CN220821223U - Power resistor - Google Patents
Power resistor Download PDFInfo
- Publication number
- CN220821223U CN220821223U CN202322117198.9U CN202322117198U CN220821223U CN 220821223 U CN220821223 U CN 220821223U CN 202322117198 U CN202322117198 U CN 202322117198U CN 220821223 U CN220821223 U CN 220821223U
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- Prior art keywords
- bonding pad
- substrate
- edge part
- power resistor
- pad
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006258 high performance thermoplastic Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Details Of Resistors (AREA)
Abstract
The utility model discloses a power resistor, which relates to the technical field of electronic information equipment, and comprises: a substrate including a first surface and a second surface disposed opposite to each other; at least two bonding pads arranged on the first surface of the substrate at intervals; the at least two pins are correspondingly connected with the at least two bonding pads; a solder coating disposed on the second surface of the substrate; a heat radiating plate welded with the welding coating; the problem of damage to the power resistor in the radio frequency system due to overlarge heat is solved.
Description
Technical Field
The utility model relates to the technical field of electronic information equipment, in particular to a power resistor.
Background
Power resistors are common elements in electronic circuits, and typically function as voltage dividing and current dividing circuits, and are safety resistors used in power supplies of the circuits. The power resistor can burn out and block the current in the circuit to protect the circuit when the power voltage and the current in a certain circuit are controlled. The power resistor generates a large amount of heat under the working condition.
At present, the power resistor is connected with the heat dissipation plate in a crimping mode, so that heat dissipation is realized. However, in the radio frequency field, the crimping mode cannot meet the heat dissipation requirement of the power resistor due to the special working condition.
Disclosure of utility model
The embodiment of the utility model provides a power resistor, which comprises:
A substrate including a first surface and a second surface disposed opposite to each other;
at least two bonding pads arranged on the first surface of the substrate at intervals;
the at least two pins are correspondingly connected with the at least two bonding pads;
A solder coating disposed on the second surface of the substrate;
And the heat dissipation plate is welded with the welding coating.
In an exemplary embodiment, the heat dissipation plate includes a water cooling plate.
In an exemplary embodiment, the material of the solder coating includes tin.
In an exemplary embodiment, the substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion, so the first side portion and the second side portion are located at opposite sides of the substrate in a first direction and each extend along a second direction, so the third side portion and the fourth side portion are located at opposite sides of the substrate in the second direction and each extend along the first direction, and the at least two pads include a first pad, a second pad, a third pad, a fourth pad, and a fifth pad, the first pad being located at a middle portion of the first side portion; the second bonding pad is positioned at one end of the first edge; the third bonding pad is positioned at one end of the second edge part; the fourth bonding pad and the fifth bonding pad are both positioned between the first edge and the second edge, and the fourth bonding pad is positioned at one side of the fifth bonding pad close to the third edge; the fifth bonding pad is positioned on one side of the fourth bonding pad, which is close to the fourth side, the first direction and the second direction are parallel to the substrate, and the first direction and the second direction are intersected.
In an exemplary embodiment, the substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion, so the first side portion and the second side portion are located at opposite sides of the substrate in a first direction and each extend along a second direction, so the third side portion and the fourth side portion are located at opposite sides of the substrate in the second direction and each extend along the first direction, and the at least two pads include a first pad, a second pad, a third pad, a fourth pad, and a fifth pad, the first pad being located at a middle portion of the first side portion; the second bonding pad is positioned in the middle of the second edge part; the third bonding pad is positioned in the middle of the third side part; the fourth bonding pad and the fifth bonding pad are both positioned at the fourth side, the fourth bonding pad is positioned at one side, close to the second side, of the fifth bonding pad, the fifth bonding pad is positioned at one side, close to the first side, of the fourth bonding pad, the first direction and the second direction are both parallel to the substrate, and the first direction and the second direction are intersected.
In an exemplary embodiment, first ends of the at least two pins are connected to corresponding pads, second ends of the at least two pins extend along a direction perpendicular to the substrate, and the second ends of the at least two pins are provided with through holes.
In an exemplary embodiment, the device further comprises an insulating housing connected with the first surface of the substrate, at least two sockets are arranged on the insulating housing, the at least two sockets are arranged corresponding to the at least two pins, and the at least two pins extend out of the insulating housing through the at least two sockets.
In an exemplary embodiment, at least two nuts are disposed on a surface of the insulating housing near one side of the substrate, and the at least two nuts are disposed corresponding to the at least two pins.
In an exemplary embodiment, a gap is provided between the insulating housing and the first surface of the substrate, and the gap is filled with an insulating paste.
In an exemplary embodiment, the insulating housing is provided with a glue injection hole, and the glue injection hole is communicated with the gap.
According to the embodiment of the utility model, the welding coating on the second surface of the substrate is welded with the radiating plate, so that heat generated by the power resistor is radiated through the radiating plate, the temperature of the power resistor is further reduced, and the problem that the power resistor is damaged due to overlarge heat in a radio frequency system is solved.
According to the embodiment of the utility model, the water cooling plate is used for radiating, so that the radiating efficiency of the power resistor is improved.
According to the embodiment of the utility model, the pins are separated through the insulating glue, so that short circuits between adjacent pins are avoided.
According to the embodiment of the utility model, the gap between the insulating shell and the substrate is filled through the glue injection hole.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate and do not limit the utility model.
Fig. 1 is a schematic plan view of a power resistor according to an exemplary embodiment of the present disclosure;
Fig. 2 is a schematic diagram of a structure of a pin in a power resistor according to an exemplary embodiment of the disclosure;
Fig. 3 is a schematic structural view of an insulating housing in a power resistor according to an exemplary embodiment of the present disclosure;
FIG. 4 is a schematic plan view of a further power resistor according to an exemplary embodiment of the present disclosure;
Fig. 5 is a schematic structural view of an insulating housing in a further power resistor according to an exemplary embodiment of the present disclosure.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in detail hereinafter with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be arbitrarily combined with each other.
Exemplary embodiments of the present disclosure provide a power resistor, including:
A substrate including a first surface and a second surface disposed opposite to each other;
at least two bonding pads arranged on the first surface of the substrate at intervals;
the at least two pins are correspondingly connected with the at least two bonding pads;
A solder coating disposed on the second surface of the substrate;
And the heat dissipation plate is welded with the welding coating.
The display substrate of the present disclosure is illustrated below by some exemplary embodiments.
Fig. 1 is a schematic plan view of a power resistor according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, as shown in fig. 1, the exemplary embodiment power resistor of the present disclosure includes a substrate 2, at least two pads 3 disposed on a first surface of the substrate 2, at least two pins (not shown in the drawing), a solder coating 1 disposed on a second surface of the substrate 2, and a heat dissipation plate (not shown in the drawing) disposed on a side of the solder coating 1 away from the substrate 2 and soldered to the solder coating 1 in a direction perpendicular to a plane in which the power resistor is located. The first surface and the second surface are two surfaces of the substrate 2 which are oppositely arranged on a plane perpendicular to the power resistor.
According to the embodiment of the utility model, the welding coating on the second surface of the substrate is welded with the radiating plate, so that heat generated by the power resistor is radiated through the radiating plate, the temperature of the power resistor is further reduced, and the problem that the power resistor is damaged due to overlarge heat in a radio frequency system is solved.
In an exemplary embodiment, the material of the substrate 2 may include ceramic. The substrate 2 has a rectangular shape, the length of the substrate 2 may be 20 to 30 mm, and the width of the substrate 2 may be 20 to 30 mm. By way of example, the length of the substrate 2 may be 25 to 26 mm and the width of the substrate 2 may be 25 to 26 mm.
In an exemplary embodiment, the material of the pad 3 may include a conductive material.
In the exemplary embodiment, the pad 3 has a rectangular shape. The pad 3 is, for example, rectangular in shape, the pad 3 extending along the second direction D2.
In an exemplary embodiment, at least two pads 3 are spaced apart on the first surface of the substrate 2.
In an exemplary embodiment, the substrate 2 includes a first edge portion 21, a second edge portion 22, a third edge portion 23, and a fourth edge portion 24, so that the first edge portion 21 and the second edge portion 22 are located at opposite sides of the substrate 2 in a first direction D1 and each extend along a second direction D2, so that the third edge portion 23 and the fourth edge portion 24 are located at opposite sides of the substrate 2 in the second direction D2 and each extend along the first direction D1, and the at least two pads 3 include a first pad 31, a second pad 32, a third pad 33, a fourth pad 34, and a fifth pad 35, and the first pad 31 is located at a middle of the first edge portion 21; the second bonding pad 32 is located at one end of the first edge 21 in the second direction D2; the third bonding pad 33 is located at one end of the second edge 22 opposite to the second direction D2; the fourth pad 34 and the fifth pad are both located between the first edge portion 21 and the second edge portion 22, and the fourth pad 34 is located on a side of the fifth pad 35 close to the third edge portion 23; the fifth pad 25 is located on a side of the fourth pad 34 near the fourth portion 24, the first direction D1 and the second direction D2 are parallel to the substrate 2, and the first direction D1 and the second direction D2 intersect.
In an exemplary embodiment, the first pad 31 and the second pad 32 have a first resistance therebetween, and the first resistance may be 10 to 30 ohms, for example. The first pad 31 and the third pad 33 have a second resistance therebetween, which may be 1 ohm to 10 ohms, for example. The first pad 31 and the fifth pad 35 have a third resistance therebetween, which may be 10 to 30 ohms, for example. The fourth pad 34 and the fifth pad 35 have a fourth resistance therebetween, which may be 10 to 30 ohms, for example. The third pad 33 and the fourth pad 34 have a fifth resistance therebetween, which may be 1 ohm to 10 ohms, for example.
In the exemplary embodiment, the solder coating 1 is located between the substrate 2 and the heat sink for soldering the substrate 2 and the heat sink together.
In an exemplary embodiment, the material of the solder coating 1 may include tin.
In an exemplary embodiment, the heat dissipation plate may include a water cooling plate. The water cooling plate is internally provided with a cooling channel for circulating a cooling medium, and the cooling medium can take away heat emitted by the power resistor.
According to the embodiment of the utility model, the water cooling plate is used for radiating, so that the radiating efficiency of the power resistor is improved.
Fig. 2 is a schematic diagram of a structure of a pin in a power resistor according to an exemplary embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 2, the power resistor of the exemplary embodiment of the present disclosure includes at least two pins 4, at least two pins 4 are connected to at least two pads in a one-to-one correspondence, a shape of a body portion 401 of each pin 4 is a strip shape, the body portion 401 of each pin 4 extends along a third direction D3, first ends of at least two pins 4 are connected to corresponding pads, second ends of at least two pins extend along the third direction D3, and second ends of at least two pins are provided with through holes 41. The third direction D3 is a direction perpendicular to the plane in which the power resistor is located.
In an exemplary embodiment, the pin 4 includes a body portion 401 and a connection portion 402 connected with the body portion 401. The main body 401 is strip-shaped and is perpendicular to the plane of the power resistor, a first end of the main body 401 is perpendicularly connected with a first end of the connecting portion 402, and a second end of the main body 401 extends along the third direction D3. The connection part 402 is strip-shaped and parallel to the plane of the power resistor, the first end of the connection part 402 is connected with the first end of the main body part 401, the second end of the connection part 402 extends along the direction parallel to the plane of the power resistor, and one side surface of the connection part 402 is welded with the surface of the corresponding bonding pad.
In an exemplary embodiment, the material of the pin 4 may include red copper. The length of the lead 4 may be 10mm to 30 mm, the width of the lead 4 may be 1 mm to 10mm, and the thickness of the lead 4 may be 0.1 mm to 1 mm.
Fig. 3 is a schematic structural view of an insulating housing in a power resistor according to an exemplary embodiment of the present disclosure. In an exemplary implementation, as shown in fig. 3, the exemplary embodiment power resistor of the present disclosure further includes an insulating case 5, and the insulating case 5 is connected to the first surface of the substrate. The insulating housing 5 is provided therein with a receiving cavity for receiving components on the first surface of the substrate.
In an exemplary embodiment, the insulating housing 5 includes a surface disposed opposite to the substrate, and at least two grooves 51 are disposed on the surface of the insulating housing 5, and the grooves 51 are grooves formed by protruding the surface of the insulating housing 5 in a direction away from the substrate. At least two convex grooves 51 are arranged in one-to-one correspondence with the pins 4, the bottom of each convex groove 51 is provided with a socket 52, and each pin 4 can extend out of the insulating shell 5 through the socket 52 on the corresponding convex groove 51.
In an exemplary embodiment, each of the grooves 51 may be provided therein with a nut, the nut being disposed on a side surface of the insulating housing 5 adjacent to the substrate, the nut in the groove 51 being disposed corresponding to the pin, the nut being capable of facilitating the installation of the pin. The nut can be a heat-shrinkable nut, and the size of the heat-shrinkable nut is M3.
In an exemplary embodiment, the material of the insulating housing 5 may include polyphenylene sulfide (PPS). Polyphenylene sulfide is a novel high-performance thermoplastic resin and has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame retardance, good thermal stability, excellent electrical property and the like.
In an exemplary embodiment, after the insulating housing 5 is fixedly connected with the substrate, a gap is provided between the insulating housing 5 and the first surface of the substrate, and the gap is filled with insulating glue.
According to the embodiment of the utility model, the pins are separated through the insulating glue, so that short circuits between adjacent pins are avoided.
In an exemplary embodiment, the insulating housing 5 is provided with a glue injection hole, and the glue injection hole is communicated with the gap.
According to the embodiment of the utility model, the gap between the insulating shell and the substrate is filled through the glue injection hole.
Fig. 4 is a schematic plan view of a power resistor according to another exemplary embodiment of the present disclosure. In an exemplary embodiment, the structure of the power resistor of the present exemplary embodiment is substantially the same as that of the embodiment shown in fig. 1, except that, as shown in fig. 4, the substrate 2 includes a first side portion 21, a second side portion 22, a third side portion 23, and a fourth side portion 24, so that the first side portion 21 and the second side portion 22 are located at opposite sides of the substrate 2 in a first direction D1 and each extend along a second direction D2, so that the third side portion 23 and the fourth side portion 24 are located at opposite sides of the substrate 2 in the second direction D2 and each extend along the first direction D1, the at least two pads 3 include a first pad 31, a second pad 32, a third pad 33, a fourth pad 34, and a fifth pad 35, and the first pad 31 is located at a middle of the first side portion 21; the second bonding pad 32 is located in the middle of the second edge 22; the third bonding pad 33 is located in the middle of the third side 23; the fourth bonding pad 34 and the fifth bonding pad are both located at the fourth side 24, the fourth bonding pad 34 is located at a side of the fifth bonding pad 35 near the second side 22, the fifth bonding pad 35 is located at a side of the fourth bonding pad 34 near the first side 21, the first direction D1 and the second direction D2 are both parallel to the substrate 2, and the first direction D1 and the second direction D2 intersect.
In an exemplary embodiment, the second pad 32 and the fourth pad 34 have a first resistance therebetween, which may be, for example, 10 ohms to 30 ohms. The second pad 32 and the third pad 33 have a second resistance therebetween, which may be 1 ohm to 10 ohms, for example. The first pad 31 and the fifth pad 35 have a third resistance therebetween, which may be 1 ohm to 10 ohms, for example. The fourth pad 34 and the fifth pad 35 have a fourth resistance therebetween, which may be 10 to 30 ohms, for example.
Fig. 5 is a schematic structural view of an insulating housing in a further power resistor according to an exemplary embodiment of the present disclosure. In an exemplary implementation, as shown in fig. 5, the exemplary embodiment power resistor of the present disclosure further includes an insulating case 5, and the insulating case 5 is connected to the first surface of the substrate. The insulating housing 5 includes a surface disposed opposite to the substrate, and at least two grooves 51 are disposed on the surface of the insulating housing 5, and the grooves 51 are grooves formed by protruding the surface of the insulating housing 5 along a direction away from the substrate. At least two convex grooves 51 are arranged in one-to-one correspondence with the pins 4, the bottom of each convex groove 51 is provided with a socket 52, and each pin 4 can extend out of the insulating shell 5 through the socket 52 on the corresponding convex groove 51.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms "upper", "lower", "one side", "the other side", "one end", "the other end", "the side", "the opposite", "four corners", "the periphery", "the" mouth "character structure", etc., are directions or positional relationships based on the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the structures referred to have a specific direction, are configured and operated in a specific direction, and thus are not to be construed as limiting the present utility model.
In the description of embodiments of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "directly connected," "indirectly connected," "fixedly connected," "mounted," "assembled" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the terms "mounted," "connected," and "fixedly connected" may be directly connected or indirectly connected through intervening media, and may also be in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Although the embodiments of the present utility model are described above, the embodiments are only used for facilitating understanding of the present utility model, and are not intended to limit the present utility model. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is defined by the appended claims.
