JP4802615B2 - LC composite parts - Google Patents

Description

  The present invention relates to an LC composite component in which inductance and capacitance are formed in a composite manner by laminating sheet-like windings.

  In recent years, with the miniaturization of electronic devices, there has been a demand for a reduction in the number of electronic components used in the electronic device, and miniaturization and low profile of individual electronic components. For example, as shown in FIG. There is provided an LC composite component 1 in which the number of components is reduced by forming a composite with a capacitance and the height is reduced by using a planar type winding.

  The LC composite component 1 shown in FIG. 13 is formed by laminating a plurality of rectangular plate-like planar substrates 10, and a winding portion 12 made of a conductor pattern is formed on the surface of each substrate 10. A plurality of inter-layer connection terminal portions 13 made of through-holes are formed along the short side at both ends in the longitudinal direction. The terminal portions 13 provided on each substrate 10 are formed at positions overlapping in the vertical direction, and lead terminals 40 for mounting on each terminal portion 13 by a method such as soldering on a printed wiring board (not shown), for example. Is connected. In addition, U-shaped cores 30 are attached to the plurality of substrates 10 from both sides in the stacking direction. Thus, when a plurality of planar substrates 10 are stacked, the winding portion 12 formed on each planar substrate 10 is stacked via the planar substrate 10 which is an insulator, and an inductance and a capacitance are formed. A part of the terminal portion 13 is electrically connected to the winding portion 12, and the winding portion 12 is electrically connected to the lead terminal 40 via the terminal portion 13.

  In the LC composite component 1 described above, the temperature rise in the winding portion 12 having a high current density is large, and in particular, in the laminating direction of the substrate 10, heat generation of the winding portion 12 tends to occur nearer the center portion. There was a problem that the loss increased. In addition, since the temperature of the substrate 10 rises due to the heat generation of the winding portion 12, a material having excellent heat resistance must be used as the material of the substrate 10, and there is a problem that the cost is increased. In addition, since the substrate 10 functions as an insulator for forming a capacitance, the material of the substrate 10 is selected based on the dielectric constant. However, the material that can be used is restricted in order to increase the heat resistance. Therefore, there has been a problem that the degree of freedom in material selection is reduced. Further, in order to prevent an increase in the size of the component, a sufficient space cannot be ensured to form the terminal portion 13 for interlayer connection, and the winding portion 12 and the lead terminal 40 are electrically connected. In some cases, the contact resistance increases and the loss increases.

  Problems such as heat generation and heat dissipation due to the downsizing of the components as described above are also a problem in electronic components other than the LC composite component 1 having the sheet-like (planar type) winding portion 12. Patent Documents 1 to 3 have proposed electronic components.

  For example, in Patent Document 1, a winding portion is formed of a plate-shaped coil plate, and the coil plate is stretched and its tip is bent to form a mounting terminal.

  Moreover, in the thing shown by patent document 2, the winding part with a large current density uses the edgewise coil which formed with one continuous conductor and ensured the cross-sectional area of the winding part enough, and current density A planar type winding is used for the winding portion having a small diameter.

Furthermore, in what is shown in Patent Document 3, the first winding portion is housed in a housing case formed of an insulator having excellent thermal conductivity, and is electrically insulated from the first winding portion. A heat conducting part formed separately is connected to the second winding part.
JP-A-5-326290 Japanese Patent No. 2962707 JP-A-6-151207

  By the way, in what is shown by patent document 1 mentioned above, there exists an effect which reduces the loss by the contact resistance of a coil part and a connection end, and what is shown by patent document 2 is a coil part with much larger current density. Suppresses heat generation of parts by taking measures such as increasing the cross-sectional area of the winding part without providing connection terminals as much as possible.

  However, the one described in Patent Document 1 can reduce the amount of heat generated in the winding part or reduce the heat generation in the winding part only by reducing the contact resistance between the winding part and the connection terminal or the mounting terminal. Efficient heat dissipation is not taken into account, and a significant reduction in the amount of heat generated by the components cannot be expected.

  Moreover, in the thing of patent document 2, when size reduction of components is required, since the cross-sectional area of a coil | winding part cannot fully be ensured, the significant reduction effect of component heat generation cannot be expected. In addition, since a plurality of winding portions of different materials or forming methods are provided, there are problems that the manufacturing process increases, the manufacturing process becomes complicated, and the number of parts increases, resulting in an increase in cost.

  Furthermore, in the thing of patent document 3, the insulator excellent in heat dissipation is required, and there existed a problem that the shape of components will change a lot with the performance of insulators, such as thermal conductivity performance and pressure | voltage resistance performance. In addition, since a case formed of an insulator and a jig for a heat conduction unit are separately required, there is a problem that the manufacturing process becomes complicated and the cost is increased.

  The present invention has been made in view of the above problems, and its object is to provide an LC composite that can be formed without using a special jig and can efficiently dissipate heat generated in the winding portion to the outside. To provide parts.

In order to achieve the above object, the invention of claim 1 is directed to an outer periphery of a laminate of a plurality of winding configuration planar substrates each having a winding portion formed of a conductor pattern formed on a surface thereof, and a winding configuration planar substrate. Between the laminated winding configuration planar substrates, and a core disposed along the plurality of winding configuration planar substrates, and an insulator disposed between the winding portions formed on the plurality of winding configuration planar substrates. Interlayer connection terminals used for connection are provided on each winding configuration planar substrate, and a plurality of winding configuration planar substrates are laminated to form inductance and capacitance, and heat generated in the winding portion is generated. provided the heat dissipation means for dissipating the laminate, the heat radiating means comprises a heat radiating planar substrate on which the conductor pattern is formed for heat dissipation on the front and back, a conductor pattern formed on the front and back of the radiating planar substrate A protruding portion protruding to the outside of the radiating planar substrate extending form, by bending the tip toward each other direction of the protrusions, by superimposing, wherein the tip of each protrusion is connected.

