CN114388237A

CN114388237A - Electronic device, power supply module and electronic equipment

Info

Publication number: CN114388237A
Application number: CN202210050705.9A
Authority: CN
Inventors: 武昊; 徐曙光; 陈君; 张晓杰
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2022-04-22

Abstract

The application provides an electronic device, a power supply module and an electronic apparatus. The electronic device includes a circuit board assembly, a first magnetic core, a second magnetic core, a first heat dissipation member, and a first heat conduction member. The circuit board assembly comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are arranged in a stacked mode and are electrically connected. The first magnetic core comprises a first main body, the first magnetic core is arranged on the second circuit board, and the first main body is positioned on one side, back to the first circuit board, of the second circuit board. The second magnetic core comprises a second main body, the second magnetic core is arranged on the first circuit board, the second main body is positioned on one side, back to the second circuit board, of the first circuit board, and the second magnetic core is fixedly connected with the first magnetic core. The first heat dissipation member is located between the first main body and the second circuit board and is in contact with the first main body and the second circuit board. The first heat conducting piece is positioned between the second main body and the first circuit board and is in contact with the second main body and the first circuit board. The first heat dissipation part and the first heat conduction part are used for dissipating heat of the two sides of the circuit board assembly.

Description

Electronic device, power supply module and electronic equipment

Technical Field

The present application relates to the field of electrical equipment, and in particular, to an electronic device, a power module, and an electronic apparatus.

Background

Planar transformers are transformers in which the windings are arranged on a circuit board to achieve planarization of the windings. On one hand, the planar transformer greatly reduces high-frequency parasitic parameters due to the special planar structure and the close coupling of the winding; on the other hand, a winding framework is omitted, the current density is increased, the current density can reach 20A/mm at most, the process is simple, the power density is high, and the high-frequency high-power-density transformer has the advantages of small size, high frequency and small height. With the continuous development of electronic devices toward small size, high power density and high efficiency, planar transformers are widely used in electronic devices. However, the winding is gathered on the circuit board, so that the heat dissipation density of the circuit board is high, and the problem of insufficient heat dissipation of the circuit board exists.

Disclosure of Invention

The application provides an electronic device, a power supply module and electronic equipment, and aims to solve the problem that the heat dissipation of a circuit board is insufficient due to the fact that windings are gathered on the circuit board.

In a first aspect, an embodiment of the present application provides an electronic device, which is applied to a power module. The electronic device includes a circuit board assembly, a first magnetic core, a second magnetic core, a first heat dissipation member, and a first heat conduction member. The circuit board assembly comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are arranged in a stacked mode and are electrically connected. The first magnetic core comprises a first main body, the first magnetic core is arranged on the second circuit board, and the first main body is positioned on one side, back to the first circuit board, of the second circuit board. The second magnetic core comprises a second main body, the second magnetic core is arranged on the first circuit board, the second main body is positioned on one side, back to the second circuit board, of the first circuit board, and the second magnetic core is fixedly connected with the first magnetic core. The first heat dissipation member is located between the first main body and the second circuit board and is in contact with the first main body and the second circuit board. The first heat conducting piece is positioned between the second main body and the first circuit board and is in contact with the second main body and the first circuit board.

The electronic device of the embodiment of the application is provided with the heat dissipation part between the first main body of the first magnetic core and the second circuit board of the circuit board assembly, and the heat conduction part is arranged between the second main body of the second magnetic core and the first circuit board of the circuit board assembly. When the electronic device works, a large amount of heat generated by the circuit board assembly and the first magnetic core during working can be absorbed by the first heat dissipation element and is conducted to the outside; the first heat-conducting piece of accessible absorbs the great amount of heats that circuit board assembly and second magnetic core during operation produced and conducts to the external world, guarantees the quick heat dissipation of circuit board assembly, first magnetic core and second magnetic core, avoids circuit board assembly, first magnetic core and second magnetic core because of the heat gathering damage performance, has prolonged the life of circuit board assembly, first magnetic core and second magnetic core, and then has prolonged electron device's life.

Compared with the prior art, the electronic device provided by the embodiment of the application can rapidly dissipate heat in two sides of the circuit board assembly through the first heat dissipation part and the first heat conduction part, so that the problem that the circuit board assembly is not convenient to dissipate heat is solved, the heat dissipation area is effectively increased, the heat dissipation effect is better, the miniaturization design and the high power density design of the electronic device are facilitated, and the miniaturization design and the high power density design of a power module of the electronic device are facilitated.

In one embodiment, the second body includes a first end surface, the first end surface is recessed with a first groove, the first groove has an opening located on the first end surface, and the first heat-conducting member is located on the first end surface.

Because the first heat conducting piece expands after being heated, when the electronic device works, the first heat conducting piece expands and partially extrudes into the first groove, so that expansion stress generated when the first heat conducting piece is heated is effectively dispersed, and the first heat conducting piece is prevented from expanding to abut against the second magnetic core to damage the second magnetic core; moreover, the design of the first groove can avoid reserving a gap between the second magnetic core and the first heat conducting piece, thereby being beneficial to flattening the electronic device and facilitating the miniaturization design of the electronic device.

In one embodiment, the first heat-conducting members are spaced by first grooves; alternatively, the first heat-conducting member covers the first groove.

In one embodiment, the first heat-conducting member is adhered to the first end surface and the surface of the first circuit board.

Because first heat-conducting piece has viscidity, the second magnetic core realizes fixed connection through the viscidity of first heat-conducting piece and circuit board assembly's first circuit board, has strengthened electronic device's structural stability.

In one embodiment, the first heat conducting member is a colloid, and the first heat conducting member is filled between the first end surface and the surface of the first circuit board.

Because the first heat-conducting piece is colloid and is filled between the first end surface and the surface of the first circuit board, the first heat-conducting piece is ensured to be completely contacted with the first end surface and the surface of the first circuit board, namely no gap is formed between the first heat-conducting piece and the surfaces of the first end surface and the first circuit board, the first heat-conducting piece is ensured to have larger contact area with the surfaces of the first end surface and the first circuit board, and the improvement of the heat dissipation efficiency of the circuit board assembly and the second magnetic core is facilitated.

In one embodiment, the first heat-conducting member is made of a compression material, and the first heat-conducting member is clamped between the first end surface and the surface of the first circuit board.

Because the first heat-conducting piece is made of a compression material and is easy to compress and deform, the first heat-conducting piece is ensured to be completely contacted with the first end face and the surface of the first circuit board, namely no gap exists between the first heat-conducting piece and the surfaces of the first end face and the first circuit board, the first heat-conducting piece is ensured to have larger contact area with the surfaces of the first end face and the first circuit board, and the improvement of the heat dissipation efficiency of the circuit board assembly and the second magnetic core is facilitated. In addition, the resilience force after the first heat-conducting piece deforms is small, and the influence of the first heat-conducting piece on the second magnetic core and the first circuit board is avoided.

In one embodiment, the thermal expansion coefficient of the first heat-conducting member is between the thermal expansion coefficient of the first magnetic core and the thermal expansion coefficient of the first circuit board.

Like this, when first heat-conducting piece is heated the inflation, reduced the thermal stress between first heat-conducting piece and the second magnetic core, reduced the thermal stress between first heat-conducting piece and the first circuit board, avoid the first heat-conducting piece after being heated to damage second magnetic core and first circuit board, and improved the intensity of fixed connection between first heat-conducting piece and second magnetic core and the first circuit board.

In one embodiment, the number of the first grooves is multiple, the multiple first grooves are sequentially spaced, the number of the first heat-conducting members is multiple, and each first heat-conducting member is disposed on the first end surface between two adjacent first grooves.

In one embodiment, the first heat-conducting member forms two first sub heat-conducting members at the first groove at intervals, and the two first sub heat-conducting members are respectively arranged on the first end surfaces at two sides of the first groove.

In one embodiment, the second magnetic core further includes a first fixing body and a second fixing body, the first fixing body and the second fixing body are convexly disposed on the first end surface and are spaced apart from each other, and the first groove and the first heat-conducting member are disposed on the first end surface between the first fixing body and the second fixing body.

The first heat conducting piece can be limited through the first fixing body and the second fixing body. When the first heat conducting piece is colloid, the first heat conducting piece is limited by the first fixing body and the second fixing body, and the first heat conducting piece can be formed and filled between the first end face and the first circuit board. When the first heat conducting piece is made of a compression material, the first heat conducting piece is limited by the first fixing body and the second fixing body, so that the first heat conducting piece is conveniently arranged between the first end face and the first circuit board, the assembly difficulty is reduced, and the assembly time is shortened.

In one embodiment, the first heat-conducting member completely covers the first end surface between the first fixed body and the second fixed body.

Because first heat-conducting piece covers the first terminal surface between first fixed body and the second fixed body completely, first heat-conducting piece all has bigger area of contact with second magnetic core and circuit board assembly's first circuit board, is favorable to second magnetic core and circuit board assembly's quick heat dissipation, has further improved the radiating efficiency.

In one embodiment, the first and second fixing bodies have a height greater than a thickness of the first heat-conducting member, the first circuit board has a first through hole and a second through hole, the first fixing body is inserted into the first through hole, and the second fixing body is inserted into the second through hole.

The first fixing body is matched with the first through hole, the second fixing body is matched with the second through hole, and the second magnetic core can be inserted into the first circuit board, so that the first heat conducting piece is stacked on the first end face between the first fixing body and the second fixing body and is contacted with the first circuit board. Moreover, because the height of the first fixing body and the second fixing body is larger than the thickness of the first heat conducting piece, the first heat conducting piece can be prevented from interfering the second magnetic core to be inserted into the first circuit board.

In one embodiment, the cross-sectional shape of the first groove is rectangular, triangular, curved convex or trapezoidal.

In one embodiment, the electronic device further includes a second heat-conducting member, the second heat-conducting member is located on a first end surface of the first fixing body on a side away from the second fixing body, and the second heat-conducting member is in contact with the first circuit board.

Accessible second heat-conducting piece absorbs a large amount of heats that circuit board assembly and second magnetic core during operation produced and conducts to the external world, heat radiating area has effectively been increased, the radiating effect is better, further guarantee the quick heat dissipation of circuit board assembly and second magnetic core, avoid circuit board assembly and second magnetic core because of the heat gathering damage performance, the life of circuit board assembly and second magnetic core has been prolonged, and then electronic device's life has been prolonged, be favorable to electronic device's miniaturized design and high power density's design, and then be favorable to using this electronic device's power module's miniaturized design and high power density's design.

In one embodiment, the second heat-conducting member is adhered to the first end surface and the surface of the first circuit board.

Because the second heat-conducting piece has viscidity, the second magnetic core realizes fixed connection through the viscidity of second heat-conducting piece and circuit board assembly's first circuit board, has strengthened electronic device's structural stability.

In one embodiment, the second heat conducting member is a colloid, and the second heat conducting member is filled between the first end surface and the surface of the first circuit board.

Because the second heat-conducting piece is colloid and is filled between the first end face and the surface of the first circuit board, the second heat-conducting piece is ensured to be completely contacted with the first end face and the surface of the first circuit board, namely no gap is formed between the second heat-conducting piece and the surfaces of the first end face and the first circuit board, the second heat-conducting piece is ensured to have larger contact area with the surfaces of the first end face and the first circuit board, and the improvement of the heat dissipation efficiency of the circuit board assembly and the second magnetic core is facilitated.

In one embodiment, the second heat-conducting member is made of a compression material, and the second heat-conducting member is clamped between the first end surface and the surface of the first circuit board.

Because the second heat conduction piece is made of a compression material and is easy to compress and deform, the second heat conduction piece is ensured to be in complete contact with the first end face and the surface of the first circuit board, namely no gap exists between the second heat conduction piece and the surfaces of the first end face and the first circuit board, larger contact areas are ensured to be formed between the second heat conduction piece and the surfaces of the first end face and the first circuit board, and the improvement of the heat dissipation efficiency of the circuit board assembly and the second magnetic core is facilitated. In addition, the resilience force after the second heat-conducting piece deforms is small, and the second heat-conducting piece is prevented from influencing the second magnetic core and the first circuit board.

In one embodiment, the thermal expansion coefficient of the second heat conducting member is between the thermal expansion coefficient of the first magnetic core and the thermal expansion coefficient of the first circuit board.

