JP2007123447A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment capable of controlling resin's going-round upon its loading, and capable of easily checking that resin goes round a necessary portion, and that no resin goes round at a portion round which resin is not wanted to go. <P>SOLUTION: The electronic equipment A includes a packaging board 1 for packaging a plurality of electronic components 5, 6 thereon, and a metal case 3 for housing the packaging board 1 with a resin filled in a predetermined range between the rear surface of the packaging board 1 and the metal case 3. In the electronic equipment, the packaging board 1 has one to plural first holes 10 provided in the vicinity of the edge of the predetermined range which is filled with the resin 2 for making the resin 2 upon its filling pass from a rear surface side of the packaging board 1 to a surface side. Further, the packaging board has one to plural second holes 11 provided outside the predetermined range which is filled with the resin 2 for checking that a filling range of the resin 2 does not exceed the predetermined range. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic device.

  In general, an electronic device including a heat generating component uses a highly rated electronic component in order to suppress heat generation and prevent thermal destruction. As a result, the board area of the mounting board on which the electronic component is mounted is increased, leading to an increase in the size of the electronic device. Moreover, it is common to attach a heat radiating plate for promoting heat dissipation to the heat generating component, and this is one of the factors for increasing the size of electronic devices.

  Therefore, as shown in FIG. 22, in order to reduce the size of the electronic device while taking measures to dissipate heat from the heat generating component, the electronic component 5 is mounted on the surface of the mounting substrate 1 and the electronic component 6 is mounted on the back surface of the mounting substrate 1. Then, the mounting substrate 1 is accommodated in the case 3a so that the back surface of the mounting substrate 1 faces the inner bottom surface of the box-shaped case 3a whose upper surface is opened, and between the back surface of the mounting substrate 1 and the inner surface of the case 3a. A technique for filling the resin 2 is disclosed. (For example, refer to Patent Document 1).

  In addition, a configuration for electrically connecting the mounting substrate 1 and the metal case 3 using a metal case (hereinafter, referred to as a metal case 3) will be described with reference to FIG. First, the through hole 20 is provided in the mounting substrate 1, and two pairs of holes 21 and 22 that are opposed to each other with the opening of the through hole 20 interposed therebetween are provided. Then, both end portions of the jumper wire 30 are inserted into the holes 21 and 22, respectively, and one end of the jumper wire 30 is soldered to a part of the copper foil pattern on the mounting substrate 1 through the one hole 21. The other end of the jumper wire 30 is not soldered while being inserted into the other hole 22. In addition, although two pairs of the holes 21 and 22 are provided, the holes 21 and 22 are formed so as to be alternately arranged for each set. Then, the screw 40 is screwed into the screw hole 51 provided in the boss 50 on the inner bottom surface of the metal case 3 through the insertion hole 20, and the jumper wire 30 is connected between the head 40 a of the screw 40 and the mounting substrate 1. The state where the screw 40 is in contact with the jumper wire 30 is maintained. Accordingly, a part of the copper foil pattern on the mounting substrate 1 is electrically connected to the metal case 3 through the jumper wire 30, the screw 40, and the screw hole 51 of the metal case 3.

  As described above, one end of the jumper wire 30 is soldered to a part of the copper foil pattern on the mounting substrate 1 through the one hole 21, and the other end of the jumper wire 30 is inserted into the other hole 22. The soldering wire 30 is not soldered to give elasticity to the jumper wire 30, and when the mounting substrate 1 and the metal case 3 are tightened with the screw 40 via the jumper wire 30, Such mechanical stress is reduced.

In addition, an insulating plate formed of an insulating material is provided between the case 3a and the resin 2, and a protruding portion that protrudes in accordance with the shape of the electronic component 5 mounted on the back surface of the mounting substrate 1 is provided on the insulating plate. Some have suppressed the filling amount of the resin 2. (For example, refer to Patent Document 2).
JP 2002-141676 A JP 2004-363192 A

  Discrete type electronic components 5 that are not surface-mounted are mounted on the surface of the mounting substrate 1, and it cannot be confirmed how much resin 2 is filled on the back surface side of the mounting substrate 1. Therefore, when the resin 2 is filled up to the back side of the electronic component 5 such as the power supply terminal and the output terminal, the resin 2 is sucked up by a capillary phenomenon and enters the electronic component 5 to cause problems such as poor contact. There was a problem to do.

  In the example shown in FIG. 23, if the resin 2 is excessively filled, the resin 2 may be discharged from the screw hole 51 of the metal case 3. In general, the resin 2 is a viscous fluid until it is cured, and therefore it is considered that the resin 2 comes out of the metal case 3 depending on the handling. Therefore, if the resin 2 is applied to the screw hole 51 provided to electrically connect the mounting substrate 1 and the metal case 3, the mounting substrate 1 and the metal case 3 can be electrically connected. There is a problem that noise performance and the like are reduced.

  Moreover, in the structure of the said patent document 2, if the position of the convex part provided in an insulating board is not considered enough, the resin 2 may not wrap around to the electronic component 6 to which heat is dissipated. It was not possible to confirm how much resin 2 was filled.

