CN217444373U

CN217444373U - Chip heat radiation structure

Info

Publication number: CN217444373U
Application number: CN202220118884.0U
Authority: CN
Inventors: 向强; 周洪涛; 张超
Original assignee: Zhejiang Zero Run Technology Co Ltd
Current assignee: Zhejiang Zero Run Technology Co Ltd
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2022-09-16
Anticipated expiration: 2032-01-17

Abstract

The utility model discloses a chip heat radiation structure, which comprises a shell and a PCB board, wherein the shell comprises an upper shell and a lower shell, blind holes are arranged at the upper end of the lower shell, a boss is arranged between the blind holes, and a spring is arranged on the boss; the bottom of the PCB is provided with a heat dissipation block; the bottom of the radiating block is provided with a fixing hole corresponding to the blind hole. This structure has increased solitary radiating block between shell and chip, and this radiating block assembles through spring and shell, because spring self possesses elasticity, even can guarantee that the spring also can slightly bounce the radiating block under the condition that products such as shell exist manufacturing and assembly error, makes radiating block and chip fully contact, guarantees the radiating effect.

Description

Chip heat radiation structure

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a chip heat radiation structure.

Background

With the global automobile consumption upgrading of the technology, the trend of automobile electronization is in a rapidly growing situation, and the number of Electronic Control Units (ECUs) carried by global automobiles is continuously increased. The trend of automobile intellectualization is more and more obvious, and intelligent passenger cabins and automatic driving are used as the main direction of the intelligent development of the current automobiles, and the intelligent passenger cabins and the automatic driving are more and more independent of stronger chips. However, with the improvement of the computing power of the chip, the power consumption of the chip is higher and higher, and when the automobile runs, the heat generated by the chip is also higher and higher, so that how to ensure that the chip can efficiently dissipate heat in the running process of the automobile becomes an important research subject.

According to the traditional chip heat dissipation scheme, heat-conducting silicone grease is smeared on a chip firstly, then a metal shell is directly used to be in contact with the heat-conducting silicone grease, and heat on the chip is transferred to the metal shell through the heat-conducting silicone grease to be dissipated. In this method, errors exist in the machining and manufacturing of the metal parts and in the assembly, and the errors can cause the clearance between the chip and the shell to be too large or too small. After the product is assembled, the gap between the chip and the shell can not be adjusted, when the gap is too large, the heat-conducting silicone grease on the chip can not be effectively contacted with the shell, the heat dissipation efficiency can be greatly reduced, when the gap is too small, the shell is directly pressed on the chip, and the chip can be crushed under the pressure applied by the shell, so that the function of the chip is invalid, and huge loss is caused.

For example, a "chip heat sink" disclosed in chinese patent document, whose publication No. CN209515642U includes a case with heat dissipating fins and a chip, the chip is fixed on the case by a chip fixing device, the chip is provided with an insulating heat conducting structure connected with a refrigerating structure, the refrigerating structure is provided with a heat dissipating plate, a plurality of fans are provided between the heat dissipating plate and the heat dissipating fins, and the fans are connected with an automatic control module. However, the module and the air-cooling device used in the patent achieve the heat dissipation effect, the structure is troublesome, and when the air-cooling device dissipates heat, the air-cooling device still dissipates certain heat, the temperature of the inside of the case can be increased, the heat cannot be dissipated completely, and meanwhile, the structure is complicated, needs a large space and is inconvenient to use.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the problems that the chip is radiated through the shell at the present stage, the gap between the chip and the shell can not be adjusted, and the effective contact between the chip and the shell can not be ensured; meanwhile, the shell has limited selectable material types, most of the shell can only be made of die-cast aluminum, and the shell cannot be made of metal materials with better heat dissipation performance; a chip heat dissipation structure is provided; the structure adds a separate radiating block between the shell and the chip, and the radiating block can use a material with better heat conduction performance to strengthen heat dissipation. In addition, the radiating block is assembled with the shell through the spring, and the spring has elasticity, so that the radiating block can be slightly bounced by the spring even if products such as the shell have manufacturing and assembling errors, the radiating block is fully contacted with the chip, and the radiating effect is ensured.

