CN220774049U - Resistor module - Google Patents
Resistor module Download PDFInfo
- Publication number
- CN220774049U CN220774049U CN202321760148.6U CN202321760148U CN220774049U CN 220774049 U CN220774049 U CN 220774049U CN 202321760148 U CN202321760148 U CN 202321760148U CN 220774049 U CN220774049 U CN 220774049U
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- China
- Prior art keywords
- circuit board
- resistor
- heat
- resistor module
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model discloses a resistor module, which comprises a circuit board, a heat dissipation structure, a resistor body and a connection structure, wherein the circuit board is provided with a first side and a second side which are oppositely arranged in the thickness direction, a printed circuit is formed on the second side, the heat dissipation structure is arranged on the first side, the resistor body is welded on the second side, the connection structure is arranged on the end side of the circuit board, and the circuit board is used for being fixed on a main circuit board through the connection structure, so that the resistor body is electrically connected with the main circuit board through the printed circuit. In the utility model, the resistor module is connected to the main circuit board in an inserting manner, compared with the prior art, the two sides of the mounting manner of the patch can radiate heat, the radiating area is increased, the radiating effect is improved, the radiator is arranged on the side opposite to the resistor body, the arrangement area of the radiator is not limited by the surface area of the resistor body, so that more radiators can be arranged, and the radiating effect is further improved.
Description
Technical Field
The utility model relates to the technical field of resistor manufacturing, in particular to a resistor module.
Background
The related electrical properties of the resistor are directly related to the temperature of the surface in use. When the resistor access circuit continuously works, part of electric energy is converted into heat energy due to impedance, so that the surface temperature of the resistor access circuit is increased, and the temperature of other resistors except the thermistor is increased, so that the related electrical property and the service life of the resistor are reduced, and the realization of the original functions is influenced.
In the prior art, in order to improve the heat dissipation performance of the resistor, a radiator can be additionally arranged to improve the heat dissipation performance of the resistor. As shown in fig. 1, a chip resistor module 100' in the prior art is bonded with a heat sink 20' on one side of a resistor 10' through a heat conductive adhesive layer 30', and soldered to a main circuit board 200' on the other side. However, the resistor structure can only dissipate heat from one side, and the heat dissipation performance of the resistor module is limited.
Disclosure of Invention
Accordingly, the present utility model is directed to a resistor module capable of enhancing heat dissipation performance of a resistor.
In order to solve the above technical problems, the present utility model provides a resistor module, including:
a circuit board having a first side and a second side disposed opposite to each other in a thickness direction, the second side having a printed wiring formed thereon;
the heat dissipation structure is arranged on the first side;
a resistor welded to the second side, the resistor and the heat dissipation structure being at least partially aligned in the thickness direction; the method comprises the steps of,
the connecting structure is arranged at the end side of the circuit board, and the circuit board is fixed on the main circuit board through the connecting structure, so that the resistor body is electrically connected with the main circuit board through the printed circuit.
In an embodiment, a projection area of the resistor body in the thickness direction is within a projection area of the heat dissipation structure in the thickness direction, and a projection area of the heat dissipation structure in the thickness direction is larger than a projection area of the resistor body in the thickness direction.
In an embodiment, the heat dissipation structure includes a heat sink and a heat conductive layer disposed between the heat sink and the circuit board.
In an embodiment, the material of the heat conducting layer is heat conducting silicone grease.
In an embodiment, screw holes are formed on the heat radiator and the heat conducting layer respectively, and the heat radiator and the heat conducting layer are fixed on the circuit board respectively through bolts penetrating through the circuit board in a threaded manner.
In one embodiment, the heat sink is provided in plurality.
In an embodiment, each heat radiator includes a bottom plate attached to the heat conducting layer, and a plurality of heat radiating fins protruding from one side of the bottom plate away from the heat conducting layer, where the plurality of heat radiating fins are arranged side by side and at intervals.
In an embodiment, the material of the heat sink is aluminum alloy.
In an embodiment, the connection structure is a socket protruding from a side edge of the circuit board, and the socket is used for being plugged into a socket on the main circuit board and welded to the main circuit board.
In an embodiment, the number of the pins is three, the three pins are arranged at intervals along the extending direction of the side edge of the circuit board, so that two inserting grooves are formed, each inserting groove is located between two adjacent pins in a one-to-one correspondence mode, pins for taking voltage are formed in each inserting groove, and each pin is connected with the resistor body through the printed circuit.