  The present invention has been made in view of the above-mentioned reasons, and an object of the present invention is to control the wrapping of the resin at the time of filling, and to make the resin wrap around the necessary place and to wrap the resin. An object of the present invention is to provide an electronic device that can easily confirm that a resin does not wrap around a part that does not exist.

  The invention according to claim 1 is an electronic device comprising a mounting substrate on which a plurality of electronic components are mounted and a case for housing the mounting substrate, and filling a predetermined range between one surface of the mounting substrate and the inner surface of the case with resin. The mounting substrate is provided with one or a plurality of first holes through which the resin at the time of filling is inserted from one side of the mounting substrate to the other side in the vicinity of an end of a predetermined range in which the resin is filled. One or a plurality of second holes for confirming from the other surface side of the mounting substrate that the thickness does not exceed the predetermined range is provided outside the predetermined range for filling the resin.

  According to this invention, the first hole for controlling the wraparound of the resin and confirming the wraparound of the resin is provided in the vicinity of the end of the predetermined range for filling the resin, and the resin filling range does not exceed the predetermined range. By providing the second hole outside the predetermined range for filling the resin, it is possible to control the wrapping of the resin at the time of filling, and that the resin wraps around the necessary place and It can be easily confirmed that the resin does not wrap around the portion that is not desired to be embedded.

  According to a second aspect of the present invention, in the first aspect, the power supply terminal to which the commercial power supply is connected and the inductor provided in the filter circuit inserted in the power supply line connected to the power supply terminal are mounted on the other surface of the mounting substrate. The first hole is provided near the inductor of the filter circuit, and the second hole is provided near the power supply terminal.

  According to the present invention, the resin is not sucked up by the capillary phenomenon and does not enter the inside of the power supply terminal, and problems such as poor contact of the power supply terminal can be prevented.

  According to a third aspect of the present invention, in the first aspect, the mounting board includes an AC / DC conversion circuit that converts a commercial power source into a DC voltage, and an inverter that converts a DC voltage output from the AC / DC conversion circuit into a high-frequency voltage. A circuit, a series resonance circuit composed of an inductor and a capacitor connected to the output of the inverter circuit, and an output terminal connected to both ends of the capacitor of the series resonance circuit are mounted. Is mounted on the other surface of the mounting substrate, the first hole is provided in the vicinity of the inductor of the series resonance circuit, and the second hole is provided in the vicinity of the output terminal.

  According to the present invention, the resin is not sucked up by the capillary phenomenon and does not enter the output terminal, and problems such as poor contact of the output terminal can be prevented.

  A fourth aspect of the present invention is the winding component according to the second or third aspect, wherein the inductor is a winding component in which a winding is wound around a core, and is inserted from one surface side to the other surface side through the first hole. The resin thus obtained is characterized by being in close contact with the core.

  According to the present invention, the heat of the winding component is easily radiated by the resin exposed to the other surface side of the mounting substrate through the first hole, and the winding component is fixed to the mounting substrate through the resin. Therefore, noise caused by vibration of the winding parts can be reduced.

  According to a fifth aspect of the present invention, in the first aspect, the mounting substrate includes a power supply terminal to which a commercial power supply is connected, a rectifier that performs full-wave rectification on the commercial power input through the power supply terminal, and a rectified output of the rectifier And a lighting circuit for converting the power into a high frequency voltage, a power supply terminal and a rectifier are mounted on the other surface of the mounting substrate, the first hole is provided in the vicinity of the rectifier, and the second hole is a power supply terminal. It is provided in the vicinity.

  According to the present invention, the resin is not sucked up by the capillary phenomenon and does not enter the inside of the power supply terminal, and problems such as poor contact of the power supply terminal can be prevented. Further, the heat of the rectifier is easily radiated by the resin exposed to the other surface side of the mounting substrate through the first hole.

  The invention of claim 6 is the power supply terminal to which a commercial power supply is connected to the mounting board in claim 1, a surface mount type rectifier for full-wave rectification of the commercial power input through the power supply terminal, A lighting circuit that converts the rectified output of the rectifier into a high-frequency voltage is mounted, the rectifier is mounted on one surface of the mounting substrate, the power supply terminal is mounted on the other surface of the mounting substrate, and the first hole is a surface Provided in the vicinity of the mounting type rectifier, and when the self-standing rectifier is mounted on the other surface of the mounting substrate, a hole for inserting the lead terminal of the rectifier is used, and the second hole is provided in the vicinity of the power supply terminal. And

  According to the present invention, the resin is not sucked up by the capillary phenomenon and does not enter the inside of the power supply terminal, and problems such as poor contact of the power supply terminal can be prevented. Further, the heat of the rectifier is easily radiated by the resin exposed to the other surface side of the mounting substrate through the first hole. Furthermore, by sharing the hole for mounting the self-standing rectifier for the control of the resin and the confirmation of the filling range, the man-hours required for drilling the mounting board can be reduced, and the cost of the mounting board can be reduced. Become.

  The invention of claim 7 is the invention according to any one of claims 1 to 6, wherein the case is substantially at the same potential as the ground of the power source, and an earth capacitor is mounted on the mounting board, and the copper foil pattern on the mounting board is A part of the ground capacitor is electrically connected to one end of the ground capacitor, the other end of the ground capacitor is electrically connected to the case via a ground connection portion provided on the mounting board, and the second hole is connected to the ground connection portion. It is provided in the vicinity.

  According to the present invention, it is possible to reliably establish electrical continuity between the earth capacitor and the case, and it is possible to prevent noise performance and the like from being deteriorated.

  The invention of claim 8 is the method of claim 7, wherein both ends are inserted into a pair of holes facing each other across an opening of the insertion hole provided in the mounting substrate, and one of the pair of holes is interposed. A jumper wire electrically connected to the other end of the earth capacitor is provided, and the other end of the earth capacitor is screwed into a jumper wire and a screw hole provided in the case through the insertion hole and is in contact with the jumper wire. It is electrically connected to the case through a screw, and the second hole is the other of the pair of holes.

  According to the present invention, it is possible to reliably establish electrical continuity between the earth capacitor and the metal case, and it is possible to prevent a reduction in noise performance and the like.

  In a ninth aspect of the present invention, in any one of the first to eighth aspects, the plurality of electronic components mounted on the mounting board constitutes a discharge lamp lighting device for lighting a discharge lamp, and the case is mounted on a lighting fixture. It is characterized by that.

  According to this invention, the lighting fixture which prevented the malfunction by filling with resin can be provided.

  As described above, in the present invention, the first hole for controlling the wrapping of the resin and confirming the wrapping of the resin is provided in the vicinity of the end of the predetermined range where the resin is filled, and the resin filling range is within the predetermined range. It is possible to control the wrapping of the resin at the time of filling by providing the second hole outside the predetermined range for filling the resin, and the resin wraps around where necessary. In addition, there is an effect that it is possible to easily confirm that the resin does not wrap around the portion where the resin does not want to wrap around.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
As shown in FIGS. 1 and 2, the electronic device A according to the present embodiment has an electronic component 5 mounted on the surface of a rectangular mounting substrate 1, an electronic component 6 mounted on the back surface of the mounting substrate 1, and an upper surface opened. The mounting substrate 1 is accommodated in the metal case 3 so that the back surface of the mounting substrate 1 faces the inner bottom surface of the rectangular box-shaped metal case 3. The inner surface of the metal case 3 is covered with a film made of an insulating material (hereinafter referred to as an insulating plate 4), and the resin 2 is filled between the back surface of the mounting substrate 1 and the insulating plate 4. FIG. 1 shows a schematic arrangement of the electronic components 5 and 6.

  Further, as shown in FIG. 3, an insertion hole 20 is provided at a corner on one end side in the longitudinal direction of the mounting substrate 1, and two pairs of holes 21 and 22 that are opposed to each other with the opening of the insertion hole 20 therebetween are provided. Then, both end portions of the jumper wire 30 are inserted into the holes 21 and 22, respectively, and one end of the jumper wire 30 is soldered to a part of the copper foil pattern on the mounting substrate 1 through the one hole 21. The other end of the jumper wire 30 is not soldered while being inserted into the other hole 22. In addition, although two pairs of the holes 21 and 22 are provided, the holes 21 and 22 are formed so as to be alternately arranged for each set. 23, the screw 40 is screwed into the screw hole 51 provided in the boss 50 on the inner bottom surface of the metal case 3 through the insertion hole 20, and the jumper wire 30 is connected to the screw 40. The state where the screw 40 is in contact with the jumper wire 30 is held between the head 40 a and the mounting substrate 1. Accordingly, a part of the copper foil pattern on the mounting substrate 1 is electrically connected to the metal case 3 through the jumper wire 30, the screw 40, and the screw hole 51 of the metal case 3.

  FIG. 4 is a perspective view of the vicinity of the insertion hole 20 as viewed from the front surface side of the mounting substrate 1. The electronic components 6 mounted on the back surface side of the mounting substrate 1 are heat generating components. Therefore, it is necessary to cover with resin 2. Between the electronic component 6 and the insertion hole 20, a circular first hole 10 and a second hole 11 having a diameter of 3 mm are provided, and the first hole 10 is located on the side close to the electronic component 6. The second hole 11 is positioned in the vicinity of the insertion hole 20.

  When the insulating plate 4 is arranged on the inner surface of the metal case 3 and the resin 2 is poured into one point on the insulating plate 4 and the mounting substrate 1 is mounted in the metal case 3, the resin 2 is planarized by the back surface of the mounting substrate 1. Since it is made smooth, it becomes a shape which spreads toward the periphery of the mounting substrate 1. The resin 2 flows around the electronic component 6 mounted on the back surface of the mounting substrate 1 and spreads toward the insertion hole 20. The resin 2 is provided between the electronic component 6 and the insertion hole 20. Through the first hole 10, the mounting substrate 1 is inserted from the back surface side to the front surface side, and does not reach the insertion hole 20. Thus, by providing the first hole 10, the wraparound of the resin 2 is controlled so that the resin does not flow out of the range where the resin 2 is desired to be filled, and the resin 2 wraps around where necessary. It can be easily confirmed that Furthermore, the second hole 11 located in the vicinity of the insertion hole 20 can easily confirm that the resin 2 does not enter the insertion hole 20 where it is desired to prevent the resin 2 from entering.

  Therefore, the resin 2 surely wraps around where necessary to improve the heat dissipation performance of the electronic component 6, but the screw hole provided to electrically connect the mounting substrate 1 and the metal case 3. No resin 51 is applied to 51 (see FIG. 23), so that the mounting substrate 1 and the metal case 3 can be reliably electrically connected to each other, and a reduction in noise performance or the like can be prevented.

  That is, in this embodiment, the first hole 10 for controlling the wraparound of the resin 2 and confirming the wraparound of the resin 2 is provided in the vicinity of the end portion of the predetermined range in which the resin 2 is filled. By providing the second hole 11 for confirming that it does not exceed the predetermined range outside the predetermined range in which the resin 2 is filled, the flow of the resin 2 can be controlled and the filling range can be easily confirmed. Note that the hole 22 that is not soldered with the other end of the jumper wire 30 inserted may be used as the second hole.

  Further, the number of the first holes 10 and the second holes 11 is not limited to one each, and the first holes 10 and the second holes 11 are respectively set according to the amount of resin 2 and the filling range. A plurality of the first holes 10 and the second holes 11 may have a size and shape corresponding to the wraparound of the resin 2.

(Embodiment 2)
5 to 7 show the configuration of the electronic apparatus A according to the present embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  First, FIG. 5 shows a circuit configuration of the electronic device A. The electronic device A is a discharge lamp lighting device that lights the discharge lamp La using the commercial power source AC as a power source. The power source terminal 5a for connecting the commercial power source AC; A filter circuit K1 connected to the power supply terminal 5a via the fuse F, an AC / DC conversion circuit K2 connected to the output of the filter circuit K1 to convert the input from the commercial power supply AC into a desired DC voltage, and AC / DC An inverter circuit K3 that converts the DC power output from the conversion circuit K2 into a high-frequency voltage and supplies the high-frequency voltage to the discharge lamp La. The filter circuit K1 includes a capacitor C1 connected between the power supply terminals 5a via the fuse F and an inductor LF1 inserted in the power supply line.

  As shown in FIG. 6, the power supply terminal 5a and the inductor LF1 are mounted on the surface of the mounting substrate 1 like the other electronic components 5, and the power supply terminal 5a is disposed at substantially the center of one end in the longitudinal direction of the mounting substrate 1. The inductor LF1 is arranged at a position that is biased toward the center of the mounting substrate 1 from the power supply terminal 5a.

  Further, between the electronic component 6 and the power supply terminal 5a, the first hole 10 for controlling the wrapping of the resin 2 and confirming the wrapping of the resin 2 and the filling range of the resin 2 exceed a predetermined range. The first hole 10 is located near the inductor LF1, and the second hole 11 is located near the power supply terminal 5a.

  Then, when the resin 2 is poured into one point on the insulating plate 4 and the mounting substrate 1 is mounted in the metal case 3, the resin 2 flows around the electronic component 6 mounted on the back surface of the mounting substrate 1, and further, the mounting substrate. The resin 2 spreads toward the lead terminal of the power supply terminal 5a projecting from the back surface of 1 but from the back surface side of the mounting substrate 1 through the first hole 10 provided between the electronic component 6 and the power supply terminal 5a. The resin 2 is not inserted into the lead terminal of the power supply terminal 5a. Therefore, the resin 2 is not sucked from the back surface side of the mounting substrate 1 due to the capillary phenomenon and does not enter the power supply terminal 5a, and the power terminal 5a does not suffer from problems such as poor contact.

  Furthermore, as shown in FIG. 7, the inductor LF1 is a winding component in which a winding LF1b is wound around a core LF1a. In the present embodiment, the inductor LF1 is exposed to the surface side of the mounting substrate 1 through the first hole 10. The resin 2 is in close contact with the core LF1a of the inductor LF1, and the heat generated by the inductor LF1 is easily radiated by the heat dissipation effect of the resin 2, and the core LF1a is fixed to the mounting substrate 1 via the resin 2, so that the inductor LF1 It is possible to reduce noise caused by vibration.

  Further, the second hole 11 located in the vicinity of the power supply terminal 5a makes it easy to confirm that the resin 2 does not wrap around the power supply terminal 5a where it is desired to prevent the resin 2 from wrapping around.

(Embodiment 3)
8 to 10 show the configuration of the electronic apparatus A according to the present embodiment. The same components as those in the second embodiment are denoted by the same reference numerals, and description thereof is omitted.

  First, FIG. 8 shows a circuit configuration of the electronic device A. The electronic device A is a discharge lamp lighting device that lights the discharge lamp La using the commercial power source AC as a power source. The power source terminal 5a for connecting the commercial power source AC; A filter circuit K1 connected to the power supply terminal 5a, an AC / DC conversion circuit K2 connected to the output of the filter circuit K1 to convert the input from the commercial power supply AC into a desired DC voltage, and an AC / DC conversion circuit K2 output An inverter circuit K3 that converts a DC power source to be converted into a high-frequency voltage and supplies it to the discharge lamp La, an inverter control circuit K4 that controls the switching operation of the inverter circuit K3, and a resonance circuit K5 connected to the output of the inverter circuit K3. .

