JP5973029B2 - Light bulb-type fluorescent lamp and lighting device - Google Patents

Description

  The present invention has a plate for fixing an arc tube and a housing in which an electronic component is housed and a base is mounted, and suppresses an increase in temperature of one surface-mounted electronic component having a low heat resistance tolerance. The present invention relates to a bulb-type fluorescent lamp. The present invention also relates to an illumination device for the bulb-type fluorescent lamp.

  Conventionally, a housing, a lighting circuit housed in the housing, a base attached to one end side of the housing, and attached to the other end side of the housing, an electrode portion is provided on the side away from the lighting circuit from the central portion in the longitudinal direction. In a bulb-type fluorescent lamp having an arc tube arranged, a plate is press-fitted from an opening of the housing with an input line connected to the lighting circuit passing through the inside of the housing, and the housing fitting portion is engaged with the engaging portion A bulb-type fluorescent lamp has been proposed in which the plate is fixed to the housing by engaging with the housing (see, for example, Patent Document 1).

  Another conventional light bulb-type fluorescent lamp has a metal plate with a spiral arc tube (light emitting part) and a lighting circuit, and a base that is a power input end that can be screwed into a socket for an incandescent light bulb. A resin housing provided and a glass globe covering the arc tube. The globe has an outer ring portion fixed to the plate. Similarly, the outer ring portion of the housing is fixedly held on the plate. The plate is provided with an engaging portion, and the housing is provided with a claw. The plate and the housing are fixed by engaging the engaging portion and the claw (see, for example, Patent Document 2).

  In addition, another conventional bulb-type fluorescent lamp is used to light a fluorescent tube in order to reduce the temperature of a smoothing electrolytic capacitor even when a small base or a voltage doubler lighting circuit is adopted. A cover having a base at the end is provided on the non-fluorescent tube side of the circuit board on which the circuit is formed. The smoothing electrolytic capacitor forming the lighting circuit is disposed along the inner surface of the cover, and the lead wire is bent and mounted on the circuit board. Thereby, the arrangement | positioning position of the electrolytic capacitor for smoothing is arrange | positioned keeping a predetermined distance from a circuit board, and relieve | moderates the influence of the heat_generation | fever from a circuit board (for example, refer patent document 3).

  Furthermore, another conventional bulb-type fluorescent lamp includes a lighting unit for lighting the arc tube in a case that holds the arc tube. The lighting unit is formed by mounting a plurality of electronic components on a resin substrate. The plurality of electronic components include a DC cut capacitor and a power transistor that also has a function of being able to stop lighting of the arc tube when it reaches a predetermined temperature, and the DC cut capacitor is a resin substrate. Is mounted at a position near the power transistor, and a slit is formed near the DC cut capacitor (see, for example, Patent Document 4).

JP 2000-315402 A JP 2008-288130 A JP 2006-24544 A JP 2008-84817 A JP 2010-192344 A JP-A-7-65613 JP 2009-59707 A Republished Patent No. 00/58997 JP 2006-93044 A JP 2004-303619 A Japanese Patent Laid-Open No. 2004-6204

  However, in the light bulb-type fluorescent lamps described in Patent Documents 1 and 2, the plate and the housing are only fixed by engaging the engaging portion and the claw. Due to this variation, there is a problem that the engagement between the engaging portion and the claw is insufficient and the housing may come off from the plate.

  In addition, the light bulb-type fluorescent lamps described in Patent Documents 3 and 4 are switching elements (surface-mounting electronic components) having a low heat resistance that are mounted on the solder surface of the substrate of the inverter unit of the light bulb-type fluorescent lamp. There was a problem that the temperature was high.

  The present invention provides a bulb-type fluorescent lamp that suppresses the temperature rise of an electronic component disposed on a substrate, and a lighting device for the bulb-type fluorescent lamp.

The bulb-type fluorescent lamp according to the present invention is
A light-emitting unit composed of an arc tube and having a lamp lead;
A plate to which the light emitting unit is fixed;
An inverter part that is fixed to the plate and has an electronic component mounted on a substrate, and lights the light emitting part,
A housing that houses the inverter and fits into the plate;
Comprising at least one electronic component of the electronic components mounted on the housing side of the substrate, and an adhesive for bonding and fixing the housing;
The plate is
One plate inner peripheral convex portion that is formed on the inner periphery on the housing side and holds the end of the substrate;
A protrusion protruding inward from the inner periphery of the housing side;
Have
The substrate is formed on the outer periphery, and a notch that fits with the protruding portion of the plate;
I have a,
The plate inner peripheral convex portion is characterized by pressing an end portion on the opposite side to the end portion where the notch fitted with the protruding portion is provided .

  The light bulb shaped fluorescent lamp according to the present invention can suppress the temperature rise of the electronic component.

FIG. 3 shows the first embodiment and is a front view showing a light bulb shaped fluorescent lamp 100. FIG. AA sectional drawing of FIG. FIG. 3 shows the first embodiment and is a view showing the light emitting unit 10 ((a) is a front view, (b) is a view seen from the plate 20 side). FIG. 5 shows the first embodiment and is a perspective view of the plate 20. FIG. 5 shows the first embodiment, and is a plan view of the plate 20 (viewed from the housing 30 side). FIG. 5 shows the first embodiment and is a side view of the plate 20. FIG. 5 shows the first embodiment, and is a front view of the housing 30. FIG. 5 shows the first embodiment and is a side view of the housing 30 (plate 20 side). FIG. 5 shows the first embodiment, and is a side view of the housing 30 (on the base 40 side). BB sectional drawing of FIG. AA sectional drawing of FIG. CC sectional drawing of FIG. FIG. 5 shows the first embodiment, and is a front view showing a state where the light emitting unit 10 is fixed to the plate 20. FIG. 5 shows the first embodiment, and is a plan view showing a state where the light emitting unit 10 is fixed to a plate 20 (viewed from the housing 30 side). FIG. 5 shows the first embodiment, and is a plan view of the inverter unit 50 (viewed from the housing 30 side). FIG. 5 shows the first embodiment and is a plan view of the inverter unit 50 (viewed from the plate 20 side). FIG. 5 shows the first embodiment, and is a side view of the inverter unit 50. FIG. 5 is a diagram showing the first embodiment, and is a longitudinal sectional view showing a state where an inverter unit 50 is attached to a plate 20 to which a light emitting unit 10 is fixed. FIG. 5 shows the first embodiment, and is a plan view showing a state where the inverter unit 50 is attached to the plate 20 to which the light emitting unit 10 is fixed (see the inverter unit 50). FIG. 19 shows the first embodiment, and is a longitudinal sectional view showing a state where the housing 30 is attached to FIG. 18. The B section enlarged view of FIG. FIG. 5 shows the first embodiment and is a configuration diagram of a lighting device 200. FIG.

Embodiment 1 FIG.
(Overview)
The light bulb-type fluorescent lamp of the present embodiment is a fluorescent lamp in which a light emitting part in which a plurality of U-shaped arc tubes are joined and an inverter circuit for lighting the light emitting part at a high frequency are integrated and the same base as the light bulb is attached.

  Then, at least one electronic component constituting the inverter circuit is disposed in the vicinity of the housing, and the housing and the one electronic component are coupled with an adhesive (for example, silicon) having excellent thermal conductivity, One feature is that the temperature rise of one electronic component is suppressed.

  In addition to fixing a light-emitting portion joined with a plurality of U-shaped arc tubes, a plate for fixing a substrate of an inverter circuit and a housing incorporating the inverter circuit are not only fixed by fitting, but also a housing → adhesive The other feature is that it is fixed by the route of the one electronic component → the substrate → the plate.

  Furthermore, in order to suppress the temperature rise of surface-mounted electronic components (for example, switching elements) with low tolerance for heat that are placed on the board, the board and the housing are fixed with an adhesive with excellent thermal conductivity. Another feature is that the surface-mounted electronic component having a low heat resistance tolerance is mounted so as to face the one electronic component.

  Hereinafter, the bulb-type fluorescent lamp of the present embodiment will be described with reference to the drawings. 1 and 2 are diagrams showing Embodiment 1, FIG. 1 is a front view showing a bulb-type fluorescent lamp 100, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

The bulb-type fluorescent lamp 100 includes at least the following elements.
(1) A light emitting unit 10 in which three U-shaped arc tubes are joined;
(2) A plate 20 for fixing the light emitting unit 10 (by an adhesive (silicone or the like)) and fixing the inverter unit 50 (see FIG. 2) (the fixing method will be described later);
(3) A housing 30 that houses the inverter unit 50, is fitted with the same base 40 as the incandescent bulb, and fits into the plate 20;
(4) a base 40 attached to the end of the housing 30 opposite to the plate 20;
(5) An inverter unit 50 having a substrate (described later) fixed to the plate 20 and housed in the housing 30;
(6) One electronic component (to be described later) of the inverter unit 50 is disposed close to the housing 30, and an adhesive 60 (having good thermal conductivity) applied between the housing 30 and the one electronic component. For example, silicon, see FIG.

  This embodiment is characterized by the configuration of the housing 30, the inverter unit 50, and the plate 20. Therefore, these will be described in detail. The light emitting unit 10 and the base 40 are simply touched.

  FIG. 3 is a diagram illustrating the first embodiment, and is a diagram illustrating the light emitting unit 10 ((a) is a front view, and (b) is a diagram viewed from the plate 20 side). The light emitting unit 10 joins three U-shaped tubes 10a (light emitting tubes) at joints 10b (two places) to form one discharge path. Stems (not shown) having electrodes and the like are attached to both ends of the discharge path, and two lamp lead wires 10c are drawn out from both ends of the discharge path. There are a total of four lamp lead wires 10c. The three U-shaped tubes 10a are bonded in the vicinity of the crotch portion of the U-shaped tube 10a with an adhesive 10d.

  4 to 6 show the first embodiment, FIG. 4 is a perspective view of the plate 20, FIG. 5 is a plan view of the plate 20 (viewed from the housing 30 side), and FIG. 6 is a side view of the plate 20. .

  The plate 20 will be described with reference to FIGS. The plate 20 has a dish shape with a generally circular shape. One side (housing 30 side) is open. Further, on the light emitting unit 10 side, six circular holes 20a into which the U-shaped tube 10a is inserted are formed. The material of the plate 20 is, for example, PET (polyethylene terephthalate resin).

  In addition, on the inner periphery of the plate 20 on the housing 30 side, protruding portions 20b that protrude inward and extend in the axial direction are formed at substantially equal intervals in the circumferential direction. A substrate mounting surface 20b-1 on which a substrate (to be described later) of the inverter unit 50 is mounted is formed on these protruding portions 20b. A stepped portion is provided at a portion that enters a predetermined length from the end portion of the protruding portion 20b on the housing 30 side, and this stepped portion is the substrate placement surface 20b-1.

  Further, six ribs 20d extending in the radial direction are formed radially on the light emitting portion 10 side end portion of the protruding portion 20b (the surface on the housing 30 side of the surface where the six hole portions 20a are formed). As will be described later, after the light emitting unit 10 is inserted into the circular hole 20a of the plate 20, it is fixed by an adhesive (silicon or the like). At that time, by providing ribs 20d on the surface of the plate 20 on which the six holes 20a are formed on the housing 30 side, the area on which the adhesive of the plate 20 is placed increases, and the light-emitting unit 10 is held. Strength (adhesive strength) is improved.

  Further, on the inner periphery of the end portion of the plate 20 on the housing 30 side, when a substrate (described later) of the inverter unit 50 is attached to the plate 20, one plate inner peripheral convex portion 20d-1 that holds the substrate is formed. At that time, the six projecting portions 20b of the plate 20 are fitted with notches formed on the outer periphery of the substrate.

  As will be described later, in addition to the above, the substrate of the inverter unit 50 and the plate 20 are fixed by winding the four lamp lead wires 10c of the light emitting unit 10 around pins (for example, tin-plated copper) provided on the substrate. (This is called wrapping.)

  In addition, positioning grooves 20e into which positioning ribs 30c (see, for example, FIG. 11) of the housing 30 to be described later are inserted are formed at approximately 180 ° intervals at the end portion of the plate 20 on the housing 30 side.

  Further, four engagement holes 20c are formed at substantially equal intervals in the circumferential direction in the vicinity of the end portion on the housing 30 side of the plate 20 to engage a convex portion 30d of the housing 30 described later (see, for example, FIG. 11). ing.

  7 to 12 show the first embodiment. FIG. 7 is a front view of the housing 30, FIG. 8 is a side view of the housing 30 (plate 20 side), and FIG. 9 is a side view of the housing 30 (base 40 side). 10 is a BB cross-sectional view of FIG. 9, FIG. 11 is an AA cross-sectional view of FIG. 9, and FIG. 12 is a CC cross-sectional view of FIG.

  The housing 30 will be described with reference to FIGS. The housing 30 includes an inverter portion storage portion 30a for storing the inverter portion 50 and a base fitting portion 30b to which the base 40 is fitted. The inverter housing portion 30a has a substantially circular cross section and a shape (tapered portion 30f) in which the diameter gradually increases from the base fitting portion 30b toward the end portion on the plate 20 side. Further, the boundary between the base fitting portion 30b and the tapered portion 30f is a stepped portion 30e. The material of the housing 30 is, for example, PBT (polybutylene terephthalate resin).

  The housing 30 includes two positioning ribs 30c on the inner periphery of the end portion on the plate 20 side (for example, FIGS. 8 and 11). The two positioning ribs 30c are arranged at an interval of about 180 °. When the housing 30 is fitted into the plate 20, the positioning rib 30 c is inserted into the positioning groove 20 e of the plate 20, and the housing 30 is positioned in the circumferential direction.

  As shown in FIG. 11, the positioning rib 30c has a plate 20 side end cut out in a substantially L shape, and a positioning rib step 30c-1 is formed. When the housing 30 is fitted to the plate 20, the end portion on the housing 30 side of the plate 20 comes into contact with the positioning rib step portion 30c-1.

  Further, the housing 30 is a convex portion that engages with the four engagement holes 20c of the plate 20 when the housing 30 is fitted to the plate 20 on the inner periphery of the inverter portion storage portion 30a in the vicinity of the end portion on the plate 20 side. 30d (see, for example, FIG. 11) is formed so as to protrude inward. Similar to the four engagement holes 20c of the plate 20, four protrusions 30d are formed at substantially equal intervals in the circumferential direction.

  FIGS. 13 and 14 are diagrams showing the first embodiment. FIG. 13 is a front view showing a state in which the light emitting unit 10 is fixed to the plate 20. FIG. 14 is a plan view showing a state in which the light emitting unit 10 is fixed to the plate 20. (Viewed from the housing 30 side).

  As for the light emission part 10, the edge part on the opposite side of the crotch part of each U-shaped pipe | tube 10a is inserted in the hole 20a of the plate 20. As shown in FIG. And as shown in FIG. 14, the light emission part 10 is fixed to the plate 20 with the adhesive agent 21 (a silicon | silicone etc. which are shown by hatching in FIG. 14).

  At this time, since the rib 20d is provided on the surface on the housing 30 side of the surface on which the six hole portions 20a of the plate 20 are opened, the area on which the adhesive 21 of the plate 20 is mounted increases, Holding power (adhesion strength) is improved.

  15 to 17 show the first embodiment. FIG. 15 is a plan view of the inverter unit 50 (viewed from the housing 30 side), and FIG. 16 is a plan view of the inverter unit 50 (viewed from the plate 20 side). 17 is a side view of the inverter unit 50.

  The inverter unit 50 will be described with reference to FIGS. 15 to 17. The inverter unit 50 includes an electronic component 53 (one electronic component, for example, a choke coil) and other electronic components 56 on a component surface (a surface opposite to the solder surface in FIG. 17) of the substrate 51 (single-sided substrate). Be placed. In the electronic components 53 and 56 arranged on the component surface of the substrate 51 (single-sided substrate), the lead wires penetrate the substrate 51 and are soldered to a pattern (not shown) on the solder surface. Electronic parts such as the electronic parts 53 and 56 are called insertion-type parts or radial parts.

  As will be described later, this embodiment is characterized in that the temperature rise of the electronic component 53 (for example, a choke coil) is suppressed.

  Then, another electronic component 56 is disposed close to the electronic component 53 that is cooled by heat conduction to the housing 30. For example, it is preferable that the other electronic components 56 be arranged close to each other within 5 mm around the electronic component 53. With such a configuration, the temperature rise of other electronic components 56 can also be suppressed.

  15 shows the component surface of the substrate 51 (single-sided substrate) (the surface on the opposite side of the solder surface in FIG. 17), but the illustration of the other electronic components 56 is omitted here because the drawing is complicated. doing.

  As shown in FIG. 15, four pins 52 to which the lamp lead wire of the light emitting unit 10 is connected stand in the vicinity of the outer peripheral edge of the substrate 51. In FIG. 17, two of them are visible (the other two are hidden by the two visible pins 52).

  Further, as shown in FIG. 15, a pair of substrate lead wires 54 that electrically connect the substrate 51 and the base 40 are drawn out to the housing 30 side in the vicinity of the outer peripheral edge of the substrate 51 (visible in FIG. 17). Not) A substrate lead wire 54 shown in FIG. 16 indicates the end portion on the substrate 51 side of the substrate lead wire 54 to be soldered on the solder surface.

  As shown in FIGS. 16 and 17, an electronic component 53 (for example, a heat radiated from the housing 30 via an adhesive as will be described later by a choke coil or the like) is an insertion-type component, and its lead wire 53a ( For example, three pieces pass through the hole of the substrate 51, are drawn out to the solder surface side, and are soldered to the solder surface. Therefore, the three lead wires 53a penetrating the substrate 51 are soldered to the substrate 51 as compared with the surface mount component, and the electronic component 53 and the substrate 51 are firmly fixed by the component having the three lead wires 53a. As a result, the housing 30 and the plate 20 are more firmly fixed. The electronic component 53 has at least three lead wires 53a.

  Surface-mounted electronic components are mounted on the solder surface. In FIG. 17, the surface-mounted electronic components other than the switching element 55 are not shown. FIG. 16 shows a switching element 55 (a switching element such as a transistor or an FET (field effect transistor)) which is one of surface-mounted electronic components. The switching element 55 is an electronic component having the highest temperature and a low heat resistance tolerance among the electronic components of the inverter unit 50. And since it exists in the position (it is in the plate 20 close to the electrode side edge part of the light emission part 10) which receives the influence of the heat | fever of the light emission part 10, it is preferable to cool so that a temperature rise may be suppressed. Therefore, the switching element 55 is disposed so as to face the electronic component 53 (for example, a choke coil or the like and radiated from the housing 30 via an adhesive as will be described later) and the substrate 51. . Furthermore, it is more preferable that the switching element 55 is disposed in a range inside the base area portion of the electronic component 53.

  18 and 19 show the first embodiment. FIG. 18 is a longitudinal sectional view showing a state where the inverter unit 50 is attached to the plate 20 to which the light emitting unit 10 is fixed. FIG. 19 shows the light emitting unit 10 fixed. FIG. 6 is a plan view showing a state where the inverter unit 50 is attached to the plate 20 (see the inverter unit 50).

  The inverter unit 50 is attached to the plate 20 to which the light emitting unit 10 is fixed. First, under the plate inner peripheral convex portion 20d-1 (FIGS. 4 and 19) formed on the inner periphery of the end portion on the housing 30 side of the plate 20, the side opposite to the end portion where the pin 52 of the substrate 51 is provided. The end (left side in FIG. 19) is inserted. Further, the notch 57 of the substrate 51 is fitted into one of the six projecting portions 20 b of the plate 20.

  Next, the four lamp lead wires 10c (FIG. 14) of the light emitting unit 10 are wound around four pins 52 (for example, tin-plated copper) provided on the substrate 51. By this lapping, the substrate 51 and the plate 20 of the inverter unit 50 are further fixed.

  Thus, the inverter part 50 and the plate 20 are reliably fixed by fitting (engagement) and lapping.

  20 and 21 are diagrams showing the first embodiment. FIG. 20 is a longitudinal sectional view showing a state where the housing 30 is attached to FIG. 18, and FIG. 21 is an enlarged view of a portion B in FIG.

  Next, the housing 30 is attached to the plate 20. First, the two positioning ribs 30 c (FIG. 8) of the housing 30 are inserted into the two positioning grooves 20 e of the plate 20. At the same time, the four protrusions 30d (FIG. 8) of the housing 30 are fitted into the four engagement holes 20c (FIG. 6) of the plate 20.

  The plate 20 and the housing 30 are fixed by fitting the four protrusions 30d of the housing 30 and the four engagement holes 20c of the plate 20.

  The inverter unit 50 has a layout in which the electronic component 53 (for example, a choke coil) of the inverter unit 50 is close to the housing 30. Further, an adhesive 60 (for example, silicon) is filled between the housing 30 and the electronic component 53.

  By filling the adhesive 60 (for example, silicon) between the housing 30 and the electronic component 53, the temperature rise of the electronic component 53 is suppressed.

  Further, with the electronic component 53 and the substrate 51 in between, a switching element 55 that is a heat-generating electronic component and is provided at a position affected by the heat of the light emitting unit 10 is disposed so as to face each other. Thereby, the temperature rise of the switching element 55 is also suppressed.

  The housing 30 and the electronic component 53 are fixed with an adhesive 60. In the electronic component 53, the lead wire penetrates the substrate 51 and is soldered to the pattern of the substrate 51 on the solder surface (FIG. 17). As described above, since the substrate 51 is fixed to the plate 20 by fitting and lapping, the housing 30 is also attached to the plate 20 by the combination of the housing 30 → the adhesive 60 → the electronic component 53 → the substrate 51 → the plate 20. It will be fixed.

The plate 20 and the housing 30 are fixed by the following two methods. (1) Fitting of the four protrusions 30d of the housing 30 and the four engagement holes 20c of the plate 20;
(2) The housing 30 → the adhesive 60 → the one electronic component 53 → the substrate 51 → the plate 20.

Next, the operation of the step portion 30e of the housing 30 will be described. Providing the step portion 30e in the housing 30 has the following effects.
(1) The amount of the adhesive 60 used to bond the housing 30 and the electronic component 53 can be reduced. The space formed by the taper portion 30f, the step portion 30e, and the electronic component 53 of the housing 30 is filled with the adhesive 60. This space has the step portion 30e, so that the space 30 is not provided with the step portion 30e. Volume is reduced. Accordingly, the amount of adhesive 60 used can be reduced.
(2) When mounting the bulb-type fluorescent lamp 100 on a lighting fixture, if the housing 30 has a stepped portion 30e, the interference between the lighting fixture and the housing 30 can be reduced compared to the case where there is no stepped portion 30e, Wearability to lighting equipment is improved.

  FIG. 22 is a diagram illustrating the first embodiment and is a configuration diagram of the illumination device 200. The lighting device 200 can be used by mounting the bulb-type fluorescent lamp 100 of the present embodiment on the socket 202 of the lighting fixture 201 for an incandescent lamp. By using the bulb-type fluorescent lamp 100 of the present embodiment, the life of the lamp can be extended, and the labor for lamp replacement can be reduced.

As described above, the bulb-type fluorescent lamp according to this embodiment is
A light-emitting unit composed of an arc tube and having a lamp lead;
A plate to which the light emitting part is fixed;
Inverter part that is fixed to the plate and electronic components are mounted on the substrate and turns on the light emitting part,
A housing that houses the inverter and fits into the plate;
An adhesive for bonding and fixing at least one of the electronic components mounted on the housing side of the substrate and the housing;
A surface mounting electronic component is provided that is surface-mounted on the solder surface of the substrate of the inverter unit and is disposed to face the electronic component and the substrate therebetween.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that one surface-mounted electronic component is an electronic component having a lower heat resistance margin than the other electronic components.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that one surface-mounted electronic component is arranged in a range inside a base area portion of one electronic component.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that one electronic component is arranged close to the housing.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that one electronic component is a choke coil.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that one surface-mounted electronic component is a switching element.

The bulb-type fluorescent lamp according to this embodiment includes a taper-shaped inverter portion storage portion whose diameter gradually increases toward the plate side end portion, in which the housing stores the inverter portion,
A step portion is formed on the opposite side of the plate side end of the inverter housing portion,
One electronic component that is bonded and fixed to the housing with an adhesive is housed in a space formed by the tapered shape and the stepped portion.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that other electronic components are arranged close to one of the electronic components of the inverter section.

  The bulb-type fluorescent lamp according to this embodiment is characterized in that other electronic components are arranged within 5 mm close to one of the electronic components of the inverter section.

  An illumination device according to this embodiment includes the light bulb shaped fluorescent lamp according to any one of claims 1 to 9 and a lighting fixture to which the light bulb shaped fluorescent lamp is mounted.

  In the bulb-type fluorescent lamp according to this embodiment, one surface-mounted electronic component that is surface-mounted on the solder surface of the substrate of the inverter unit is disposed so as to face each other with the one electronic component and the substrate interposed therebetween. The temperature rise of one surface-mounted electronic component can be suppressed.

  In the bulb-type fluorescent lamp according to this embodiment, one surface-mounted electronic component is an electronic component with less heat tolerance than the other electronic components, so that the durability of one surface-mounted electronic component is improved. can do.

  In the bulb-type fluorescent lamp according to this embodiment, one surface-mounting electronic component is arranged in a range inside the base area portion of one electronic component. Temperature rise can be suppressed.

  In the bulb-type fluorescent lamp according to this embodiment, one electronic component is arranged close to the housing, and therefore, the temperature rise of the one electronic component can be suppressed.

  In the bulb-type fluorescent lamp according to this embodiment, the choke coil is disposed close to the housing, so that the temperature rise of the choke coil can be suppressed.