Like this, when the second heat-conducting piece is heated the inflation, reduced the thermal stress between second heat-conducting piece and the second magnetic core, reduced the thermal stress between second heat-conducting piece and the first circuit board, avoid the second heat-conducting piece after being heated to damage second magnetic core and first circuit board, and improved the intensity of fixed connection between second heat-conducting piece and second magnetic core and the first circuit board.

In one embodiment, the second body of the second magnetic core is further recessed with a second recess, the second recess has an opening at the first end face, and the second heat-conducting members are spaced by the second recess; alternatively, the second heat-conducting member covers the second groove.

The second heat conducting piece can expand after being heated, when the electronic device works, the second heat conducting piece can expand and partially extrude into the second groove, so that expansion stress generated when the second heat conducting piece is heated is effectively dispersed, and the second magnetic core is prevented from being damaged because the second heat conducting piece expands to abut against the second magnetic core; moreover, due to the design of the second groove, a gap between the second magnetic core and the first heat conducting piece can be prevented from being reserved, so that the flattening of the electronic device is facilitated, and the miniaturization design of the electronic device is facilitated.

In one embodiment, the second magnetic core further includes a third fixing body, the third fixing body is disposed at the first end face in a protruding manner and spaced from the first fixing body, and is located on a side of the first fixing body away from the second fixing body, the first circuit board is provided with a third through hole, the third fixing body is inserted into the third through hole, and the second heat conducting element and the second groove are located on the first end face between the first fixing body and the third fixing body.

The second heat conducting piece can be limited through the first fixing body and the third fixing body. When the second heat conducting piece is colloid, the second heat conducting piece is limited by the first fixing body and the third fixing body, and the second heat conducting piece can be formed and filled between the first end face and the first circuit board. When the second heat conducting piece is made of a compression material, the first heat conducting piece is limited through the first fixing body and the third fixing body, the second heat conducting piece is convenient to mount between the first end face and the first circuit board, the assembling difficulty is reduced, and the assembling time is shortened.

In one embodiment, the number of the second grooves is multiple, the multiple second grooves are sequentially spaced, the number of the second heat-conducting members is multiple, and each second heat-conducting member is disposed on the first end surface between every two adjacent second grooves.

In one embodiment, the second heat-conducting member forms two second sub heat-conducting members at the second groove at intervals, and the two second sub heat-conducting members are respectively arranged on the first end surfaces at two sides of the second groove.

In one embodiment, the second heat-conducting member completely covers the first end surface between the first fixed body and the third fixed body.

Because the second heat-conducting piece covers the first end face between the first fixing body and the third fixing body completely, the second heat-conducting piece, the second magnetic core and the first circuit board of the circuit board assembly have larger contact area, the second magnetic core and the circuit board assembly are favorable for quick heat dissipation, and the heat dissipation efficiency is further improved.

In one embodiment, the cross-sectional shape of the second groove is rectangular, triangular, curved convex or trapezoidal.

In one embodiment, the first main body of the first magnetic core includes a first surface, the first magnetic core further includes a first connector and a second connector, the first connector and the second connector are convexly disposed on the first surface and are spaced apart from each other, and the first heat sink is disposed on the first surface between the first connector and the second connector.

The first heat dissipation element can be limited through the first connector and the second connector. When the first heat dissipation element is a colloid, the first heat dissipation element is limited by the first connector and the second connector, so that the first heat dissipation element can be formed and filled between the first surface and the first circuit board.

In one embodiment, the second circuit board is provided with a first docking through hole and a second docking through hole, the first docking through hole corresponds to the first through hole, the second docking through hole corresponds to the second through hole, the first connector is inserted into the first docking through hole and fixedly connected with the first fixing body, and the second connector is inserted into the second docking through hole and fixedly connected with the second fixing body.

The first butt joint through hole corresponds to the first through hole, the second butt joint through hole corresponds to the second through hole, the first butt joint through hole is communicated with the first through hole, the second butt joint through hole is communicated with the second through hole, so that the first connecting body inserted into the first butt joint through hole can be contacted with the first fixing body inserted into the first through hole to be fixedly connected, and the second connecting body inserted into the second butt joint through hole can be contacted with the second fixing body inserted into the second through hole to be fixedly connected.

In one embodiment, the electronic device further includes a first adhesive member and a second adhesive member, the first connecting body is fixedly connected to the first fixing body through the first adhesive member, and the second connecting body is fixedly connected to the second fixing body through the second adhesive member.

The first bonding piece is positioned between the first connecting body and the first fixing body and is respectively contacted with the surface of the first connecting body and the surface of the first fixing body. The second bonding piece is positioned between the second connecting body and the second fixing body and is respectively contacted with the surface of the second connecting body and the surface of the second heat fixing body. The first connecting body is fixedly connected with the first fixing body through the first bonding piece due to the fact that the first bonding piece and the second bonding piece have viscosity; the second connector is fixedly connected with the second fixing body through the second bonding piece, so that the connection is stable, the structure is simple, the cost is low, and the stability of the whole structure of the electronic device is improved.

In one embodiment, the first magnetic core further includes a third connector, the third connector is protruded from the first surface and spaced from the first connector, and is located on a side of the first connector away from the second connector, and the electronic device further includes a second heat dissipation member, and the second heat dissipation member is located on the first surface between the first connector and the third connector.

The second heat dissipation element can be limited by the first connector and the third connector. When the second heat dissipation element is made of colloid, the second heat dissipation element is limited by the first connector and the third connector, and the second heat dissipation element can be formed and filled between the first surface and the first circuit board.

In one embodiment, the electronic device further includes a third adhesive member, the second circuit board is provided with a third through hole, the third through hole corresponds to the third through hole, and the third connector is inserted into the third through hole and is fixedly connected to the third fixing body through the third adhesive member.

The third bonding piece is positioned between the third connecting body and the third fixing body and is respectively contacted with the surface of the third connecting body and the surface of the third fixing body. Because the third bonding piece has viscidity, the third connector is fixedly connected with the third fixing body through the third bonding piece, the connection is stable, the structure is simple, the cost is low, and the stability of the whole structure of the electronic device is improved.

In one embodiment, the first heat dissipation element and/or the second heat dissipation element has tackiness.

Through the viscidity of first radiating piece and/or second radiating piece, first magnetic core and second circuit board fixed connection, connect stably, simple structure and low cost have improved electron device's overall structure stability.

In one embodiment, the circuit board assembly further includes a first winding and a second winding, the first winding is disposed on the first circuit board and electrically connected to the first circuit board, the second winding is disposed on the second circuit board and electrically connected to the second circuit board, and the first winding is coupled to the second winding; the first winding surrounds the first through hole, and the second winding surrounds the first butt joint through hole.

The electronic device realizes the function of voltage conversion through the coupling of the first winding and the second winding.

In a second aspect, an embodiment of the present application provides a power module, which includes the electronic device described in any one of the first aspects and a housing, where the electronic device is housed inside the housing, and the electronic device is configured to perform voltage conversion processing on alternating current.

In a third aspect, an embodiment of the present application provides an electronic device, including the power module and the load module described in the second aspect, where the power module is electrically connected to the load module.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a block diagram of an electronic device provided in an embodiment of the present application;

fig. 2 is a schematic perspective view of an electronic device according to an embodiment of the present application;

FIG. 3 is a cross-sectional view of the electronic device of FIG. 2 taken along line III-III;

FIG. 4 is an exploded view of the electronic device of FIG. 2 taken in cross-section along line III-III;

FIG. 5 is an exploded view of the electronic device of FIG. 2;

fig. 6 is an exploded perspective view of a circuit board assembly of the electronic device of fig. 5;

fig. 7 is a schematic perspective view of a portion of the first core, the heat spreader, and the adhesive of the electronic device of fig. 5;

fig. 8 is a cross-sectional view of the electronic device of fig. 2 (with the second core and the heat-conductive member portion omitted) taken along the line III-III;

fig. 9 is an exploded view of the electronic device of fig. 2 (with portions of the second core, the adhesive member, and the heat conductive member omitted) taken along the line III-III;

fig. 10 is an exploded perspective view of a second core and a thermal conductor of the electronic device of fig. 1;

FIG. 11 is a schematic view of an alternate angle configuration of the second core of FIG. 10;

fig. 12 is an enlarged view of the XII portion of the second core in fig. 11;

fig. 13 is an enlarged view of another embodiment of a XII portion of the second core in fig. 11;

fig. 14 is an enlarged view of another embodiment of a XII portion of the second core in fig. 11;

fig. 15 is an enlarged view of another embodiment of a XII portion of the second core in fig. 11;

fig. 16 is an enlarged view of another embodiment of a XII portion of the second core in fig. 11;

fig. 17 is an enlarged view of another embodiment of a XII portion of the second core in fig. 11;

FIG. 18 is a schematic perspective view of the electronic device of FIG. 2 in a second embodiment;

FIG. 19 is a cross-sectional view of the electronic device of FIG. 18 taken along line XX-XX;

fig. 20 is an exploded view of the cross-sectional view of the electronic device of fig. 18 taken along line XX-XX.

Detailed Description

The embodiment of the application provides an electronic device which is applied to a power module. The power module is applied to electronic equipment. The electronic component may be a planar transformer, or may be an electronic component in which a winding is provided on a circuit board, such as a planar inductor. Among them, the planar transformer is a transformer in which a winding is disposed on a circuit board to achieve planarization of the winding. In this application, the connection of "part a" with "part B" means that "part a" is directly connected with "part B"; alternatively, "part a" is indirectly connected to "part B" through "part C".

The embodiments of the present application will be described below with reference to the drawings.

Referring to fig. 1, fig. 1 is a block diagram of an electronic device 1000 according to an embodiment of the present disclosure. .

The embodiment of the application provides an electronic device 1000. The electronic device includes a power module 1000a and a load module 1000b, and the power module 1000a is electrically connected to the load module 1000 b. In this embodiment, the power module 1000a is an Alternating Current (AC) -AC power module, and is configured to perform voltage reduction conversion processing on the AC power, for example, the power module 1000a may convert 380V AC output by the external power supply 2000 into 220V AC and output the 220V AC to the load module 1000b, so that the load module 1000b works. In other embodiments, the power module 1000a may also perform a boost conversion process on the ac power. The present application does not limit the external power source 2000 and the load module 1000b, the external power source 2000 may be any device or element capable of outputting ac power, the load module 1000b may be any functional module using ac power, for example, the load module 1000b may be a radio frequency module.

In other embodiments, the power module 1000a may also be an AC-DC (Direct Current) power module, which is used to convert AC power into DC power; the power module 1000a may also be a DC-DC power module, configured to convert a direct current; the power module 1000a may also be a DC-AC power module for converting direct current into alternating current, and the type of the power module 1000a is not particularly limited in this application. The electronic device may be any electric device, such as a servo transformer, and the like, which is not limited in this application.

As shown in fig. 1, the power module 1000a includes an electronic device 100 and a housing 200, and the electronic device 100 is accommodated in the housing 200 and electrically connected to an external power source 2000 and a load module 1000 b. In this embodiment, the electronic device 100 is specifically a planar transformer, which is used for performing voltage reduction and conversion processing on alternating current. The ac power output from the external power supply 2000 is subjected to voltage reduction and conversion processing by the electronic device 100, and then is transmitted to the load module 1000b, so that the load module 1000b can work. In addition, because the electronic device 100 is accommodated in the casing 200, the electronic device 100 is isolated from the outside through the casing 200, and the casing 200 plays a role in protecting the electronic device 100, so that the electrical performance of the electronic device 100 is prevented from being influenced by the outside, the performance of the electronic device 100 is ensured, and further the performance of the power module 1000a is ensured. Note that the present application does not specifically limit the structure of the housing 200.

In other embodiments, the electronic device 100 may also be used to perform a boost conversion process on an ac power, which is not limited in this application. That is, the electronic device 100 can be used to perform voltage conversion processing (step-up conversion processing and step-down conversion processing) on alternating current.

In other embodiments, the power module 1000a may also include only the electronic device 100, i.e., the power module 1000a may also not include the housing 200. The power module 1000a may further include other electronic components electrically connected to the electronic device 100, such as a voltage stabilizing unit, a filtering unit, and the like, which is not limited in this application.

The electronic device 100 of the present embodiment is specifically described below.

Referring to fig. 2 and fig. 3, fig. 2 is a schematic perspective view of an electronic device 100 according to an embodiment of the present disclosure;

fig. 3 is a cross-sectional view of the electronic device 100 of fig. 2 along the line III-III.