  The inverter circuit K3 includes a series circuit of switching elements Q1 and Q2 connected between the output ends of the AC / DC conversion circuit K2, and a capacitor C2 having one end connected to a connection midpoint of the switching elements Q1 and Q2. The elements Q1 and Q2 are on / off controlled by the inverter control circuit K4.

  The resonance circuit K5 is constituted by a series resonance circuit of an inductor L1 and a capacitor C3 connected between both ends of the switching element Q2 via the capacitor C2 of the inverter circuit K3, and an output for connecting the discharge lamp La to both ends of the capacitor C3. Terminal 5b is provided.

  As shown in FIG. 9, the power supply terminal 5a, the inductor L1, the capacitors C2 and C3, and the output terminal 5b are mounted on the surface of the mounting substrate 1 like the other electronic components 5, and the power supply terminal 5a is mounted on the mounting substrate 1. The output terminal 5b is disposed substantially at the center of the other end in the longitudinal direction of the mounting substrate 1, and the inductors L1, capacitors C2 and C3 are biased from the output terminal 5b toward the center of the mounting substrate 1. It is arranged at the position.

  Further, between the electronic component 6 and the output terminal 5b, the first hole 10 for controlling the wrapping of the resin 2 and confirming the wrapping of the resin 2 and the filling range of the resin 2 exceed a predetermined range. The first hole 10 is located near the inductor L1, and the second hole 11 is located near the output terminal 5b.

  Then, when the resin 2 is poured into one point on the insulating plate 4 and the mounting substrate 1 is mounted in the metal case 3, the resin 2 flows around the electronic component 6 mounted on the back surface of the mounting substrate 1, and further, the mounting substrate. The resin 2 spreads toward the lead terminal of the output terminal 5b projecting from the back surface of 1 but from the back surface side of the mounting substrate 1 through the first hole 10 provided between the electronic component 6 and the output terminal 5b. The resin 2 is not inserted into the lead terminal of the output terminal 5b. Therefore, the resin 2 is not sucked from the back surface side of the mounting substrate 1 due to the capillary phenomenon and does not enter the output terminal 5b, and the output terminal 5b does not suffer from problems such as poor contact.

  Furthermore, as shown in FIG. 10, the inductor L1 is a winding component in which the winding L1b is wound around the core L1a. In this embodiment, the inductor L1 is exposed to the surface side of the mounting substrate 1 through the first hole 10. The resin 2 is in close contact with the core L1a of the inductor L1, and heat generated by the inductor L1 is easily radiated due to the heat dissipation effect of the resin 2, and the core L1a is fixed to the mounting substrate 1 via the resin 2. It is possible to reduce noise caused by vibration.

  Further, the second hole 11 located in the vicinity of the output terminal 5b can easily confirm that the resin 2 does not wrap around the output terminal 5b where it is desired to prevent the resin 2 from wrapping around.

(Embodiment 4)
11 and 12 show the configuration of the electronic apparatus A according to the present embodiment. The same reference numerals are given to the same configurations as those in the first embodiment, and description thereof will be omitted.

  First, FIG. 11 shows a circuit configuration of the electronic device A. The electronic device A is a discharge lamp lighting device that lights the discharge lamp La using the commercial power source AC as a power source. The power source terminal 5a for connecting the commercial power source AC; A self-contained rectifier K6 that is composed of a filter circuit K1 connected to the power supply terminal 5a, a diode bridge connected to the output of the filter circuit K1 and full-wave rectifies the input from the commercial power supply AC, and converts the rectified voltage into a high-frequency voltage. And a lighting circuit K7 for supplying to the discharge lamp La.

  Then, as shown in FIG. 12, the power supply terminal 5a and the rectifier K6 are mounted on the surface of the mounting board 1 like the other electronic components 5, and the power supply terminal 5a is arranged at substantially the center of one end in the longitudinal direction of the mounting board 1. The rectifier K6 is arranged by inserting lead terminals into the four mounting holes 12 provided at positions shifted from the power supply terminal 5a toward the center of the mounting substrate 1.

  Further, between the electronic component 6 and the power supply terminal 5a, the first hole 10 for controlling the wrapping of the resin 2 and confirming the wrapping of the resin 2 and the filling range of the resin 2 exceed a predetermined range. The first hole 10 is located in the vicinity of the rectifier K6, and the second hole 11 is located in the vicinity of the power supply terminal 5a.

  Then, when the resin 2 is poured into one point on the insulating plate 4 and the mounting substrate 1 is mounted in the metal case 3, the resin 2 flows around the electronic component 6 mounted on the back surface of the mounting substrate 1, and further, the mounting substrate. The resin 2 spreads toward the lead terminal of the power supply terminal 5a projecting from the back surface of 1 but from the back surface side of the mounting substrate 1 through the first hole 10 provided between the electronic component 6 and the power supply terminal 5a. The resin 2 is not inserted into the lead terminal of the power supply terminal 5a. Therefore, the resin 2 is not sucked from the back surface side of the mounting substrate 1 due to the capillary phenomenon and does not enter the power supply terminal 5a, and the power terminal 5a does not suffer from problems such as poor contact.

  Further, in the present embodiment, by providing the first hole 10 in the vicinity of the rectifier K6, the resin 2 exposed to the surface side of the mounting substrate 1 through the first hole 10 is in close contact with the rectifier K6, and the resin 2 The heat generated by the rectifier K6 is easily radiated due to the heat radiation effect.

  Further, the second hole 11 located in the vicinity of the power supply terminal 5a makes it easy to confirm that the resin 2 does not wrap around the power supply terminal 5a where it is desired to prevent the resin 2 from wrapping around.

(Embodiment 5)
FIG. 13 shows the configuration of the electronic apparatus A of the present embodiment, and the same components as those of the fourth embodiment are denoted by the same reference numerals and description thereof is omitted.

  Although the self-supporting rectifier K6 is used in the fourth embodiment, the rectifier K6 ′ configured by using four surface-mounted diodes is used in the present embodiment, and the rectifier K6 ′ is the same mounting substrate as that of the fourth embodiment. 1 is mounted on the back surface. On the back surface of the mounting substrate 1, a copper foil pattern is formed in advance so that a surface-mounted rectifier K6 'can be mounted. That is, the mounting substrate 1 is designed to be shared by the self-supporting rectifier K6 of the fourth embodiment and the surface-mounted rectifier K6 'of the present embodiment (see FIGS. 12 and 13).

  And in this embodiment, the effect similar to Embodiment 4 is acquired by using the mounting hole 12 of the rectifier K6 as a 1st hole which controls the wraparound of the resin 2 and confirms the wraparound of the resin 2. be able to. Further, by sharing the mounting hole 12 for the control of the resin 2 and the confirmation of the filling range, the number of steps required for drilling the mounting substrate 1 is reduced, and the cost of the mounting substrate 1 can be reduced.

(Embodiment 6)
14 and 15 show the configuration of the electronic apparatus A according to the present embodiment. The same reference numerals are given to the same configurations as those in the fifth embodiment, and the description thereof will be omitted.

  First, FIG. 14 shows a circuit configuration of the electronic device A. In the same circuit configuration as that of the second embodiment (see FIG. 5), one power line in the filter circuit K1 is connected to the metal case 3 via the earth capacitor C4. Electrically conducting. The electrical connection between the earth capacitor C4 and the metal case 3 is made through the earth connection portion P. Here, the metal case 3 has substantially the same potential as the power supply ground. For example, the metal case 3 is realized by electrically connecting the housing of the lighting fixture with a power terminal for single-phase three-wire including the power supply ground wire and the metal case 3. To do.

  As shown in FIG. 15, the power supply terminal 5 a and the earth capacitor C <b> 4 are mounted on the surface of the mounting substrate 1 like the other electronic components 5, and the power supply terminal 5 a is approximately at the center of one end in the longitudinal direction of the mounting substrate 1. The ground capacitor C4 is disposed at a position deviated from the power supply terminal 5a toward the center of the mounting substrate 1.

  Hereinafter, the configuration of the ground connection portion P will be described. One end of the ground capacitor C4 is soldered to a copper foil pattern having the same potential as the power supply line in the filter circuit K1, and the other end of the ground capacitor C4 is connected to the jumper wire 30. One end is soldered to a copper foil pattern connected through a hole 21 (see FIG. 3). 23, the screw 40 is screwed into the screw hole 51 provided in the boss 50 on the inner bottom surface of the metal case 3 through the insertion hole 20, and the jumper wire 30 is connected to the screw 40. The state where the screw 40 is in contact with the jumper wire 30 is held between the head 40 a and the mounting substrate 1. Therefore, the earth capacitor C4 is electrically connected to the metal case 3 having substantially the same potential as the power supply ground via the jumper wire 30, the screw 40, and the screw hole 51 of the metal case 3.

  Thus, the noise performance of the electronic device A is improved by electrically connecting the power supply line in the filter circuit K1 and the metal case 3 via the earth capacitor C4.

  Here, the mounting hole 12 of the rectifier K6 described above is provided between the electronic component 6 and the insertion hole 20 to control the wraparound of the resin 2 and to confirm the wraparound of the resin 2. The mounting hole 12 is used as a hole.

  Further, a hole 22 in which the other end of the jumper wire 30 is inserted and not soldered is provided in the vicinity of the insertion hole 20, and it is confirmed that the filling range of the resin 2 does not exceed a predetermined range. The hole 22 is used as the second hole (see FIG. 3).

  Then, the wraparound of the resin 2 is controlled by the mounting hole 12 so that the resin does not flow out of the range where the resin 2 is desired to be filled, and it is easily confirmed that the resin 2 wraps around where necessary. it can. Further, the hole 22 located in the vicinity of the insertion hole 20 can easily confirm that the resin 2 does not enter the insertion hole 20 where it is desired to prevent the resin 2 from entering. Therefore, the resin 2 surely wraps around where necessary to improve the heat dissipation performance of the electronic component 6, but the screw hole provided to electrically connect the earth capacitor C4 and the metal case 3 No resin 51 is applied to 51 (see FIG. 23), and the earth capacitor C4 and the metal case 3 can be reliably electrically connected to each other, so that a reduction in noise performance or the like can be prevented.