According to the present invention, when a plurality of winding configuration planar substrates are stacked, the heat generated in the winding portion is trapped in the central portion in the stacking direction, and the temperature of the winding configuration planar substrate increases. Since the heat generated in the winding part is dissipated by the heat dissipating means, the temperature rise of the winding configuration planar substrate can be suppressed, and since the heat dissipating means is provided in the laminate, a special treatment is provided. The heat dissipation means can be formed without using tools. In addition, since the heat dissipating conductor pattern can be formed by the same forming method as that of the winding part and no special jig is required, the number of manufacturing steps is not increased and the cost is not increased.

In the invention of claim 2, in the invention of claim 1, in the laminate of the planar substrate winding arrangement of multiple, characterized in that the radiating planar substrate located in the vicinity of the center in the stacking direction.

According to the present invention, since the heat dissipation planar substrate on which the heat dissipation conductor pattern is formed is disposed near the center in the stacking direction, the heat generation near the center where heat is easily trapped can be released .

According to a third aspect of the invention, in the second aspect of the invention, the conductor pattern formed on the heat dissipating planar substrate disposed in the vicinity of the center in the laminating direction is a winding formed on any of the winding configuration planar substrates. It constitutes a part of the line part.

  According to the present invention, since the heat dissipating conductor pattern forms a part of the winding part, the heat of the winding part is easily conducted to the heat dissipating conductor pattern, and the heat dissipating conductive pattern efficiently dissipates heat. can do.

  According to a fourth aspect of the present invention, there is provided the component according to the second or third aspect, wherein the conductor pattern formed on the heat dissipation planar substrate is connected to a winding portion formed on any of the winding configuration planar substrates. It is characterized in that it is directly connected to the mounting terminal section.

  According to the present invention, since the heat dissipating conductor pattern is directly connected to the component mounting terminal portion electrically connected to the winding portion, the heat generation of the winding portion is mounted from the heat dissipating conductor pattern to the component mounting. It is possible to efficiently dissipate heat to the mounting substrate side through the terminal portion for use, and to suppress the temperature rise of the LC composite component.

According to a fifth aspect of the present invention, in the second aspect of the present invention, the conductor pattern formed on the heat dissipation planar substrate is electrically insulated from the winding portion formed on the winding configuration planar substrate. It is characterized by being directly connected to the terminal portion.

  According to the present invention, since the component mounting terminal portion directly connected to the heat radiation conductor pattern is electrically insulated from the winding portion, the component mounting terminal portion can be directly connected to a mounting target such as a case. Since the heat conducted from the winding portion to the conductive pattern for heat dissipation can be directly released to the mounting target such as a case, heat dissipation is improved.

  According to a sixth aspect of the present invention, in the invention according to any one of the second to fifth aspects, the heat radiation planar substrate is provided with a convex portion that protrudes closer to the mounting target side than the winding configuration planar substrate in the mounting direction to the mounting target. And a part of the conductive pattern for heat dissipation is formed on the convex portion.

  According to the present invention, the conductor pattern formed on the convex portion protrudes closer to the mounting target side than the winding configuration planar substrate. Therefore, the conductor pattern formed on the convex portion is used as a mounting terminal. be able to. In addition, since the mounting strength can be ensured by the convex portion, sufficient mounting strength can be ensured without increasing the thickness of the conductor pattern formed on the convex portion.

  According to a seventh aspect of the present invention, in the invention according to any one of the second to sixth aspects, at least a part is formed of a conductor, and is formed on a conductive portion of a storage case for storing a laminate of each planar substrate, on a heat dissipation planar substrate. It is characterized in that a conductive pattern for heat dissipation is connected.

  According to this invention, since the conductor pattern for heat dissipation is connected to the conductor portion of the storage case, the connection resistance between the conductor pattern and the storage case can be reduced, and the heat of the conductor pattern for heat dissipation can be transferred to the storage case. Heat can be radiated efficiently.

  According to the invention of claim 8, in the invention of any one of claims 2 to 7, a part of the core is disposed so as to penetrate the center of the winding part formed on the planar substrate for winding structure, and the winding is performed. An air gap is provided in the core disposed at the center of the line portion, and at least a part of the heat dissipation planar substrate is disposed in the vicinity of the air gap.

  By the way, when the inductance is arranged in the air gap, the loss increases due to the fringing effect. However, according to the invention of claim 8, since at least a part of the heat dissipation planar substrate is arranged in the vicinity of the air gap, An increase in loss due to the fringing effect can be prevented.

  The invention of claim 9 is characterized in that, in the invention of claim 8, a capacitance is formed by a part of the heat dissipation planar substrate disposed in the vicinity of the air gap.

  Here, if the inductance is arranged in the vicinity of the air gap, an adverse effect due to the fringing effect occurs. However, according to the invention of claim 9, a capacitance is formed by a part of the planar substrate for heat radiation arranged in the vicinity of the air gap. Since the capacitance is not affected by the fringing effect, the capacitance of the capacitor can be increased without increasing the loss of components.

  According to a tenth aspect of the present invention, in any one of the second to ninth aspects, the thickness of the heat dissipating conductor pattern formed on the heat dissipating planar substrate is equal to that of the winding portion formed on the winding constituting planar substrate. It is more than thickness.

  According to the present invention, by setting the thickness of the heat dissipating conductor pattern to be equal to or greater than the thickness of the winding portion, the heat of the winding portion can be easily released to the conductor pattern, and heat dissipation can be improved.

  The invention of claim 11 is characterized in that, in the invention according to any one of claims 1 to 10, the cross-sectional area of the winding portion is increased toward the center portion in the stacking direction of the planar substrate for winding structure.

  According to this invention, since the cross-sectional area of the winding portion is increased toward the center portion in the stacking direction, heat generated in the winding portion disposed in the center portion can be reduced, and the winding portion By increasing the surface area, it is possible to easily dissipate heat generated in the winding part.

  According to a twelfth aspect of the present invention, in any one of the first to tenth aspects of the present invention, a part of the winding portion formed on the winding configuration planar substrate projects to the outside of the winding configuration planar substrate. And a winding portion formed on the plurality of winding configuration planar substrates is electrically connected via the projecting portion.

  According to the present invention, since the winding portions formed on the plurality of winding configuration planar substrates are electrically connected via the protruding portions provided on a part of the winding portion, the through portions provided on the substrate are provided. Compared to the case where conduction is made through a hole, the cross-sectional area of the protruding portion can be easily increased. Therefore, the connection resistance of the winding portion can be reduced, and the heat of the winding portion can be easily conducted to the heat radiating means. Thus, loss due to heat can be reduced.

  According to the present invention, when a plurality of winding configuration planar substrates are stacked, heat generated in the winding portion is trapped in the central portion in the stacking direction, and the temperature of the winding configuration planar substrate increases. Since the heat generated in the winding part is dissipated by the heat dissipating means, the temperature rise of the winding configuration planar substrate can be suppressed, and since the heat dissipating means is provided in the laminate, a special treatment is provided. The heat dissipation means can be formed without using tools.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
A first embodiment of the present invention will be described with reference to FIGS. The LC composite component 1 of the present embodiment includes a plurality of winding configuration planar substrates 10, a heat dissipation planar substrate 20 serving as heat dissipation means, cores 30 and 30, and lead terminals 40 as main components.

  The plurality of winding configuration planar substrates 10 are formed in substantially the same shape, and have a rectangular plate shape as shown in FIG. 1 (b), and penetrate through the middle leg (not shown) of the core 30 in the center. A hole 11 is provided, and a winding portion 12 made of a conductor pattern such as a copper foil is formed around the through hole 11. In addition, a plurality of (for example, five) laminated terminal portions 13 for through-hole connection are formed on both sides in the longitudinal direction of the planar substrate 10 along the short side, and one end of the winding portion 12 is formed. Is electrically connected to one of the terminal portions 13. Further, the other end of the winding portion 12 is electrically connected to an interlayer connection terminal portion 14 formed of a through hole provided in the vicinity of the through hole 11. The winding portion 12 may be formed on only one surface of the planar substrate 10 or may be formed on both surfaces. When the winding portion 12 is formed on both surfaces of the substrate, the terminal portions 13 and 14 are provided. It is only necessary to electrically connect the winding portions 12 on both sides. The winding portion 12 can be connected to the winding portion 12 formed on another planar substrate 10 or the winding portion 22 formed on the planar substrate 20 described later via the terminal portions 13 and 14.

  The heat dissipation planar substrate 20 has a rectangular plate shape as shown in FIG. 1A, and has a through hole 21 through which the middle leg of the core 30 is inserted at the center, and a donut-shaped copper foil around the through hole. A conductor pattern 22 made of, for example, is formed. In addition, on both sides of the planar substrate 20 in the longitudinal direction, five interlayer connection terminal portions 23 each including a through hole are formed at positions overlapping the terminal portions 13 of the planar substrate 10. The conductor pattern 22 is directly connected to a lead terminal 40 that is electrically insulated from the winding portion 12 formed on the planar substrate 10, and the mounting board or case of the LC composite component 1 is connected via the lead terminal 40. Since the heat can be directly radiated, the heat dissipation is improved. Here, in order to enhance the heat dissipation effect of the planar substrate 20, it is preferable to make the area of the conductive pattern 22 for heat dissipation larger, and as an example, the shape as shown in FIG. The number of conductor patterns 22 per substrate and the number of terminal portions 23 connected to the conductor pattern 22 (that is, the number of heat radiation locations) may be plural. Further, the heat dissipating conductor pattern 22 may be formed on only one surface of the planar substrate 10 or may be formed on both surfaces. When the conductor pattern 22 is formed on both surfaces of the substrate, the terminal portion 23 is formed. , 24 may be used to electrically connect the conductive patterns 22 on both sides.

  The plurality of winding configuration planar substrates 10 and the heat dissipation planar substrate 20 are laminated in the thickness direction, and the lead terminals 40 are soldered to the terminal portions 13 and 23 of the planar substrates 10 and 20. Here, an inductance is formed by laminating a plurality of winding configuration planar substrates 10, and functions as a coil or a transformer depending on how the winding portions 12 of each layer are connected. In addition, when a plurality of winding configuration planar substrates 10 are stacked, an insulator (planar substrate 10) is disposed between the winding portions 12, thereby forming a capacitance. The lead terminal 40 is also used as a terminal for mounting the LC composite component 1, and a part of the lead terminal 40 functions as an output terminal for inductance or capacitance.

  Each core 30 is formed of a magnetic material, and a side piece 32 is formed in a U shape in a side view by a central piece 31 and side pieces 32 protruding in one direction from both ends of the central piece 31. The cores 30 and 30 are assembled to the laminated body of the planar substrates 10 and 20 from both sides in the laminating direction, and are coupled in a state where the tips of the both side pieces 32 are in contact with each other. A central leg (not shown) that projects through the through holes 11 and 21 of the planar substrates 10 and 20 protrudes from the central piece 31 of each core 30.

  The LC composite component 1 has the above-described configuration, and when a plurality of winding configuration planar substrates 10 are stacked, the heat generation of the winding portion 12 is likely to occur in the central portion in the stacking direction. In this embodiment, the planar substrate 20 for heat dissipation is laminated together with the planar substrate 10 for winding configuration, and the conductive pattern 22 for heat dissipation is formed on the planar substrate 20. By letting the heat of the winding part 12 formed on the substrate 10 escape to the conductive pattern 22 for heat dissipation, an increase in the component temperature can be suppressed. In addition, since the heat of the heat dissipating conductor pattern 22 is radiated to the mounting substrate side via the lead terminals 40, the temperature rise of the winding portion 12 formed on the planar substrate 10 is further reduced to suppress loss. be able to. Note that the thickness of the conductor pattern 22 is preferably greater than the thickness of the winding portion 12 formed on the planar substrate 10, and the heat dissipation effect by the conductor pattern 22 can be improved. Also, a plurality of heat dissipation planar substrates 20 may be stacked. In this case, the thickness of the conductor pattern 22 is increased as it approaches the center portion in the stacking direction, thereby improving the heat dissipation performance of the center portion where heat can be easily trapped. it can.

  Here, since the heat dissipating conductor pattern 22 is connected to the terminal portion 23 that is electrically insulated from the winding portion 12 of each planar substrate 10, the heat of the conductor pattern 22 is transferred to a metal heat conducting member ( The heat can be directly radiated to the mounting substrate or the case via the lead terminals 40), and the heat of the conductor pattern 22 can be efficiently released. In the present embodiment, the shape of the heat radiation conductor pattern 22 is annular, and the conductor pattern 22 functions as a coil for one turn. Therefore, when the transformer is constituted by the winding configuration planar substrate 10, the operation of the transformer is performed. 3, it is also preferable to cut out a part of the conductor pattern 22 so that a coil is not formed as shown in FIG. 3.

  As shown in FIG. 2B, the heat dissipation planar substrate 20 may be disposed near the center in the stacking direction where heat is easily trapped, and the heat dissipation effect of the planar substrate 20 can be enhanced. In this embodiment, the number of the heat dissipation planar substrates 20 is one, but the number of the planar substrates 20 is not limited to one. What is necessary is just to set suitably the number of the planar board | substrates 20 for thermal radiation.

(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG. Since the configuration other than the heat dissipation planar substrate 20 is the same as that of the first embodiment, common components are denoted by the same reference numerals and description thereof is omitted.

  In the first embodiment described above, only the heat dissipating conductor pattern 22 is formed on the heat dissipating planar substrate 20, whereas in the present embodiment, in addition to the heat dissipating conductor pattern 22a, the winding portion formed of the conductor pattern. 24, and electrically connect one end of the winding portion 24 to one of the terminal portions 23 and electrically connect the other end of the winding portion 24 to a through hole 25 provided in the vicinity of the through hole 21. It is.

  When the LC composite component 1 is used in a high frequency region having a frequency of several hundred kHz or more, the winding portion 24 is preferably formed with rounded corners in consideration of influences such as an edge effect. Further, the through-hole 21 through which the middle leg of the core 30 is inserted is inevitably in a shape close to a perfect circle in consideration of miniaturization of parts. Therefore, it is necessary to determine the conductor pattern 22a and the wiring pattern of the winding portion 24 in consideration of these conditions. For example, if the planar substrate 20 is a rectangular plate, the conductor pattern 22 is not formed on the peripheral portion of the substrate. Since there are vacant spaces, particularly wide vacant spaces at the four corners of the substrate, as shown in FIG. 4A, the strip-shaped conductor pattern 22a along the peripheral edge of the substrate 20 is used by using the vacant space. Is preferably formed. In addition, when the empty space exists only in a very limited narrow area at the four corners of the substrate, as shown in FIG. 4B, the four corners of the substrate 20 are formed in a shape in which the conductive pattern 22b for heat radiation is matched to the empty space. A plurality of them may be provided.

  Here, the heat dissipating conductor pattern 22a shown in FIG. 4A is electrically connected to one of the terminal portions 23, and if the lead terminal 40 connected to the terminal portion 23 is mounted on the mounting substrate, Since the heat of the conductor pattern 22a is radiated to the mounting substrate side via the lead terminals 40, heat can be radiated efficiently. In the planar substrate 20 shown in FIG. 4B, the conductor pattern 22b may be electrically connected to any one of the terminal portions 23, and the lead terminals 40 connected to the terminal portions 23 are mounted on the mounting substrate. In this manner, the heat of the conductor pattern 22b can be efficiently radiated to the mounting substrate side via the lead terminals 40 as described above.

  In the present embodiment, the winding portion 24 and the heat radiation conductor pattern 22a (22b) are formed on one planar substrate 20, and it is not necessary to provide a dedicated heat radiation planar substrate. Therefore, it is possible to reduce the size and cost of parts. The conductive pattern 22a (22b) for heat dissipation is formed in an empty space where the winding portion 24 is not formed, and therefore does not affect the conductor width of the winding portion 24.