In this embodiment, the electronic device 100 is exemplified as a planar transformer. The electronic device 100 includes a circuit board assembly 10, a first magnetic core 20, a second magnetic core 30, a heat sink 40, an adhesive member 50, and a heat conductive member 60. The first magnetic core 20 is attached to the circuit board assembly 10 from one side of the circuit board assembly 10. The second magnetic core 30 is disposed opposite to the first magnetic core 20, and is mounted on the circuit board assembly 10 from the other side of the circuit board assembly 10, and is fixedly connected to the first magnetic core 20. The heat sink 40 is located between the first magnetic core 20 and the circuit board assembly 10. The adhesive member 50 is located between the first magnetic core 20 and the second magnetic core 30. The thermal conductive member 60 is located between the second magnetic core 30 and the circuit board assembly 10. In this embodiment, the circuit board assembly 10 is used for converting an alternating current, the circuit board assembly 10 is electrically connected to an external power supply 2000 (as shown in fig. 1) and the load module 1000b, and the alternating current output by the external power supply 2000 is subjected to voltage reduction and conversion by the circuit board assembly 10 and then output to the load module 1000b, so that the load module 1000b can work.

Referring to fig. 4, 5 and 6, fig. 4 is an exploded view of the electronic device 100 of fig. 2 along the III-III line. Fig. 5 is an exploded schematic perspective view of the electronic device 100 of fig. 2; fig. 6 is an exploded perspective view of the circuit board assembly 10 of the electronic device 100 of fig. 5.

Referring to fig. 3 and 4, the circuit board assembly 10 includes a first circuit board 11, a first winding 12, a second circuit board 13, and a second winding 14, wherein the first winding 12 is disposed on the first circuit board 11 and electrically connected to the first circuit board 11. The second winding 14 is disposed on the second circuit board 13 and electrically connected to the second circuit board 13, the second circuit board 13 and the first circuit board 11 are stacked, and the second winding 14 is coupled to the first winding 12. In the present embodiment, the first circuit board 11 and the second circuit board 13 are stacked in the first direction (the illustrated Z-axis direction). The first circuit board 11 is located on the side of the second circuit board 13 toward the positive direction of the Z-axis. The first magnetic core 20 is mounted to the circuit board assembly 10 from a side of the second circuit board 13 away from the first circuit board 11, and the second magnetic core 30 is mounted to the circuit board assembly 10 from a side of the first circuit board 11 away from the second circuit board 13.

The first winding 12 is electrically connected to an external power source 2000 (shown in fig. 1), and the second winding 14 is electrically connected to the load module 1000 b. The ac power output by the external power source 2000 is transmitted to the first winding 12, and the second winding 14 outputs the ac power for the load module 1000b to operate through the coupling of the first winding 12 and the second winding 14.

In other embodiments, circuit board assembly 10 may also include other electronic components, such as chips, inductors, power switches, and the like. The electronic element can be arranged on the first circuit board 11 and electrically connected with the first circuit board 11; can also be installed on the second circuit board 13 and electrically connected with the second circuit board 13; alternatively, other electronic components are provided on both the first circuit board 11 and the second circuit board 13.

In the present embodiment, the first circuit board 11 is a rectangular board. The thickness direction of the first circuit board 11 is the first direction (shown as the Z-axis direction), the length direction of the first circuit board 11 is the second direction (shown as the X-axis direction), and the width direction of the first circuit board 11 is the third direction (shown as the Y-axis direction).

The first circuit board 11 includes a first front surface 111 and a first back surface 112. The first front surface 111 is opposite to the first back surface 112. The first circuit board 11 is provided with a through hole 113, a via hole 114, and a through hole 115. The through holes 113, the via holes 114, and the through holes 115 penetrate the first front surface 111 and the first rear surface 112 of the first circuit board 11. The through holes 113, the through holes 114 and the through holes 115 are distributed at intervals and are not limited in number, and the hole walls of the through holes 114 and the through holes 115 are plated with conductive materials. Illustratively, the conductive material is metallic copper. In other embodiments, the conductive material may be other metals such as aluminum or other conductive materials.

In this embodiment, the number of the through holes 113 is three and is approximately set at the middle position of the first circuit board 11, and the three through holes 113 are respectively a first through hole 1131, a second through hole 1132 and a third through hole 1133. The first through hole 1131, the second through hole 1132 and the third through hole 1133 are all rectangular holes. Along the X-axis direction, first through-hole 1131, second through-hole 1132 and third through-hole 1133 are interval distribution in proper order, and second through-hole 1132 and third through-hole 1133 are located the relative both sides of first through-hole 1131 respectively. The second through hole 1132 is located on a side of the first through hole 1131 facing the positive direction of the X axis, and the third through hole 1133 is located on a side of the first through hole 1131 facing the negative direction of the X axis. The width of the first through hole 1131 is greater than the width of the second through hole 1132, and is greater than the width of the third through hole 1133; the width dimension of the second through hole 1132 is equal to the width dimension of the third through hole 1133. The length dimension of the first through-hole 1131, the length dimension of the second through-hole 1132, and the length dimension of the third through-hole 1133 are equal. In other words, the area of the first through hole 1131 is larger than the area of the second through hole 1132, and is larger than the area of the third through hole 1133; the area of the second through hole 1132 is equal to the area of the third through hole 1133. In this embodiment, the width direction of each through hole 113 is the X-axis direction shown above, and the length direction of each through hole 113 is the Y-axis direction shown above. "area of part A" refers to the area of the projection of part A on the X-Y plane. The following description of "area" is to be understood as such.

In other embodiments, the area of the first through hole 1131 may also be equal to or smaller than the areas of the second through hole 1132 and the third through hole 1133; the areas of the second through holes 1132 and the third through holes 1133 may not be equal. The shapes of the first through hole 1131, the second through hole 1132 and the third through hole 1133 may also be different, and the shapes of the three may also be a circular hole, a triangular hole, a special-shaped hole, or the like, which is not limited in this application. The number of the through holes 113 may also be two or more, for example, four, five, etc.

In this embodiment, the number of the via holes 114 is three, and the three via holes 114 are a first via hole 1141, a second via hole 1142 and a third via hole 1143, respectively. The first via 1141 is located at one end of the first via 1131, the second via 1142 and the third via 1143 are located at one side of the second via 1132 away from the first via 1131, and the second via 1142 and the third via 1143 are located at two opposite ends of the second via 1132, respectively. In other embodiments, the number of the vias 114 may also be more, for example, four, five, etc., which is not limited in this application.

In this embodiment, the number of the through holes 115 is two, and the two through holes 115 are a first through hole 1151 and a second through hole 1152. The first through hole 1151 and the second through hole 1152 are located on a side of the third through hole 1133 away from the first through hole 1131. The first through hole 1151 is located at an end of the third through hole 1133 close to the first via 1141, and the second through hole 1152 is located at an end of the third through hole 1133 away from the first via 1141. In other embodiments, the number of the perforations 115 may be more, for example, three, four, five, etc., which is not limited in this application.

Referring to fig. 5 and fig. 6, in the present embodiment, the first winding 12 includes a first coil 121 and a second coil (not shown), and the first coil 121 is disposed on the first front surface 111 of the first circuit board 11 and is fixedly connected and electrically connected to the first circuit board 11. The second coil is disposed on the first back surface 112 of the first circuit board 11, and is fixedly connected and electrically connected to the first circuit board 11. The second coil is electrically connected to the first coil 121. Specifically, the second coil is electrically connected to the first coil 121 through the first via 1141. Illustratively, the first coil 121 is a copper foil printed on the first front surface 111, and the second coil is a copper foil printed on the first back surface 112. In other embodiments, the first coil 121 may also be a copper wire printed on the first front surface 111; and/or the second coil may also be a copper wire printed on the first back surface 112. The first coil 121 and the second coil may also be made of other metals or other conductive materials, which is not limited in this application.

In this embodiment, the first coil 121 is disposed around the first through hole 1131. Specifically, the first coil 121 is in a planar spiral shape around the first through hole 1131 and encloses four turns. The first coil 121 includes a first connection end 1211 and a first input end 1212, where the first connection end 1211 is located inside a loop enclosed by the first coil 121, and the first input end 1212 is located outside the loop enclosed by the first coil 121. The first connection end 1211 is located in the first via 1141 and electrically connected to the first via 1141. The first input end 1212 is located in the second via 1142 and electrically connected to the second via 1142. In other embodiments, the first coil 121 may also be disposed around the first through hole 1131 by one turn, two turns, three turns, or more. The first coil 121 may also be disposed around the second through hole 1132 or the third through hole 1133.

In this embodiment, the second coil is disposed around the first through hole 1131. Specifically, the second coil is in a planar spiral shape around the first through hole 1131 and encloses four turns. The second coil comprises a second connecting end and a second input end which are opposite, the second connecting end is located on the inner side of a circle formed by the second coil, and the second input end is located on the outer side of the circle formed by the second coil. The second connection end is located in the first via 1141 and electrically connected to the first via 1141. The second input end is located in the third via 1143 and electrically connected to the third via 1143. In other embodiments, the second coil may also be disposed one, two, three, or more turns around the first via 1131. The second coil may also be disposed around the second via 1132 or the third via 1133. In this embodiment, the second connection end and the first connection end 1211 are electrically connected through the first via 1141, that is, the second coil is electrically connected to the first coil 121 through the first via 1141, so that the first winding 12 surrounds the first via 1131 for eight turns. I.e. the number of turns of the first winding 12 is eight turns.

It should be noted that an insulating layer (not shown) is disposed on the surface of the first coil 121 and the surface of the second coil departing from the first circuit board 11, so as to ensure that the first coil 121 and the second coil are insulated from the outside, prevent the electrical properties of the first coil 121 and the second coil from being affected, and ensure the performance of the electronic device 100. Illustratively, the insulating layer is an insulating tape. In other embodiments, the insulating layer may also be made of an insulating material coating, and the insulating layer may also be an insulating circuit board, which is not limited in this application.

In other embodiments, the first coil 121 and the second coil may be disposed on different circuit boards. For example, the circuit board assembly 10 may further include a third circuit board located between the first circuit board 11 and the second circuit board 13, the first coil 121 is disposed on the first front surface 111 of the first circuit board 11, and the second coil is disposed on a surface of the third circuit board facing toward or away from the first circuit board 11. The first winding may further include a third coil, a fourth coil, and so on, which are not limited in this application.

In the present embodiment, the second circuit board 13 is a rectangular board. The thickness direction of the second circuit board 13 is the first direction (shown as the Z-axis direction), the length direction of the second circuit board 13 is the second direction (shown as the X-axis direction), and the width direction of the second circuit board 13 is the third direction (shown as the Y-axis direction). The area of the second circuit board 13 is equal to the area of the first circuit board 11.

Because the length direction of the second circuit board 13 is parallel to the length direction of the first circuit board 11, and the width direction of the second circuit board 13 is parallel to the width direction of the first circuit board 11, the area of the circuit board assembly 10 is favorably reduced, and the miniaturization design of the electronic device 100 is further favorably realized; in addition, the area of the second circuit board 13 is equal to the area of the first circuit board 11, so that an unnecessary space between the second circuit board 13 and the first circuit board 11 is avoided, the space utilization rate of the circuit board assembly 10 can be effectively improved, the miniaturization design of the circuit board assembly 10 is facilitated, and the miniaturization design of the electronic device 100 is facilitated.

In other embodiments, the length direction of the second circuit board 13 may also be the third direction shown above, and the width direction of the second circuit board 13 may also be the second direction shown above. The area of the second circuit board 13 may also be different from the area of the first circuit board 11, which is not limited in this application.