  Further, by sharing the mounting holes 12 and 22 as the first and second holes for the control of the resin 2 and the confirmation of the filling range, the number of man-hours required for drilling the mounting substrate 1 is reduced. The cost can be reduced.

(Embodiment 7)
16 and 17 show the configuration of the electronic apparatus A according to the present embodiment. The same reference numerals are given to the same configurations as those in the first embodiment, and the description thereof will be omitted.

  In addition to the configuration of the first embodiment, the mounting board 1 of the present embodiment is mounted on the surface of the mounting board 1 with a winding component 5c in which a winding 5e is wound around a core 5d, and in the vicinity of the winding component 5c. As shown in FIG. 17, the resin 2 exposed on the surface side of the mounting substrate 1 is in close contact with the core 5 d of the winding component 5 c, and the heat dissipation effect by the resin 2 is provided. Thus, the heat generated by the winding component 5c is easily dissipated, and the core 5d is fixed to the mounting substrate 1 via the resin 2, so that noise due to vibration of the winding component 5c can be reduced.

(Embodiment 8)
18 and 19 show the configuration of the electronic apparatus A of the present embodiment, and the same components as those of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In addition to the configuration of the first embodiment, the mounting substrate 1 of the present embodiment is mounted horizontally on the surface of the mounting substrate 1 with a lead-forming cylindrical aluminum electrolytic capacitor 5f whose lead terminals are bent at a right angle. The mounting substrate 1 has a hole 14 directly below or in the vicinity of the aluminum electrolytic capacitor 5f. Then, as shown in FIG. 19, the resin 2 exposed on the surface side of the mounting substrate 1 through the hole 14 is in close contact with the aluminum electrolytic capacitor 5f, so that the orientation of the aluminum electrolytic capacitor 5f can be fixed and transported. Strength is improved against vibrations such as time.

(Embodiment 9)
20 and 21 show the configuration of the electronic apparatus A according to the present embodiment. The same reference numerals are given to the same configurations as those in the first embodiment, and the description thereof will be omitted.

  First, FIG. 20 shows a part of the control circuit K8 of the electronic device A, and one socket 7 of the pair of sockets 7 and 7 to which the lamp La is connected is connected to the discharge lamp La via the lead wire 8a. And a lead wire 8b having one end connected to the lead wire 8a via the filament of the discharge lamp La, and a series circuit of resistors R1 to R5 is provided between the other end of the lead wire 8b and the ground. A capacitor C5 and a diode D1 are connected in parallel to the resistor R5. When the discharge lamp La is lit, a voltage corresponding to the voltage across the discharge lamp La (lamp voltage) is generated in the capacitor C5, and it is determined that the lead wires 8a and 8b are connected to the discharge lamp La. . However, when the lead wire 8a or 8b is disconnected, the voltage of the capacitor C5 becomes substantially 0V, and it is determined that the lead wire 8a or 8b is disconnected and the disconnection is detected.

  Then, as shown in FIG. 21, the control circuit K8 is mounted on the back surface of the mounting substrate 1 in the same manner as the other electronic components 6, and between the electronic component 6 and the control circuit K8, the resin 2 is surrounded. And a second hole 11 for checking that the filling range of the resin 2 does not exceed a predetermined range is provided. The hole 11 is located in the vicinity of the control circuit K8, and the first hole 10 is displaced from the control circuit K8 toward the center of the mounting substrate 1.

  Then, when the resin 2 is poured into one point on the insulating plate 4 and the mounting substrate 1 is mounted in the metal case 3, the resin 2 flows around the electronic component 6 mounted on the back surface of the mounting substrate 1, and further, the mounting substrate. 1 spreads toward the control circuit K8 mounted on the back surface of the resin 1, but the resin 2 passes from the back surface side to the front surface side of the mounting substrate 1 through the first hole 10 provided between the electronic component 6 and the control circuit K8. The resin 2 does not enter the control circuit K8. Further, the second hole 11 located in the vicinity of the control circuit K8 can easily confirm that the resin 2 does not enter the control circuit K8 where it is desired to prevent the resin 2 from entering.

  Here, the disconnection detecting means of the control circuit K8 has a high impedance of several hundred kΩ or more, and when the resin 2 is in close contact with the disconnection detecting means, the resin 2 operates as a dielectric insulator, that is, a capacitor. As a result, the space between the mounting substrate 1 and the metal case 3 via the resin 2 becomes a charging part and capacitively couples, causing malfunction in detection of disconnection. However, in this embodiment, the resin 2 does not adhere to the control circuit K8 as described above, and it is possible to prevent a malfunction from occurring in the disconnection detection.

  In addition, in the said Embodiment 1-9, the electronic device A comprises the discharge lamp lighting device, and shall mount the metal case 3 in a lighting fixture.