The above technical problem of the present invention can be solved by the following technical solutions:

a chip heat dissipation structure comprises a shell and a PCB, wherein the shell comprises an upper shell and a lower shell, blind holes are formed in the upper end of the lower shell, bosses are arranged among the blind holes, and springs are arranged on the bosses; the bottom of the PCB is provided with a heat dissipation block; the bottom of the radiating block is provided with a fixing hole corresponding to the blind hole. According to the structure, the independent radiating block is additionally arranged between the shell and the chip and assembled with the shell through the spring, and the spring has elasticity, so that the radiating block can be slightly bounced even if products such as the shell have manufacturing and assembling errors, the radiating block is fully contacted with the chip, and the radiating effect is guaranteed.

As the optimization, the top of spring is higher than the boss top slightly, when leading to the radiating block to extrude downwards because of the structure, can guarantee to leave sufficient compression space, avoids the boss top to influence the extrusion of spring to the radiating block, guarantees that the radiating block can laminate with the top chip all the time.

Preferably, the reserved height between the fixing hole and the blind hole is smaller than the extension length of the spring in the natural state, the middle gap is smaller than the extension length of the spring in the natural state, the difference length of the two is larger than the process error value caused by the manufacturing process, the spring can be ensured to be always in a compression state, when the manufacturing process generates small difference, the spring cannot affect the jacking of the whole radiating block, and the radiating block can be ensured to be in closer contact with a chip on a PCB.

Preferably, the lower shell is provided with a fixing table, the PCB is provided with a screw hole, the screw hole corresponds to the fixing table, the lower shell and the PCB can be tightly fixed through the screw, and the PCB is prevented from being damaged due to unstable structure.

As preferred, the PCB board contains heat conduction silicone grease coating, and heat conduction silicone grease coating contact the radiating block top surface, both contacts mainly rely on the spring to apply the extrusion force for the radiating block, and both contacts can guarantee the radiating effect of chip, and dual radiating effect can guarantee that the radiating effect of PCB board is good.

Preferably, the bottom of the radiating block is provided with a positioning hole, the upper end of the lower shell is provided with a positioning column, the positioning hole corresponds to the positioning column, the positioning hole and the positioning column are matched, combination can be achieved through the concave-convex structure of the radiating block, combination is tight, and the radiating block can be basically fixed on the lower shell.

The utility model has the advantages that:

1. the problem that the gap is not adjustable is solved, the chip can still be effectively contacted with the shell even if the product has manufacturing deviation, and the heat dissipation is more reliable;

2. the radiating block is additionally arranged between the chip and the shell, the radiating block can be made of a material with better radiating performance, and then the radiating block is installed with the shell, so that the radiating capacity of the system is improved and the heat dissipation of the chip is enhanced on the premise that the cost is not greatly increased.

Drawings

Fig. 1 is a front view of the present invention;

FIG. 2 is a schematic cross-sectional view taken along line A in a front view;

FIG. 3 is a schematic cross-sectional view taken along line B in elevation;

wherein: 1-an upper shell; 2-a PCB board; 3-chip; 4-heat-conducting silicone grease coating; 5-a heat dissipation block; 6-a spring; 7-a lower shell; 8-screw holes; 9-positioning column.

Detailed Description

It should be understood that the examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.

The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.

A chip heat radiation structure comprises a PCB board 2, an upper shell 1 and a lower shell 7.

The upper end of the lower shell 7 is provided with four blind holes, bosses are arranged among the four blind holes, the bosses are slightly smaller than reserved positions among the blind holes, springs 6 are arranged outside the bosses, the heights of the springs 6 are higher than the tops of the bosses, and the springs are in a compression state. The bottom of the lower shell 7 is provided with two positioning columns for positioning, the positioning columns and two positioning holes arranged at the lower end of the radiating block 5 are in concave-convex relation, and the positioning holes and the positioning columns are tightly combined together to ensure the stability of the radiating block 5.