In this embodiment, the second circuit board 13 includes a second front surface 131 and a second back surface 132. The second front surface 131 is opposite to the second back surface 132. The second front surface 131 faces the first circuit board 11, and the second back surface 132 faces away from the first circuit board 11. The second circuit board 13 is provided with a through hole 133 and a through hole 134. The docking through-hole 133 and the docking through-hole 134 penetrate the second front surface 131 and the second rear surface 132 of the second circuit board 13. The docking through holes 133 and the docking through holes 134 are distributed at intervals and are not limited in number, the docking through holes 133 correspond to the through holes 113, the docking through holes 134 correspond to the through holes 115, and the hole walls of the docking through holes 134 are plated with conductive materials. Illustratively, the conductive material is metallic copper. In other embodiments, the conductive material may be other metals such as aluminum or other conductive materials. In this application, "part A corresponds to part B" means that the projections of part A and part B on the X-Y plane overlap. The following description of "corresponding" is to be understood as such. It should be noted that the docking through hole 133 corresponds to the through hole 113, the docking through hole 134 corresponds to the through hole 115, and the docking through hole 133 of the second circuit board 13 is communicated with the through hole 113 of the first circuit board 11, so that the first magnetic core 20 and the second magnetic core 30 can be fixed; the mating through-hole 134 of the second circuit board 13 corresponds to the through-hole 115 of the first circuit board 11, so that the load module 1000b (shown in fig. 1) can be directly inserted from the first circuit board 11.

In this embodiment, the number of the docking through holes 133 is three, and the three docking through holes 133 are a first pair of through holes 1331, a second pair of through holes 1332, and a third docking through hole 1333, respectively. The first pair of through holes 1331, the second pair of through holes 1332, and the third through hole 1333 are rectangular holes. In the X-axis direction, the first pair of through holes 1331, the second pair of through holes 1332, and the third through holes 1333 are sequentially spaced apart, and the second pair of through holes 1332 and the third through holes 1333 are respectively located at two opposite sides of the first pair of through holes 1331. The second pair of through holes 1332 is located on the side of the first pair of through holes 1331 facing the positive direction of the X-axis, and the third mating through hole 1333 is located on the side of the first pair of through holes 1332 facing the negative direction of the X-axis. The first pair of through holes 1331 corresponds to the first through hole 1131, the second pair of through holes 1332 corresponds to the second through hole 1132, and the third docking through hole 1333 corresponds to the third through hole 1133.

In this embodiment, the width of the first pair of through holes 1331 is greater than the width of the second pair of through holes 1332, and greater than the width of the third docking through hole 1333; the width dimension of the second pair of through holes 1332 is equal to the width dimension of the third mating through hole 1333. The length of the first pair of through holes 1331, the length of the second pair of through holes 1332, and the length of the third mating through hole 1333 are equal. In other words, the area of the first pair of through holes 1331 is greater than the area of the second pair of through holes 1332 and greater than the area of the third docking through holes 1333; the area of the second pair of through holes 1332 is equal to the area of the third docking through hole 1333. In the present embodiment, the width direction of each of the through-holes 133 is the X-axis direction described above, and the length direction of each of the through-holes 133 is the Y-axis direction described above.

In other embodiments, the area of the first pair of through holes 1331 may also be equal to or smaller than the area of the second pair of through holes 1332 and the third docking through holes 1333; the areas of the second pair of through holes 1332 and the third docking through holes 1333 may also be unequal. In other embodiments, the shapes of the first pair of through holes 1331, the second pair of through holes 1332, and the third through hole 1333 may be different, and the shapes of the three through holes may be circular holes, triangular holes, or irregular holes, which is not limited in this application. The number of the docking through-holes 133 may also be two or more, for example, four, five, etc.

In this embodiment, the number of the docking through holes 134 is three, and the three docking through holes 134 are a first docking through hole 1341, a second docking through hole 1342 and a third docking through hole 1343, respectively. The first docking through hole 1341 is located at one end of the third docking through hole 1333, the second docking through hole 1342 and the third docking through hole 1343 are located at one side of the third docking through hole 1333 away from the first docking through hole 1331, and the second docking through hole 1342 and the third docking through hole 1343 are located at two opposite ends of the third docking through hole 1333, respectively.

The first butt-joint through hole 1341 does not correspond to the first via hole 1141; the second butt via 1342 corresponds to the first via 1151 and is electrically connected to the first via 1151; the third through hole 1343 corresponds to the second through hole 1152 and is electrically connected to the second through hole 1152. In other embodiments, the first butt-joint through hole 1341 and the first via 1141 may correspond to each other. The number of the docking through holes 134 may also be more, for example, four, five, etc., which is not limited in the present application.

In the embodiment, the second winding 14 includes a first conductive coil 141 and a second conductive coil (not shown), and the first conductive coil 141 is disposed on the second front surface 131 of the second circuit board 13 and electrically connected to the second circuit board 13. The second conductive ring is disposed on the second back surface 132 of the second circuit board 13 and electrically connected to the second circuit board 13. The second conductive ring is electrically connected to the first conductive ring 141. Specifically, the second conductive ring is electrically connected to the first conductive ring 141 through the first butt via hole 1341. Illustratively, the first conductive loop 141 is a copper foil printed on the second front surface 131, and the second conductive loop is a copper foil printed on the second back surface 132. In other embodiments, the first conductive loop 141 may also be a copper wire printed on the second front surface 131; and/or the second conductive loop may also be a copper wire printed on the second back surface 132. The first conductive ring 141 and the second conductive ring may also be made of other metals or other conductive materials, which is not limited in this application.

In this embodiment, the first conductive ring 141 is disposed around the first pair of via holes 1331. Specifically, the first conductive ring 141 is in a planar spiral shape around the first pair of through holes 1331 and encloses three turns. The first conductive loop 141 includes a first conductive end 1411 and a first output end 1412, where the first conductive end 1411 is located inside a loop formed by the first conductive loop 141, and the first output end 1412 is located outside the loop formed by the first conductive loop 141. The first conductive end 1411 is located at the first butt-joint through hole 1341 and electrically connected to the first butt-joint through hole 1341. The first output terminal 1412 is located at the second docking through hole 1342 and electrically connected to the second docking through hole 1342. In other embodiments, the first conductive loop 141 may also be disposed around the first pair of via holes 1331 by one, two, or more turns. The first conductive loop 141 may also be disposed around the second pair of via holes 1332 or the third mating through hole 1333.

In this embodiment, the second conductive loop is disposed around the first pair of via holes 1331. Specifically, the second conductive loop is in a planar spiral shape around the first pair of through holes 1331 and encloses three loops. The second conductive ring comprises a second conductive end and a second output end which are opposite, the second conductive end is positioned on the inner side of the ring surrounded by the second conductive ring, and the second output end is positioned on the outer side of the ring surrounded by the second conductive ring. The second conductive end is located at the first butt-joint through hole 1341 and electrically connected to the first butt-joint through hole 1341. The second output end is located at the third docking through hole 1343 and electrically connected to the third docking through hole 1343. In other embodiments, the second conductive loop may also be disposed one, two, or more turns around the first pair of via holes 1331. A second conductive loop may also be disposed around the second pair of via holes 1332 or the third mating through hole 1333. In this embodiment, the second conductive end and the first conductive end 1411 are electrically connected through the first butt via hole 1341, that is, the second conductive ring is electrically connected with the first conductive ring 141 through the first butt via hole 1341, so that the second winding 14 surrounds the first pair of through holes 1331 for six turns. I.e. the number of turns of the second winding 14 is six.

It should be noted that an insulating layer (not shown) is disposed on the surface of the first conductive ring 141 and the surface of the second conductive ring away from the second circuit board 13 to ensure that the first conductive ring 141 and the second conductive ring are insulated from the outside, so as to prevent the electrical properties of the first conductive ring 141 and the second conductive ring from being affected and ensure the performance of the electronic device 100. Illustratively, the insulating layer is an insulating tape. In other embodiments, the insulating layer may also be made of an insulating material coating, and the insulating layer may also be an insulating circuit board, which is not limited in this application.

In other embodiments, the first conductive ring 141 and the second conductive ring may be disposed on different circuit boards. For example, the circuit board assembly 10 may further include a fourth circuit board located between the first circuit board 11 and the second circuit board 13, the first conductive ring 141 is disposed on the second front surface 131 of the second circuit board 13, and the second conductive ring is disposed on a surface of the fourth circuit board facing toward or away from the second circuit board 13. The second winding may further include a third conductive loop, a fourth conductive loop, and other more conductive loops, which are not limited in this application.

In this embodiment, two output terminals of the external power source 2000 (shown in fig. 1) are electrically connected to the second via 1142 and the third via 1143, respectively, so that the external power source 2000 is electrically connected to the first winding 12. The two input terminals of the load module 1000b are electrically connected to the first through hole 1151 and the second through hole 1152, respectively, and the load module 1000b is electrically connected to the second winding 14 through the electrical connection between the first through hole 1151 and the second through hole 1342 and the electrical connection between the second through hole 1152 and the third through hole 1343. The ac power output by the external power source 2000 can be transmitted to the first winding 12, and through the coupling between the first winding 12 and the second winding 14, the second winding 14 can output the ac power after voltage reduction and conversion to the load module 1000b, so as to enable the load module 1000b to work.

Referring to fig. 7 to 9, fig. 7 is a schematic perspective view of the first magnetic core 20, the heat spreader 40 and the adhesive member 50 of the electronic device 100 in fig. 5, fig. 8 is a sectional view of the electronic device 100 (omitting the second magnetic core 30 and the heat conducting member 60) in fig. 2 along the line III-III, and fig. 9 is an exploded schematic structural view of the electronic device 100 (omitting the second magnetic core 30, the adhesive member 50 and the heat conducting member 60) in fig. 2 along the sectional view of the line III-III.

The first magnetic core 20 is inserted into the circuit board assembly 10 and is fixedly connected to the circuit board assembly 10. Specifically, the first magnetic core 20 is inserted into the second circuit board 13 through the docking through hole 133, and is fixedly connected to the second circuit board 13. In the present embodiment, the first core 20 is made of ferrite material. In other embodiments, the first magnetic core 20 may be made of other magnetic materials, which is not limited in this application.

Referring to fig. 7, the first magnetic core 20 includes a first main body 21 and a connecting body 22. The connecting body 22 is convexly disposed on a side surface of the first main body 21 and extends toward the positive direction of the Z-axis. The first body 21 and the connecting body 22 can be integrally formed, so as to simplify the manufacturing process of the first magnetic core 20 and ensure the overall strength of the first magnetic core 20.

In this embodiment, the first body 21 includes a first surface 211 and a second surface 212. The first surface 211 is disposed opposite the second surface 212. Specifically, the first surface 211 faces the positive Z-axis direction, and the second surface 212 faces the negative Z-axis direction. In this embodiment, the first body 21 is a rectangular block. In other embodiments, the first body 21 may also be a cylinder or a profile body, etc.

In this embodiment, the number of the connection bodies 22 is three, and the three connection bodies 22 are the first connection body 221, the second connection body 222, and the third connection body 223, respectively. The first connecting body 221, the second connecting body 222 and the third connecting body 223 are all block bodies. The first connecting body 221, the second connecting body 222 and the third connecting body 223 are protruded on the first surface 211 of the first body 21 along the Z-axis direction, and are sequentially spaced along the X-axis direction. The second connecting body 222 and the third connecting body 223 are located on two opposite sides of the first connecting body 221. The first connecting body 221 is for insertion into the first pair of through holes 1331. The second connector 222 is inserted into the second pair of through holes 1332. The third connecting body 223 is adapted to be inserted into the third mating through hole 1333.

Specifically, along the X-axis direction, the first connecting body 221 is protruded at the middle portion of the first main body 21, and the second connecting body 222 and the third connecting body 223 are protruded at the opposite end portions of the first main body 21, so as to ensure that the first main body 21 is stressed uniformly and improve the overall strength of the first magnetic core 20. In other words, the cross-sectional shape of the first magnetic core 20 is E-shaped, so that the structure is simple, the processing is easy, and the processing cost is low; moreover, the entire electronic device is flat, and the height dimension (i.e., the dimension in the Z-axis direction) is small, which is advantageous for the compact design of the electronic device 100 (shown in fig. 1). In the present application, "the cross-sectional shape of the component a" refers to the shape of the projection of the component a on the X-Z plane, and the following description of the "cross-sectional shape" is equally understood.

In other embodiments, the first connecting body 221, the second connecting body 222, and the third connecting body 223 may also be cylinders or profiles, which is not limited in this application. The number of connectors 22 may also be two, four or more.

In this embodiment, the height of the first connecting body 221 is greater than the height of the second connecting body 222 and greater than the height of the third connecting body 223; the second connection body 222 and the third connection body 223 have the same height dimension. The width dimension of the first connection body 221 is greater than the width dimension of the second connection body 222 and greater than the width dimension of the third connection body 223; the second connection body 222 and the third connection body 223 have the same width. The length dimensions of the first connecting body 221, the second connecting body 222 and the third connecting body 223 are all equal to the width dimension of the first main body 21, which is beneficial to reducing the size of the first magnetic core 20 and the miniaturization design of the first magnetic core 20. In the present embodiment, the width direction of each connecting body 22 is the X-axis direction, the length direction is the Y-axis direction, and the height direction is the Z-axis direction. The width direction of the first body 21 is the Y-axis direction shown above.