Claims (10)
1. A power resistor, comprising:
A substrate including a first surface and a second surface disposed opposite to each other;
at least two bonding pads arranged on the first surface of the substrate at intervals;
the at least two pins are correspondingly connected with the at least two bonding pads;
A solder coating disposed on the second surface of the substrate;
And the heat dissipation plate is welded with the welding coating.
2. The power resistor of claim 1, wherein: the heat dissipation plate includes a water cooling plate.
3. The power resistor of claim 1, wherein: the material of the solder coating includes tin.
4. The power resistor of claim 1, wherein: the substrate comprises a first edge part, a second edge part, a third edge part and a fourth edge part, so that the first edge part and the second edge part are positioned on two opposite sides of the substrate in a first direction and extend along a second direction, so that the third edge part and the fourth edge part are positioned on two opposite sides of the substrate in the second direction and extend along the first direction, and the at least two bonding pads comprise a first bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a fifth bonding pad, and the first bonding pad is positioned in the middle of the first edge part; the second bonding pad is positioned at one end of the first edge; the third bonding pad is positioned at one end of the second edge part; the fourth bonding pad and the fifth bonding pad are both positioned between the first edge and the second edge, and the fourth bonding pad is positioned at one side of the fifth bonding pad close to the third edge; the fifth bonding pad is positioned on one side of the fourth bonding pad, which is close to the fourth side, the first direction and the second direction are parallel to the substrate, and the first direction and the second direction are intersected.
5. The power resistor of claim 1, wherein: the substrate comprises a first edge part, a second edge part, a third edge part and a fourth edge part, so that the first edge part and the second edge part are positioned on two opposite sides of the substrate in a first direction and extend along a second direction, so that the third edge part and the fourth edge part are positioned on two opposite sides of the substrate in the second direction and extend along the first direction, and the at least two bonding pads comprise a first bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a fifth bonding pad, and the first bonding pad is positioned in the middle of the first edge part; the second bonding pad is positioned in the middle of the second edge part; the third bonding pad is positioned in the middle of the third side part; the fourth bonding pad and the fifth bonding pad are both positioned at the fourth side, the fourth bonding pad is positioned at one side, close to the second side, of the fifth bonding pad, the fifth bonding pad is positioned at one side, close to the first side, of the fourth bonding pad, the first direction and the second direction are both parallel to the substrate, and the first direction and the second direction are intersected.
6. A power resistor according to any of claims 1 to 5, characterized in that: the first ends of the at least two pins are connected with the corresponding bonding pads, the second ends of the at least two pins extend along the direction perpendicular to the substrate, and the second ends of the at least two pins are provided with through holes.
7. A power resistor according to any of claims 1 to 5, characterized in that: the circuit further comprises an insulating shell, wherein the insulating shell is connected with the first surface of the substrate, at least two jacks are arranged on the insulating shell, the at least two jacks and the at least two pins are correspondingly arranged, and the at least two pins extend out of the insulating shell through the at least two jacks.
8. The power resistor of claim 7, wherein: at least two nuts are arranged on the surface, close to one side of the substrate, of the insulating shell, and the at least two nuts are arranged corresponding to the at least two pins.
9. The power resistor of claim 7, wherein: a gap is arranged between the insulating shell and the first surface of the substrate, and insulating glue is filled in the gap.
10. The power resistor of claim 9, wherein: and the insulating shell is provided with a glue injection hole, and the glue injection hole is communicated with the gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322117198.9U CN220821223U (en) | 2023-08-08 | 2023-08-08 | Power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322117198.9U CN220821223U (en) | 2023-08-08 | 2023-08-08 | Power resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220821223U true CN220821223U (en) | 2024-04-19 |
Family
ID=90713803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322117198.9U Active CN220821223U (en) | 2023-08-08 | 2023-08-08 | Power resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220821223U (en) |
-
2023
- 2023-08-08 CN CN202322117198.9U patent/CN220821223U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240530 Address after: J, 3rd Floor, No. 7, Lane 150, Taiye Street, Jiading District, Shanghai, 2018 Patentee after: Semicon (Shanghai) Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 132, W Zone, 1st Floor, Building 1, No. 3398 Huqingping Road, Zhaoxiang Town, Qingpu District, Shanghai, 201799 Patentee before: Shanghai Eel Micro Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |