JP4802616B2 - LC composite parts - Google Patents

Description

  The present invention relates to an LC composite component in which inductance and capacitance are formed in a composite manner by laminating sheet-like windings.

  In recent years, with the miniaturization of electronic devices, there has been a demand for a reduction in the number of electronic components used in the electronic devices, and downsizing and low profile of individual electronic components. For example, as shown in FIG. There is provided an LC composite component 1 in which the number of components is reduced by forming a composite with a capacitance and the height is reduced by using a planar type winding.

The LC composite component 1 shown in FIG. 12 is configured by stacking a plurality of rectangular plate-like planar substrates 10 and arranging the cores 20 and 20 along the outer periphery of the laminate of the substrates 10. Winding portions 12 made of a conductor pattern are formed on the surface of each substrate 10, and laminated terminal portions 13 such as filled vias for interlayer connection are formed along the short sides at both longitudinal ends of the substrate 10. It is formed. The lamination terminal portions 13 provided on the respective substrates 10 are formed at positions overlapping in the vertical direction, and the substrates 10 of the respective layers are electrically connected by the metal filled in the holes.
Thus, by laminating the plurality of substrates 10 (insulators) on which the winding portions 12 are formed via a part of the laminating terminal portion 13, inductance and capacitance are formed, and the laminating terminal portion 13 is formed. Is electrically connected to a lead terminal 30 provided in the lamination terminal portion 13 by being electrically connected to a part of the winding portion 12. Note that the lead terminals 30 are connected to a printed wiring board on which electronic components are mounted, for example, by a method such as soldering.

  In the above-described LC composite component 1, the number of components is reduced by providing inductance and capacitance in a composite manner, and the height of the component is reduced by using the planar winding portion 12. Since the formation method of the wire portion 12 and the formation method of the lead terminal 30 used for mounting on the printed wiring board are different, the number of manufacturing processes increases, resulting in an increase in cost and an increase in size of components. was there. In addition, in order to reduce the size of the component, when a sufficient arrangement space for the mounting terminal portions (lamination terminal portion 13 and lead terminal 30) cannot be ensured, the conductor pattern and the mounting terminal portion constituting the winding portion 12 There is a problem that the connection resistance increases and the loss increases.

  Such problems are also a problem in conventional coil parts other than the planar type, and electronic parts shown in the following Patent Documents 1 to 3 have been conventionally proposed as countermeasures.

  The thin transformer shown in Patent Document 1 is a coil part formed by processing a conductive plate. The winding part is formed by extending a part of the coil plate and bending the tip to mount it. The terminal for is formed.

  In the inductance element shown in Patent Document 2, a coil component is formed by a rectangular wire, and both ends of the rectangular wire are pulled out to a predetermined position using a dedicated jig, and used as a mounting terminal.

Furthermore, the inductance element shown in Patent Document 3 is a coil component formed by a rectangular wire, and a mounting terminal block having a rectangular wire positioning function is provided to realize a bobbin-less connection and connection of the rectangular wire to the mounting terminal. It makes work easier.
Utility Model Registration No. 2500787 JP-A-9-232154 Japanese Patent Laid-Open No. 7-220950

  By the way, in the thin transformer shown in the above-mentioned Patent Document 1, since a part of the coil plate is bent and used as it is as a mounting terminal, the strength of the mounting terminal is determined by the cross-sectional area of the coil plate, and the current density of the coil is Even if it is sufficiently small, the cross-sectional area of the coil plate has to be increased to some extent in order to ensure the strength of the mounting terminals, leading to an increase in size and cost of components. Further, when there are a plurality of mounting terminals, it is difficult to ensure the parallelism of each mounting terminal with respect to the mounting surface, and the mounting position of the mounting terminal may deviate from the normal position.

  In addition, in the inductance element disclosed in Patent Document 2 described above, since a part of the flat winding is fixed by using a dedicated jig and used as a mounting terminal, the displacement of the mounting position can be reduced. Since a tool is required and a complicated process is required depending on the shape of the jig, the cost may increase.

  Further, in the inductance element shown in Patent Document 3 described above, since the rectangular winding and the mounting terminal are connected, the connection resistance between the flat winding and the mounting terminal can be reduced, but the rectangular winding is mounted on the mounting terminal block. Since a dedicated jig is required to connect the wires, a complicated process is required depending on the shape of the jig, which may increase the cost.

  As described above, in Patent Documents 1 to 3, it is possible to solve the problem of the conventional LC composite component in which the connection resistance between the winding component and the mounting terminal portion is increased. There is a problem that the cost becomes higher due to complexity.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a small and low-cost LC composite component that is easy to manufacture.

In order to achieve the above object, the invention of claim 1 includes a plurality of planar substrates each having a winding portion formed of a conductor pattern formed on a surface thereof, and a core disposed along the outer periphery of the laminate of the planar substrates. An insulator disposed between winding portions formed on a plurality of planar substrates, and an interlayer connection terminal portion provided on each planar substrate and electrically connected between the stacked planar substrates. In addition to forming a plurality of planar substrates, inductance and capacitance are formed , and in a laminating direction, between the planar substrates each having a conductor pattern and a mounting conductor portion used for mounting the laminated body formed on the surface. as planar substrate cutout in a portion overlapping with the mounting conductor portion is provided is disposed, the planar groups of the mounting conductor portion is formed on the surface Said planar substrate on which the notch is provided with is characterized by being laminated alternately.

According to the present invention, since the mounting conductor portion formed of the conductor pattern is formed on at least one planar substrate, the mounting conductor portion can be formed by the same forming method as the winding portion. As compared with the case of using a lead terminal formed by a different formation method from the winding part, the cost of the lead terminal can be reduced and the number of manufacturing processes can be reduced, and the lead terminal can be eliminated. It is also possible to reduce the size of the parts. Further, if the mounting conductor portion is formed of the same material as the winding portion, it can be formed simultaneously with the winding portion, and the number of manufacturing steps can be further reduced. Furthermore, the mounting target can be mounted on the mounting conductor portion exposed from the notch. In addition, when multiple layers of a planar substrate with a notch and a planar substrate without a notch are stacked, a clearance is secured between the mounting conductor portions formed on different planar substrates. Therefore, the mounting conductor portions can be reliably insulated from each other, and mounting objects having different potentials can be mounted on the mounting conductor portions of each planar substrate.

According to a second aspect of the present invention, in the first aspect of the present invention, the planar substrate provided with a notch and disposed in the outermost layer comprises a conductor pattern on the peripheral portion of the notch and is used for mounting the laminate. A portion is formed .

According to the present invention, the mounting conductor portion is formed at the peripheral portion of the notch on the outer surface of the outermost planar substrate, so that mounting on the mounting conductor portion can be easily performed.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the mounting conductor is formed on the side of the planar substrate that is closer to the mounting portion of the laminate.

  According to this invention, since the mounting conductor portion is formed on the side close to the mounting portion, the operation of mounting the mounting conductor portion on the mounting portion can be easily performed.

According to a fourth aspect of the present invention, in any one of the first to third aspects, at least one layer of the planar substrate on which the mounting conductor portion is formed and the planar substrate on which the mounting conductor portion is not formed are overlapped. And laminating.

  According to the present invention, since the planar substrate on which the mounting conductor portion is formed and the planar substrate on which the mounting conductor portion is not formed are stacked on top of each other, the mounting conductor portion formed on a different planar substrate. As a result, the mounting conductor portions can be reliably insulated from each other, so that mounting targets having different potentials can be mounted on the mounting conductor portions of the respective planar substrates.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the present invention further includes a storage case for storing the laminate of the planar substrates so that the mounting conductor portion is close to the inner wall, and the inner wall of the storage case. Further, a connecting conductor portion that is electrically connected to at least a part of the mounting conductor portion is provided.

  According to the present invention, when the planar substrate laminate is stored in the storage case, the mounting conductor formed on the planar substrate is disposed close to the inner wall of the storage case. The connecting conductor portion can be easily connected to the connecting conductor portion provided on the inner wall of the storage case.

According to a sixth aspect of the present invention, there is provided a storage case according to any one of the first to fourth aspects, wherein at least the planar substrate multilayer body is accommodated and the multilayer body is disposed so that the mounting conductor portion is close to the inner wall. A plurality of connecting conductor portions insulated from each other are provided on the inner wall of the storage case, and the connecting conductor portion is electrically connected to at least a part of the mounting conductor portion.

  According to the present invention, when the planar substrate laminate is stored in the storage case, the mounting conductor formed on the planar substrate is disposed close to the inner wall of the storage case. The connecting conductor portion can be easily connected to the connecting conductor portion provided on the inner wall of the storage case. Furthermore, since the connecting conductor portions provided on the inner wall of the storage case are insulated from each other, a circuit can be formed by connecting other electronic components stored in the storage case to the connecting conductor portion. Is used as a part of the circuit pattern, so that the mounting can be performed at a higher density, and the size of the component can be reduced.

  According to the present invention, since the mounting conductor portion formed of the conductor pattern is formed on at least one planar substrate, the mounting conductor portion can be formed by the same forming method as the winding portion. As compared with the case of using a lead terminal formed by a different formation method from the winding part, the cost of the lead terminal can be reduced and the number of manufacturing processes can be reduced, and the lead terminal can be eliminated. It is also possible to reduce the size of parts. Further, if the mounting conductor portion is formed of the same material as the winding portion, it can be formed simultaneously with the winding portion, and the number of manufacturing steps can be further reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

(Basic configuration)
The basic configuration of the present invention will be described with reference to FIGS. The LC composite component 1 includes a planar substrate 10 for a plurality of winding configurations and cores 20 and 20 as main components.

  The planar substrates 10 for a plurality of winding structures are formed in substantially the same shape, and are rectangular plates as shown in FIG. 1A, and the middle legs (not shown) of the core 20 are inserted through the central portion. A through hole 11 is provided, and a winding portion 12 made of a conductor pattern such as a copper foil is formed around the through hole 11. In addition, a plurality of (for example, five) laminated terminal portions 13 such as through-hole filled vias are formed along the short side on both side portions in the longitudinal direction of the planar substrate 10, and in the vicinity of the through-hole 11. A lamination terminal portion 13a to which one end of the winding portion 12 is electrically connected is formed. In addition, the winding part 12 which consists of a conductor pattern may be formed only in one side of the planar board | substrate 10, may be formed in both surfaces, and the case where the winding part 12 is formed in both surfaces of the board | substrate 10. May be electrically connected to the winding parts 12 on both sides via the laminating terminal parts 13 and 13a which are laminating terminal parts. The laminated terminal portion 13 includes an electrical connection between the winding portion 12 and mounting conductor portions 14a and 14b, which will be described later, and a winding portion 12 formed on the winding portion 12 and another planar substrate 10. It may be used for electrical connection between the two, or may be used for securing the lamination strength.

Among the plurality of planar substrates 10, the outermost planar substrate 10 in the stacking direction has a rectangular mounting shape made of a conductor pattern such as copper foil on one side in the short width direction (left side in FIG. 1A). Two conductor portions 14a and 14b are formed at an interval, the other end of the winding portion 12 is electrically connected to one mounting conductor portion 14a, and the other mounting conductor portion 14b is a conductor pattern. 15 is electrically connected to the terminal portion 13 for lamination. The mounting conductor portions 14a may be formed on only one surface of the planar substrate 10, or may be formed on both surfaces, or may be formed on the planar substrate 10 other than the outermost layer. In addition, in the LC composite component shown in FIG. 1A and the LC composite component described below , two mounting conductor portions 14a and 14b are formed on one surface of the planar substrate 10 for easy explanation. The case will be described as an example, but the number of mounting conductors may be appropriately set according to the required mounting strength and the number of terminals required for the LC composite component 1. Further, in the embodiment of FIG. 1A, one mounting conductor portion 14a is electrically connected to the winding portion 12, but the mounting conductor portions 14a and 14b are for the purpose of ensuring the mounting strength of the components. In some cases, it may not be connected to the winding part 12.

  On the other hand, the core 20 is formed of a magnetic material, and a side piece 22 is formed in a U-shape in a side view with a central piece 21 and side pieces 22 protruding in one direction from both ends of the central piece 21. The cores 20 and 20 are assembled to the laminated body of the plurality of planar substrates 10 from both sides in the laminating direction, and are joined in a state where the tips of the both side pieces 22 are in contact with each other along the outer periphery of the laminated body. Be placed. In addition, a middle leg (not shown) that is inserted through the through hole 11 of the planar substrate 10 protrudes from the central piece 21 of each core 20.

  The LC composite component 1 has the above-described configuration, and an inductance is configured by laminating a plurality of planar substrates 10 on which the winding portions 12 are formed. How to connect the winding portions 12 of each layer It functions as a coil or a transformer. In addition, when a plurality of winding configuration planar substrates 10 are stacked, an insulator (planar substrate 10) is disposed between the winding portions 12, thereby forming a capacitance. In the case where the winding portions 12 are formed on both surfaces of the planar substrate 10, a separate insulating plate (not shown) may be interposed between the planar substrates 10.

In the LC composite component 1 described above, the mounting conductor portions 14a and 14b made of a conductor pattern are formed on the outer surface of at least the outermost planar substrate 10, and the mounting conductor portions 14a and 14b are formed on a printed wiring board or the like. By mounting, the LC composite component 1 can be easily mounted. Accordingly, the lead terminals for mounting are not required as in the conventional LC composite component 1, so that the size can be reduced and the cost can be reduced by reducing the member cost and the assembly process. Further, the mounting conductor portions 14a and 14b are formed of a conductor pattern formed on the surface of the planar substrate 10. If the same material as the winding portion 12 is used, the mounting conductor portions 14a and 14b are formed simultaneously with the winding portion 12. Since it can be handled only by changing the conductor pattern formed on the surface of the substrate, the manufacturing process is not complicated and the cost is not increased.

By the way, in consideration of core loss and downsizing, it is preferable that the center leg of the core 20 is formed in a perfect circle shape in plan view. In this case, the shape of the winding portion 12 is also close to a circular shape. If is a rectangular plate, there will be empty spaces at the four corners. In this LC composite component 1 , since the mounting conductor portions 14a and 14b are arranged in this empty space, the planar substrate 10 does not increase in size. Further, the mounting conductor portions 14a and 14b may be formed anywhere as long as they are vacant spaces in the planar substrate 10. However, the mounting conductor portions 14a and 14b are mounted on the side close to the mounting portion (for example, a printed wiring board) of the LC composite component 1 (laminated body). If the conductor portions 14a and 14b are formed, the conductor portions 14a and 14b can be directly mounted on the printed wiring board without using a conductive member for connecting the mounting conductor portions 14a and 14b and the printed wiring board. For example, when the LC composite component 1 is mounted on the printed wiring board so that the planar substrate 10 is substantially orthogonal to the printed wiring board, the mounting direction of the LC composite component 1 (indicated by an arrow D1 in FIG. 1B). In the direction), the mounting conductor portions 14a and 14b are formed on the side close to the printed wiring board, so that it can be directly mounted on the printed wiring board.

  Here, FIGS. 2A and 2B show connection examples to the mounting conductor portions 14a and 14b. For example, as shown in FIG. 2A, the mounting conductor portions 14a and 14b are connected to the lead frame. The plate-like conductor 40 formed from can be connected. If there is no problem in deformation due to differences in component strength and heat shrinkage rate, the mounting conductor portions 14a and 14b are mounted on the mounting land of the chip mounting component 41 such as a chip resistor as shown in FIG. By directly mounting the electrode 41a of the chip mounting component 41 on the mounting conductor portions 14a and 14b, a circuit pattern becomes unnecessary, and higher-density mounting is possible and the circuit pattern Loss is reduced and the device can be further miniaturized.

(Modification 1)
A modification of the LC composite component 1 described in the basic configuration will be described with reference to FIGS. In this LC composite component 1 , in the LC composite component 1 described in the basic configuration, convex portions 16a and 16a projecting laterally from one side (the right side in FIG. 3A) in the short width direction of the planar substrate 10 are provided. Mounting conductor portions 14a and 14b made of a conductor pattern such as a copper foil are formed on the surfaces of the convex portions 16a and 16a. Then, one mounting conductor portion 14a is electrically connected to one end of the winding portion 12, and the other mounting conductor portion 14b is electrically connected to the lamination terminal portion 13 via the conductor pattern 15. Yes. Since the mounting conductor portions 14a, 14b are the same as the LC composite component 1 described in the basic configuration except that the convex portions 16a, 16a are formed, common constituent elements are denoted by the same reference numerals, The description is omitted.

  Here, considering the case where the LC composite component 1 is mounted on the printed wiring board so that the planar substrate 10 is substantially orthogonal to the printed wiring board, the mounting direction of the LC composite component 1 (in FIG. 3A) If the tip surface B1 of the convex portion 16a is substantially the same height as the lowermost surface of the core 20 (the surface A1 of the side piece 22) or lower than the lowermost surface of the core 20 (that is, the convex portion). When the LC composite component 1 is mounted on the printed wiring board, the core 20 does not interfere with the printed wiring board (if the tip end surface B1 of 16a protrudes to the mounting site side from the lowermost surface A1 of the core 20). There is no need to form a through hole in the printed wiring board for allowing the core 20 to escape. Moreover, if the front end surface B1 of the convex part 16a is made substantially the same height as the lowermost surface A1 of the core 20, the lowermost surface A1 of the core 20 contacts the printed wiring board, and the mounting state is stabilized. The convex portions 16a can be formed on all the planar substrates 10. By forming the convex portions 16a on each planar substrate 10, the strength of the convex portions 16a can be increased and the mounting strength can be further increased.

  When the LC composite component 1 is mounted on a printed wiring board so that the planar substrate 10 is substantially parallel to the printed wiring board, a plurality of sheets are formed on the outer surface of the outermost planar substrate 10 in the stacking direction. A convex portion 16b protruding in the stacking direction may be formed by laminating insulating plates, and the mounting conductor portions 14a and 14b may be formed on the surface B2 of the convex portion 16b. Here, the mounting conductor portions 14a and 14b formed on the surface B2 of the convex portion 16b are stacked between the stacked terminal portions 13b such as filled vias provided on a plurality of insulating plates constituting the convex portion 16b. Are electrically connected and electrically connected to the winding portion 12 and the like of the planar substrate 10.

  Here, in the mounting direction of the LC composite component 1 (the direction indicated by the arrow D3 in FIG. 3C), the front end surface B2 of the convex portion 16b is substantially the same as the lowermost surface of the core 20 (the surface A2 of the central piece 21). If the height is the same or lower than the lowermost surface of the core 20 (that is, if the front end surface B2 of the convex portion 16b protrudes to the mounting site side of the lowermost surface A2 of the core 20), the LC composite component 1 is printed circuit board. When mounting on the printed circuit board, the core 20 does not interfere with the printed wiring board, and there is no need to form a through hole in the printed wiring board for allowing the core 20 to escape. Moreover, if the front end surface B2 of the convex part 16b is made substantially the same height as the lowermost surface of the core 20, the lowermost surface A2 of the core 20 contacts the printed wiring board, and the mounting state is stabilized.

As described above, in the LC composite component 1 , the mounting conductor portions 14a and 14b made of a conductor pattern are formed on the convex portions 16a and 16b provided on the planar substrate 10, and the mounting conductor portions 14a and 14b are formed. By mounting on a printed wiring board or the like, the LC composite component 1 can be easily mounted. Therefore, there is no need for a lead terminal for mounting as in the conventional LC composite component 1, and no mounting terminal is formed using a special member, so that downsizing and reduction of member cost and assembly process are achieved. Can reduce the cost. Further, the mounting conductor portions 14a and 14b are made of a conductor pattern formed on the surface of the planar substrate 10 and can be formed by the same material and the same forming method as the winding portion 12, so that the manufacturing process is complicated. There is no cost increase.

Further , in this LC composite component 1 , since the mounting conductors 14a and 14b are formed on the projecting portions 16a and 16b protruding from the planar substrate 10, the direction in which the mounting conductors 14a and 14b are pulled out, and the mounting conductor portion The drawer lengths of 14a and 14b can be set freely, and there is an advantage that the degree of freedom of component arrangement of the LC composite component 1 is improved.

In this LC composite component 1 , the convex portions 16 a and 16 b are projected at two locations on the planar substrate 10, but this is not intended to limit the number of convex portions forming the mounting conductor portion to two. What is necessary is just to set the number of convex parts suitably according to the mounting form of the LC composite component 1.

(Modification 2)
A modification of the LC composite component 1 described in the basic configuration will be described with reference to FIGS. In the LC composite component 1 , the mounting conductor portions 14 a and 14 b provided on the outermost planar substrate 10 in the stacking direction in the LC composite component 1 described in the basic configuration are projected to the outside of the planar substrate 10. The projecting portions of the mounting conductor portions 14a and 14b are bent toward the planar substrate 10 as shown in FIG. 5A, and the tips of the projecting portions are provided on the opposite planar substrate in the stacking direction. It is electrically connected to a conductor (not shown) by a method such as soldering. In addition, since it is the same as that of LC composite component 1 demonstrated by basic structure except the shape of the conductor parts 14a for mounting, 14b, the same code | symbol is attached | subjected to a common component and the description is abbreviate | omitted.

As described above, in the LC composite component 1 , the mounting conductor portions 14a and 14b provided on the planar substrate 10 are extended to the outside of the planar substrate 10, and the protruding portions of the mounting conductor portions 14a and 14b are formed in the planar portion. A surface C1 that is substantially perpendicular to the mounting direction (the direction indicated by the arrow D4 in FIG. 5) is formed by being bent so as to be wound around the laminate of the substrate 10, and the mounting conductor portions 14a and 14b are connected to the printed wiring board. When soldering, the plane C1 is also soldered, so that the mounting strength can be improved. Further, since the projecting portions of the mounting conductor portions 14a and 14b are wound around the laminate of the planar substrate 10, the laminate strength of the laminate can be ensured.

Thus, in this LC composite component 1 , the LC composite component 1 can be easily mounted by mounting the mounting conductor portions 14a and 14b formed on the planar substrate 10 on a printed wiring board or the like. Moreover, unlike the conventional LC composite component 1, no mounting lead terminal is required, and no mounting terminal is formed using a special member, so that downsizing and reduction of member costs and assembly processes are achieved. Can reduce the cost. When the mounting conductor portions 14 a and 14 b need strength, the mounting conductor portions 14 a and 14 b may be thicker than the winding portion 12. Further, since the mounting conductor portions 14a and 14b do not contribute to the formation of capacitance, the thickness of the conductor pattern constituting the mounting conductor portions 14a and 14b can be freely set. Here, when the thickness of the mounting conductor portions 14a and 14b is increased in order to ensure the strength, the thickness of the entire substrate is increased, but the mounting conductor portions 14a and 14b are increased in thickness by the amount for mounting. If the portion of the planar substrate 10 where the conductor portions 14a and 14b are formed is made thinner, the thickness of the portion where the winding portion 12 is formed and the thickness of the portion where the mounting conductor portions 14a and 14b are formed can be made substantially the same. .

  Further, the projecting portions of the mounting conductor portions 14a and 14b are bent so as to be wound around the plurality of stacked planar substrates 10, and their tips are opposed to the outer surface of the opposite planar substrate 10 in the stacking direction. In addition, since it is electrically connected to the winding portion 12 formed on the outer surface, the mounting conductor portions 14a and 14b are connected not only as mounting terminals but also between the stacked planar substrates 10. Since the cross-sectional areas of the mounting conductor portions 14a and 14b can be relatively easily ensured as compared with the laminated terminal portion 13 such as filled vias, the winding portion has a high current density. When connecting 12 between substrates, it can suppress that the loss by contact resistance generate | occur | produces.

  As shown in FIG. 5B, the mounting conductors 14a and 14b protrude to the outside of the planar substrate 10 in the mounting direction, and a part of the mounting conductors 14a and 14b extends in the longitudinal direction of the planar substrate 10 (mounting). The side surface C2 of the mounting conductors 14a and 14b can be soldered to a mounting target such as a printed wiring board, and the mounting strength can be further increased.

Further, in the LC composite component 1 described in the first modification , the mounting conductor portions 14a and 14b formed on the convex portion 16a are replaced with the planar substrate 10 (that is, the convex portion) as in the LC composite component 1 described in the second modification. A surface perpendicular to the mounting direction may be formed by extending to the outside of 16a) and bending the protruding portions of the mounting conductor portions 14a and 14b around the convex portion 16a.

Further , in this LC composite component 1 , two mounting conductor portions 14a and 14b are formed. However, the number of the mounting conductor portions 14a and 14b is not limited to two, and the mounting strength and the like are used. What is necessary is just to determine suitably the number of the conductor parts 14a and 14b for mounting according to conditions.

(Modification 3)
A modification of the LC composite component 1 described in the basic configuration will be described with reference to FIGS. In this LC composite component 1 , in the LC composite component 1 described in the basic configuration , as shown in FIGS. 6A and 6B, notches 17 and 17 that are recessed in a rectangular shape are formed on the side edges of the planar substrate 10. The mounting conductor portions 14a and 14b having a U-shape in plan view are formed on the peripheral portions of the notches 17 and 17, respectively. Since the configuration other than the mounting conductor portions 14a and 14b and the notch 17 is the same as that of the LC composite component 1 described in the basic configuration , common constituent elements are denoted by the same reference numerals and description thereof is omitted. To do.

FIG. 6 (c) shows a state of mounting the conductive plate 42 of the elongate formed by the lead frame L C composite component 1, in this case, in the state through the conductive plate 42 in the notch 17, the mounting conductor Since the portions 14a and 14b can be connected to the conductor plate 42 by a method such as soldering, positioning of the mounting position is easy, and in the mounting conductor portions 14a and 14b, the conductor portion around the notch 17 is viewed from three directions. Since it is connected to the conductor plate 42, the mounting strength can be increased as compared with the LC composite component 1 described in the basic configuration .

The shape of the notch 17 provided in the mounting conductor portions 14a and 14b is formed in accordance with the shape of the mounting target (the conductor plate 42 in the example of FIG. 6C), and the mounting target is inserted into the notch 17. If the notch 17 is formed so that the gap that can be formed becomes as small as possible, the mounting strength can be further increased. Further, when implementing this LC composite component 1 by soldering to a printed wiring board, by devising the shape of the notch 17 not only as a terminal for mounting, also be used for positioning with respect to the printed circuit board it can.

(Embodiment 1 )
The first embodiment of the present invention will be described with reference to FIGS. In this embodiment, in the LC composite component 1 described in the basic configuration, the planar substrate 10 (see FIG. 7A) on which the mounting conductor portions 14a and 14b are formed, and the mounting conductor portions 14a and 14b in the stacking direction. The LC composite component 1 is configured by laminating at least one planar substrate 10 ′ (see FIG. 7B) having notches 17a and 17a formed at the same position. Since the components other than the planar substrate 10 ′ are the same as those of the LC composite component 1 described in the basic configuration , common constituent elements are denoted by the same reference numerals and description thereof is omitted.

  Although the stacking order of the planar substrates 10 and 10 ′ varies as necessary, FIG. 8B shows the planar substrate 10 provided with the mounting conductor portions 14a and 14b and the planar substrate 10 ′ provided with the notches 17a and 17a. Are shown alternately stacked. FIG. 8B shows a case where the mounting conductor portions 14a and 14b and the notches 17a are formed at the corners of the planar substrates 10 and 10 'for ease of illustration. In the example of FIG. 8B, the two-layer planar substrate 10 is laminated between the three-layer planar substrate 10 '.

  By stacking the planar substrate 10 on which the mounting conductor portions 14a and 14b are formed in this manner and the planar substrate 10 ′ on which the mounting conductor portion is not formed, the mounting conductor portion 14a formed on the planar substrate 10 is stacked. , 14b can be ensured to increase the insulation. Moreover, since the planar substrate 10 ′ is provided with the cutouts 17a at the same positions as the mounting conductor portions 14a and 14b in the stacking direction, the spatial distance between the mounting conductor portions 14a or 14b formed on different substrates. Is longer, and the mounting conductor portions 14a or 14b are reliably insulated, so that the terminal pieces 43a and 43b having different potentials are connected to the mounting conductor portions of the respective planar substrates 10 as shown in FIG. 14b and 14b can be used.

  In the planar substrate 10 ′ shown in FIG. 7B, all the portions corresponding to the mounting conductor portions 14a and 14b of the planar substrate 10 are cut out in the stacking direction, but as shown in FIG. A planar substrate 10 in which a notch 17b is provided in a part of the portion corresponding to the mounting conductor portions 14a and 14b in the stacking direction, and U-shaped mounting conductor portions 14c and 14d are formed in the remaining portions (peripheral portions of the notch 17b). "May be used.

  FIG. 8A shows a state in which the above-described planar substrate 10 ″ is laminated instead of the outermost planar substrate 10 ′ in the laminated structure shown in FIG. 8B, and the mounting conductor portion is formed. An enlarged view of the part is shown in Fig. 8C. In Fig. 8C, the mounting conductor portions 14a to 14d and the notches 17b are formed at the corners of the planar substrates 10 and 10 "for easy illustration. Shows the case.

  As described above, the planar substrate 10 ′, which is stacked on the planar substrate 10 on which the mounting conductor portions 14 a and 14 b are formed, is provided with a notch 17 a at the same position as the mounting conductor portions 14 a and 14 b in the stacking direction. Therefore, since a spatial distance can be secured between the mounting conductor portions 14a or 14b formed on the separate planar substrates 10 ', and the mounting conductor portions 14a or 14b are reliably insulated, the terminal pieces having different potentials can be obtained. 43a and 43b can be used by being connected to the mounting conductor portions 14b and 14b of each planar substrate 10.

  Here, the planar substrate 10 ′ laminated between the planar substrates 10 and 10 is provided with a notch 17a at a portion overlapping the mounting conductor portions 14a and 14b in the laminating direction. Since the mounting conductor portions 14a or 14b formed on the substrates 10 and 10 are reliably insulated, the terminal pieces 43a and 43b having different potentials are connected to the mounting conductor portions 14b and 14b of each planar substrate 10. Can be used. Further, since the mounting conductor portions 14c and 14d are formed on the peripheral portion of the notch 17b in the outermost planar substrate 10 ″, it is possible to mount the components to be mounted on these mounting conductor portions 14c and 14c. it can.

In this embodiment, as described in the second modification , the mounting conductor portions 14a and 14b are extended to the outside of the substrate, and the protruding portions of the mounting conductor portions 14a and 14b are bent and formed on another planar substrate. It is possible to electrically connect to the wound winding portion 12 or to electrically connect the mounting conductor portions 14a and 14b exposed from the notches 17 in each planar substrate 10 via a connection conductor (not shown). The planar substrates 10 thus formed can be electrically connected, and the capacitance of the capacitor can be adjusted by the connection between the substrates, and the degree of freedom of the installation location of the capacitor and the winding portion can be increased.

(Embodiment 2 )
The second embodiment of the present invention will be described with reference to FIGS. The LC composite component 1 ′ of the present embodiment is configured by storing the planar component 10 and the laminated component 2 of the core 20 described in the basic configuration in a storage case 50 formed of an insulating synthetic resin. In addition, since the laminated component 2 including the planar substrate 10 and the core 20 is substantially the same as the LC composite component 1 described in the basic configuration , common components are denoted by the same reference numerals, and description thereof is omitted. .

  On the surface of the planar substrate 10, mounting conductor portions 14a and 14b are formed at one end side in the short width direction (left side in FIG. 9A) with a gap therebetween, and the other end side in the short width direction ( Mounting conductor portions 14e and 14f are formed on the right side in FIG.

  On the other hand, the size of the storage case 50 is determined so that the outer surface of the laminated component 2 including the planar substrate 10 and the core 20 is close to the inner wall through a slight gap, and is formed on the planar substrate 10. Mounting conductor portions 51a to 51d each having a conductor pattern are formed at portions facing the mounting conductor portions 14a, 14b, 14e, and 14f. Further, part of the mounting conductor portions 51a to 51d (for example, the mounting conductor portions 51c and 51d) are electrically connected to lead terminals 52a and 52b protruding from the surface of the storage case 50 (FIG. 10A). reference). Here, the inside of the storage case 50 may be filled with a filler (not shown) made of an insulating material to seal the laminated component 2.

  Thus, when the laminated component in which the core 20 is assembled to the laminate of the planar substrate 10 is stored in the storage case 50, the mounting conductor portions 14a, 14b, 14e, 14f formed on the planar substrate 10 are While being electrically connected to the mounting conductor portions 51a to 51d provided on the inner wall of the storage case 50, a part of the mounting conductor portions 14a, 14b, 14e, 14f (for example, the mounting conductor portions 14e, 14f) is mounted. Electrically connected to the lead terminals 52a and 52b via the conductor portions 51c and 51d.

Here, since the outer surface of the multilayer component 2 composed of the planar substrate 10 and the core 20 is close to the inner wall of the storage case 50, the mounting conductor portion 14a is provided anywhere on the outer surface of the multilayer component 2, Without using a conductive plate having a complicated shape, it can be electrically connected to the mounting conductor portions 51a provided on the inner wall of the storage case 50, and it is easy to ensure mounting strength. Further, the forming lead terminals 52a and 52b can be taken out in a relatively free direction by the method of forming the mounting conductor portions 51a on the inner wall of the storage case 50, and the degree of freedom in the mounting direction of the storage case 50 is improved. . Further, the thickness of the mounting conductor portions 51a provided on the inner wall of the storage case 50 is formed to be substantially the same as the thickness of the wall of the storage case 50, and the mounting conductor portions 51a are exposed to the outer surface of the storage case 50. The mounting conductor portions 51a can also be used as terminals for surface mounting. Further, if the mounting conductor portions 14a formed on each planar substrate 10 are protruded to the outside of the substrate as described in the second modification , the protruding portions of the mounting conductor portions 14a are bent and the storage case 50 is bent. By forming a plane parallel to the inner wall, it is possible to easily connect to the mounting conductor portions 51a provided on the inner wall.

  Then, the LC composite component 1 ′ in which the planar component 10 and the laminated component 2 of the core 20 are stored in the storage case 50 is mounted on the printed wiring board 61 together with other electronic components 62 as shown in FIG. It is stored in the outer case 60.

  Here, since the outer surface of the storage case 50 for storing the laminated component 2 is formed of an insulating material, it can be mounted on the printed wiring board 61 in a state of being close to the inner wall of another electronic component 62 or the outer case 60. The printed wiring board 61 and the outer case 60 can be downsized. Further, if an insulating material having excellent thermal conductivity is used for the material of the storage case 50 and the filler material filled in the storage case 50, the heat generated by the laminated component 2 is transferred from the storage case 50 to the outer case 60. It is transmitted quickly and radiated to the space outside the case. Further, when the LC composite component 1 ′ is used as a main transformer of a power control converter, for example, the LC composite component 1 ′ has a large power capacity. The conductor part 51a... Is made thicker so that more conductors are arranged in a portion where the storage case 50 and the outer case 60 are close to each other, thereby radiating most of the heat generated by the laminated component 2 to the outer case 60 side. It is possible to prevent other electronic components 62 from being affected by the heat generated in the LC composite component 1 ′.

(Embodiment 3 )
A third embodiment of the present invention will be described with reference to FIG. The LC composite component 1 ″ of this embodiment is configured by storing the planar component 10 and the laminated component 2 of the core 20 described in the basic configuration in a storage case 70 together with other electronic components (not shown). In addition, since the laminated component 2 including the planar substrate 10 and the core 20 is substantially the same as the LC composite component 1 described in the basic configuration , common components are denoted by the same reference numerals, and description thereof is omitted. .

  On the surface of the planar substrate 10, mounting conductor portions 14a and 14b are formed at one end side in the short width direction (left side in FIG. 9A) with a gap therebetween, and the other end side in the short width direction ( Mounting conductor portions 14e and 14f are formed on the right side in FIG.