In other embodiments, the height dimensions of the first connecting body 221, the second connecting body 222 and the third connecting body 223 may be equal or unequal. The width dimensions of the first, second and

third connection bodies

221, 222 and 223 may be equal or unequal. The length of the first connecting body 221, the second connecting body 222, and the third connecting body 223 may not be equal to the width of the first body 21.

Referring to fig. 7 and 8, the heat sink 40 is located between the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, and is in contact with the first main body 21 and the second circuit board 13. Specifically, the heat sink 40 is located between the first surface 211 of the first body 21 and the second back surface 132 of the second circuit board 13, and is in contact with the first surface 211 and the second back surface 132. The first magnetic core 20 is fixedly connected to the second circuit board 13 through the heat sink 40. Wherein, the heat sink 40 is disposed on the first surface 211 of the first body 21.

In this embodiment, the heat dissipation member 40 is black glue, specifically, epoxy resin glue, which has good thermal conductivity and adhesiveness. The heat sink 40 is formed on the first surface 211 in a melted state, and is solidified after the first magnetic core 20 is assembled with the second circuit board 13. The first magnetic core 20 and the second circuit board 13 are fixedly connected by the adhesion of the heat sink 40.

Since the heat sink 40 has good thermal conductivity, it can rapidly absorb heat generated when the circuit board assembly 10 operates, thereby ensuring rapid heat dissipation of the circuit board assembly 10. The heat dissipation member 40 is designed to reduce the thermal contact resistance between the first magnetic core 20 and the second circuit board 13, and a part of heat generated during the operation of the circuit board assembly 10 can be conducted to the first magnetic core 20 through the heat dissipation member 40 and conducted to the outside through the first magnetic core 20; another part of the heat may be directly conducted to the outside through absorption by the heat sink 40. The heat sink 40 may be formed on the first surface 211 of the first body 21 by welding or fusing, etc. In other embodiments, the heat dissipation member 40 may also be formed on the second back surface 132 of the second circuit board 13, the heat dissipation member 40 is formed on the second back surface 132 in a molten state, and after the first magnetic core 20 is assembled with the second circuit board 13 and then solidified, the first magnetic core 20 and the circuit board assembly 10 may also be fixedly connected by the adhesion of the heat dissipation member 40.

In other embodiments, the heat dissipation member 40 may be other adhesive with viscosity, good thermal conductivity and reflow resistance; alternatively, the heat dissipation pad may have good thermal conductivity, two sides of the heat dissipation pad are coated with an adhesive, and the first magnetic core 20 is fixedly connected to the circuit board assembly 10 through the heat dissipation pad coated with the adhesive on two sides, which is not limited in this application.

In the present embodiment, the number of the heat dissipation elements 40 is two, and the two heat dissipation elements 40 are the first heat dissipation element 41 and the second heat dissipation element 42, respectively. The first heat dissipation member 41 and the second heat dissipation member 42 are rectangular blocks. In other embodiments, the first heat dissipation element 41 and the second heat dissipation element 42 may also be cylinders or profiles. In the present embodiment, the width direction of each heat dissipation element 40 is the X-axis direction, the length direction is the Y-axis direction, and the height direction is the Z-axis direction.

In this embodiment, the first heat dissipation element 41 is disposed on the first surface 211 and between the first connector 221 and the second connector 222. Wherein, the opposite ends of the first heat sink 41 are respectively abutted with the first connector 221 and the second connector 222; the length dimension of the first heat sink 41 is equal to the width dimension of the first body 21. In this way, the first heat dissipation member 41 has a larger contact area with the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, so that not only the strength of the fixed connection between the first heat dissipation member 41 and the first magnetic core 20 is ensured, but also the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the first heat dissipation member 41 is ensured. In addition, since the first heat dissipation member 41 has thermal conductivity, it is also advantageous for the first heat dissipation member 41 to quickly dissipate heat from the circuit board assembly 10 and the first magnetic core 20.

In other embodiments, the opposite ends of the first heat sink 41 may not abut against the first connector 221 and the second connector 222, that is, a gap may exist between the opposite ends of the first heat sink 41 and the first connector 221 and the second connector 222. The length dimension of the first heat sink 41 may not be equal to the width dimension of the first body 21.

In this embodiment, the second heat dissipation element 42 is disposed on the first surface 211 and between the first connector 221 and the third connector 223. Wherein, the opposite ends of the second heat sink 42 are respectively abutted against the first connector 221 and the third connector 223; the length dimension of the second heat sink 42 is equal to the width dimension of the first body 21. In this way, the second heat dissipation member 42 and the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10 have a larger contact area therebetween, which not only ensures the strength of the fixed connection between the second heat dissipation member 42 and the first magnetic core 20, but also ensures the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the second heat dissipation member 42, and further ensures the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the heat dissipation member 40. In addition, since the second heat dissipation member 42 has thermal conductivity, it is also advantageous for the second heat dissipation member 42 to quickly dissipate heat from the circuit board assembly 10 and the first magnetic core 20.

In other embodiments, the opposite ends of the second heat sink 42 may not abut against the first connector 221 and the third connector 223, that is, a gap may exist between the opposite ends of the second heat sink 42 and the first connector 221 and the third connector 223. The length dimension of the second heat sink 42 may not be equal to the width dimension of the first body 21.

In the present embodiment, the height dimensions of the first heat dissipation element 41 and the second heat dissipation element 42 are equal. The height direction of the heat sink 40 refers to the Z-axis direction shown above. In the Z-axis direction, the difference between the height dimension of the first connector 221 of the first magnetic core 20 minus the height dimension of the first heat sink 41 (or the second heat sink 42) is larger than the depth dimension of the first pair of through holes 1331; the difference of the height dimension of the second connector 222 minus the height dimension of the first heat sink 41 is smaller than the depth dimension of the second pair of through holes 1332; the difference between the height dimension of the third connecting body 223 minus the height dimension of the second heat dissipation member 42 is smaller than the thickness dimension of the second circuit board 13, that is, smaller than the depth dimension of the third mating through hole 1333.

In other embodiments, the difference of the height dimension of the first connector body 221 minus the height dimension of the first heat sink 41 (or the second heat sink 42) may also be equal to or less than the depth dimension of the first pair of through holes 1331; the difference between the height dimension of the second connector 222 minus the height dimension of the first heat dissipation element 41 may also be equal to or greater than the depth dimension of the second pair of through holes 1332; the difference of the height dimension of third connecting body 223 minus the height dimension of second heat dissipation member 42 may also be equal to or greater than the depth dimension of third docking through-hole 1333.

Referring to fig. 8 and 9, in the present embodiment, along the Z-axis direction, the first magnetic core 20 is mounted on the second circuit board 13 from the second back surface 132 of the second circuit board 13, specifically, the first connecting body 221 of the first magnetic core 20 is inserted into the first pair of through holes 1331 of the second circuit board 13; meanwhile, the second connection body 222 of the first magnetic core 20 is inserted into the second pair of through holes 1332 of the second circuit board 13, and the third connection body 223 of the first magnetic core 20 is inserted into the third pair of through holes 1333 of the second circuit board 13; until the first heat sink 41 and the second heat sink 42 provided on the first body 21 are brought into contact with and bonded to the second back surface 132 of the second circuit board 13. The first magnetic core 20 is fixedly connected to the second circuit board 13, i.e., to the circuit board assembly 10, via the heat sink 40. The first magnetic core 20 is fixedly connected with the second circuit board 13 through the heat dissipation member 40, that is, fixedly connected with the circuit board assembly 10, the connection is stable, the structure is simple, the cost is low, and the overall structural stability of the electronic device 100 (as shown in fig. 1) is improved.

At this time, the first connector 221 passes through the first mating through hole 1331 and extends into the first through hole 1131 of the first circuit board 11; the second connection body 222 is fixed in the second pair of through holes 1332 and does not extend into the second through hole 1132 of the first circuit board 11; the third connecting body 223 is fixed in the third docking through hole 1333 and does not extend into the third through hole 1133 of the first circuit board 11. The second winding 14 (shown in fig. 5) surrounds the first connection body 221 of the first magnetic core 20.

Since the heat dissipation members 40 have good thermal conductivity, and two opposite ends of each heat dissipation member 40 (i.e., two opposite portions of each heat dissipation member 40 along the Y-axis direction) are exposed to the outside, the heat dissipation members 40 can rapidly absorb and conduct a large amount of heat generated by the circuit board assembly 10 and the first magnetic core 20 during operation to the outside; the heat dissipation member 40 is designed to reduce the thermal contact resistance between the first magnetic core 20 and the second circuit board 13, and a part of heat generated during the operation of the circuit board assembly 10 can be conducted to the first magnetic core 20 through the heat dissipation member 40 and conducted to the outside through the first magnetic core 20; another part of the heat may be absorbed by the heat sink 40 and directly conducted to the outside. The rapid heat dissipation of the circuit board assembly 10 and the first magnetic core 20 is ensured, the damage of the circuit board assembly 10 and the first magnetic core 20 due to heat accumulation is avoided, the service lives of the circuit board assembly 10 and the first magnetic core 20 are prolonged, and the service life of the electronic device 100 (shown in fig. 1) is further prolonged.

In this embodiment, after the first circuit board 11 and the second circuit board 13 are stacked, the through hole 113 of the first circuit board 11 is in butt communication with the butt through hole 133 of the second circuit board 13, the first magnetic core 20 is mounted on the second circuit board 13, and finally the second magnetic core 30 (shown in fig. 3) is mounted on the first circuit board 11. In addition, the adhesive 50 is located in the through hole 113 of the first circuit board 11 or at a connection position of the butting through hole 133 and the through hole 113. In other embodiments, the adhesive member 50 may also be located in the docking through hole 133 of the second circuit board 13.

Referring to fig. 4 and 10, fig. 10 is a schematic perspective view of the second magnetic core 30 and the heat conducting element 60 of the electronic device 100 in fig. 1.

The second magnetic core 30 is inserted into the circuit board assembly 10 and is fixedly connected to the first magnetic core 20. Specifically, the second core 30 is inserted into the first circuit board 11 through the through hole 113, and is fixedly connected to the first core 20. In the present embodiment, the second core 30 is made of ferrite material. In other embodiments, the second magnetic core 30 may be made of other magnetic materials, which is not limited in this application.

Referring to fig. 10 and 11, fig. 11 is a schematic structural view of the second magnetic core 30 in fig. 10 at another angle.

The second core 30 includes a second body 31 and a fixing body 32. The fixing body 32 is protruded from one side surface of the second body 31 and extends toward the negative direction of the Z-axis. The second body 31 and the fixing body 32 may be integrally formed, so as to simplify the manufacturing process of the second magnetic core 30 and ensure the overall strength of the second magnetic core 30.

The second body 31 includes a first end surface 311 and a second end surface 312. The first end surface 311 is opposite to the second end surface 312 along the Z-axis direction. Specifically, the first end surface 311 faces the negative Z-axis direction, and the second end surface 312 faces the positive Z-axis direction. I.e., the first end face 311 faces the first circuit board 11 of the circuit board assembly 10 (as shown in fig. 3), and the second end face 312 faces away from the first circuit board 11 of the circuit board assembly 10. In this embodiment, the second body 31 is a rectangular block. In other embodiments, the second body 31 may also be a cylinder or a profile body, etc.