  The bulb-type fluorescent lamp according to this embodiment can suppress the temperature rise of the switching element, which is one surface-mounted electronic component.

  The bulb-type fluorescent lamp according to this embodiment includes a taper-shaped inverter portion storage portion whose diameter gradually increases toward the plate-side end portion, in which the housing stores the inverter portion, and the plate of the inverter portion storage portion A step part is formed on the opposite side of the side end part, and one electronic component that is bonded and fixed to the housing by an adhesive is housed in the space formed by the taper shape and the step part. Can be reduced.

  In the bulb-type fluorescent lamp according to this embodiment, the other electronic components are arranged close to one of the electronic components of the inverter unit, so that the temperature rise of the other electronic components can be suppressed.

  In the bulb-type fluorescent lamp according to this embodiment, one electronic component of the inverter unit is placed close to another electronic component within 5 mm, so that the temperature of the other electronic component is reliably increased. Can be suppressed.

  The illuminating device according to this embodiment includes the light bulb-type fluorescent lamp and a lighting fixture to which the light bulb-type fluorescent lamp is attached, so that the life of the lamp is extended and the labor for replacing the lamp can be saved.

  10 light emitting part, 10a U-shaped tube, 10b joint part, 10c lamp lead wire, 10d adhesive, 20 plate, 20a hole part, 20b protrusion part, 20b-1 substrate mounting surface, 20c engagement hole, 20d rib, 20d -1 Plate inner peripheral convex part, 20e Positioning groove, 21 Adhesive, 30 Housing, 30a Inverter part accommodating part, 30b Base fitting part, 30c Positioning rib, 30c-1 Positioning rib step part, 30d Convex part, 30e Step Part, 30f taper part, 40 base, 50 inverter part, 51 substrate, 52 pin, 53 electronic component, 53a lead wire, 54 substrate lead wire, 55 switching element, 56 electronic component, 60 adhesive, 100 bulb-type fluorescent lamp, 200 lighting device, 201 lighting fixture, 202 socket.

Claims (7)

A light-emitting unit composed of an arc tube and having a lamp lead;
A plate to which the light emitting unit is fixed;
An inverter part that is fixed to the plate and has an electronic component mounted on a substrate, and lights the light emitting part,
A housing that houses the inverter and fits into the plate;
Comprising at least one electronic component of the electronic components mounted on the housing side of the substrate, and an adhesive for bonding and fixing the housing;
The plate is
One plate inner peripheral convex portion that is formed on the inner periphery on the housing side and holds the end of the substrate;
A protrusion protruding inward from the inner periphery of the housing side;
Have
The substrate is formed on the outer peripheral, it has a cutout for engagement with the projecting portion of the plate,
The plate inner peripheral convex portion is a light bulb-type fluorescent lamp in which an end portion on the opposite side to an end portion provided with the notch to be fitted to the protruding portion is pressed .   The bulb-type fluorescent lamp according to claim 1, wherein the plate forms a substrate mounting surface on which the substrate of the inverter unit is mounted by the protruding portion.   The bulb-type fluorescent lamp according to claim 2, wherein the protruding portion is fitted into the notch of the substrate, and the substrate and the plate of the inverter portion are fixed. The one electronic part is insertion-type parts, in a state where the lead wire of the insertion-type parts is drawn on the solder side through the hole of the substrate from the component side of the substrate, Tei soldered on the solder side And
The board is provided with a pin at an end provided with the notch to be fitted with the protruding portion of the component surface,
The end portion of the substrate opposite to the end portion on which the pin is provided is submerged under the inner peripheral convex portion of the plate, and the protruding portion is fitted into the notch of the substrate, The substrate is fixed to the plate in a state where the solder surface is mounted on the substrate mounting surface and the lamp lead wire is wound around a pin provided on the component surface of the substrate. The described bulb-type fluorescent lamp.   The bulb-type fluorescent lamp according to claim 2, wherein the projecting portion has a stepped portion that forms the substrate mounting surface at a portion that enters a predetermined length inside from the end on the housing side.   The bulb-type fluorescent lamp according to any one of claims 1 to 5, wherein a plurality of the protruding portions and the notches are formed at substantially equal intervals in the circumferential direction.   An illumination device comprising: the bulb-type fluorescent lamp according to any one of claims 1 to 6; and a lighting fixture to which the bulb-type fluorescent lamp is attached.

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