5 tops of radiating block are PCB board 2, and radiating block 5 passes through the reference column to be fixed under on the casing, and casing 7 bottom sets up the fixed station down, has the screw that corresponds with the fixed station on PCB board 2, fixes PCB board 2 and casing 7 together down through the screw. At this time, the PCB board 2 is in close contact with the heat dissipation block 5. The PCB comprises a heat-conducting silicone grease coating 4, and the heat-conducting silicone grease coating 4 is contacted with the top surface of the heat dissipation block 5.

When the spring is installed, 4 springs firstly penetrate through the lug boss on the lower shell 7, and the springs are in a natural state. Then, two positioning holes of the radiating block 5 are aligned to two positioning columns on the lower shell 7, the radiating block is arranged on the lower shell, and at the moment, the spring 6 is compressed to generate certain elastic force to push the radiating block to move upwards. Then, the PCB 2 (with the chip on the PCB and the heat-conducting silicone grease evenly coated on the chip) coated with the heat-conducting silicone grease coating 4 is assembled on the shell, the PCB 2 is locked on the lower shell 7 by screws, and the upper shell 1 is locked with the lower shell 7 by screws, thus completing the combination.

In the scheme, the heat dissipation block 5 can be made of a material with good heat conductivity, such as beryllium copper, and the materials of the upper shell 1 and the lower shell 7 can still be made of conventional die-cast aluminum materials. The elastic coefficient and the compression amount of the spring 6 can be selected according to the force required by the supporting radiating block, and the spring is very flexible. When the height processing deviation of the screw post assembled by the lower shell 7 and the PCB 2 is large or the lower shell 7 deforms greatly, even if a large gap exists between the chip and the radiating block 5, the spring 6 can still be ensured to jack up the radiating block 5 by reasonably selecting the elastic coefficient and the compression amount of the spring 6, so that the radiating block 5 is reliably contacted with the chip, and the heat dissipation can be effectively ensured. The scheme can be suitable for various same working conditions, reduces the requirement on the processing precision of products, improves the fault-tolerant rate, saves the cost and improves the product percent of pass.

The structure adds a single radiating block 5 between the shell and the chip, and the radiating block 5 can use a material with better heat conducting property to enhance the heat dissipation. In addition, the radiating block 5 is assembled with the shell through the spring 6, and the spring 6 has elasticity, so that the spring 6 can ensure that the radiating block 5 can be slightly bounced even if products such as the shell have manufacturing and assembling errors, the radiating block 5 is fully contacted with the chip, and the radiating effect is ensured.

The spring 6 is used for ensuring the reliable contact between the chip and the heat dissipation structure, so that the requirement on the processing precision of parts is reduced; increase a radiating block 5 alone between chip and casing, this radiating block can select for use different heat conductivities's material according to actual need, can promote the radiating efficiency of chip.

Claims

1. The utility model provides a chip heat radiation structure, includes casing and PCB board (2), its characterized in that: the shell comprises an upper shell (1) and a lower shell (7), blind holes are formed in the upper end of the lower shell (7), bosses are arranged among the blind holes, and springs (6) are arranged on the bosses; the bottom of the PCB (2) is provided with a heat dissipation block (5); the bottom of the heat dissipation block (5) is provided with a fixing hole corresponding to the blind hole.

2. A chip heat dissipation structure as recited in claim 1, wherein: the top of the spring (6) is higher than that of the lug boss.

3. A chip heat dissipation structure as recited in claim 2, wherein: the reserved height between the fixing hole and the blind hole is smaller than the extension length of the spring (6) in a natural state.

4. A chip heat dissipation structure as recited in claim 1, wherein: the lower shell (7) is provided with a fixing table, and the PCB (2) is provided with a screw hole (8) corresponding to the fixing table.

5. A chip heat dissipation structure as recited in claim 1, wherein: the PCB comprises a heat-conducting silicone grease coating (4), wherein the heat-conducting silicone grease coating (4) is in contact with the top surface of the heat dissipation block (5).

6. A chip heat dissipation structure as recited in claim 1, wherein: the bottom of the heat dissipation block (5) is provided with a positioning hole; and the upper end of the lower shell (7) is provided with a positioning column corresponding to the positioning hole.