In this embodiment, the number of the fixing bodies 32 is three, and the three fixing bodies 32 are respectively a first fixing body 321, a second fixing body 322 and a third fixing body 323. The first fixing body 321, the second fixing body 322 and the third fixing body 323 are rectangular blocks. The first fixing body 321, the second fixing body 322, and the third fixing body 323 are protruded on the first end surface 311 of the second body 31 along the Z-axis direction, and are sequentially spaced along the X-axis direction. The second fixing body 322 and the third fixing body 323 are located at two opposite sides of the first fixing body 321. The first fixing body 321 is inserted into the first through hole 1131 of the first circuit board 11 (shown in fig. 4). The second fixing body 322 is configured to be inserted into the second through hole 1132 of the first circuit board 11. The third fixing body 323 is for insertion into the third through hole 1133 of the first circuit board 11. Specifically, along the X-axis direction, the first fixing body 321 is convexly disposed at the middle portion of the second main body 31, and the second fixing body 322 and the third fixing body 323 are convexly disposed at the two opposite end portions of the second main body 31, so as to ensure that the stress of the second main body 31 is uniform, and improve the overall strength of the second magnetic core 30. In other words, the cross-sectional shape of the second magnetic core 30 is E-shaped, so that the structure is simple, the processing is easy, and the processing cost is low; moreover, the entire electronic device is flat, and the height dimension (i.e., the dimension in the Z-axis direction) is small, which is advantageous for the compact design of the electronic device 100 (shown in fig. 1).

In other embodiments, the first fixing body 321, the second fixing body 322, and the third fixing body 323 may also be a column, a square column, or a special-shaped body, which is not limited in this application. The number of the fixing bodies 32 may also be two, four or more.

In this embodiment, the height of the first fixing body 321 is smaller than the height of the second fixing body 322 and smaller than the height of the third fixing body 323; the second fixing body 322 and the third fixing body 323 have the same height dimension. The width dimension of the first fixing body 321 is greater than the width dimension of the second fixing body 322 and greater than the width dimension of the third fixing body 323; the second fixing body 322 and the third fixing body 323 have the same width dimension. The length dimensions of the first fixing body 321, the second fixing body 322 and the third fixing body 323 are all equal to the width dimension of the second body 31, which is beneficial to reducing the size of the second magnetic core 30 and the miniaturization design of the second magnetic core 30. In the present embodiment, the width direction of each fixing body 32 is the X-axis direction, the length direction is the Y-axis direction, and the height direction is the Z-axis direction. The width direction of the second body 31 is the Y-axis direction shown above.

In other embodiments, the height dimensions of the first fixing body 321, the second fixing body 322 and the third fixing body 323 may be equal or unequal. The first fixing body 321, the second fixing body 322, and the third fixing body 323 may have equal or unequal width dimensions. The length dimensions of the first fixing body 321, the second fixing body 322, and the third fixing body 323 may not be equal to the width dimension of the second body 31.

Furthermore, the second magnetic core 30 is provided with a recess 33. In particular, the second body 31 is provided with the above-indicated recess 33. The groove 33 is recessed on the first end surface 311, the groove 33 has an opening on the first end surface 311, and the groove 33 penetrates through two opposite side surfaces of the second body 31 along the Y-axis direction. In other embodiments, the groove 33 may not penetrate through two opposite sides of the second body 31 along the Y-axis direction.

Referring to fig. 11 and 12, fig. 12 is an enlarged view of a XII portion of the second core 30 in fig. 11.

In the present embodiment, the number of the grooves 33 is fourteen. The fourteen slots 33 are seven first slots 331 and seven second slots 332, respectively. Seven first grooves 331 are located between the first fixing body 321 and the second fixing body 322, and are spaced apart along the X-axis direction. Each of the first recesses 331 has a rectangular sectional shape. In the X-axis direction, the width dimension (as shown in a1) of the opening of each first indentation 331 is smaller than the distance (as shown in a2) between the first indentation 331 and the adjacent first indentation 331. In other embodiments, the width dimension a1 of the opening of each first indentation 331 along the X-axis direction may be greater than or equal to the distance a2 between the first indentation 331 and the adjacent first indentation 331.

In this embodiment, in the X-axis direction, the opening width dimensions a1 of the seven first grooves 331 are all equal, the distance a2 between each first groove 331 and the adjacent first groove 331 is all equal, and the seven first grooves 331 are uniformly distributed between the first fixing body 321 and the second fixing body 322, so that the stress is uniform, which is beneficial to improving the overall strength of the second magnetic core 30. In other embodiments, the width dimensions a1 of the openings of the seven first recesses 331 may not be equal to each other along the X-axis direction, and the distances a2 between each first recess 331 and its adjacent first recess 331 may not be equal to each other. The number of the first recesses 331 may also be two, three, four, five, six or more, for example, eight, nine, etc., which is not limited in the present application.

In this embodiment, seven second grooves 332 are located between the first fixing body 321 and the third fixing body 323 and are spaced apart in the X-axis direction. Each of the second grooves 332 has a rectangular sectional shape. The width dimension of the opening of each second groove 332 in the X-axis direction is smaller than the distance between the second groove 332 and the second groove 332 adjacent thereto. In other embodiments, the width dimension of the opening of each second groove 332 along the X-axis direction may also be greater than or equal to the distance between the second groove 332 and the adjacent second groove 332.

In this embodiment, the openings of the seven second grooves 332 have equal width, the distance between each second groove 332 and the adjacent second groove 332 is equal, and the seven second grooves 332 are uniformly distributed between the first fixing body 321 and the third fixing body 323, so that the stress is uniform, and the improvement of the overall strength of the second magnetic core 30 is facilitated. In other embodiments, the width dimensions of the openings of the second grooves 332 may not be equal, and the distance between each second groove 332 and the adjacent second groove 332 may not be equal. The number of the second grooves 332 may also be two, three, four, five, six or more, for example, eight, nine, etc., which is not limited in the present application.

In the present embodiment, the cross-sectional shapes of the seven first grooves 331 and the seven second grooves 332 are all rectangular, that is, the cross-sectional shape of each groove 33 is rectangular. In other embodiments, the cross-sectional shapes of the seven first grooves 331 and the seven second grooves 332 may be different. The cross-sectional shape of the groove 33 may be other shapes, and reference is made to some embodiments provided in the examples of the present application.

Referring to fig. 13 to 17, fig. 13 is an enlarged view of another embodiment of a XII portion of the second core 30 in fig. 11, fig. 14 is an enlarged view of another embodiment of a XII portion of the second core 30 in fig. 11, fig. 15 is an enlarged view of another embodiment of a XII portion of the second core 30 in fig. 11, fig. 16 is an enlarged view of another embodiment of a XII portion of the second core 30 in fig. 11, and fig. 17 is an enlarged view of another embodiment of a XII portion of the second core 30 in fig. 11.

As shown in fig. 13, in the embodiment shown in fig. 13, the sectional shape of the groove 33 may also be triangular. As shown in fig. 14 and 15, the cross-sectional shape of the groove 33 may be an arc-like projection. Specifically, in the embodiment shown in fig. 14, the sectional shape of the groove 33 is a semicircle; in the embodiment shown in fig. 15, the cross-sectional shape of the groove 33 is a semi-elliptical shape. As shown in fig. 16 and 17, the cross-sectional shape of the groove 33 may be trapezoidal. In other embodiments, the cross-sectional shape of the groove 33 may be other regular patterns or irregular patterns, which is not specifically limited in the present application.

In addition, referring to fig. 3, 4 and 7, the adhesive member 50 is located between the first magnetic core 20 and the second magnetic core 30. Specifically, the adhesive 50 is located between the connection body 22 of the first magnetic core 20 and the fixed body 32 of the second magnetic core 30. The fixed body 32 is fixedly connected to the connecting body 22 by the adhesive 50, that is, the second magnetic core 30 is fixedly connected to the first magnetic core 20 by the adhesive 50.

In this embodiment, the adhesive 50 is specifically an epoxy resin adhesive having adhesiveness. The adhesive 50 is formed in a molten state on an end surface of the connecting body 22 facing away from the first body 21, and is solidified after the first and second

magnetic cores

20 and 30 are assembled. The first magnetic core 20 and the second magnetic core 30 are fixedly connected by the adhesion of the adhesive member 50. The adhesive member 50 may be formed on an end surface of the connection body 22 facing away from the first body 21 by welding or fusing.

In other embodiments, the adhesive member 50 may also be formed on an end surface of the fixing body 32 facing away from the second main body 31, for example, a double-sided tape is disposed on an end surface of the fixing body 32 facing away from the second main body 31, and the fixing connection between the fixing body 32 and the connection body 22 is realized by the double-sided tape. In other embodiments, the adhesive 50 may be other adhesive and reflow-resistant glue, which is not limited in this application.

In this embodiment, the number of the adhesive members 50 is three, and the adhesive members are a first adhesive member 51, a second adhesive member 52, and a third adhesive member 53, and the first adhesive member 51, the second adhesive member 52, and the third adhesive member 53 are sequentially provided at intervals. The first adhesive 51 is formed on an end surface of the first connecting body 221 away from the first main body 21, and specifically, the first adhesive 51 in a molten state is injected into the first through hole 1131. The first adhesive member 51 is used to fixedly connect the first connecting body 221 and the first fixing body 321. The second adhesive member 52 is formed on an end surface of the second connection body 222 away from the first body 21, and is specifically made by injecting the second adhesive member 52 in a molten state into the second through hole 1132. The second adhesive member 52 is used to fixedly connect the second connection body 222 and the second fixed body 322. The third adhesive 53 is formed on a surface of the third connecting body 223 away from the first main body 21, and is specifically made by injecting the molten third adhesive 53 into the third through hole 1133. The third adhesive member 53 is used to fixedly connect the third connecting body 223 and the third fixed body 323.

In this embodiment, the first adhesive member 51, the second adhesive member 52, and the third adhesive member 53 are rectangular blocks. The area of the first adhesive member 51 is equal to the area of the end surface of the first connecting body 221 facing away from the first body 21, the area of the second adhesive member 52 is equal to the area of the end surface of the second connecting body 222 facing away from the first body 21, and the area of the third adhesive member 53 is equal to the area of the end surface of the third connecting body 223 facing away from the first body 21. Thus, the first adhesive member 51, the first magnetic core 20 and the second magnetic core 30 have a large contact area, the second adhesive member 52, the first magnetic core 20 and the second magnetic core 30 have a large contact area, and the third adhesive member 53, the first magnetic core 20 and the second magnetic core 30 have a large contact area. In this way, not only the strength of the fixed connection between the first adhesive material 51, the second adhesive material 52, and the third adhesive material 53 and the first magnetic core 20, but also the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 via the adhesive material 50 are ensured. In addition, since the adhesive member 50 has thermal conductivity, it is also advantageous for the adhesive member 50 to rapidly dissipate heat from the first and second

magnetic cores

20 and 30.

In other embodiments, the area of the first adhesive member 51 may not be equal to the area of the end surface of the first connecting body 221 facing away from the first main body 21, the area of the second adhesive member 52 may not be equal to the area of the end surface of the second connecting body 222 facing away from the first main body 21, and the area of the third adhesive member 53 may not be equal to the area of the end surface of the third connecting body 223 facing away from the first main body 21. The first adhesive member 51, the second adhesive member 52, and the third adhesive member 53 may be columns, irregular bodies, or the like.

In the present embodiment, after the first magnetic core 20 is mounted on the first circuit board 11, the adhesive 50 is formed on the connecting body 22 of the first magnetic core 20. In other embodiments, the first magnetic core 20 may be mounted on the first circuit board 11 after the adhesive member 50 is formed on the connecting body 22 of the first magnetic core 20.

Referring to fig. 3 and fig. 4, in the embodiment, in the Z-axis direction, the second magnetic core 30 is mounted on the first circuit board 11 from the first front surface 111 of the first circuit board 11, specifically, the first fixing body 321 of the second magnetic core 30 is inserted into the first through hole 1131 of the first circuit board 11 and is adhered to the first adhesive member 51 of the first connecting body 221 disposed on the first magnetic core 20, the first fixing body 321 is fixedly connected to the first connecting body 221 through the first adhesive member 51, and at this time, the first adhesive member 51 is located in the first through hole 1131; meanwhile, the second fixing body 322 of the second magnetic core 30 is inserted into the second through hole 1132 of the first circuit board 11, and is bonded to the second adhesive member 52 of the second connection body 222 disposed on the first magnetic core 20, and the second fixing body 322 is fixedly connected to the second connection body 222 through the second adhesive member 52, at this time, the second adhesive member 52 is located at a connection position between the second through hole 1132 and the second pair of through holes 1332; the third fixing body 323 of the second magnetic core 30 is inserted into the third through hole 1133 of the first circuit board 11, and is bonded to the third adhesive member 53 of the third connecting body 223 disposed on the first magnetic core 20, the third fixing body 323 is fixedly connected to the third connecting body 223 through the third adhesive member 53, at this time, the third adhesive member 53 is located at the connection position between the third through hole 1133 and the third docking through hole 1333, so that the second magnetic core 30 is fixedly connected to the first magnetic core 20 through the adhesive member 50, the connection is stable, the structure is simple, the cost is low, and the stability of the overall structure of the electronic device 100 is improved.