(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIGS. 5A is a plan view of the winding configuration planar substrate 10, and FIG. 5B is a plan view of the heat dissipation planar substrate 20. Since the configuration other than the planar substrate 20 is the same as that of the first embodiment, they are common. Constituent elements are denoted by the same reference numerals and description thereof is omitted.

  A C-shaped conductor pattern 22 is formed around the through hole 21 on the surface of the planar substrate 20, and both ends of the conductor pattern 22 are electrically connected to separate terminal portions 23 and 23, respectively. Here, the pattern width of the heat dissipating conductor pattern 22 is wider than the winding portion 12 formed on the winding constituting planar substrate 10, and the number of turns per substrate is smaller than that of the conductor pattern 10. Yes.

  The planar substrate 20 is laminated together with a plurality of planar substrates 10 for winding configuration shown in FIG. 5A, and is arranged at the center in the laminating direction. The heat dissipating conductor pattern 22 formed on the planar substrate 20 is electrically connected to the winding portion 12 formed on the planar substrate 10 via the lead terminals 40, and the planar substrate for winding configuration is provided. 10 constitutes a part of the winding portion 12 formed on the substrate 10, and the inductance and capacitance are formed by laminating the planar substrates 10 and 20.

  In the first embodiment described above, since the heat dissipating conductor pattern 22 is electrically insulated from the winding portion 12 of the winding configuration planar substrate 10, the LC composite component 1 is large in order to secure an insulation distance. In this embodiment, since the heat radiation conductor pattern 22 is electrically connected to the winding portion 12, the degree of freedom in insulation design is improved. Further, when the heat dissipating conductor pattern 22 is electrically insulated from the winding part 12 as in the first embodiment, the heat of the winding part 12 cannot be taken out efficiently. Since the conductive conductor pattern 22 is electrically connected to the winding part 12, the heat of the central part of the laminate can be efficiently radiated through the conductive pattern 22 for heat dissipation. Further, in the first embodiment, when the heat of the heat dissipating conductor pattern 22 is radiated to the mounting substrate side through the lead terminals 40, the terminal portion electrically insulated from the winding portion (winding portion 12) is configured as an LC. In this embodiment, a part of the winding portion 12 is always connected to the mounting terminal (lead terminal 40). Therefore, a terminal portion is separately provided for the heat dissipating conductor pattern 22. There is no need to provide it.

  In the present embodiment, if the capacitance is formed by using the heat dissipating conductor pattern 22, the pattern width is wider than the winding portion 12 formed on the winding configuration planar substrate 10. A relatively large capacitance can be formed as compared with the case where the capacitance is formed.

(Embodiment 4)
Embodiment 4 of the present invention will be described below. In the present embodiment, in the above-described first embodiment, the heat dissipation planar substrate 20 is disposed in the center in the stacking direction, and the conductor pattern 22 formed on the planar substrate 20 is wound on any of the planar substrates 10. The terminal portion 23 connected to the portion 12 (that is, the lead terminal 40) is directly connected. In addition, since it is the same as that of Embodiment 1 except the connection form of the conductor pattern 22 for thermal radiation, the same code | symbol is attached | subjected to a common component and illustration and description are abbreviate | omitted.

  In the LC composite component 1, the conductor pattern 22 formed on the heat dissipation planar substrate 20 is electrically connected to the winding portion 12 for winding configuration formed on any of the planar substrates 10, and the terminal Since it is directly connected to the lead terminal 40 via the portion 23, the heat generated in the winding portion can be efficiently radiated from the heat radiation conductor pattern 22 to the mounting board side via the lead terminal 40, and the LC composite component Temperature rise can be suppressed.

(Embodiment 5)
A fifth embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a protruding piece 22 c that protrudes to the outside of the planar substrate 20 is integrally formed on the conductor pattern 22 formed on the surface of the planar substrate 20. Since the configuration other than the planar substrate 20 is the same as that of the first embodiment, the same components are denoted by the same reference numerals and the description thereof is omitted.

  The planar substrate 20 has a rectangular plate shape, and a through hole 21 through which the middle leg of the core 30 is inserted is provided at the center, and a donut-shaped copper conductor pattern 22 is formed around the through hole 21. In addition, five terminal portions 23 are formed on both sides in the longitudinal direction of the planar substrate 20 at positions overlapping the terminal portions 13 of the planar substrate 10. Is electrically insulated. And from the side edge (right side edge) of the conductor pattern 22 along the longitudinal direction of the planar board | substrate 20, the strip-shaped protrusion piece 22c which protrudes in the right side in FIG. In the present embodiment, the protruding piece 22c is formed at only one place, but the protruding piece 22c may be formed at a plurality of places.

  The LC composite component 1 using the planar substrate 20 is mounted on a mounting substrate 50 together with other electronic components 51, and is stored in a storage case 60 formed at least partly of metal. A description will be given based on (c).

  FIG. 7B shows a state in which the LC composite component 1 is mounted on the mounting board 50, and the protruding pieces 22 of the conductor pattern 22 formed on the planar board 20 are mounted on the mounting land formed on the mounting board 50. 52 is soldered. The land 52 is provided with an insertion hole 52a through which the fixing screw 53 is inserted. As shown in FIG. 7C, the mounting substrate 50 is attached to the storage case 60 by using the fixing screw 53 passed through the insertion hole 52a. It is screwed. Therefore, the land 52 provided on the mounting substrate 50 and the metal portion of the storage case 60 are electrically connected via the metal fixing screw 53 and are also thermally coupled. Is radiated to the storage case 60 via the protruding piece 22c, the land 52, and the fixing screw 53, and the heat of the conductor pattern 22 can be efficiently radiated.