The technical scheme provided by the utility model has the following advantages:
the utility model provides a resistor module, which comprises a circuit board, a heat dissipation structure, a resistor body and a connection structure, wherein the circuit board is provided with a first side and a second side which are oppositely arranged in the thickness direction, a printed circuit is formed on the second side, the heat dissipation structure is arranged on the first side, the resistor body is welded on the second side, the resistor body and the heat dissipation structure are at least partially aligned in the thickness direction, the connection structure is arranged on the end side of the circuit board, and the circuit board is fixed on a main circuit board through the connection structure, so that the resistor body is electrically connected with the main circuit board through the printed circuit. In the embodiment provided by the utility model, the resistor module is connected to the main circuit board in an inserting mode, compared with the prior art, the two sides of the surface mounting mode can radiate heat, the radiating area is increased, the radiating effect is improved, the radiator is arranged on the side opposite to the resistor body, the arrangement area of the radiator is not limited by the surface area of the resistor body, so that more radiators can be arranged, and the radiating effect is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a three-dimensional structure of a resistor module mounted on a main circuit in the prior art;
FIG. 2 is a schematic perspective view of an embodiment of a resistor module according to the present utility model;
FIG. 3 is an exploded view of the resistor module of FIG. 2;
fig. 4 is a schematic perspective view of the resistor module in fig. 1 at another view angle.
The icon illustrates:
a 100-resistance module; 10-a circuit board; 11-a first side; 12-a second side; 13-printed wiring; 14-plug pins; 15-inserting grooves; 16-bolts; 20-a heat dissipation structure; 21-a heat sink; 211-a bottom plate; 212-cooling fins; 22-a heat conducting layer; 30-resistor.
Detailed Description
The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which embodiments of the utility model are shown, some, but not all embodiments of the utility model
Examples of the part. The utility model will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
The present utility model provides a resistor module 100, please refer to fig. 2 to 4. The resistor module 100 includes a circuit board 10, a heat dissipating structure 20, a resistor body 30, and a connection structure 14. The circuit board 10 has a first side 11 and a second side 12 disposed opposite to each other in the thickness direction, and a printed wiring 13 is formed on the second side 12. The printed wiring 13 is used to electrically connect the resistor body 30 with the main circuit board 200 (see fig. 1). The circuit board 10 may be manufactured by conventional printed circuit board manufacturing processes, and may be made of copper foil, glass fiber, or the like.
The heat dissipation structure 20 is disposed on the first side 11, and the specific type of the heat dissipation structure 20 is not present, and may be, for example, a heat sink, a profile heat sink, a heat dissipation coating, or the like. In a preferred embodiment, the heat dissipating structure 20 includes a heat sink 21 and a thermally conductive layer 22 disposed between the heat sink 21 and the circuit board 10. The heat sink 21 is used for conducting heat generated by the resistor 30 to the outside, and the heat conducting layer 22 is used for uniformly and quickly conducting heat on the circuit board 10 to the heat sink 21 so as to enhance the heat conducting performance between the heat sink 21 and the circuit board 10 and enhance the connection between the heat sink 21 and the circuit board 10. The heat sink 21 may be made of a metal material such as aluminum alloy, copper, or the like. Preferably, the radiator 21 is made of aluminum alloy, and has good heat radiation performance, low cost and good stability. The heat conducting layer 22 can be made of heat conducting silicone grease, heat conducting silica gel and other materials.
The resistor 30 is welded to the second side 12, and the resistor 30 may be made of a conventional metal oxide or carbon film, and the resistor 30 and the heat dissipation structure 20 are at least partially aligned in the thickness direction. That is, the projection area of the resistor 30 in the thickness direction is at least partially overlapped with the projection area of the heat dissipation structure 20 in the thickness direction. Preferably, the projection area of the resistor 30 in the thickness direction is within the projection area of the heat dissipation structure 20 in the thickness direction, and the projection area of the heat dissipation structure 20 in the thickness direction is larger than the projection area of the resistor 30 in the thickness direction. In this way, the heat generated by the resistor 30 can be absorbed more easily by the heat dissipating structure 20, and compared to the conventional embodiment in which the heat sink 21 is provided to the resistor 30, in this embodiment, the resistor 30 and the heat dissipating structure 20 are provided separately to both sides of the circuit board 10, so that the mounting position of the heat sink 21 is not limited to the area of the resistor 30, and can be set to be larger than the surface range of the resistor, thereby further enhancing the heat dissipating effect.
The connection structure 14 is disposed at an end side of the circuit board 10, and the circuit board 10 is fixed to the main circuit board through the connection structure 14, so that the resistor module 100 as a whole functions on the main circuit board. The specific type of connection structure 14 is not limited, and may be soldered directly to the main circuit board, for example, or may be fixed to the main circuit board in other manners. The two sides of the resistor module 100 provided in this embodiment are exposed in the air, and compared with the conventional chip resistor, the resistor module has larger heat dissipation area and better heat dissipation effect.