The second magnetic core 30 is fixed to the circuit board assembly 10 through the first magnetic core 20, and the first fixing body 321 is fixed in the first through hole 1131 and does not extend into the first pair of through holes 1331 of the second circuit board 13; the second fixing body 322 is fixed in the second through hole 1132, and does not extend into the second pair of through holes 1332 of the second circuit board 13; the third fixing body 323 is fixed in the third through hole 1133 and does not extend into the third through hole 1333 of the second circuit board 13. At this time, there is a gap between the second body 31 and the first circuit board 11, the first winding 12 (shown in fig. 5) surrounds the first connection body 221 of the first magnetic core 20 and the first fixing body 321 of the second magnetic core 30, and the second winding 14 surrounds the first connection body 221 of the first magnetic core 20.

Referring to fig. 3 and 5, when the ac power outputted from the external power source 2000 (shown in fig. 1) is transmitted to the first winding 12, the first connecting body 221 of the first magnetic core 20 and the first fixing body 321 of the second magnetic core 30 generate an alternating magnetic field according to the principle of electromagnetic induction; the second winding 14 of the first connection body 221 surrounding the first magnetic core 20 may output an alternating current to the load module 1000 b. In this embodiment, since the number of turns (six turns) of the second winding 14 is smaller than the number of turns (eight turns) of the first winding 12, and the ac voltage output by the second winding 14 is smaller than the ac voltage received by the first winding 12 (i.e., the ac voltage output by the external power supply 2000), the ac output by the external power supply 2000 can be subjected to voltage reduction conversion processing through the coupling between the first winding 12 and the second winding 14, so as to enable the load module 1000b to operate. That is, the electronic device 100 may perform voltage-reducing conversion processing on the ac power output by the external power supply 2000, and transmit the ac power to the load module 1000b, so as to operate the load module 1000 b.

Referring to fig. 3 and 10, the heat conducting element 60 is located between the second main body 31 of the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, and is in contact with the second main body 31 and the first circuit board 11. Specifically, the heat conduction member 60 is sandwiched between the first end surface 311 of the second body 31 and the first front surface 111 of the first circuit board 11. Wherein the heat-conducting member 60 is disposed on the first end surface 311 of the second body 31.

In the present embodiment, the heat conducting member 60 is a compression material with good thermal conductivity, specifically a heat conducting gasket, which has good thermal conductivity, is sticky, and is easily compressed and deformed. The thermal conductive member 60 is adhered to the first end surface 311, after the first magnetic core 20 and the second magnetic core 30 are assembled, the thermal conductive member 60 is adhered to the first front surface 111 of the first circuit board 11, and the thermal conductive member 60 is sandwiched between the first end surface 311 and the first front surface 111. Since the heat conducting member 60 is easily compressed and deformed, the second magnetic core 30 can press the heat conducting member 60 to be compressed and deformed, so as to ensure that the heat conducting member 60 is completely contacted with the first end surface 311 and the first front surface 111, i.e. no gap exists between the heat conducting member 60 and the first end surface 311 and the first front surface 111, and ensure that the heat conducting member 60 has a larger contact area with the first end surface 311 and the first front surface 111. It should be noted that the thermal conductive member 60 is easily compressed and deformed, and the resilience force of the deformed thermal conductive member is small, so that the second main body 31 of the second magnetic core 30 and the first circuit board 11 are not affected. The thermal expansion coefficient of the thermal conductive member 60 is located between the second main body 31 of the second magnetic core 30 and the first circuit board 11, so that the second main body 31 of the second magnetic core 30 and the first circuit board 11 are not damaged after being heated.

Since the heat conducting member 60 has good thermal conductivity, it can quickly absorb and conduct heat generated by the circuit board assembly 10 and the second magnetic core 30 during operation to the outside, thereby ensuring quick heat dissipation of the circuit board assembly 10 and the second magnetic core 30. The design of the heat conducting member 60 reduces the thermal contact resistance between the second magnetic core 30 and the first circuit board 11, and a part of heat generated by the circuit board assembly 10 during operation can be quickly conducted to the second magnetic core 30 through the heat conducting member 60 and conducted to the outside through the second magnetic core 30; another part of the heat may be directly conducted to the outside by the absorption of the heat conductive member 60. In addition, since the thermal conductive member 60 has viscosity, the second magnetic core 30 can be fixedly connected to the circuit board assembly 10 by the viscosity of the thermal conductive member 60, thereby enhancing the structural stability of the electronic device 100. In addition, since there is no gap between the heat conducting member 60 and the first end surface 311 and the first front surface 111, it is ensured that the heat conducting member 60 and the first end surface 311 and the first front surface 111 both have a larger contact area, which is beneficial to improving the heat dissipation efficiency of the circuit board assembly 10 and the second magnetic core 30.

In other embodiments, the heat conducting member 60 may also be a colloid with viscosity and good thermal conductivity, such as a heat conducting silicone; or other soft or compressible materials with good thermal conductivity. The thermal conductive member 60 may also be filled between the first end surface 311 of the second magnetic core 30 and the first front surface 111 of the first circuit board 11 by injection or the like, which is not limited in the present application.

In this embodiment, after the heat conducting member 60 is disposed on the first end surface 311 of the second magnetic core 30, the second magnetic core 30 is fixedly connected to the first magnetic core 20, so that the heat conducting member 60 is sandwiched between the first end surface 311 of the second magnetic core 30 and the first front surface 111 of the first circuit board 11. In other embodiments, after the heat conducting member 60 is disposed on the first front surface 111 of the first circuit board 11, the second magnetic core 30 and the first magnetic core 20 are fixedly connected, so that the heat conducting member 60 is clamped between the first end surface 311 of the second magnetic core 30 and the first front surface 111 of the first circuit board 11.

Referring to fig. 4 and 18, in the present embodiment, the number of the heat-conducting members 60 is twelve, and the twelve heat-conducting members 60 are six first heat-conducting members 61 and six second heat-conducting members 62, respectively. The first heat-conducting member 61 and the second heat-conducting member 62 are rectangular blocks. In other embodiments, the first heat conduction member 61 and the second heat conduction member 62 may also be cylinders or shaped bodies, and the shapes of the six first heat conduction members 61 and the six second heat conduction members 62 may also be different, which is not limited in this application. In this embodiment, the width direction of each heat-conducting member 60 is the X-axis direction, the length direction is the Y-axis direction, and the thickness direction is the Z-axis direction.

In this embodiment, six first heat-conducting members 61 are sequentially disposed on the first end surface 311 of the second body 31 at intervals and between the first fixing body 321 and the second fixing body 322. Wherein, in the X-axis direction, each first heat-conducting member 61 is disposed on the first end surface 311 between each adjacent two first recesses 331. The thickness of the first heat conducting member 61 is smaller than the height of the first fixing body 321 and the second fixing body 322, so as to prevent the first heat conducting member 61 from interfering with the first fixing body 321 and the second fixing body 322 mounted on the first circuit board 11. In other embodiments, the six first heat-conducting members 61 may not be spaced, and the number of the first heat-conducting members 61 may be one, two, three, four, five or more.

In the present embodiment, the distance a2 (shown in fig. 12) between the openings of every two adjacent first recesses 331 is equal to the width dimension of the first heat-conducting member 61 located between the two first recesses 331 along the X-axis direction. The length dimension of each first heat-conducting member 61 is equal to the width dimension of the second body 31. That is, the first end surface 311 between each adjacent two of the first recesses 331 is completely covered by each of the first heat-conducting members 61. Thus, each first heat-conducting member 61, the second main body 31 and the circuit board assembly 10 have a larger contact area, which is beneficial for each first heat-conducting member 61 to quickly dissipate heat of the circuit board assembly 10 and the second magnetic core 30. Moreover, because the first heat-conducting member 61 has viscosity, the strength of the fixed connection between each first heat-conducting member 61 and the second main body 31 is ensured, the first heat-conducting member 61 is prevented from falling off from the second main body 31, and the structural stability is improved. In addition, the second magnetic core 30 can be fixedly connected with the first circuit board 11 of the circuit board assembly 10 through the adhesion of the first heat-conducting member 61, so that the structural stability of the electronic device 100 is enhanced.

In other embodiments, the distance a2 between the openings of every two adjacent first recesses 331 and the width dimension of the first heat-conducting member 61 located between the two first recesses 331 may not be equal to each other along the X-axis direction. The length dimension of each first heat-conducting member 61 may not be equal to the width dimension of the second body 31.

In other embodiments, the number of the first heat-conducting members 61 is one, and one first heat-conducting member 61 is spaced by seven first recesses 331 to form six first sub heat-conducting members, each of which is similar to the first heat-conducting member 61. For example, the first heat-conducting member 61 may be cut at each first recess 331 by cutting or the like, and six first sub heat-conducting members may be disposed on the first end surface 311 of each adjacent two first recesses 331.

In this embodiment, six second heat conduction members 62 are sequentially disposed on the first end surface 311 of the second body 31 at intervals, and are located between the first fixing body 321 and the third fixing body 323. Wherein each second heat-conducting member 62 is disposed on the first end surface 311 between each adjacent two second grooves 332. The thickness of the second heat conducting member 62 is smaller than the height of the first fixing body 321 and the third fixing body 323, so as to prevent the second heat conducting member 62 from interfering with the first fixing body 321 and the third fixing body 323 mounted on the first circuit board 11. In other embodiments, the six second heat-conducting members 62 may not be spaced apart. The number of second heat-conducting members 62 may also be one, two, three, four, five or more.

In this embodiment, the distance between the openings of every two adjacent second grooves 332 in the X-axis direction is equal to the width of the second heat-conducting member 62 located between the two second grooves 332. The length dimension of each second heat-conducting member 62 is equal to the width dimension of the second body 31. That is, the first end surface 311 between each adjacent two of the second grooves 332 is completely covered by each of the second heat conduction members 62. Thus, each second heat conduction member 62 is ensured to have a larger contact area with the second main body 31 and the circuit board assembly 10, which is beneficial for each second heat conduction member 62 to quickly dissipate heat of the circuit board assembly 10 and the second magnetic core 30. Moreover, the second heat-conducting members 62 have viscosity, so that the strength of the fixed connection between each second heat-conducting member 62 and the second main body 31 is ensured, the second heat-conducting members 62 are prevented from falling off from the second main body 31, and the structural stability is improved. In addition, the second magnetic core 30 can be fixedly connected with the first circuit board 11 of the circuit board assembly 10 through the adhesion of the second heat conduction member 62, so that the structural stability of the electronic device 100 is enhanced.

In other embodiments, the distance between the openings of every two adjacent second grooves 332 and the width dimension of the second heat-conducting member 62 between the two second grooves 332 may not be equal to each other along the X-axis direction. The length dimension of each second heat-conducting member 62 may not be equal to the width dimension of the second body 31.

In other embodiments, the number of the second heat-conducting members 62 is one, and one second heat-conducting member 62 is spaced by seven second grooves 332 to form six second sub heat-conducting members, each of which is similar to the second heat-conducting member 62. For example, the second heat-conducting member 62 may be cut at each second groove 332 by cutting or the like, and six second sub heat-conducting members may be disposed on the first end surfaces 311 of each adjacent two second grooves 332, respectively.

It should be noted that, in the present embodiment, each of the heat-conducting members 60 expands when heated. Wherein, the thermal expansion coefficient of each thermal conduction member 60 is between the thermal expansion coefficient of the second magnetic core 30 and the thermal expansion coefficient of the first circuit board 11. When the heat conducting member 60 is heated and expanded, the thermal stress between the heat conducting member 60 and the second magnetic core 30 is reduced, the thermal stress between the heat conducting member 60 and the first circuit board 11 is reduced, the heat conducting member 60 after being heated is prevented from damaging the second magnetic core 30 and the first circuit board 11, and the strength of the fixed connection between the heat conducting member 60 and the second magnetic core 30 as well as the first circuit board 11 is improved.