1 is a side cross-sectional view illustrating a configuration of an electronic device according to a first embodiment. It is a top view same as the above. It is an enlarged view which shows the penetration hole vicinity same as the above. It is the perspective view which looked at the penetration hole vicinity same as the above from the surface side of the mounting board | substrate. It is a figure which shows the circuit structure of the electronic device of Embodiment 2. FIG. It is a top view same as the above. It is end surface sectional drawing same as the above. It is a figure which shows the circuit structure of the electronic device of Embodiment 3. FIG. It is a top view same as the above. It is end surface sectional drawing same as the above. It is a figure which shows the circuit structure of the electronic device of Embodiment 4. It is a top view same as the above. FIG. 10 is a top view illustrating a configuration of an electronic device according to a fifth embodiment. FIG. 10 is a diagram illustrating a circuit configuration of an electronic device according to a sixth embodiment. It is a top view same as the above. FIG. 10 is a top view illustrating a configuration of an electronic device according to a seventh embodiment. It is end surface sectional drawing same as the above. FIG. 10 is a top view illustrating a configuration of an electronic device according to an eighth embodiment. It is end surface sectional drawing same as the above. FIG. 10 is a diagram illustrating a part of a control circuit according to a ninth embodiment. It is a top view same as the above. It is sectional drawing of the end surface of the conventional electronic device. It is a perspective view which shows the conduction | electrical_connection means of the conventional electronic device.

Explanation of symbols

A Electronic device 1 Mounting substrate 2 Resin 3 Metal case 4 Insulating plate 5 Electronic component 6 Electronic component 10 First hole 11 Second hole 20 Insertion hole

Claims (9)

In an electronic device that includes a mounting board on which a plurality of electronic components are mounted and a case that houses the mounting board, and that fills a predetermined range between one surface of the mounting board and the inner surface of the case, the mounting board is filled One or more first holes through which the resin at the time is inserted from one side of the mounting board to the other side are provided near the end of a predetermined range for filling the resin, and the resin filling range does not exceed the predetermined range One or more second holes for confirming this from the other surface side of the mounting substrate are provided outside a predetermined range filled with resin. A power supply terminal to which a commercial power supply is connected and an inductor provided in a filter circuit inserted in a power supply line connected to the power supply terminal are mounted on the other surface of the mounting substrate, and the first hole is an inductor of the filter circuit The electronic device according to claim 1, wherein the electronic device is provided in the vicinity, and the second hole is provided in the vicinity of a power supply terminal. The mounting board includes an AC / DC conversion circuit that converts a commercial power source into a DC voltage, an inverter circuit that converts a DC voltage output from the AC / DC conversion circuit into a high-frequency voltage, and an inductor connected to the output of the inverter circuit A series resonance circuit composed of a capacitor and an output terminal connected to both ends of the capacitor of the series resonance circuit are mounted, and an inductor and an output terminal of the series resonance circuit are mounted on the other surface of the mounting substrate, 2. The electronic device according to claim 1, wherein the first hole is provided in the vicinity of the inductor of the series resonance circuit, and the second hole is provided in the vicinity of the output terminal. The inductor is a winding component in which a winding is wound around a core, and the resin inserted from one side of the mounting board to the other side through the first hole is in close contact with the core. Electronic equipment according to 2 or 3. Mounted on the mounting board are a power supply terminal to which a commercial power supply is connected, a rectifier for full-wave rectification of the commercial power input via the power supply terminal, and a lighting circuit for converting the rectified output of the rectifier into a high-frequency voltage. 2. The power supply terminal and the rectifier are mounted on the other surface of the mounting substrate, and the first hole is provided in the vicinity of the rectifier, and the second hole is provided in the vicinity of the power supply terminal. Electronic equipment. The mounting board includes a power supply terminal to which a commercial power supply is connected, a surface-mounted rectifier that performs full-wave rectification on the commercial power input via the power supply terminal, and a lighting circuit that converts the rectified output of the rectifier into a high-frequency voltage. Are mounted, the rectifier is mounted on one surface of the mounting substrate, the power supply terminal is mounted on the other surface of the mounting substrate, and the first hole is provided in the vicinity of the surface mounting type rectifier, 2. The electronic device according to claim 1, wherein when the rectifier is mounted on the other surface of the mounting substrate, a hole through which the lead terminal of the rectifier is inserted is used, and the second hole is provided in the vicinity of the power supply terminal. The case has substantially the same potential as the ground of the power supply, and an earth capacitor is mounted on the mounting board, and a part of the copper foil pattern on the mounting board is electrically connected to one end of the earth capacitor. The other end of the first electrode is electrically connected to the case through a ground connection provided on the mounting substrate, and the second hole is provided in the vicinity of the ground connection. Or electronic equipment as described. Both ends are inserted into a pair of holes facing each other across the opening of the insertion hole provided in the mounting substrate, and electrically connected to the other end of the earth capacitor through one of the pair of holes. A jumper wire is provided, and the other end of the ground capacitor is electrically connected to the case via a screw that is in contact with the jumper wire and a screw hole provided in the case via the insertion hole. The electronic device according to claim 7, wherein the second hole is the other of the pair of holes. 9. The electronic apparatus according to claim 1, wherein the plurality of electronic components mounted on the mounting substrate constitute a discharge lamp lighting device that lights a discharge lamp, and the case is mounted on a lighting fixture. .

Images