  In the above-described fourth embodiment, the heat of the conductor pattern 22 is directly radiated to the mounting substrate side via the lead terminals 40, but a sufficient cross-sectional area of the terminal portion 23 and the lead terminals 40 is ensured with the miniaturization of components. If this is not possible, there is a possibility that the heat of the heat dissipating conductor pattern 22 may not be radiated smoothly due to the influence of the connection resistance and the line resistance. Therefore, in the present embodiment, the heat dissipation conductor pattern 22 is provided with a protruding piece 22 protruding outward from the substrate, and the protruding piece 22c easily secures a relatively large cross-sectional area. If heat is radiated to the case 60 via the protruding piece 22c, the heat of the conductor pattern 22 can be efficiently radiated.

  In the present embodiment, the protruding piece 22 provided on the conductor pattern 22 is bent and electrically connected to the land 52 provided on the mounting substrate 50, and the land 52 and the metal portion of the storage case 60 are connected to each other by a metal fixing screw 53. The heat of the conductor pattern 22 is radiated to the storage case 60 by being thermally coupled to the LC composite component 1 with the protruding piece 22c provided on the conductor pattern 22 pressed against the metal portion of the storage case 60. May be stored in the storage case 60 so that the heat of the conductor pattern 22 is released to the storage case 60.

  Further, in the form shown in FIG. 7, the heat dissipation planar substrate 20 is arranged in the outermost layer in the laminating direction for easy explanation, but it is arranged in the central part in the laminating direction as in the above embodiments. In addition, by disposing the heat dissipation planar substrate 20 at the center in the stacking direction, the heat dissipation can be improved.

(Embodiment 6)
Embodiment 6 of the present invention will be described with reference to FIG. In the present embodiment, in the LC composite component 1 of the above-described fifth embodiment, convex portions 20a and 20a are provided on a part of the planar substrate 20, and a protruding piece 22c extending from the conductor pattern 22 is formed on the convex portion 20a. The protruding piece 22 c provided on the convex portion 20 a is used as a mounting terminal for the LC composite component 1. Since the configuration other than the planar substrate 20 is the same as that of the fifth embodiment, the same components are denoted by the same reference numerals and the description thereof is omitted.

  By the way, in LC composite component 1 of Embodiment 4 mentioned above, in order to secure the mounting strength of the heat dissipation conductor (conductor pattern 22) for radiating the heat of conductor pattern 22, the thickness of conductor pattern 22 is made thick enough. However, in this embodiment, the projecting piece 22c provided on the convex portion 20a is used as a mounting terminal, and sufficient mounting is achieved regardless of the thickness of the conductor pattern 22 only by changing the shape of the planar substrate 20. The strength can be ensured, and the lead terminal 40 described in the above embodiments is not necessary. Further, the protruding piece 22c formed on the convex portion 20a can also form a capacitance, and further miniaturization of the component can be realized. Further, since it is not necessary to connect the conductive pattern 22 for heat dissipation and the terminal portion 23 or between the terminal portion 23 and the lead terminal 40 and it is not necessary to consider the influence of loss due to contact resistance, the size of the component is further reduced. be able to. Note that the electrical connection between the winding portion 12 formed on the planar substrate 10 and the outside may be electrically connected via a lead terminal connected to the terminal portion 13 or the same method as that of the planar substrate 20. You may connect with.

  In this embodiment, the heat dissipation planar substrate 20 is disposed in the outermost layer in the stacking direction for ease of explanation, but it may be disposed in the center in the stacking direction as in the above-described embodiments. By disposing the heat dissipation planar substrate 20 at the center in the stacking direction, heat dissipation can be improved. Further, the heat dissipating conductor pattern 22 may be a part of the winding portion 12 formed on the planar substrate 10 or may be electrically insulated. Moreover, the convex part 20a provided in the planar board | substrate 20 may be used not only for the terminal for mounting but for the positioning at the time of component mounting.

(Embodiment 7)
An eighth embodiment of the present invention will be described with reference to FIG. FIG. 9A is an external perspective view of the LC composite component of this embodiment, and FIG. 9B is a cross-sectional view taken along line AA ′. In the LC composite component 1, in the first embodiment, the middle legs 33, 33 provided on the cores 30, 30 face each other through the air gap G, and the heat dissipation planar substrate 20 is disposed in the vicinity of the gap G. is doing. In addition, since it is the same as that of Embodiment 1 except arrangement | positioning of the planar board | substrate 20, the same code | symbol is attached | subjected to a common component and the description is abbreviate | omitted. In FIG. 9B, the insulator interposed between the planar substrates 10 and 20 is omitted.

  Generally, the middle legs 33 and 33 of the cores 30 and 30 are opposed to each other via an air gap G, and a winding portion (winding portion 12 of the planar substrate 10) constituting a coil or a transformer is provided in the vicinity of the gap G. When arranged, the loss tends to increase due to the fringing effect.

  Therefore, in the present embodiment, the planar substrate 20 is arranged so that the heat dissipation planar substrate 20 is substantially the same height as the gap G in the stacking direction of the planar substrates 10 and 20. Is disposed away from the gap G, the loss due to the fringing effect can be reduced.

  Here, if the gap G is provided in the central portion of the middle leg 33 of the core 30 in the mounting direction of the LC composite component 1, the heat dissipation planar substrate 20 is disposed in the center in the stacking direction, and the heat dissipation conductor pattern 22 is disposed. The heat dissipation effect by can be enhanced, and the temperature rise of the LC composite component 1 can be further reduced.

  When the conductor pattern 22 provided on the heat dissipation planar substrate 20 is a part of a conductor pattern that forms inductance or capacitance, the capacitance may be formed by the conductor pattern 22 formed on both surfaces of the planar substrate 20. In the case of capacitance, since it is not affected by the fringing effect, the loss of components can be reduced while forming a large-capacity capacitor.

(Embodiment 8)
An eighth embodiment of the present invention will be described with reference to FIGS. FIG. 10A shows an external perspective view of the LC composite component of this embodiment, and FIG. 10B shows a BB ′ cross-sectional view. In the LC composite component 1, the planar substrate 20 for heat dissipation is eliminated in the first embodiment, and only a plurality of the winding configuration planar substrates 10 are stacked, and the closer to the center portion in the stacking direction, the closer to each planar substrate 10. The formed winding portion 12 has a wide conductor width. In addition, since it is substantially the same as Embodiment 1 except the shape of the coil | winding part 12 formed in the planar board | substrate 10, the same code | symbol is attached | subjected to a common component and the description is abbreviate | omitted. In FIG. 10B, an insulator interposed between the planar substrates 10 is omitted.

  In this way, the cross-sectional area of the winding portion 12 is increased by forming the conductor width of the winding portion 12 wider at the central portion in the stacking direction where heat generation of the winding portion 12 is likely to occur. The heat generation of the parts can be reduced, and the heat dissipation can be improved because the surface area is increased. That is, the heat radiating means is constituted by the winding portion 12 having a large cross-sectional area.

  Here, in the form shown in FIG. 10B, the conductor widths of the winding portions 12 are different on the front and back of each planar substrate 10 so that the conductor width of the winding portions 12 becomes wider as it approaches the central portion in the stacking direction. However, in consideration of manufacturing cost and productivity, the conductor widths of the winding portions 12 may be the same on the front and back of the planar substrate 10 (see FIG. 10C).

  In the above embodiment, the cross-sectional area is increased by increasing the conductor width of the winding portion 12 as it approaches the central portion in the stacking direction. However, as shown in FIG. The thickness of the winding portion 12 may be increased as it approaches the center, and the heat generation of the component can be reduced by increasing the cross-sectional area as it approaches the center portion as described above. Here, in the form shown in FIG. 10D, the thickness of the winding portion 12 is made different between the front and back surfaces of each planar substrate 10 so that the winding portion 12 becomes thicker as it gets closer to the central portion in the stacking direction. However, in consideration of manufacturing cost and productivity, the winding portions 12 may be formed to have the same thickness on the front and back sides of the planar substrate 10. Further, when the thickness of the winding portion 12 is increased, the thickness of the entire component is increased. However, the thickness of the planar portion 10 is reduced by increasing the thickness of the winding portion 12, thereby reducing the height of the component. Can be planned.

  Note that the number of stacked planar substrates 10 and the number of winding portions 12 per substrate are not limited to those shown in FIGS. 10B to 10D, and are appropriately determined according to the use conditions. Set it. Further, in FIGS. 10B to 10D, the planar substrates 10 are illustrated with a space between them for easy explanation.

  Here, in each of the above-described embodiments, the conductor width of the conductor pattern 22 formed on the heat dissipation planar substrate 20 is formed wider toward the center in the stacking direction, or the conductor pattern 22 is thicker at the center in the stacking direction. Alternatively, heat dissipation can be enhanced by increasing the cross-sectional area of the conductor pattern 22 toward the center.

(Embodiment 9)
Embodiment 9 of the present invention will be described with reference to FIG. In the present embodiment, the planar substrate 20 for heat dissipation is arranged on the upper side in the mounted state of the LC composite component 1 as shown in FIG. In addition, since it is the same as that of Embodiment 1 except arrangement | positioning of the planar board | substrate 20, the same code | symbol is attached | subjected to a common component and the description is abbreviate | omitted.

  In general, since heat generated from the component tends to flow upward, in this embodiment, in order to efficiently dissipate the heat of the LC composite component 1 to the outside, the heat dissipation planar substrate 20 is disposed on the upper side in the mounted state. is doing. Here, in the present embodiment, the heat dissipation planar substrate 20 may be provided at the central portion in the stacking direction, and the heat trapped in the central portion in the stacking direction can be efficiently released to the outside by the heat dissipation planar substrate 20. The rise in temperature can be further reduced.

(Embodiment 10)
A tenth embodiment of the present invention will be described with reference to FIG. In the first embodiment described above, the conductor patterns 22 formed on the front and back surfaces of the planar substrate 20 are electrically connected via the terminal portions 23, whereas in the present embodiment, the conductor patterns 22 are formed on the front and back surfaces of the planar substrate 20. The projecting pieces 22c and 22c (projecting portions) projecting to the outside of the planar substrate 20 are extended from the conductor patterns 22 and 22 so as to overlap each other in the thickness direction, and the tips of the projecting pieces 22c and 22c approach each other. The tips of the projecting pieces 22c and 22c are electrically connected by bending and overlapping (in the direction indicated by the arrow in FIG. 12B). Since the configuration other than the planar substrate 20 is the same as that of the first embodiment, common components are denoted by the same reference numerals, and description thereof is omitted.

  By the way, considering the miniaturization of the LC composite component 1, in the above-described first embodiment, the connection resistance at the terminal portion 23 is increased, and even if the conductor pattern 22 for heat radiation is sufficiently secured, the heat of the component is efficiently obtained. It may not be possible to dissipate heat. Therefore, in this embodiment, the projecting pieces 22c and 22c provided on the conductor patterns 22 and 22 are bent and brought into contact with each other to thermally couple the conductor patterns 22 and 22, so that the connection resistance is reduced. The heat of the component can be radiated efficiently, and the temperature rise of the component can be suppressed.

  It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.

(A) is a top view of the planar board | substrate for heat radiation used for Embodiment 1, (b) is a top view of the planar board | substrate for coil | winding structure used for Embodiment 1. FIG. (A) is an external appearance perspective view same as the above, (b) is a principal part expansion perspective view. It is a top view of another heat dissipation planar board | substrate used for the same as the above. (A) and (b) are the top views of the planar board | substrate for thermal radiation used for Embodiment 2. FIG. (A) is a top view of the planar board | substrate for coil | winding structure used for Embodiment 3, (b) is a top view of the planar board | substrate for thermal radiation used for Embodiment 3. FIG. 6 is a plan view of a heat dissipation planar substrate used in Embodiment 5. FIG. (A)-(c) is explanatory drawing explaining the attachment state same as the above. (A) is a top view of the heat dissipation planar board | substrate used for Embodiment 6, (b) is an external appearance perspective view which can abbreviate | omit a part of LC composite component. Embodiment 7 is shown, (a) is an external perspective view, (b) is an A-A 'sectional view. Embodiment 8 is shown, (a) is an external perspective view, and (b) to (d) are B-B ′ cross-sectional views. 10 is a sectional view of Embodiment 9. FIG. The heat dissipation planar board | substrate used for Embodiment 10 is shown, (a) is a top view, (b) is an external appearance perspective view. It is an external appearance perspective view of the conventional LC composite component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Planar board for winding composition 12 Winding part 13 Terminal part 20 Thermal radiation planar board 22 Conductor pattern

Claims (12)

A plurality of winding configuration planar substrates each having a winding portion formed of a conductor pattern on the surface, a core disposed along the outer periphery of the laminate of the winding configuration planar substrate, and a plurality of winding configurations Insulators disposed between the winding portions formed on the planar substrate, and the interlayer connection terminal portions used for electrical connection between the stacked winding configuration planar substrates, each winding configuration A plurality of planar substrate for winding configuration is provided on the planar substrate for forming an inductance and a capacitance, and a heat radiating means for radiating heat generated in the winding portion is provided on the laminated body, and the heat radiating means but consists radiating planar substrate on which the conductor pattern is formed for heat dissipation on the front and back, a conductor pattern formed on the front and back of the planar substrate wherein the heat dissipation, the outside of the planar substrate for the heat radiation The protrusion protruding extended form to, by bending the tip toward each other direction of the protrusions, by superposing, LC composite component, wherein a tip of each protrusion is connected. In the laminate of the winding arrangement for a planar substrate of multiple, LC composite component according to claim 1, wherein said that the radiating planar substrate located in the vicinity of the center in the stacking direction. The conductor pattern formed on the heat dissipating planar substrate disposed in the vicinity of the center in the laminating direction constitutes a part of a winding portion formed on any of the winding composing planar substrates. The LC composite component according to claim 2.   The conductor pattern formed on the planar substrate for heat dissipation is directly connected to a component mounting terminal portion connected to a winding portion formed on any of the winding configuration planar substrates. The LC composite part according to 2 or 3. The conductor pattern formed on the heat dissipation planar substrate is directly connected to a component mounting terminal portion that is electrically insulated from a winding portion formed on the winding configuration planar substrate. 2 Symbol placement LC composite component.   In the mounting direction to the mounting target, the heat dissipation planar substrate is provided with a convex portion that protrudes from the winding configuration planar substrate toward the mounting target side, and a part of the heat dissipation conductor pattern is formed on the convex portion. The LC composite component according to claim 2, wherein the LC composite component is provided.   3. A heat dissipation conductor pattern formed on a heat dissipation planar substrate is connected to a conductor portion of a storage case that is at least partially formed of a conductor and stores a laminate of the respective planar substrates. LC composite component in any one of thru | or 6.   A part of the core is arranged so as to penetrate the center of the winding part formed on the planar substrate for winding composition, and an air gap is provided in the core arranged at the center of the winding part. The LC composite component according to claim 2, wherein at least a part of the planar substrate for heat dissipation is disposed in the vicinity of.   9. The LC composite component according to claim 8, wherein a capacitance is formed by a part of the planar substrate for heat dissipation disposed in the vicinity of the air gap.   The thickness of the conductive pattern for heat radiation formed on the planar substrate for heat radiation is equal to or greater than the thickness of the winding portion formed on the planar substrate for winding composition. LC composite parts.   11. The LC composite component according to claim 1, wherein the cross-sectional area of the winding portion is increased toward the center portion in the stacking direction of the winding configuration planar substrate. A part of the winding portion formed on the winding configuration planar substrate is provided with a protruding portion that protrudes to the outside of the winding configuration planar substrate, and a plurality of winding configuration planar substrates are provided via the protruding portion. The LC composite component according to claim 1, wherein the formed winding portion is electrically connected.

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