  On the other hand, the size of the storage case 70 is determined so that the outer surfaces in the longitudinal direction and the short width direction of the laminated component 2 including the planar substrate 10 and the core 20 are close to the inner wall through a slight gap. And at least a portion is formed of an insulator.

On the inner wall of the storage case 70, rectangular mounting conductor portions 71 a to 71 d (connecting conductor portions) made of conductive patterns insulated from each other are mounted on the mounting conductor portions 14 a, 14 b, 14 e, provided on the planar substrate 10. A plurality of portions are formed at portions facing 14f. The areas and thicknesses of the mounting conductor portions 71a to 71d are determined by the amount of current flowing through the mounting conductor portions 71a to 71d.

  Here, the mounting conductor portions 71 a to 71 d provided on the inner wall of the storage case 70 are conductor patterns for connecting the sheet-like winding portions 12 formed on the planar substrate 10, and each mounting conductor portion. If the mounting terminals of other electronic components (not shown) are connected in accordance with the potentials of 71a to 71d, the mounting conductor portions 71a to 71d function as circuit patterns for connecting the electronic components. High-density mounting is possible, and the LC composite component 1 ″ can be reduced in size.

  Note that all the mounting conductor portions 71a to 71d provided on the inner wall of the storage case 70 do not have to be a part of the circuit pattern, and may be used as heat-dissipating conductors and are used in a high-temperature environment. In this case, only the minimum part necessary for ensuring insulation between the mounting conductors 71a provided on the inner wall of the storage case 70 is formed of an insulating material, and most of the other part is a metal having excellent thermal conductivity. By forming with a material, the heat dissipation of the storage case 70 can be improved. Further, the storage case 70 may be formed of an insulating material having good thermal conductivity, and the internal heat can be easily radiated to the outside of the case.

  It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.

The basic composition of LC composite parts concerning the present invention is shown, (a) is a top view of the planar substrate used for LC composite parts, and (b) is the appearance perspective view of LC composite parts. (A) and (b) are the principal part expansion perspective views explaining the example of a connection to the conductor part for mounting. Modification 1 is shown, in which (a) is a plan view of a planar substrate used in an LC composite component, and (b) and (c) are external perspective views in which a part of the LC composite component can be omitted. Modification 2 is shown, (a) is a plan view of a planar substrate used in an LC composite component, and (b) is an external perspective view of the LC composite component. (A) and (b) are the principal part expansion perspective views of LC composite component. Modification 3 is shown, (a) is a plan view of a planar substrate used for an LC composite component, (b) is an external perspective view of the LC composite component, and (c) is an explanatory view of a mounted state. (A)-(c) is a top view of the planar board | substrate used for Embodiment 1. FIG. (A) is an external appearance perspective view same as the above, (b) (c) is a principal part expansion perspective view. Embodiment 2 is shown, (a) is a plan view of a planar substrate used for an LC composite component, and (b) is an external perspective view of the LC composite component. (A) is an external appearance perspective view of a storage case, (b) is explanatory drawing explaining a mounting state. Shows an embodiment 3, a plan view, (b) an external perspective view of the LC composite part, (c) is an explanatory view showing a storage state of the storage case of planar substrate for use in (a) an LC composite component. It is an external appearance perspective view of the conventional LC composite component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LC composite component 10 Planar substrate 12 Winding part 13 Laminating terminal part 14a, 14b Mounting terminal part 20 Core

Claims (6)

Between a plurality of planar substrates each having a winding portion formed of a conductor pattern formed on the surface, a core disposed along the outer periphery of the laminate of the planar substrates, and a winding portion formed on the plurality of planar substrates. Insulators to be disposed, and interlayer connection terminals that are provided on each planar substrate and electrically connect the stacked planar substrates, and inductance and capacitance are obtained by laminating a plurality of planar substrates. In addition, a notch is provided in a portion overlapping the mounting conductor portion in the stacking direction between the planar substrates each formed on the surface and formed with a conductor pattern and used for mounting the multilayer body. as planar substrate is placed, and the planar substrate on which the mounting conductor portion is formed on the surface, the planar groups of the notch is provided LC composite component, characterized in that bets are alternately stacked.   The planar substrate disposed in the outermost layer with the cutout is characterized in that a mounting conductor portion made of a conductor pattern and used for mounting the laminated body is formed on a peripheral portion of the cutout. The LC composite component according to claim 1.   3. The LC composite component according to claim 1, wherein the mounting conductor portion is formed on a side of the planar substrate close to the mounting portion of the multilayer body.   4. The planar substrate on which the mounting conductor portion is formed and the planar substrate on which the mounting conductor portion is not formed are stacked on top of each other at least one layer. LC composite component according to item.   A storage case for storing the laminate of the planar substrate so that the mounting conductor portion is close to the inner wall, and being electrically connected to at least a part of the mounting conductor portion on the inner wall of the storage case The LC composite component according to any one of claims 1 to 4, wherein a conductor portion is provided.   A plurality of connecting conductor portions, each of which includes a storage case in which the multilayer body of the planar substrate is stored and in which the stacked body is disposed so that the mounting conductor portion is close to the inner wall, are insulated from each other on the inner wall of the storage case 5. The LC composite component according to claim 1, wherein the connection conductor portion is electrically connected to at least a part of the mounting conductor portion. 6.

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