducted to the metal substrate via the heat conductive protrusions.
3. The notebook computer capable of dissipating heat through the keyboard support according to claim 2, wherein the temperature of the keyboard support is controlled not to be higher than 45 ℃ by controlling the amount of contact between the bottom of the metal substrate and the heat conductive copper foil on the notebook motherboard.
4. The notebook computer capable of dissipating heat through the keyboard support according to claim 3, wherein the heat-conducting protrusion is in contact with a heat sink on the notebook motherboard through heat-conducting silicone.
CN202020155735.2U 2020-02-08 2020-02-08 Notebook computer capable of dissipating heat through keyboard bracket Active CN211403294U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020155735.2U CN211403294U (en) 2020-02-08 2020-02-08 Notebook computer capable of dissipating heat through keyboard bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020155735.2U CN211403294U (en) 2020-02-08 2020-02-08 Notebook computer capable of dissipating heat through keyboard bracket

Publications (1)

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CN211403294U true CN211403294U (en) 2020-09-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112286329A (en) * 2020-11-26 2021-01-29 南京微智新科技有限公司 Notebook computer and heat dissipation module thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112286329A (en) * 2020-11-26 2021-01-29 南京微智新科技有限公司 Notebook computer and heat dissipation module thereof

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