In this embodiment, when the electronic device 100 operates, each of the thermal conduction members 60 can rapidly absorb and rapidly conduct a large amount of heat generated by the circuit board assembly 10 and the second magnetic core 30 during operation to the outside due to the good thermal conductivity of the thermal conduction member 60. The design of the heat conducting member 60 reduces the thermal contact resistance between the second magnetic core 30 and the first circuit board 11, and a part of heat generated by the circuit board assembly 10 during operation is quickly conducted to the second magnetic core 30 through the heat conducting member 60 and conducted to the outside through the second magnetic core 30; another part of the heat is directly conducted to the outside by the absorption of the heat-conductive member 60. The design of the heat conducting member 60 ensures the rapid heat dissipation of the circuit board assembly 10 and the second magnetic core 30, prevents the circuit board assembly 10 and the second magnetic core 30 from damaging the performance due to heat accumulation, prolongs the service life of the circuit board assembly 10 and the second magnetic core 30, and further prolongs the service life of the electronic device 100.

In addition, since the thermal conductive member 60 expands when heated, when the electronic device 100 operates, the first thermal conductive member 61 expands and partially pushes into the first recess 331; the second heat-conducting member 62 expands to partially intrude into the second groove 332. The design of the groove 33 effectively disperses the expansion stress generated when the heat conducting piece 60 is heated, and avoids the heat conducting piece 60 from expanding to push against the second magnetic core 30 to damage the second magnetic core 30; moreover, the design of the groove 33 can avoid a gap between the second magnetic core 30 and the heat conducting member 60, which is beneficial to the flattening of the electronic device 100 and the miniaturization design of the electronic device 100.

In the present embodiment, since the width dimension (a 1 shown in fig. 12) of the opening of each first indentation 331 is smaller than the distance (a 2 shown in fig. 12) between the first indentation 331 and the adjacent first indentation 331 along the X-axis direction; the width dimension of the opening of each second groove 332 is smaller than the distance between the second groove 332 and the adjacent second groove 332. The first heat-conducting member 61 facilitating expansion thus intrudes into the first recess 331, and the second heat-conducting member 62 facilitating expansion intrudes into the second recess 332, further enhancing the ability of the recess 33 to disperse expansion stress.

In other embodiments, the second magnetic core 30 may not be provided with the recess 33. The plurality of first heat-conducting members 61 and the plurality of second heat-conducting members 62 are arranged at intervals, the expansion stress generated when each first heat-conducting member 61 is heated is dispersed through the spaces among the plurality of first heat-conducting members 61, and the expansion stress generated when each second heat-conducting member 62 is heated is dispersed through the spaces among the plurality of second heat-conducting members 62, so that the first heat-conducting members 61 and the second heat-conducting members 62 which are expanded by heating can be prevented from abutting against the second magnetic core 30 to damage the second magnetic core 30.

As shown in fig. 3 and 4, in the electronic device 100 according to the embodiment of the present application, the heat sink 40 is disposed between the first body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, and the heat conducting member 60 is disposed between the second body 31 of the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10. When the electronic device 100 operates, a large amount of heat generated by the circuit board assembly 10 and the first magnetic core 20 during operation may be absorbed by the heat sink 40 and conducted to the outside; the accessible heat-conducting member 60 absorbs the great amount of heat that circuit board subassembly 10 and second magnetic core 30 during operation produced and conducts to the external world, guarantees the quick heat dissipation of circuit board subassembly 10, first magnetic core 20 and second magnetic core 30, avoids circuit board subassembly 10, first magnetic core 20 and second magnetic core 30 because of the heat gathering damage performance, has prolonged circuit board subassembly 10, first magnetic core 20 and second magnetic core 30's life, and then has prolonged electron device 100's life.

Compared with the prior art, the electronic device 100 of the embodiment of the present application performs rapid heat dissipation on two sides of the circuit board assembly 10 through the heat dissipation member 40 and the heat conduction member 60, so as to solve the problem that the circuit board assembly 10 is not convenient for heat dissipation, effectively increase the heat dissipation area, achieve better heat dissipation effect, and facilitate the miniaturization design and the high power density design of the electronic device 100, and further facilitate the miniaturization design and the high power density design of the power module 1000a (as shown in fig. 1). In addition, through the design of the groove 33, the expansion stress of the heat conducting piece 60 can be effectively dispersed, and the heat conducting piece 60 is prevented from expanding to abut against the second magnetic core 30 to damage the second magnetic core 30; moreover, the design of the groove 33 can avoid a gap between the second magnetic core 30 and the heat conducting member 60, which is beneficial to the flattening of the electronic device 100 and the miniaturization design of the electronic device 100. In addition, the electronic device 100 of the embodiment of the application has a simple structure, is easy to process, and has low processing cost.

Referring to fig. 18 to 20, fig. 18 is a schematic perspective view of the electronic device 100 in fig. 2 according to a second embodiment, fig. 19 is a cross-sectional view of the electronic device 100 in fig. 18 along line XX-XX, and fig. 20 is an exploded schematic structural view of the cross-sectional view of the electronic device 100 in fig. 18 along line XX-XX.

The electronic device 100 shown in the present embodiment is different from the electronic device 100 shown in the first embodiment described above in that the number of the first heat-conductive members 61 and the number of the second heat-conductive members 62 are both one. The first heat-conducting member 61 is located between the first end 311 of the second body 31 and the first circuit board 11 of the circuit board assembly 10. Opposite ends of the first heat conductor 61 are in contact with the first fixing body 321 and the second fixing body 322, respectively. The length dimension of the first heat-conducting member 61 is equal to the width dimension of the second body 31, respectively. That is, the first heat conduction member 61 completely covers the first end surface 311 between the first fixing body 321 and the second fixing body 322. In other embodiments, the length dimension of the first heat-conducting member 61 may not be equal to the width dimension of the second body 31.

The second heat-conducting member 62 is located between the first end surface 311 of the second body 31 and the first circuit board 11 of the circuit board assembly 10. Opposite end portions of the second heat conductor 62 are in contact with the first fixed body 321 and the third fixed body 323, respectively. The length dimension of the second heat-conducting member 62 is equal to the width dimension of the second body 31. That is, the second heat conduction member 62 completely covers the first end surface 311 between the first fixed body 321 and the third fixed body 323. In other embodiments, the length dimension of the second thermal conduction member 62 may not be equal to the width dimension of the second body 31.

Compared with the electronic device 100 shown in the first embodiment, the first heat conducting member 61, the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10 of the electronic device 100 shown in this embodiment have larger contact areas, and the second heat conducting member 62, the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10 have larger contact areas, which is beneficial to fast heat dissipation of the second magnetic core 30 and the circuit board assembly 10, and further improves heat dissipation efficiency. Moreover, since the number of the first heat-conducting members 61 and the second heat-conducting members 62 is one, the first heat-conducting members 61 and the second heat-conducting members 62 are conveniently arranged between the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, so that the assembly is easy, and the assembly time is reduced.

The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device applied to a power module, the electronic device comprising:

the circuit board assembly comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are arranged in a stacked mode and are electrically connected;

the first magnetic core comprises a first main body, the first magnetic core is arranged on the second circuit board, and the first main body is positioned on one side of the second circuit board, which is back to the first circuit board;

the second magnetic core comprises a second main body, the second magnetic core is arranged on the first circuit board, the second main body is positioned on one side of the first circuit board, which is back to the second circuit board, and the second magnetic core is fixedly connected with the first magnetic core;

a first heat dissipation member located between the first body and the second circuit board and contacting the first body and the second circuit board; and

a first thermal conductive member between the second body and the first circuit board and contacting the second body and the first circuit board.

2. The electronic device of claim 1, wherein the second body includes a first end surface recessed with a first recess having an opening at the first end surface, the first thermal conduction member being located at the first end surface.

3. The electronic device of claim 2, wherein the first thermal conduction members are spaced by the first grooves; alternatively, the first heat-conducting member covers the first groove.

4. The electronic device of claim 2, wherein the first thermal conduction member bonds the first end surface to a surface of the first circuit board.

5. The electronic device according to any one of claims 1 to 4, wherein a thermal expansion coefficient of the first heat-conducting member is between a thermal expansion coefficient of the first core and a thermal expansion coefficient of the first circuit board.

6. The electronic device according to any one of claims 2 to 4, wherein the number of the first grooves is plural, the plural first grooves are sequentially spaced, the number of the first heat-conducting members is plural, and each of the first heat-conducting members is disposed on the first end surface between two adjacent first grooves.

7. The electronic device according to any one of claims 2 to 4, wherein the second magnetic core further comprises a first fixing body and a second fixing body, the first fixing body and the second fixing body are protruded from the first end surface and spaced apart from each other, and the first groove and the first heat conducting member are located on the first end surface between the first fixing body and the second fixing body.

8. The electronic device according to claim 7, wherein the first heat-conducting member entirely covers the first end face between the first fixing body and the second fixing body.

9. The electronic device according to claim 7, wherein the first fixing body and the second fixing body have a height larger than a thickness of the first heat conductive member, the first circuit board is provided with a first through hole into which the first fixing body is inserted and a second through hole into which the second fixing body is inserted.

10. The electronic device according to any one of claims 2 to 4, wherein the cross-sectional shape of the first groove is rectangular, triangular, an arc-shaped protrusion, or trapezoidal.

11. The electronic device according to claim 9, further comprising a second heat-conductive member on a first end surface of a side of the first fixing body remote from the second fixing body, the second heat-conductive member being in contact with the first circuit board.

12. The electronic device of claim 11, wherein the second body of the second magnetic core is further recessed with a second recess having an opening at the first end face, the second thermal conduction member being spaced apart by the second recess; alternatively, the second heat-conducting member covers the second groove.

13. The electronic device according to claim 12, wherein the second magnetic core further comprises a third fixing body, the third fixing body is protruded from the first end surface and spaced apart from the first fixing body, and is located on a side of the first fixing body away from the second fixing body, the first circuit board is provided with a third through hole, the third fixing body is inserted into the third through hole, and the second heat conducting member and the second groove are located on the first end surface between the first fixing body and the third fixing body.

14. The electronic device according to claim 12 or 13, wherein the number of the second grooves is plural, a plurality of the second grooves are sequentially spaced, and the number of the second heat-conducting members is plural, and each of the second heat-conducting members is disposed on the first end surface between every adjacent two of the second grooves.

15. The electronic device according to claim 13, wherein the second heat-conducting member entirely covers the first end face between the first fixing body and the third fixing body.

16. The electronic device according to any one of claims 12 to 15, wherein the cross-sectional shape of the second groove is rectangular, triangular, an arc-shaped protrusion, or trapezoidal.

17. The electronic device according to claim 13, wherein the first body of the first magnetic core includes a first surface, the first magnetic core further includes a first connecting body and a second connecting body, the first connecting body and the second connecting body are protruded from the first surface and spaced apart from each other, and the first heat sink is located on the first surface between the first connecting body and the second connecting body.

18. The electronic device as claimed in claim 17, wherein the second circuit board has a first through hole and a second through hole, the first through hole corresponds to the first through hole, the second through hole corresponds to the second through hole, the first connector is inserted into the first through hole and is fixedly connected to the first fixing body, and the second connector is inserted into the second through hole and is fixedly connected to the second fixing body.

19. The electronic device according to claim 18, further comprising a first adhesive member and a second adhesive member, wherein the first connecting body is fixedly connected to the first fixing body via the first adhesive member, and wherein the second connecting body is fixedly connected to the second fixing body via the second adhesive member.

20. The electronic device according to claim 17, wherein the first magnetic core further comprises a third connector protruding from the first surface and spaced apart from the first connector, and located on a side of the first connector away from the second connector, and the electronic device further comprises a second heat dissipation member located on the first surface between the first connector and the third connector.

21. The electronic device according to claim 17, further comprising a third adhesive member, wherein the second circuit board is provided with a third through hole, the third through hole corresponds to the third through hole, and the third connecting member is inserted into the third through hole and is fixedly connected to the third fixing member through the third adhesive member.

22. The electronic device of claim 20, wherein the circuit board assembly further comprises a first winding disposed on the first circuit board and electrically connected to the first circuit board, and a second winding disposed on the second circuit board and electrically connected to the second circuit board, the first winding coupled to the second winding; wherein the first winding surrounds the first through hole and the second winding surrounds the first docking through hole.

23. A power module comprising the electronic device according to any one of claims 1 to 22 and a housing, wherein the electronic device is housed in the housing, and the electronic device is configured to perform voltage conversion processing on alternating current.

24. An electronic device comprising the power module of claim 23 and a load module, wherein the power module is electrically connected to the load module.