CN210244274U

CN210244274U - Heat sink device

Info

Publication number: CN210244274U
Application number: CN201921183411.3U
Authority: CN
Inventors: Xun Chen; 陈迅
Original assignee: Shenzhen Jetio Technology Co ltd
Current assignee: Shenzhen Jetio Technology Co ltd
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2020-04-03
Anticipated expiration: 2029-07-25

Abstract

The utility model discloses a heat dissipation device, which is suitable for U.2 interface, and comprises a bottom shell, a circuit board and a heat dissipation upper cover, wherein the bottom shell and the heat dissipation upper cover are locked by a locking piece, the heat dissipation upper cover comprises a heat dissipation bottom plate, a heat conduction pipe and heat dissipation fins, the circuit board is arranged between the lower surface of the heat dissipation bottom plate and the bottom shell, the heat dissipation fins are arranged on the upper surface of the heat dissipation bottom plate, the heat conduction pipe is embedded between the upper surface of the heat dissipation bottom plate and the heat dissipation fins to fully dissipate heat generated by a chip on the circuit board, after simulation and actual measurement, the utility model can achieve the purpose that the rated 25W power consumption is achieved under the environment temperature of 60 ℃ and the wind speed of 200LFM, the temperature of a control chip is not more than 100 ℃, and the size of the whole device is equivalent to the size of the circuit board, and can, the system can be installed in a server system based on an SFF8639 interface, and has strong compatibility.

Description

Heat sink device

Technical Field

The utility model relates to a computer field especially relates to a heat abstractor suitable for U.2 interface.

Background

The interface of SFF8639(U.2) is increasing on server applications today. The heat dissipation of the SSD of SFF8639 is basically performed by the housing, and the amount of heat that can be dissipated is limited. The power consumption of applications based on SFF8639 interfaces is also getting larger, so that the housing of SFF8639SSD can not effectively dissipate the heat generated by new applications.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the present invention is to provide a heat dissipation device suitable for U.2 interface to the above-mentioned defect of prior art.

The utility model provides a technical scheme that its technical problem adopted is: a heat dissipation device is constructed, and is suitable for U.2 interfaces, and includes a bottom shell, a circuit board and a heat dissipation upper cover, the bottom shell with the heat dissipation upper cover is locked through a locking member, the heat dissipation upper cover includes a heat dissipation bottom plate, a heat pipe and heat dissipation fins, the circuit board is arranged on the lower surface of the heat dissipation bottom plate and between the bottom shell, the heat dissipation fins are arranged on the upper surface of the heat dissipation bottom plate, and the heat pipe is embedded in the upper surface of the heat dissipation bottom plate and between the heat dissipation fins.

Preferably, the upper surface of the heat dissipation bottom plate is recessed to form an installation groove matched with the shape and size of the heat conduction pipe, and the heat conduction pipe is arranged in the installation groove.

Preferably, the number of the heat conduction pipes is two, each heat conduction pipe is a C-shaped copper liquid heat conduction pipe, and the two copper liquid heat conduction pipes are arranged back to back.

Preferably, a heat dissipation paste with a high thermal conductivity coefficient is disposed between the metal cover of the chip on the circuit board and the lower surface of the heat dissipation bottom plate.

Preferably, the heat dissipation fins comprise a plurality of copper fins, and the plurality of copper fins are vertically welded on the upper surface of the heat dissipation base plate side by side.

Preferably, the retaining member is a screw with a spring, the bottom case and the heat dissipation upper cover are spliced to form a box body, and the four corners of the box body are respectively locked and fixed through the screw with the spring.

Preferably, a rubber pad is arranged between the lower surface of the circuit board and the bottom shell.

Preferably, the upper surface and the lower surface of the circuit board are respectively provided with an insulating film, and the insulating film is hollowed at the position of a component of the circuit board.

The utility model discloses a heat abstractor suitable for U.2 interface has following beneficial effect: the utility model discloses a heat abstractor can carry out abundant heat dissipation to the heat that the chip produced on the circuit board, through emulation and actual measurement, the utility model discloses can reach under 60 degrees ambient temperature and 200LFM wind speed, rated 25W's consumed power, control chip's temperature is no longer than 100 degrees, and the size of whole device matches with the circuit board size moreover, can accomplish to go with 2.5 cun hard disk identical, can install into and go in the server system based on SFF8639 interface, and is compatible strong.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts:

fig. 1 is a schematic structural view of the heat dissipation device of the present invention;

fig. 2 is an exploded view of the heat dissipating device of the present invention.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Exemplary embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It should be understood that the embodiments and specific features in the embodiments of the present invention are described in detail in the present application, but not limited to the present application, and the technical features in the embodiments and specific features in the embodiments of the present invention can be combined with each other without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1-2, the heat dissipation device of the present invention, which is suitable for U.2 interface, includes a bottom case 1, a circuit board 4, and a heat dissipation upper cover, wherein the circuit board 4 is provided with U.2 interface related circuits. The bottom case 1 may be slightly larger than the circuit board 4.

The bottom case 1 and the heat-dissipating upper cover are locked by a locking member 9, and the locking member 9 may preferably be a screw with a spring. For example, the bottom case 1 and the heat dissipation upper cover are spliced to form a box body, and four corners of the box body are respectively locked and fixed through the screws with the springs.

The heat dissipation upper cover comprises a heat dissipation bottom plate 6, a heat conduction pipe 7 and heat dissipation fins 8, the circuit board 4 is arranged between the lower surface of the heat dissipation bottom plate 6 and the bottom case 1, the heat dissipation fins 8 are arranged on the upper surface of the heat dissipation bottom plate 6, and the heat conduction pipe 7 is embedded between the upper surface of the heat dissipation bottom plate 6 and the heat dissipation fins 8.

Specifically, the quantity of heat pipe 7 is two, the upper surface of radiating bottom plate 6 is sunken to form and two mounting grooves of two heat pipe 7 shape size assorted, and two heat pipe 7 are arranged in two mounting grooves. In this embodiment, each of the heat pipes 7 is a C-shaped liquid copper heat pipe 7, and the two liquid copper heat pipes 7 are disposed back to back.

Specifically, the heat dissipation fins 8 include a plurality of copper fins, and the plurality of copper fins are vertically welded on the upper surface of the heat dissipation base plate 6 side by side.

Preferably, a heat dissipation paste with high thermal conductivity is disposed between the metal cover of the chip on the circuit board 4 and the lower surface of the heat dissipation base plate 6 to ensure close bonding between the two.

Preferably, a rubber pad 3 is disposed between the lower surface of the circuit board 4 and the bottom case 1 for supporting the PCB and preventing the PCB from being deformed due to excessive pressure.

Preferably, the upper surface of the circuit board 4 is provided with an insulating film 2, the lower surface is provided with an insulating film 5, and the

insulating films

2 and 5 are hollowed out at the positions of the components of the circuit board 4.

The device of the embodiment can reduce the temperature of the control chip to be lower than 100 ℃ under the conditions of 60 ℃ ambient temperature and 200LFM wind speed, and the rated consumption power of 25W. The maximum power of 25W defined by SFF8639 specification is fully utilized in the application. The requirement that the temperature of the metal shell of the control chip does not exceed 100 ℃ is met. Within the current data center temperature control range (<25 degrees), more powerful load demands can be emitted.

While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. The utility model provides a heat abstractor, is applicable to U.2 interfaces, its characterized in that, includes drain pan, circuit board, heat dissipation upper cover, the drain pan with the heat dissipation upper cover passes through retaining member locking, the heat dissipation upper cover includes radiating bottom plate, heat pipe and heat radiation fins, the circuit board sets up radiating bottom plate's lower surface with between the drain pan, heat radiation fins sets up on radiating bottom plate's upper surface, the heat pipe embedding radiating bottom plate's upper surface with between the heat radiation fins.

2. The heat dissipating device of claim 1, wherein the upper surface of the heat dissipating base plate is recessed to form a mounting groove matching the shape and size of the heat conducting pipe, and the heat conducting pipe is disposed in the mounting groove.

3. The heat dissipating device of claim 2, wherein the number of the heat conducting pipes is two, each of the heat conducting pipes is a C-shaped liquid copper heat conducting pipe, and the two liquid copper heat conducting pipes are arranged back to back.

4. The heat dissipating device of claim 1, wherein a heat dissipating paste having a high thermal conductivity is disposed between the metal cap of the chip on the circuit board and the lower surface of the heat dissipating base plate.

5. The heat dissipating device of claim 1, wherein the heat dissipating fins comprise a plurality of copper fins that are welded side-by-side vertically on the upper surface of the heat dissipating base plate.

6. The heat dissipation device of claim 1, wherein the locking member is a screw with a spring, the bottom case and the heat dissipation upper cover are assembled to form a box body, and four corners of the box body are respectively locked and fixed by the screw with a spring.

7. The heat dissipating device of claim 1, wherein a rubber pad is disposed between the lower surface of the circuit board and the bottom case.

8. The heat dissipation device as claimed in claim 1, wherein the circuit board has an upper surface and a lower surface respectively provided with an insulating film, and the insulating film is hollowed at positions of components of the circuit board.