In a preferred embodiment, the connection structure 14 is a socket protruding from a side of the circuit board 10, and the socket 14 is used for being plugged into a socket on the main circuit board 200 and soldered to the main circuit board 200. Preferably, the pins 14 are three, and the three pins 14 are arranged at intervals along the extending direction of the side edge of the circuit board 10, so as to form two inserting grooves 15, each inserting groove 15 is located between two adjacent pins 14 in a one-to-one correspondence manner, pins 16 for taking voltage are formed in each inserting groove 15, and each pin 16 is connected with the resistor body 30 through the printed circuit 13. In this way, the resistor module 100 can be more easily mounted on the main circuit board 200, and a desired voltage value can be obtained through the pins 16.
Preferably, the heat conducting layer 22 is made of heat conducting silicone grease, which is more stable than the heat conducting silica gel material, and can adapt to the severe temperature change of the resistor 30, so that the resistor is not easy to come off and break, and cannot fall off under the low-temperature condition. On this basis, screw holes (not shown) are formed on the heat sink 21 and the heat conductive layer 22, respectively, and are screwed and fixed to the circuit board 10 by bolts (not shown) penetrating through the circuit board 10, respectively. In this way, the connection between the heat dissipation structure 20 and the circuit board 10 can be firmer, and loosening or falling off can be avoided.
In a preferred embodiment, referring to fig. 2 to 4, the heat sinks 21 are plural, each heat sink 21 includes a base 211 abutting against the heat conducting layer 22, and a plurality of heat sinks 212 protruding from a side of the base 211 away from the heat conducting layer 22, and the plurality of heat sinks 212 are arranged side by side and at intervals. Thus, the heat dissipation area of the heat sink 21 can be increased, and the heat dissipation efficiency can be improved.
Compared with the prior art that the two sides of the patch mounting mode can radiate heat, the resistor module 100 provided by the utility model increases the radiating area and improves the radiating effect, and the radiator 21 is arranged on the side opposite to the resistor body 30, and the arrangement area of the radiator 21 is not limited by the surface area of the resistor body 30, so that more radiators 21 can be arranged, and the radiating effect is further improved.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the utility model. Based on the embodiments of the present utility model, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present utility model.
Claims (10)
1. A resistor module, comprising:
a circuit board having a first side and a second side disposed opposite to each other in a thickness direction, the second side having a printed wiring formed thereon;
the heat dissipation structure is arranged on the first side;
a resistor welded to the second side, the resistor and the heat dissipation structure being at least partially aligned in the thickness direction; the method comprises the steps of,
the connecting structure is arranged at the end side of the circuit board, and the circuit board is fixed on the main circuit board through the connecting structure, so that the resistor body is electrically connected with the main circuit board through the printed circuit.
2. The resistor module of claim 1, wherein a projected area of the resistor body in the thickness direction is within a projected area of the heat dissipating structure in the thickness direction, and a projected area of the heat dissipating structure in the thickness direction is larger than a projected area of the resistor body in the thickness direction.
3. The resistor module of claim 2, wherein the heat dissipating structure comprises a heat sink and a thermally conductive layer disposed between the heat sink and the circuit board.
4. A resistor module according to claim 3, wherein the thermally conductive layer is made of thermally conductive silicone.
5. The resistor module of claim 4, wherein the heat sink and the heat conductive layer are respectively formed with screw holes and are respectively screwed to the circuit board by bolts penetrating through the circuit board.
6. A resistor module according to any of claims 3 to 5, characterized in that the heat sink is provided with a plurality.
7. The resistor module of claim 6, wherein each of the heat sinks includes a bottom plate abutting the heat conductive layer, and a plurality of heat sinks protruding from a side of the bottom plate away from the heat conductive layer, and the plurality of heat sinks are arranged side by side and at intervals.
8. The resistor module of claim 7, wherein the heat sink is aluminum alloy.
9. The resistor module of claim 1, wherein the connection structure is a pin protruding from a side of the circuit board, and the pin is configured to be inserted into a socket on the main circuit board and soldered to the main circuit board.
10. The resistor module of claim 9, wherein three of the pins are arranged at intervals along the extending direction of the side edge of the circuit board, so as to form two plugging grooves, each plugging groove is located between two adjacent pins in a one-to-one correspondence manner, a pin for taking voltage is formed in each plugging groove, and each pin is connected with the resistor body through the printed circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321760148.6U CN220774049U (en) | 2023-07-06 | 2023-07-06 | Resistor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321760148.6U CN220774049U (en) | 2023-07-06 | 2023-07-06 | Resistor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774049U true CN220774049U (en) | 2024-04-12 |
Family
ID=90614250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321760148.6U Active CN220774049U (en) | 2023-07-06 | 2023-07-06 | Resistor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220774049U (en) |
-
2023
- 2023-07-06 CN CN202321760148.6U patent/CN220774049U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |